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ISSCC 2012
Major Reference:
3D-MAPS: 3D Massively Parallel Processor
with Stacked Memory
Dae Hyun Kim, Krit Athikulwongse, Michael Healy,
Mohammad Hossain, Moongon Jung, et al.
Georgia Institute of Technology, Atlanta, GA
KAIST, Daejeon, Korea
Amkor Technology, Seoul, Korea
University of Tehran
Presented by: S.Ghanbari
CIDSP Seminar
May 2013
2-D Ics[7]:
• Large Chip Area
• Long Interconnects Causing Delay-related Issues
• Hard to Meet Different Voltage Requirements
• Inability of Using Incompatible Technologies Together
2D vs SoC vs 3D[7]
Solutions[7]
• 3D Packaging
Stacking several chips in one package. Chips
communicate using off-chip signaling.
• 3D Ics[7]
Using different layers on the same chip. Chips
communicate using on-chip signaling.
3D IC has the same relation with a 3D package as
SoC with a Circuit board.
3D IC Advantages[7]
• Footprint
• Cost(yield and fabrication cost)
• Integrating different processes, better optimization
• Shorter interconnect
• Power reduction with On-chip signals
• Circuit security
• Bandwidth
Manufacturing Technologies[7]
• Wafer-on-Wafer
• Die-on-Wafer
• Die-on-Die
Design styles[7]
• Gate-level Integration
• Block-level Integration
3D-MAPS
3D Massively Parallel Processor with Stacked
Memory
• 64 general-purpose processor cores at 277MHz
• 256KB SRAM
• 130nm Technology
• 33M Transistors, 50K TSV, 50K Face-to-Face
connections in 5mm*5mm footprint.
• 1.5V Supply, up to 4W power consumption. Results in
16W/cm2 power density.
3D-MAPS
3D Massively Parallel Processor with Stacked
Memory
• 64 custom processor cores
• 4KB SRAM data memory for each core
• Theoretical
maximum data
memory bandwidth
at 277MHz is
70.9GB/s
Overview and single core architecture[1]
3D-MAPS
Tezzaron 3D Technology
• F2F(Face to Face) bonding
• 235 I/O cells along the periphery of the core die.
• 204 TSVs, connecting metal 1 to backside metal,
wirebonded to the package.
• Uses dummy TSVs to satisfy the TSV density
rule(Total of 4500 dummy TSVs on the memory die).
3D-MAPS
Stacking, TSV, F2F, and chip-to-package connection[1]
3D-MAPS
294 P/G land pads to supply high current(2.7A) hence
high temperature(~90C from simulation).
Heat and Power measures
• A dummy silicon substrate to increase thermal
conductivity.
• Center region of LGA implemented as a large copper
pad dedicated to VSS to decrease thermal resistance.
• Decoupling capacitors added to improve power
integrity.
Average parasitic values of signal package routes:
R=377.5mΩ
L=4.1nH
C=1pF
3D-MAPS
Bandwidth and power measurement results[1]
3D-MAPS
Frequency vs. power (at 1.5V) and voltage vs. power (at 250MHz) for AES encryption[1]
3D-MAPS
Regularity
Single core and memory tile layouts[1]
Modularity
Die photos[1]
3D-MAPS
References:
[1] Dae Hyun Kim, Krit Athikulwongse, Michael Healy, Mohammad Hossain, Moongon Jung, et al. “3D-MAPS: 3D
Massively Parallel Processor with Stacked Memory”, ISSCC 2012, S.10, P.06.
"
[2] M. Koyanagi, et al. “Neuromorphic Vision Chip Fabricated Using Three-Dimensional Integration Technology”, ISSCC
Dig. Tech. Papers, pp. 270-271, 2001.
[3] U. Kang, et al. “8Gb 3D DDR3 DRAM Using Through-Silicon-Via Technology”, ISSCC Dig. Tech. Papers,pp. 130-131,
2009.
[4] G. Van der Plas, et al., “Design Issues and Considerations for Low-Cost 3D TSV IC Technology”, ISSCC Dig. Tech.
Papers,pp. 148-149, 2010..
[5J.-S. Kim, et al. “A 1.2V 12.8GB/s 2Gb Mobile Wide-I/O DRAM with 4x128 I/Os Using TSV-Based Stacking”, ISSCC
Dig. Tech. Papers,pp. 496-498, 2011.
[6] M. Healy, et al. ”Design and Analysis of 3D-MAPS: A Many-Core 3D Processor with Stacked Memory”, IEEE Custom
Integrated Circuits Conf., pp. 1-4, 2010.
[7] http://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit
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