The Development of Large-Area
Thin Planar Psec Photodetectors
Henry Frisch,
Enrico Fermi Institute and ANL
4/8/2015
Fermilab Detector Workshop
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The Large-Area Psec Photo-detector Collaboration
3 National Labs, 6 Divisions at
Argonne, 3 US small
companies; electronics
expertise at UC Berkely, and
the Universities of Chicago
and Hawaii
Goal of 3-year R&Dcommercializable modules.
DOE Funded (a little NSF)
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Three Goals of a New (1 yr-old)
Collaborative Effort:
1. Large-Area Low-Cost Photodetectors with
good correlated time and space resolution
(target 10 $/sq-in incremental areal cost)
2. Large-Area TOF particle/photon detectors
with psec time resolution ( < 1psec at 100 p.e.)
3. Understanding photocathodes so that we can
reliably make high QE, tailor the spectral
response, and develop new materials and
geometries (QE > 50%?, public formula)
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Detector Development- 3 Prongs
MCP development- use modern fabrication processes to
control emissivities, resistivities, out-gassing
Use Atomic Layer Deposition for emissive material
(amplification) on cheap inert substrates (glass capillary arrays,
AAO). Scalable to large sizes; economical; pure – i.e. chemically
robust and (it seems- see below) stable
Readout: Use transmission lines and modern chip
technologies for high speed cheap low-power highdensity readout.
Anode is a 50-ohm stripline. Scalable up to many feet in length ;
readout 2 ends; CMOS sampling onto capacitors- fast, cheap,
low-power (New idea- make MCP-PMT tiles on single PC-card
readout- see below)
Use computational advances -simulation as basis for
design
Modern computing tools allow simulation at level of basic
processes- validate with data. Use for `rational design’
(Klaus Attenkofer’s phrase).
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4 Groups
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+ Integration and Management
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Parallel Efforts on Specific Applications
PET
.
Explicit strategy for staying on task
(UC/BSD,
UCB, Lyon)
Muon
Cooling
Muons,Inc
(SBIR)
(UC,
ANL,Saclay.
LAPD Detector
Development
Security
(TBD)
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K->pnn
ANL,Arradiance,Chicago,Fermilab,
Hawaii,Muons,Inc,SLAC,SSL/UCB,
Synkera, U. Wash.
Drawing Not To Scale (!)
DUSEL
(Matt, Mayly,
Bob, John, ..)
Collider
Fermilab Detector Workshop
(UC(?))
Mass
Spec
All these need work- naturally
tend to lag the reality of the
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detector development
Application 1-Colliders
At colliders we measure the 3-momenta of hadrons, but can’t follow
the flavor-flow of quarks, the primary objects that are colliding. 2orders-of-magnitude in time resolution would all us to measure ALL
the information=>greatly enhanced discovery potential.
A real top candidate
event from CDF- has
top, antitop, each
decaying into a Wboson and a b or
antib. Goal- identify
the quarks that
make the jets.
(explain why…)
Specs:
Signal: 50-10,000
photons
Space resolution: 1 mm
t-tbar -> W+bW-bbar->
Time resolution 1 psec
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e+ nu+c+sbar+b+bbar
Cost: <100K$/m2:
Application 2- Neutrino Physics
(Howard Nicholson)

Spec: signal single photon, 100 ps time, 1 cm space, low cost/m2
(5-10K$/m2)*
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Application 3- Medical Imaging (PET)
Alternating
radiator and
cheap 3050 psec
planar mcppmt’s on
each side
Can we solve the
depth-ofinteraction
problem and also
use cheaper
faster
radiators?
Simulations by Heejong
Kim (Chicago)
Heejong Kim
Heejong Kim
4/8/2015
Depth in crystal by timeDepth in crystal by
difference
Fermilab Detector Workshopenergy- asymmetry
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Application 4Cherenkov-sensitive Sampling Calorimeters
Idea: planes on one side
read
•I both Cherenkov and
scintillation light- on other
only scintillation.
A picture of an em shower A `cartoon’ of a fixed target geometry such as for
in a cloud-chamber with
JPARC’s KL-> pizero nunubar (at UC, Yao Wah) or
½” Pb plates (Rossi,
LHCb
p215- from CY Chao)
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The 24”x16” `SuperModule
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Sealed Tube (Tile) Construction
•All (cheap) glass
•Anode is silk-screened
•No pins, penetrations
•No internal connections
•Anode determines locations
(i.e. no mech tolerancing for
position resolution)
•Fastens with double-sticky to
readout Tray: so can tile
different length strings, areas
•Tile Factory in works (ANL)
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ANL-UC Glass Hermetic Packaging Group

