© Mikell P. Groover 2013
Chapter 31 ELECTRONICS ASSEMBLY AND PACKAGING
Multiple Choice Quiz
There are 20 correct answers in this multiple choice quiz (some questions have multiple answers that are correct). To achieve a perfect score on the quiz, all correct answers must be given. Each correct answer is worth 1 point. Each omitted answer or wrong answer reduces the score by 1 point. Percentage score on the quiz is based on the total number of correct answers.
31.1
The first level of packaging refers to which one of the following: (a) Chip-to-package interconnections to form an IC package, (b) circuit board to rack, (c) IC package to printed circuit board, (d) intraconnections on the IC chip, or (e) wiring and cabling connections in the cabinet?
31.2
Surface-mount technology is used at which one of the following packaging levels: (a) zero,
(b) first, (c) second, (d) third, or (e) fourth?
31.3
Card-on-board (COB) packaging refers to which one of the following packaging levels: (a) zero, (b) first, (c) second, (d) third, or (e) fourth?
31.4
Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers): (a) copper, (b) E-glass, (c) epoxy, (d) phenolic, (e) polyethylene, and (f) polypropylene?
31.5
Typical thickness of the copper layer in a printed circuit board is which one of the following: (a) 4 mm (0.160 in), (b) 0.4 mm (0.016 in), (c) 0.04 mm (0.0016 in), or (d)
0.004 mm (0.00016 in)?
31.6
Several types of holes must be created in a printed circuit board prior to assembly. Which one of the following hole types is not required when surface mount components are assembled to the board: (a) insertion holes, (b) tooling holes, or (c) via holes?
31.7
Which of the following plating processes has the higher deposition rate in PCB fabrication:
(a) electroless plating or (b) electroplating?
31.8
In addition to copper, which one of the following is another common metal plated onto a
PCB: (a) aluminum, (b) gold, (c) nickel, or (d) tin?
31.9
In the subtractive circuitization method used to transform a copper-clad board into a printed circuit board, portions of the copper cladding that are coated with resist are etched away so that the tracks and lands of the desired circuit remain: (a) true or (b) false?
31.10
The solder paste and reflow soldering method of affixing components in surface-mount technology includes a wave soldering step to securely attach the components to the board:
(a) true or (b) false?
31.11
In the solder paste and reflow soldering method of affixing components in surface-mount technology, the methods of applying the solder paste to the surface of the printed circuit board include which of the following (two best answers): (a) automated placement machines, (b) hand painting, (c) photolithography, (d) screen printing, (e) semiautomatic placement machines, or (f) syringe dispensing?
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© Mikell P. Groover 2013
31.12
In the adhesive bonding and wave soldering method of affixing components in surfacemount technology, the components themselves pass through the molten solder wave: (a) true or (b) false?
31.13
Which of the following are the soldering processes used to attach components to printed circuit boards in through-hole technology (two best answers): (a) hand soldering, (b) infrared soldering, (c) reflow soldering, (d) torch soldering, and (e) wave soldering?
31.14
In general, which of the following technologies causes more problems during rework: (a) surface-mount technology or (b) through-hole technology?
31.15
Hand soldering is sometimes used after wave soldering in the solder paste and reflow soldering method to add delicate components that would be damaged in the harsh environment of the wave-soldering chamber: (a) true or (b) false?
31.16
Which of the following electrical connection methods produce a separable connection (two correct answers): (a) crimping of terminals, (b) press fitting, (c) soldering, (d) terminal blocks, and (e) sockets?
Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976 United States Copyright Act without the permission of the copyright owner is unlawful.