VLSI System Design Lect. 2.2 CMOS Transistor Theory2 Engr. Anees ul Husnain ( anees.buzdar@gmail.com ) Department of Electronics & Computer Systems Engineering, College of Engineering & Technology, IUB Outline . . . Non-ideal Transistor Behavior High Field Effects Mobility Degradation Velocity Saturation Channel Length Modulation Ideal Transistor I-V polysilicon gate W tox n+ L SiO2 gate oxide (good insulator, ox = 3.9) n+ p-type body 0 V I ds Vgs Vt ds 2 2 V V gs t 2 for nMOS Vgs Vt V V V ds ds dsat Vds Vdsat cutoff linear saturation for pMOS The important practical effects are neglected. . . Ideal vs. non-ideal ideal Non-ideal Saturation current does not increase quadratically with Vgs Saturation current lightly increases with increase in Vds REASONS Velocity Saturation Mobility Degradation Channel Length Modulation Sub-Threshold Conduction Junction Leakage Ideal vs. non-ideal There is leakage current when the transistor is in cut off Ids depends on the temperature Ideal vs. Simulated nMOS I-V Plot 65 nm IBM process, VDD = 1.0 V Ids (A) Simulated Vgs = 1.0 Ideal 1200 Velocity saturation & Mobility degradation: Ion lower than ideal model predicts 1000 Ion = 747 mA @ Channel length modulation: V = V = V gs ds DD Saturation current increases with Vds Vgs = 1.0 800 Vgs = 0.8 600 Velocity saturation & Mobility degradation: Saturation current increases less than quadratically with Vgs 400 Vgs = 0.8 Vgs = 0.6 200 Vgs = 0.6 Vgs = 0.4 0 Vds 0 0.2 0.4 0.6 0.8 1 ON and OFF Current Ids (A) 1000 Ion = 747 mA @ Vgs = Vds = VDD 800 Ion = Ids @ Vgs = Vds = VDD Saturation Vgs = 1.0 600 Vgs = 0.8 400 Vgs = 0.6 200 Vgs = 0.4 0 Vds 0 Ioff = Ids @ Vgs = 0, Vds = VDD Cutoff 0.2 0.4 0.6 0.8 1 Electric Fields Effects Vertical electric field: Evert = Vgs / tox Attracts carriers into channel Long channel: Qchannel Evert Lateral electric field: Elat = Vds / L Accelerates carriers from drain to source Long channel: v = Elat Coffee Cart Analogy Tired student runs from VLSI lab to coffee cart Freshmen are pouring out of the some other lecture Vds is how long you have been up Your velocity = fatigue × mobility Vgs is a wind blowing you against the glass (SiO2) wall At high Vgs, you are buffeted against the wall Mobility degradation At high Vds, you scatter off freshmen, fall down, get up Velocity saturation Don’t confuse this with the saturation region Velocity Saturation When A strong enough electric field is applied: the carrier velocity in the semiconductor reaches a maximum value saturation velocity the carriers lose energy through increased levels of interaction with the lattice, collisions and by emitting phonons Velocity Saturation Velocity Saturation Velocity Saturation Velocity Saturation At high Elat, carrier velocity rolls off Carriers scatter off atoms in silicon lattice Velocity reaches vsat Electrons: 107 cm/s Holes: 8 x 106 cm/s Better model Vel Sat I-V Effects Ideal transistor ON2 current increases with VDD2 2 W Vgs Vt I ds Cox Vgs Vt L 2 2 Velocity-saturated ON current increases with VDD I ds CoxW Vgs Vt vmax Real transistors are partially velocity saturated Approximate with a-power law model Ids VDDa 1 < a < 2 determined empirically (≈ 1.3 for 65 nm) Alpha model Transistor to operate in region: (moderate supply voltages) v no longer inc. with field but not completely saturated a – velocity saturation index For the Transistors with Long channels or Low Vdd quadratic I-V characteristics in saturation Alpha = 2 (max) More velocity saturated increasing Vgs less effect on current Alpha decreases (reaching 1 for completely velocity saturated) Simply THE MODEL HAS STRAIGHT LINE IN LINEAR REGION Alpha model 0 Vgs Vt cutoff Vds I ds I dsat Vds Vdsat linear Vdsat I dsat Vds Vdsat saturation I dsat Pc V 2 gs Vt a Vdsat Pv Vgs Vt a /2 Pc, Pv and alpha are found by fitting the model to the empirical modeling results Empirical Modeling Refers to any