純玻璃觸控技術比較
比較項目
電容式
(Capacitive)
音波式 (SAW)
紅外線式 (IR)
觸控介質
手或其他帶導
體之介質
限手或其他軟
性介質
手(可戴手套)
或其他介質
感應方式
運用人體靜電
感應電流變化
偵測聲波
訊號遮斷
電場感應
90%以上
92%以上
100%
90%
佳(錯誤率<1%)
優
佳
佳
2億次
5,000萬次
千萬次以上
透光度
觸控準確度
觸控次數
特性
應用領域
近場感應式
(NFI)
手(可戴手套)
或其他介質
千萬次
防污、防火、
防火、耐刮
防靜電及灰塵、
耐刮、反應速
度快
可靠性高、耐 防火性佳、但
刮、防火性佳、 易受其他介質
但防水及防汙 干擾
性較差
ATM、POI 、
POS、公共查
詢機(KIOSK)、
工業用設備
ATM、OA事
醫療器材及其
務機、電子白 他工業、特殊
板、醫療器材、 用途設備
工業用設備
Source：全球產研整理，2001/11
公共查詢機、
自動售票機、
POI、POS、
醫療器材
Capacitive_ Surface process
Capacitive Operation Principle
Grounding
Input Current
Input Current
Input Current
Input Current
電阻式觸控面板構成及種類
Film/Film
Film/Glass
Glass/Glass
Film/Plastic
Dot
(Film or Plastic)
Spacer
上側
Film
Film
Glass
Film
下側
Film
Glass
Glass
Plastic
特性
應用產
品
1.重量輕
2.應用二層Film的貼
和，透光率至少
(80%以上)
FA用途
Source：全球產研整理，2001/11
1.目前最主流使用
之產品，技術最成
熟
2.透光率達82%以
上
PDA
適合條件惡劣的環
境使用，抗候性、
抗衡性佳
車用顯示器
1.質量輕、不易破損
2.透光率可達80%以
上
PDA
電阻式觸控面板電極配線方式
四線式
上
部
電
極
下
部
電
極
X1
五線式
七線式
X2
Y1
Y1
Y1
X1
1.為最一般之配線方
式，不受專利權限制
2..產品不耐刮、壽命
較短
3.價格最低
Y2
1.美商ELO Touch
System及3M Touch
System之專利技術
2.改良四線式不耐刮
之缺點
Source：全球產研整理，2001/11
八線式
X1
X3
X2
X4
Y1
Y2
Y3
Y4
X1
X2
Y2
特
性
六線式
X2
Y2
1.國內廠商宇宙光電之
專利技術
2.除耐刮外，更增加防
電磁波及噪音功能
1.日商富士通之專利技
術
2.耐刮、準確度較高
1.3M Touch System
之專利
2.耐溼度及環境溫度
變化，適合工業用途
電阻式面板結構
手指或筆等介質
( (Hard Coat Layer)
硬殼層
薄膜電極
(Film Electrode)
薄膜(ITO Membrane)
上部電極(Electrode X1)
點隔片(Dot Spacer)
下部電極(Electrode Y1)
玻璃電極
(Glass Electrode)
Source：全球產研整理，2001/11
玻璃基板或薄膜
(Glass or Film Plate)
電磁感應式 Digitizer_ structure
Battery Free, Digital Pen
Cover and Protective Glass
LCD Display
Sensor Board
Optical_ Infrared
http://www.elotouch.com/products/Touchscreens/CarrollTouch/howitworks.asp
*Ref.[5]
Integrated Touch Panel
AUO Proprietary & Confidential
Optical_ Photo sensor
Readout TFT
Select
line
Cst2
Black Matrix
Color Filter
Pixel ITO
Blue pixel
Photo TFT
W/L=6/6
Data line
*Ref.[6]
Sense line
Photo-Sensor
TFT
Readout TFT
Operating of Press_Type Touch Panel
△Clc2 will depend on the pressure.
