Syllabus
Ben-Gurion University of the Negev
Department of Electrical & Computer Engineering
PASSIVE ELECTRONIC COMPONENTS
Course # 361-1-4111
Dr. MICHAEL BELMAN
Year ‫( תשע"ה‬2014/2015), Semester 2
http://www.ee.bgu.ac.il/~pec
Course Description:
The course includes the following topics:
1. History of passive electronic components.
2. Modern technologies of passive electronic components manufacturing and mounting.
3. Heat dissipation in electronic components.
4. Physical aspects of pulse loading of resistors.
5. Theory, construction, specifications, and typical applications of passive electronic components
(resistors, capacitors, inductors, circuit protection components).
6. Methods of in-circuit resistance measurement.
7. General rules of engineering calculations.
Course Objectives:
To give to the students an understanding of:
 Theory, construction and capabilities (electrical, thermal, and mechanical) of passive components
that constitute more than 90% of total number of electronic component in the modern electronic
circuits.
 Optimal selection of types of passive components.
Course Structure:
Number of lectures: 13.
Dedicated class room:
‫יום‬
‫שעות‬
‫בנין חדר‬
‫ א‬20:00-17:00 308 32
Course requirements:
The course is intended for 3- and 4-year students that have already attended basic courses in physics and
electronics.
2
Structure of Final Course-Grade:
Component
1.
Exam
2.
……………
__________
Total:
Weight
100%
……….
_______
100%
A "Pass" requirement regarding final exam: Yes/No
Lecturer’s E-mail address and telephones:
E-mail: mbelman@bgu.ac.il Tel. 08-6290146 (office), 054-3304309 (mobile)
Description of the Lections
Meeting
Date
Subject(s)
08/03/15 Typical applications and history of
passive electronic components
1
Solving of engineering problem
15/03/15 Manufacturing of the passive
electronic components
2
22/03/15 Mounting of Passive Electronic
Components
3
4
12/04/15 Heat transfer in passive electronic
components (steady state)
19/04/15 Resistors 1
5
Details
1. Introduction.
2. Characteristics of passive
electronic components.
3. Historical excursus.
4. Typical applications of
passive components.
5. Why all discrete passive
components cannot be
integrated in IC or in PCB.
1. Stages of a solution.
2. General rules of calculations
and paperwork.
1. Materials for manufacturing of
passive electronic components
2. Bulk elements assembly
3. Thick film technology
4. Thin film technology
5. Laser trimming
6. Termination, packaging
(molding, coating)
1. Point-to-point mounting
2. Printed Circuit Board
3. Through-Hole Mount
Technology
4. Surface Mount Technology
5. The problems associated with
surface mounting
6. Soldering and gluing
1. Physical basics
2. Parameters specified
3. Typical constructions
1. Different types of resistors
2. Typical applications.
3. Selection guidelines.
3
26/04/15 Resistors 2
6
03/05/15 Pulse loading of resistors
7
10/05/15 Capacitors 1
8
17/05/15 Capacitors 2
9
31/05/15 Inductors
10
07/06/15 Fuses, thermistors and varistors
11
14/06/15 In-circuit measurements
12
13
21/06/15 Solving of typical exam problems
Exam dates:
‫שעה בנין חדר‬
1, 2
212
‫מועד תאריך‬
92 09:00 17/07/15 ‫א‬
35 17:30 12/08/15 ‫ב‬
1. Physics of dynamic heat
transfer.
2. Resistive element temperature
estimation.
3. Physical phenomena that
accompany pulse loading.
1. Physical basics
2. Parameters specified
3. Typical constructions
1. Different types of capacitors
2. Typical applications
3. Selection guidelines
1. Common types of capacitors
2. Special types of capacitors
3. Typical applications
4. Selection guidelines
1. Physical basics
2. Parameters specified
3. Typical constructions Typical
applications
4. Selection guidelines
1. Fuses
2. Thermistors
3. Varistors
1. Compensation method
2. Calculation method
3. Achievable accuracy
estimation
4
Literature:
1)
1.
F. Zandman, P.-R. Simon, J. Szwarc, Resistor theory and technology.
Malvern, PA: Vishay Intertechnology; Distributed by Scitech Pub., 2001
TK 7872.R4Z3
2.
K.R. Demarest, Engineering electromagnetics. Upper Saddle River, NJ:
Prentice Hall, 1998.
QC 760.D39 1998
3.
L.S. Miller, J.B. Mullin, Electronic materials. NY: Plenium Press, 1991
TK 7871. E437
4.
J. H. Lienhard IV and J. H. Lienhard V, A Heat Transfer Textbook.
3rd ed., Cambridge, MA: Phlogiston Press, 2004 1)
TJ 260.L445
5.
H.S. Nalwa, Handbook of advanced electronic and photonic materials and
devices. San Diego, CA: Academic Press, 2001
TK 7871.H36
6.
M. Pecht, Integrated circuit, hybrid, and multichip module package design
guidelines. NY: John Wiley & Sons, Inc., 1994
TK 7870.15. P42
7.
G. Humpston, D. M. Jacobson, Principles of soldering and brazing. NY:
ASM International, 1993
TS 610.H85
8.
F.P. McCluskey, R. Grzbowsky, T. Podlesak, High temperature electronics.
NY: CRC Press, Inc., 1997
TK 7870.25.H54
9.
Passive Electronic Component Handbook by Charles A. Harper (Editor):
McGraw-Hill Professional, 1997.
-
10.
Ian Robertson Sinclair, Passive components for circuit design. Elsevier
Science & Technology, 2000.
-
11.
Charles A. Harper, Electronic Materials and Processes Handbook.
McGraw-Hill, 3 ed., 2003.
-
12.
Tocci, R.J., Introduction to electric circuit analysis, Charles E. Merrill
Publishing Co., Columbus, Ohio, 1974, 842 p.
-
13.
Belman M., Reliable in-circuit evaluation of passive electronic components.
CARTS- EUROPE 2000 (14th European Passive Components Symposium)
Proc., pp. 117-121.
-
14.
Belman M., Kadim Y., and Akhtman L., Reliable Operation of Thick-Film
Chip Resistors under Pulsed Conditions. CARTS 2003 (23rd Capacitor and
Resistor Technology Symposium) Proc., pp. 117-123.
-
15.
Belman M., Surge current chip resistor. US Patent 6,873,028; 2005.
16.
Belman M., Four-terminal resistor with four resistors and adjustable
temperature coefficient of resistance. US Patent 8,581,687; 2013.
17.
Belman M., Akhtman L., Sulfuration resistant chip resistor and method for
making same. US Patent 8,957,756; 2015.
A free electronic version is available at
http://web.mit.edu/lienhard/www/ahtt.html