COMPANY PROFILE
公司簡介
 Location:
地理位置：
桃園縣大園鄉
Taoyuan Country
 Factory Site：14,900m2 / 160 kSF 廠房面積： 4,500坪
 Employee：165 persons
員工人數：165人
 15 min From International Airport
1
COMPANY PROFILE
公司簡介
 Established：Dec, 1997
 創立日期：1997年12月
 Start Operation：Jul, 1999
 投產日期：1999年7月
 ISO-9001 Certified：Sep, 2000
 ISO-9001認證：2000年9月
 Mass-Lam Startup：Apr, 2004
 Mass-Lam 投產：2004年4月

Emerging Market：Jul, 2004
 興櫃股票交易：2004年7月

TS16949 Certified : Mar, 2011(FST)
 TS16949認證 : 2011年3月

IS14000 Certified : Jun, 2011(FST)
 IS14000認證 : 2011年6月

OTC Stock Marking : May, 2011(FST)  OTC店頭市場 : 2011年5月
2
COMPANY PROFILE
公司簡介

Sales Revenue：
 營業收入：
2004: US＄38M
2004年: 12億5仟萬元
2005: US＄46M
2005年: 14億8仟萬元
2006: US＄52M
2006年: 17億2仟萬元
2007: US＄43M
2007年: 13億8仟萬元
2008: US＄31M
2008年: 10億元
2009: US＄28M
2009年: 9億元
2010: US $ 50M
2010年 : 15億元(FST)
※ SR ( 2004-2007 ) including CCL and Mass-Lam
3
Sales Revenue營收成長
20
17.2
15
14.8
15
13.8
12.5
10
10
9
5
0
NT$ 億
2004
2005
2006
CCL + MASS-LAM
2007
2008
2009
CCL
2010(f)
4
PRODUCTS ( FR-4 )
產品 ( FR-4 )
FR-4 Laminates & Prepregs
Di-functional (雙功能)
 Tetra-functional (四功能)
 High Performance (高性能)
5
PRODUCTS ( MC-CCL )
產品 ( MC-CCL )

Thermal Conductive RCC (TCR)
( Resin- Coated Copper )

Thermal Conductive Prepreg ( TCP )
( With glass fiber )

Thermal Conductive Film ( TCC )
( With glass fiber )