Release
Press
Clc
Clc
reset
VCOM
Address TFT
Select
Cst on Com
Cfb
Clc
Clc2 changed
to Short
VOUT
Readout TFT
－
Clc2
＋
CF VCOM (DC is better)
Charge Amplifier
VREF
Provide by RSEF0 JM
Display Sensor
Area
Area
Touch Panel
Touch Panel: PS on CF
CF
1.4mm
Cell Gap
(normal
area)
4.8mm
ITO
(0.075mm)
Photo Spacer
(4.0mm)
Photo
Photo
Spacer
Spacer
Cell Gap (Sensing Area)
0.6mm
Pixel
electrode
Space >
5mm
Pixel
electrode
 Similar Hybrid PS structure
 No need to add bump, but CF ITO is deposited on PS.
 The space between PS and PX should be larger than 5mm in case
of alignment shift.
Touch Panel for New User Interface
UI focusing on finger input (UI defines how user operates the device; not touch panel)
Apple iPhone
LG PRADA
HTC Touch
Screen Size
3.5” (HVGA 480x320)
3.0” (WQVGA 400x240)
2.8” (QVGA 320x240)
Touch Panel
Capacitive Touch Panel
Capacitive Touch Panel on Protective
Screen (Synaptics)
Resistive Touch Panel
Multi-touch
Multi-touch
Single-touch
Single-touch
Operation
Two hand
Single hand
Single Hand
UI
iPhone UI on OS-X
Adobe Flash Lite UI
Windows Mobile &
HTC’s TouchFLO
Finger input only applications: DSC, Car navigation, PMP, MP3, information display
For PDA, smart phone or GPS, UI can cover the need of pen writing using on-screen keypad.
Non-Contact Presence Sensors
(Proximity)
•
•
Capacitive Type Touch Panel
•
Proximity of object to sensor provide different capacitance value for sensors
•
Detection of sensor can be done with two types
•
E-field Sensor
•
Detection of capacitance by change of electric field
•
Capacitive Sensor
•
Detection of capacitance by measuring holding charge
Other sensor types
•
Inductive Sensors
•
Detection of the proximity of metal objects only (electro-magnetic)
•
Optical Sensors
Capacitive Touch Panel
•
Sensor Design Consideration
TPII Proposal v1
AG
AG
Glass (0.5mm)
Touch Sensor Set
PF
CF Glass
Color Resist
PF
CF Glass
Color Resist
LC
LC
TFT
TFT
Feature:
 Easy Process- Not necessary to be traIt could be attached by 雙面膠 in
module process.
Issue:
 Thick module-An extra glass and AG film is necessary.
TPII Proposal v2
PF
Touch Sensor Set
CF Glass
Color Resist
LC
TFT
Feature:
 Thin module—No need extra glass.
Issue:
 Process complexity– Due to CF maker could not pattern ITO,
it is necessary to finish touch panel in Array Fab before CF
process.
TP side process
TP Sensor Process Flow
Glass 入料
3F ITO line
2F TBM line
ITO Sputter
ITO Etching
3F OC line
OC1 deposit
On cell
OC2 deposit
3F PS line
Metal Etching
Metal Sputter
3F Metal etching line
2F Cr line
APR Printing
3F PI coater line
TP2
OC1
Moly
ITO
Glass
TP side process
Glass
ITO target
ITO Sputter
ITO Etching
OC2 Process
APR Process
Moly Etching
OC1 Process
TP Sensor One Glass Process ( 5PEP )
BM deposit
ITO Sputter
ITO Etching
Metal Etching
Metal Sputter
OC1 deposit
Glass 入料
APR Printing
OC2 deposit
TP sensor
BM
Glass
Compare 5 pep with 6 pep
process
OC2
ITO
Metal
BM
1. The original 6 peps design to a
new 5 peps design.
OC0
OC2
Metal
ITO
BM
OC1
`
2. The new 5 peps design has few
advantages, as cost down, lead
time reduced and etc.