Proceed in 3 steps: 1) hermetic box; 2)
Add MCP’s, readout, (Au cathode); 3)
Add photocathode
Box
Box+ 8” MCPs
Possible Au anode
Box+MCP+PC
Yr 1
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Yr 3
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SSL Photocathode Process Chamber
Ossy Siegmund, Jason McPhate, Sharon Jalinsky
UV Transmissive
Window
Manipulators
Glass Window
18” ID Chamber
UHV valves
Photo-Cathode
Forming Well Flange
16.5” Detector
Loading Flange
Ion Pump supply
Ion Pumps
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SSL Photocathodes: Processing
Oven, Cathode
Deposition
•Oven accommodates Large Format
Inside Envelope: 36” x 30” x 25” High
•Defines Large Chamber Limits
•Cathode station controls alkali metal
deposition, and monitors cathode
response
•Ossy Siegmund
•15
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Advanced Photocathode Group
Moving to understanding the physics
Klaus Attenkofer, Sasha Paramonov, Zikri Yusof,
Junqi Xi, Seon Wu Lee, UIUC, WashU, ….




III-V have the potential for high
QE, shifting toward the blue, and
robustness i.e. they age well, hightemp)
Opaque PC’s have much higher QE
than transmission PC’s- we have
the geometry
Many small factors to be gained in
absorption, anti-reflection- see
papers by Townsend and talk by
Fontaine on our web site
Quantum Effic. Of 60% have been
achieved in bialkalis
Big payoff if we can get >50% QE robust
Photocathodes, and/or more robust (assembly). Also want to
get away from `cooking recipes’ to rational design.
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MCP/Photocathode DevelopmentTest setup at APS laser
Bernhard Adams, Klaus Attenkofer, (APS), Matt
Wetstein (HEP)
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Characterization of Materials
•Igor Veryovkin, Slade Jokela, Thomas Proslier, Alexander Zinovev
(MSD)- joint meeting with ALD and Photocathode groups, also
works closely with simulation
• Have constructed dedicated setup for low-energy SEE
and PE measurements of ALD materials- parts on order.
• Group also has parts-per-trillion capability for
characterizing photocathodes after exposure to Argon,
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MCP’s before&after scrubbing, aging.
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Simulation (crosses all groups)
Valentin Ivanov, Zeke Insepov, Zeke Yusof, Sergey Antipov
•10μm pore
•40μm spacing
•Funnel
(!)
•Large Area Photodetector Development Collaboration
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New Femtosec Laser Lab at APS
•Bernhard Adams, Matthieu Chabon, Matt Wetstein
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Electronics Group
J.F. Genat, Gary VarnerHerve Grabas, Eric Oberla, Larry Ruckman,
Kurtis Nishimura
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PSEC-2 ASIC
•130nm IBM 8RF Process
•This chip 4 channels, 256 deep analog ring buffer
•Sampling tested at 11 GS/sec
•Each channel has its own ADC- 9 bits eff (?)
•The ADCs on this chip didn’t work due to leakage (silly,
didn’t simulate slow easy things) - resubmitted, and test
card out for fab with external ADC - will use 1 of 4 chnls
•We’re learning from Breton, Delagnes, Ritt and Varner
(Gary is of course a collaborator)
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1. History- Key Ingredients
1. Seed Money Opportunities(pre big DOE proposal)
1. Seed Money From the PSD Dean
2. Competitive LDRD Program (3 yrs)
3. Competitive ANL-FNAL-UC Program
4. Competitive DOE ADR Program
5. French Consulate, Chicago-France Center (Comp)
6. Non-projectized good-will and friends, hubcaps…
2. Local (i.e. University) Technical Infrastructure
1. EFI Electronics Shop
2. PSD Engineering Center, Central Shop
3. UC undergrads, 1st yr grads, IMSA
4. SSL (UCB) – Anton, Ossy advice
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1. History- Key Ingredients- cont.
3. Access to Lab Resources
1. Fermilab technical help- Greg Sellberg, SciDet
2. ANL SULI student (Camden) + Laser Lab (LDRD)
Fermilab Test Beam- Erik, MTEST, PREP, safety,…
2. Post DOE Proposal – Key Ingrednts
1. Enlightened and visionary DOE Support (multi-level)
1. Portfolio of risk- willing to go for some high-payoff
hi-risk projects in the portfolio (global competition)
2. Involvement with direction, scope, vision
3. Got us past the `start small, low-risk’ gap of death by
reviewer – some things need to start big to succeed.
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Post-prop Key Ingredients- continued
4. Enlightened Lab Management
1. Openness to crossing `silos’, new ideas, crossdisciplinary synergies (hard to do if `projectized’)
2. Willingness to change management structures to enable
new alignments, needs
3. Direct involvement with universities, physics, young
ones, staff, at all levels
4. Very low or no barriers to access to resources
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Bottom Line- What does it take to
have an Effective Univ.-Lab Project
1. A clear goal with near-term applications (e.g. 3-5yr)
2. Local infrastructure (engineers, machinists,
computation) at the universities
3. Encouragement and seed funds at the university
4. Competitive opportunities like DOE-ADR, LDRD,
FAACTS , SBIR for next level seeding
5. Risk portfolio management at the agencies for the next
step after ADR, LDRD
6. Strong support, `moral and financial’, but also
intellectual, from the Lab management
7. Access to talent at the Labs
8. Access to facilities at the Labs
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More Information:
•
•
•
•
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Main Page: http://psec.uchicago.edu
Library: Image Library, Document Library,
Year-1 Summary Report, Links to MCP,
Photocathode, Materials Literature, etc.;
Blog: Our log-book- open to all (say yes to
certificate Cerberus, etc.)- can keep track of
us (at least several companies do);
Wish us well- goal is in 3 years (2 from now)
to have commercializable modules- too late
for the 1st round of LBNE, but maybe not
too late for a 2nd or 3rd-generation detector.
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THE END
Thanks to everybody in the
LAPPD collaboration who
contributed to our progress,
esp. the young ones.
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The End-
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Some Neutrino-specific Thoughts
AREA
Tiles are very robust against pressure –
less risk of implosion, can build higher;
 Tiles have very small internal volume
(0.6mm thick internally, close to half of
that MCP capillary plate)- no shock?
 Can add area incrementally as
transmission lines probably work well at 6
feet (8 tiles) => incremental cost is only
the tile
 Tesselation is flexible- can have 8” by
72”, 16” by 24” (SM), optimized for app...