Thermal Thin Core ( TTC ) - for mass-lam use.
6
PRODUCTION
生產
10%
CCL
P/P
90%
Product
Application( 產品應用 ) 5C：
Computer (資訊)
： PC, Note Book
Communication (通訊)
： Cellular, Internet
Consumer (消費性產品) ： DVD, PS, X-Box
Car (汽車)
： Inst Panel,
Controller / Others (其他) ： Instrument, Calculator, Controller
7
SALES COVERAGE
銷售分佈
Export
Domestic
30%
韓國(KOREA)
美國(USA)
70%
大陸(CHINA)
歐洲(EUC)/中東(MIDDLE EAST)
其他(Others)
8
MANUFACTURING PROCESS
製程
Àô®ñ¾ð¯×
·»¾¯ µw¤Æ¾¯
Epoxy Solvent Hardener
¯N ½c
Oven
ÂH ¦X ¤ù
½Õ ½¦
Varnish
preparation
¬Á ¼þ ¥¬
Glass Fabric
§t ®û ³B ²z
Treating
ÀË Åç
Inspection
¤Á ³Î
Sheeting
Å| ¸m
Core-up
»É ¥Ö
Copper Foil
²Õ ¦X
Lay-up
À£ ¦X
Lamination
¤Á ªO
Trimming
ÀË Åç
Inspection
¥] ¸Ë/¥X ³f
Packing/Shipping
9
PRODUCTION EQUIPMENT(1)
生產線設備(一)
TAKUMA - VERTICAL TREATER
立式上膠機 / 日本 Takuma
Features
：Drying by IR radiant combined
with hot air
Advantages：Ensure
uniform and stable
prepreg properties
10
PRODUCTION EQUIPMENT(2)
生產線設備(二)
AIKI AUTOMATED LAY-UP LINE
自動組合線 / 日本愛機
Features
：”Sandwich” type lay-up line in
clean room
Advantages：Ensure
laminate surface quality
11
PRODUCTION EQUIPMENT(3)
生產線設備(三)
KITAGAWA VACUUM PRESS
真空熱壓機 / 日本北川
Features
：Vacuum assisted and hot / cold
transfer system
Advantages：Ensure
even thickness and
consistent dimensional
stability
12
FINAL INSPECTION & AUTO PACKING(4)
檢驗線及自動包裝機(四)
FINAL INSPECTION
檢驗線
AUTO PACKING
自動包裝機
13
AUTOMATED STORAGE &
RETRIEVING SYSTEM(5)
自動倉儲系統(五)
日本大福
Features ：Integration of AS/RS and MIS System
Advantages：Ensure warehouse efficiency
Makers :
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CAPACITY
產能
-- CCL ：240 K sheets / month
銅箔基板： 24 萬張/月
-- P/P ：1,250 K m / month
黏合膠片：125 萬米/月
-- MC-CCL : 200 K panel / month
LED用-金屬基板 : 20 萬片/月
( 510 x 610 mm 標準尺寸 )
15
PRODUCT OFFERING
產品範疇
-
-
CCL：
Copper
Thickness
H oz ~ 6.0 oz
3 Mil ~ 197 Mil
(0.08 mm) (5.0 mm)
P/P ： 1080 / 2116 / 7628 / 7629 / 7630 / 1506
- MC-CCL : Copper
Insulating Thickness
1 oz
~ 6 oz
2 mil ~ 10 mil
50 μm ~ 250 μm
Al-Base Thickness :
0.6 / 1.0 / 1.5 mm
K值:導熱係數 1.5 / 2.0 / 3.0 / 6.0 W / mK
16
SUMMARY OF FR-4 PRODUCT
FR-4產品概要
UL File No.E199230
PRODUCT
Normal
CCL
HF
Normal
PP
B/S
SM-730R,M
Yellow
140
SM-730R,M (150Tg)
Yellow
150
SM-750R,M (170Tg)
LF
LF
HF
COLOR Tg。C
SM-750R,M (180Tg)
Yellow
Yellow
SM-560
170
180
140
Yellow
DESCRIPTIONS
Tetrafunctional Epoxy
Laminate, UV Block, AOI
Fluorescence Capability
Multifunctional Epoxy
Laminate,UV Block, AOI
Fluorescence Capability,
High Tg
Tetrafunctional Epoxy Laminate,
UV Block, AOI Fluorescence
Capability,Halogen -free
SM-730B
Yellow
140
Tetrafunctional Epoxy Prepreg
SM-730B (150Tg)
Yellow
150
Tetrafunctional Epoxy Prepreg
SM-750B(170Tg)
Yellow
170
Multifunctional Epoxy Prepreg