One glass _ Original design with OC0 process
Process sequence :
BM, black matrix
BM
(black matrix frame) 
OC0, over coat layer0
BM
OC0
(isolated BM and ITO) 
ITO
ITO,
(patterned sensor) 
BM
OC0
One glass _ Original design with OC0 process
Process sequence :
ITO
OC1, over coat layer1
BM
OC0
(isolated ITO & metal) 
Metal
ITO
Metal, metal bridge
(sensor connection) 
BM
OC0
OC2
Metal
OC2, over coat layer2
(Protection coating) 
ITO
BM
OC0
One glass _ New design remove OC0 process
Process sequence :
BM, black matrix
BM
(black matrix frame) 
ITO,
ITO
(patterned sensor) 
BM
OC1, over coat layer1
(isolated ITO & metal) 
ITO
BM
OC1
One glass _ New design remove OC0 process
Metal
Metal, metal bridge
ITO
(sensor connection) 
BM
OC1
`
OC2
Metal
OC2, over coat layer2
(Protection coating) 
ITO
BM
OC1
`
CF side process
CF Process Flow
2F RED line
Glass reserve
BM Formation
R resistor
coating
2F BLU line
B resistor
coating
PS
ITO
OC
2F PS line
2F ITO line
G resistor
coating
2F Thermal OC line
2F GRN line
Cr BM Process
空白玻璃
鍍第一層Cr膜
上光阻(coating)
光罩
去光阻液
強酸液
顯影液
對準,曝光(stepping)
去光阻(striping)
蝕刻(etching)
顯影(developing)
RBM Process
光罩
空白玻璃
塗佈Resin film
顯影液
顯影成膜及硬烤
對準,曝光(exposing)
RGB Process _ part 1 (2F_RGB
line)
Slit coater
光罩
BM玻璃
R光阻塗佈
=> Spin
曝光
Slit coater
光罩
曝光
B光阻塗佈
=> Spin
R顯影成膜及硬烤
RGB Process _ part 2 (2F_RGB
line)
Slit coater
B顯影成膜及硬烤
G光阻塗佈
=> Spin
三色成品檢驗
曝光
B顯影成膜及硬烤
OC Process (2F_Thermal OC line)
Spinless
RGB基板
OC layer塗佈
烘烤
ITO Process
ITO靶
RGB+OC基板
在基板上放遮罩
移去遮罩之成品
濺鍍
鍍好ITO膜之基板
MVA Process (4F_MVA line)
UV 燈
MVA光罩
MVA光阻塗佈及旋轉
烘烤
曝光
顯影
PS Process (2F_PS line)
UV 燈
PS光罩
PS光阻塗佈及旋轉
顯影
曝光
烘烤
TPII Mask Design
1. TPII 5m X 5m design ( Cypress Design )
TPII V1 : 根據Cypress Design Guide line 設計
Sensor size = 4.9mm x 4.9mm
Sensor spacing = 0.3mm
Sensor bridge width = 50um
Space = 0.3mm
Sensor density = 14*8
2. TPII 5m X 5m design ( for Yokohama )
V2
Sensor size = 4.9mm x 4.9mm
Sensor spacing = 0.3mm
Dummy width = 240um
ITO spacing = 30um
Sensor size = 4.9mm x 4.9mm
Sensor spacing = 0.3mm
Dummy width = 60um
ITO spacing = 30um
TPII Type G v2 Design
Capacitive Sense Touch panel (Sample output:8/E)
Sensors in the same plane
Sensors in 2 plane
ITO bridge
ITO
300A
A
PC403
3.0um
dummy
ITO
300A
sensor
dummy
sensor
dummy
dummy
30um
PC403
3um
Glass
ITO
300A
ITO
300A
SiNx
1000A
PC403
3.0um
ITO
300A
ITO
300A
PC403
3um
PC403
3um
B
30um
30um60um
sensor
sensor
sensor
sensor
dummy
Glass
Glass
Cypress : 10k
TPII v2 : 40~50k (14X), 105pF (14X)
Type
1st
insulator
2nd
insulator
T%
( x, y )
R 7.5X (1X)
B
SiNx
PC403
95.36%
(0.315,0.322)
28.8K (4.6k)
B
PC403
PC403
91.53%
(0.316,0.323)
23.6K (3.1k)
A
PC403
PC403
91.90%
(0.321,0.329)
23.2K (3.1k)
LCDs with Integrated Touch Panel
Wintek
(Current