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Some Neutrino-specific Thoughts
DETECTOR DESIGN
Spatial Res of <1cm plus 100% (well,..
ykwim) coverage would allow working
close to the walls => greater Fid/Tot
ratio;
 Also would make curve of Fid/Tot
flatter wrt to symmetry- could make a
high, long, narrow (book-on-end)
detector at smaller loss of F/T;
 Cavern height cheaper than width;
robust tubes can stand more pressure
 Narrow may allow magnetic field (!)

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Some Neutrino-specific Thoughts
SIGNAL TO BACKGROUND
100 psec time resolution is 3cm space
resolution ALONG photon direction in
a perfect world;
 Transverse resolution on each photon
should be sub-cm;
 Question- can one reconstruct tracks?
 Question- can one reconstruct vertices?
 Question- can one distinguish a pizero
from an electron and 2 vertices from
one? (4 tracks vs 1 too)

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VERTEX RECONSTRUCTION
(forgive my ignorance- fools rush in
where angels fear to tread.)
Question: Can we reconstruct the first 3
radiation lengths of an event with
resolution ~1/10 of a radiation length?
 Handles on pizero-electron separation: 2
vs 1 vertices; no track vs 1 track between
primary vertex and first photon
conversion; 2 tracks (twice the photons)
from the 2 conversion vertices;
 Know photon angle, lots of photons-phit
 Book-on-end aspect ratio helps against
dispersion, scattering-have to look at
whole picture.

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New MCP
Structure
(not
to
scale)
pore
1 KV
1) resistive coating (ALD)
2) emissive coating (ALD)
3) conductive coating (thermal
evaporation or sputtering)
Jeff Elam
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Atomic Layer Deposition (ALD) Thin
Film Coating Technology
•Lots of possible
materials => much room
for higher performance
 Atomic level thickness control
 Deposit nearly any material
 Precise coatings on 3-D objects
(JE)
Jeff Elam pictures
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Put it all together- the `Frugal’ MCP


Put all ingredients
together- flat glass
case (think TV’s),
capillary/ALD
amplification,
transmission line
anodes, waveform
sampling
Glass is cheap, and
they make vacuum
tubes out of it- why
not MCP’s?
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Put it all together- the `Frugal’ MCP


Put all ingredients
together- flat glass
case (think TV’s),
capillary/ALD
amplification,
transmission line
anodes, waveform
sampling
Glass is cheap, and
they make vacuum
tubes out of it- why
not MCP’s?
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The 24”x16” `SuperModule
•Tile now has no
penetrations- neither
HV nor signals
•Digital card in design
•Front-end ASICs ditto
•Mockup of 2x3 SM
•Real parts- but no MCP
•Tile tests in ~3 months?
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GodParent Review Panels
•Packaging Group
•Karen Byrum
•K.Arisaka
•J. Elam
•D. Ferenc
•J.F. Genat
•P. Hink
•A. Ronzhin
4/8/2015
•MCP Group
• Bob Wagner
• K.Attenkofer
A. Bross
• Z. Insepov
A. Tremsin
• J. Va’vra
• A. Zinovev
•Photocathode Group
•
Gary Varner
• J. Buckley
• K. Harkay
• V. Ivanov
A. Lyashenko
• T. Prolier
• M. Wetstein
HJF: LAPPD Advanced Photo-Detector Status
•Electronics Group
•
•
Zikri Yusof
B. Adams
•
M.
Demarteau
•
G. Drake
•
T. Liu
•
I. Veryovkin
•
S. Ross
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