SM-750B(180Tg)
Yellow
180
Multifunctional Epoxy Prepreg
SM-560B
Yellow
140
Size Maximum:
37”*49”
41”*49”
43”*49”
GENERAL
SPECIFICATION
Thickness
0.003” ~ 0.197”
(0.08mm~5.0mm)
Copper Cladding
0.5oz ~ 6.0oz
(0.018mm~0.204mm)
Size
inch
(mm)
36.8x48.8 (935x1240)
40.8x48.8 (1036x1240)
42.8x48.8 (1087x1240)
Size
7628:1250mmx150M
1080:1250mmx300M
2116:1250mmx250M
1506:1250mmx150M
Tetrafunctional Epoxy Prepreg
17
Product FR-4 Roadmap
Under developing
Lead free process
compatibility
Special Laminate
4)SM750-5
5)SM750-7
6)SM750-8
Green HF Laminate
7)SM560-4
8)SM560-5
1)SM730-4
2)SM730-E
3)SM730-5
2000
FR-4
High CTI(>600volts)
Laminate
Normal FR-4 (Dicy)
Cost advantage
High Thermal
reliability (PN)
11) High Perf.Tg180(SM780-8)
12) Fast Cure(SM750-T)
13) Low Dk/Df (SM780-LK)
14) Anti-Migration (SM750-CAF)
15) Phosphate & Halogen Free
(SM560-PHF)
9)SM560-C
10)SM630-4
2005
2010
2015
Updated 2010.10.10
H
Performance
Product Offerings
性
能
SM780-8
High Thermal reliability
Low z-CTE Tg 180 High
Reliability Laminate
Tg 180 Thermal
SM750-8 Reliable Laminate
SM750-M
Tg 170
Multifunctional
for Thermal Reliable IC
Substrate & Telecom PWB
VS(IT180A/370-HR comp)
for High Layer Count
Dimensional Stable(IT180 comp)
for High Layer Count &
Low flow applications(IS-410 comp)
for D/S &
Tg 150 Halogen
multiplayer(IT140/NPGN-150R
comp)
Free Laminate
SM560-C
for Medium to High
HI CTI >600V+Halogen Free SM730-5 Tg 150 Normal FR-4
Layer Count Multilayer
Multifunctional
Tg 140 Laminate
for D/S &
Tg 140 Halogen
SM560-4
Multilayer
HI CTI >600VTg 140
Free Laminate
SM630-4
Laminate
for Low to Medium Layer Count
Tg 145 Normal
SM730-E
Multilayer
FR-4 Multifunctional
for D/S &
Rigid Board
L
L
SM730-4
SM560-5
Tg 140 Normal FR-4 for Double Side
Rigid Board
Rigid Laminate
應用
Application
H
Updated 2010/10/10
19
Metal-CCL
PROPERTY
TCC
TCC-A18
TCC-A22
80 +/- 5
80 +/- 5
510 x 610 mm
510 x 610 mm
>= 1.0
>= 1.0
IPC-TM-650 2.4.9
Solder dip test ( 288oC, 30sec )
Pass
Pass
IPC-TM-650 2.4.13
Chemical resistance
Pass
Pass
IPC-TM-650 2.3.2
Flammability ( UL )
94V-0
94V-0
UL-94
Surface resistance ( ohm )
> 1014
> 1014
IPC-TM-650 2.5.17.1
Volume resistance ( ohm-cm )
> 1015
> 1015
IPC-TM-650 2.5.17.1
Breakdown voltage ( AC, V/mil )
1,000
1,000
IPC-TM-650 2.5.6
Glass transition temp ( oC )
120
120
IPC-TM-650 2.4.25
Thermal conductivity ( W/mK )
1.8
2.2
ASTM-D5470
Dielectric thickness ( um )
Size ( mm )
Peeling strength ( kg/cm )
TEST METHOD
20
Metal-CCL
PROPERTY
TCC
TCC-A15
TCC-A20
80 +/- 5
80 +/- 5
510 x 610 mm
510 x 610 mm
>= 1.0
>= 1.0
IPC-TM-650 2.4.9
Solder dip test ( 288oC, 30sec )
Pass
Pass
IPC-TM-650 2.4.13
Chemical resistance
Pass
Pass
IPC-TM-650 2.3.2
Flammability ( UL )
94V-0
94V-0
UL-94