status)Cypress
CapSense
AUO
Samsung
iTSP
Samsung
hTSP
TMD
Sensor
Type
In-cell
Capacitive /
Switch Sensor
External
Resistive Sensor
In-cell
Capacitive
Sensor
In-cell Photo
Sensor
In-cell
Capacitive
Sensor
Capacitive
(in-cell or
integrated oncell)
External
Capacitive
Sensor
Detection
Pressure
<50g (touch
mura)
Pressure
required
Pressure
required
0g
0g
0g
0g
LCM
Thickness
LCM only
LCM + 1 film
LCM only
LCM only
LCM only
LCM only
LCM only +
external TP
Input Method
Finger or stylus
Finger or stylus
Finger or
stylus
Finger or light
pen
Finger or metal
stylus
Finger or metal
stylus
Finger or metal
stylus
Pen Writing
YES
YES
YES
YES
YES
YES
YES
Multi-touch
YES
NO
YES
YES
YES
YES
YES
Issues
Touch Mura
Dual side
process for CF
Touch Mura
Touch Mura
Lighting
required for
sensing
Patterned ITO
process for CF
Patterned ITO
process for CF
Vendor
focuses on TP
on protection
screen
Demo
3.6” QVGA
4.8” WSVGA
7.0” WVGA
(SID 2007)
3.5” QVGA
2.8” WQVGA
(SID 2007)
3.5” QVGA
(SID 2007)
Currently, there are only 4 companies with multi-touch technology and patent license:
1. Synaptics, 2. Cypress, 3. ALPS, 4. EMC
Synaptic
Onyx
LG PRADA
phone
Touch Panel Technology Comparison
AUO (Current)
Traditional
Resistive
Traditional
Capacitive
Multi-touch
Resistive
Multi-touch
Capacitive
Photo
Cypress
CapSense
Sensor
Type
In-cell Cap. /
Switch Sensor
Resistive Sensor
Capacitive Sensor
Res. Sensor
Array
Cap. Sensor
Array
Photo Sensor
Array
Cap. Sensor
Sensing
Pressure
Pressure
Proximity
Pressure
Proximity
Shadow
Proximity
Pressure
<50g
< 30g
0g
< 30g
0g
0g
0g
LCM Thickness
LCM only
LCM + 1 glass /
film
LCM only
LCM + 1 glass
/ film
LCM only
LCM only
LCM only
ITO for TP
0
2
1
2
1
0
1
Transmittance
80%
80%
90%
80%
90%
80%
90%
Input Method
Finger or stylus
Finger or stylus
Finger or metal
stylus
Finger or
stylus
Finger or metal
stylus
Finger or light
pen
Finger or metal
stylus
Pen Writing
YES
YES
YES **
YES
YES **
YES ***
YES **
Multi-touch
YES
NO
NO
YES
YES
YES
YES
Single Hand
YES *
YES *
YES
YES *
YES
YES ****
YES
Detection
Simple /
Complicated
Simple
Complicated
Simple
Complicated
Most Complicated
Complicated
Issues
Touch Mura vs
pressure
TP cavity, film
process, patterned
ITO on CF
patterned ITO on
CF
TP cavity, film
process,
patterned ITO
on CF
patterned ITO on
CF
Lighting required,
complex
algorithm
Patterned ITO for
CF
HTC Touch
Mid / Small size
application
LG Prada
Large / Mid Size
application
Apple iPhone
TMD
WinTek
Application
* Single hand operation can be achieved if pressure is < 20g
** Stylus with metallic tip required for pen writing
** Light Pen required for pen writing
*** Single hand operation depends on software capability
Touch Panel Technology
Comparison
Capacitive
Tech.