kind of (computer) modelling based on empirical observations rather than on mathematically describable relationships of the system modelled. The word empirical denotes information gained by means of observation, experience, or experiment Channel Length Modulation Reverse-biased p-n junctions form a depletion region Region between n and p with no carriers Width of depletion Ld region grows with reverse bias Leff = L – Ld Shorter Leff gives more current Ids increases with Vds Even in saturation GND Source VDD Gate VDD Drain Depletion Region Width: Ld n + L Leff p GND n + bulk Si Channel length modulation • Increasing Vds increases depletion width decreases effective channel length increases current Channel length modulation factor (empirical factor) Next . . . Threshold Voltage Effects Leakage Body Effect Drain-Induced Barrier Lowering Short Channel Effect Subthreshold Leakage Gate Leakage Junction Leakage Process and Environmental Variations Threshold Voltage Effects Vt is Vgs for which when the channel starts to invert Means Vgs has the control of thresh hold Ideal models assumed Vt is constant Really depends (weakly) on almost everything else: Body voltage: Body Effect Drain voltage: Drain-Induced Barrier Lowering Channel length: Short Channel Effect Body Effect Body is a fourth transistor terminal Vsb affects the charge required to invert the channel Increasing Vs or decreasing Vb increases Vt Vt Vt 0 g fs Vsb fs fs = surface potential at threshold fs 2vT ln NA ni Depends on doping level NA And intrinsic carrier concentration ni g = body effect coefficient 2q si N A t g ox 2q si N A ox Cox DIBL Electric field from drain affects channel More pronounced in small transistors where the drain is closer to the channel Drain-Induced Barrier Lowering VVV ttds Drain voltage also affect Vt Vt Vt Vds High drain voltage causes current to increase. Short Channel Effect In small transistors, source/drain depletion regions extend into the channel Impacts the amount of charge required to invert the channel And thus makes Vt a function of channel length Short channel effect: Vt increases with L Some processes exhibit a reverse short channel effect in which Vt decreases with L Leakage What about current in cutoff? Simulated results What differs? Current doesn’t go to 0 in cutoff Leakage Sources Subthreshold conduction Transistors can’t abruptly turn ON or OFF Dominant source in contemporary transistors Tunnel current Gate leakage polysilicon gate Tunneling through ultrathin gate dielectric W t ox n+ Junction leakage L n+ Subthreshold conductio p-type body Reverse-biased PN junction diode current Junction leakage Subthreshold leakage is the biggest source in modern transistors Junction Leakage Reverse-biased p-n junctions have some leakage p+ n+ n+ p+ p+ n well p substrate n+ Leakage current: junction leakage and tunneling Junction leakage: reverse-biased p-n junctions have VvD T some leakage. I D I S e 1 Is depends on doping levels and area and perimeter of diffusion regions p+ n+ n+ p+ p+ n+ n well p substrate 109 0.6 nm 0.8 nm 2 JG (A/cm ) Tunneling leakage: Carriers may tunnel thorough very thin gate oxides Negligible for older processes 10 tox VD D trend 6 103 1.0 nm 1.2 nm 100 1.5 nm 1.9 nm 10-3 10-6 10-9 0 0.3 0.6 0.9 VD D 1.2 1.5 1.8 Temperature Sensitivity Increasing temperature Reduces mobility Reduces Vt ION decreases with temperature IOFF increases with temperature I ds increasing temperature Vgs Process variations threshold voltage 0.97V threshold voltage 0.57V Both MOSFETs have 30nm channel with 130 dopant atoms in the channel depletion region Process variations impact gate length, threshold voltage, and oxide thickness So What? So what if transistors are not ideal? They still behave like switches. But these effects matter for… Supply voltage choice Logical effort Quiescent power consumption Pass transistors Temperature of operation