Surface resistance ( ohm )
> 1014
> 1014
IPC-TM-650 2.5.17.1
Volume resistance ( ohm-cm )
> 1015
> 1015
IPC-TM-650 2.5.17.1
Breakdown voltage ( AC, V/mil )
1,000
1,000
IPC-TM-650 2.5.6
Glass transition temp ( oC )
120
120
IPC-TM-650 2.4.25
Thermal conductivity ( W/mK )
1.5
2.0
ASTM-D5470
Dielectric thickness ( um )
Size ( mm )
Peeling strength ( kg/cm )
TEST METHOD
21
Metal-CCL
PROPERTY
TCP
TCP-A20
TCP-A10
70 +/- 5
70 +/- 5
510 x 610 mm
510 x 610 mm
>= 1.0
>= 1.0
IPC-TM-650 2.4.9
Solder dip test ( 288oC, 30sec )
Pass
Pass
IPC-TM-650 2.4.13
Chemical resistance
Pass
Pass
IPC-TM-650 2.3.2
Flammability ( UL )
94V-0
94V-0
UL-94
Surface resistance ( ohm )
> 1014
> 1014
IPC-TM-650 2.5.17.1
Volume resistance ( ohm-cm )
> 1015
> 1015
IPC-TM-650 2.5.17.1
Breakdown voltage ( AC, V/mil )
1,000
1,000
IPC-TM-650 2.5.6
Glass transition temp ( oC )
120
120
IPC-TM-650 2.4.25
Thermal conductivity ( W/mK )
2.0
1.5
ASTM-D5470
Dielectric thickness ( um )
Size ( mm )
Peeling strength ( kg/cm )
TEST METHOD
22
LABORATORY EQUIPMENT(1)
實驗室設備(一)
Thermal Mechanical Analyzer (TMA) / DSC / TGA
- Tg & CTE & Td:
熱機械分析儀
Digital Viscometer
- Prepreg Rheology Monitor
高剪切率粘度計
X.Y.Z.-Axis 3D Measuring Instrument
3D - Dimensional Stability
三次元測定儀
Isothermal chamber (85°C/ 85RH) Simulator / 恆溫恆溼爐
HT ( High Temp) Furnaces / 高温爐
23
LABORATORY EQUIPMENT(2)
實驗室設備(二)
Universal Tester
- Mechanical Properties Measurement
萬能拉力機
LCR Meter
- Dielectric Constant & Electrical
Measurement
介質常數及電氣性能測量儀
Lab Test
- Chemical Analysis
化驗室
24
LABORATORY EQUIPMENT(3)
實驗室設備(三)
TIM Tester
-Thermal Resistance and Thermal Conductivity
界面材料熱阻值及熱傳導係數量測儀(K-值)
Puncture / Insulation Tester
- Dielectric Breakdown Voltage,ac
耐壓絕緣測試器
Tracking Resistance Tester
- CTI
抗漏電壓指數測試機
25
LABORATORY EQUIPMENT (4)
實驗室設備(四)
Differential Scanning Calorimeter (DSC)
- Tg
示差掃瞄分析儀
Thermo-gravimetric Analysis (TGA)
- Td
熱重量分析儀
Metallurgical Microscope
- Micro-section
金像顯微鏡
26
OUR COMMITMENTS
經營理念
We are a customer-oriented company,
demonstrating mutual respect
and trust to customers
and growing through
continuous innovation.
客戶導向
創新成長
誠信互惠
永續經營
27
QUALITY POLICY / 品質政策
We satisfy customers via
training our employees
to drive for excellence
and continuously improving
our internal process.
不斷訓練 追求卓越
持續改善 滿足客戶
28
核心價值
1. We are a family.
2. We create more shine.
3. We want 4E +1C
Energy – 活力
Energizer – 激勵
Edge – 利基產品
Execution – 執行力
4. Compete To Win
快一點 + 好一點 + 有效率一點
Faster in working. Better in quality.
More effective in cost competition.
29
ShineMore
全員工作哲學 - 4E+1C
Energy：活力
Energizer：激勵
Edge：利基
Execution：執行力
Compete To Win ： 快一點 + 好一點 + 有效率一點
……….
30
努力
每天您少
用心
10
10%
10年後(0.9) =0.35
每天您多
努力
10%
用心
10
10年後(1.1) =2.59
您選擇哪一種呢?
~總經理與大家 共勉之~
31