Acoustic
Optical
Resistive
電磁感應式
Digitizer
Infrared
Detection
Current
Electric
field
Wave
absorption
Wave
generation
Light
interruption
Photo
current
Voltage
Magnetic field
Input
medium
Finger,
conductive
stylus
Finger,
Gloves, or
conductive
stylus
Finger,
Gloves
Finger,
Gloves, or
Stylus (All)
Obstacle
Finger,
Gloves
Finger, Gloves, or Stylus (All)
專用電磁筆
特性
(差異點)
較次電靜反
不使或電應
適用溼及速
用需度灰度
於作造塵快
小校成 、
尺正誤但防
寸 動容污
面成作易、
板本 因防
高每靜
水外高
、陽精
灰光確
塵下度
等使
用抗
震
不
怕可
雨在
、戶
,
(
優點:
1.可整合現
行製程
2.Longer
life time
缺點:
1.環境光影
響大
點改
良
表四
層線
破式
損不
時耐
仍刮
可之
使缺
用
6W
訊耐
刮
、
防
電
磁
波
、
防
雜
7W
耐
刮
、
準
確
度
較
高
8W
用環特
途境性
溫同
度四
變線
化式
適耐
合溼
工度
業及
優點:
1.成本低, 較輕薄
2.干擾性小
3.可增加palm rejection function
缺點:
1.透光率差
2.怕火
3.需施加壓力才能感應
也電
可磁
感筆
應不
到需
位接
置觸
訊到
息面
板
,
容
易
不
耐
刮
、
壽
命
短
、
便
宜
5W
,
,
),
優點:
1.防刮, 耐高溫
2.透光度高
3.手輕微碰觸即可動作
缺點:
1.製程較複雜
2.過去有專利問題, 成本較高 (APR例外)
3.易受周圍環境影響 (Surface, SAW, IR)
因應
環用
境於
光小
而尺
誤寸
動面
作板
,
,
)
析較可
度差靠
發較、性
光差容高
量精易
會密誤但
衰度動防
退不作水
及
高、防
解
污
4W
,
,
,
,
,
易
受
價移只佳拖
格現需 曳
便象出防、
宜 廠水耐
校、久
正防性
一塵、
次、穩
防定
無油性
飄
,
,
, Palm rejection,
(
,
,
優/缺
雜怕
質水
干、
擾油
水污
及
溼灰
氣塵
LED
APR
Item
,
SAW
Photo
Sensor
,
Surface
Projected
(NFI)
優點:
1.壓力感應度高
2.手掌接觸到面板
時不會誤動作
缺點:
1.需專用電磁筆
2.體積大, 組裝不
易, LCD內需設
置硬體線路
Resolution
1024 X 1024
4096 X 4096
1024 X 1024
4096 X 4096
1024 X 1024
4096 X 4096
1024 X 1024
4096 X 4096
100 X 100
1000 X 720
1024 X 1024
1024 X 1024
4096 X 4096
(視Driver, 應用電壓 及面板大小決定)
1024 X 1024
4096 X 4096
Response
time
15 ~ 24ms
3ms/3M
<20ms
<10ms
<10ms
50 ~ 300ms
<16.6ms
(60Hz)
<20ms
<8ms
Cost (USD)
4 ~ 10
/inch
5~8
/inch
3~7
/inch
--
2~5
/inch
0.6 ~ 1.4
/inch
1~2
/inch
7 ~ 10
/inch
Source: 全球產研整理2000/10 & 2001/11, 中華液晶資訊網2002/05, 工研院IEK-IT IS計畫2006/03, 時緯科技2003/05, Hi touch2005/04, Microtouch, G touch
Touch Panel Technology Application
Tech.
Capacitive
Acoustic
Optical
Resistive
Surface
Projected
(NFI)
SAW
APR
Infrared
Photo
Sensor
○
○
○
○
○
5W
6W
7W
○
○ ○
△
△ ○
AV
○
○
○
△
△
○
NB**
○
○
○
△
△
○
○
○
○
○
△
△
○
○
○
○
○
△
△
○
Appl.
GD*
DT
○
○
○
○
TV
○
○
○
○
Application
Size
7” ↑
42” --
10” ↑
42” --
7” ↑
42” --
2” ↑ 42”
--
○
19” ↑
2” ↑
4W
8W
電磁感應式
Digitizer
2” ↑
80” --
7” ↑
21” --
△: 較少使用
* ATM, POI, POS, 公共查詢機(KIOSK), 工業用設備, 自動售票機, 醫療器材, OA事務機, 特殊用途設備
** TABLET-PC
Source: 全球產研整理2000/10 & 2001/11, 中華液晶資訊網2002/05, 工研院IEK-IT IS計畫2006/03, 時緯科技2003/05, Hi touch2005/04, Microtouch, G
touch, KEYTEC