CHILISIN ELECTRONICS CORP.
奇力新電子股份有限公司
Company Presentation 2014
1
公司沿革
Established A Local
Ferrite Producer
Business
Expansion
World-class
Company
Major Domestic
Player
K $USD
Acquired Belkin Int’l
120,000
Formed strategic
alliance with Yageo
Revenue
100,000
Developed HighFrequency Chip
Inductor
Developed SMD
Power Inductor
80,000
Developed Mn-Zn
and Iron Core
40,000
Company
established
1972
1977
1997
1998
1999
Established China
Henan plant
Established
Korea office
Expanded China
DongGuan plant
Established China
DongGuan plant
1990
Established
U.S. office
Established
ChinaSuZhou
office
Developed WireWound and
Multilayer
60,000
Established
second plant
Developed Molding
and Thin-Film
Technology
Public listing
on TWSE
Constructed Hukou
new HQ and plant
2000
2001
2002
2003
2005
2007 2009 2011 2013
Year
2
奇力新成長 vs. 全球市場
CEC Sales Revenue
($USD ’000)
Global Value
($USD Million)
$2,700
$140,000
$120,330
$124,556
$115,000
$120,000
$2,600
$2,580
$99,433
$100,000
$2,479
$2,500
$2,408
$80,000
$2,400
$64,375
$60,000
$2,300
$2,218
$2,216
$40,000
$2,200
$20,000
$2,100
$0
2009
2010
2011
2012
2013
$2,000
2009
2010
2009~2013
Revenue Growth
CAGR
Chilisin
93.49%
17.94%
2011
2012
2013
Source: Paumanok Publications, Inc .
3
奇力新全球市場位置
Tokyo Parts
FDK 0.3% Mitsumi KOA
0.8%
0.3% 0.2%
ABC
Taiwan
1.0%
Others
Sumida
14.6%
1.0%
Delta
2013
1.6%
Volume(e)
Toko
(247B
2.4%
Sunlord
2.8%
Vishay
2.8%
Panasonic
3.5%
ABC Taiwan FDK Mitsumi KOA
0.9% 0.8%
1.1%
0.5%
Tokyo Parts
1.3%
Murata
24.1%
Panasonic
3.2%
Toko
3.5%
pcs)
Chilisin
5.1%
TDK
21.5%
Taiyo
Yuden
18.0%
Sunlord
2.0%
Others
11.7%
TDK
26.0%
2013
Value(e)
(2,394M
USD)
Taiyo Yuden
16.8%
Delta
3.6%
Chilisin
Vishay
3.6% Sumida
4.6% 5.2%
Murata
15.2%
Product Coverage: wire-wound, multilayer, and thin-film inductors for power and signal applications
Chilisin: #4 global position as 2013 global total estimated volume is 246,965Mpcs
Chilisin: #6 global position as 2013 global total estimated value is JPY246,290M (USD2,394M)
Source:株式会社マーケティング・アイ(MAKETINKUAI CORP) http://www.m-eye.co.jp/
4
2013銷售市場分布
Industrial
3%
Consumer
13%
NB
3%
Automotive
2%
Communication
41%
Mobile
16%
PC
22%
5
主要客戶
PC / Systems
Telecommunication
Consumer Electronics
OEMs / EMSs
Automotives
*Any trademarks or logos used throughout this presentation are the property of their respective owners,
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Chilisin does not claim ownership or distribution rights of the above logos
製造基地與服務據點
Taiwan
China
Korea
Taipei Office
Headquarter
Hsinchu/Hukou Plant
Henan Plant
Anyang Office
Suzhou Plant
Touliu
Powder Plant
USA
Chongqing
Office
Dongguan Plant
Hong Kong
Office
Wuhan Office
San Jose Office
7
生產廠區概況
Headquarter
Hukou, Taiwan
Factory
Dongguan, China
Factory
Henan, China
Factory
Suzhou, China
Est. 1972
Employee: 751
Est. 1997
Employee: 1,199
Est. 2010
Employee: 518
Est. 2001
Employee: 96
----------------------------------- All factories are ISO 9001 and TS 16949 certified ---------------------------------
Wire-Winding
Molding
Multi-layering
Thin-film
Through-hole
Manufacture Site
Finished Products Inventory
8
產品線與技術
Wire-winding
Molding
Multi-layering
Thin-film Process
Power Inductor
Power Inductor
Ferrite Bead
Chip Inductor
• Wide range
• for power solution
• DIP type
• for motherboard
• Up to GHZ band
• Downsize from 0402 to 0201
• For RF application
• 0201 size +/-0.1nH
Magnetic-resin
Power Inductor
Power Inductor
Chip Inductor
• 2016~3030 size
for mobile phone
• 4040~5050 size
for tablet PC
• 6060~8080 size
for TV/audio
• SMD type
• for notebook & tablet PC
Power Inductor
New - Power Inductor
• SMD Miniature type:
3225~2012 size, t: 1.0mm
• for handset & ultrabook
• Ferrite core for baseband
application
• Ceramic core for RF
application
• for USB2.0/3.0/HDMI
• 2520~1608 size, t: 0.55mm
• for handset & ultrabook
Common-mode Choke
• 0805 package
• for USB2.0
Chip Inductor
Common Mode Choke
• Baseband &RF application
• Downsize from 0402 to 0201
Core
Formation
In-house
Powder Mixing
Technology
Powder
Formula
9
產品發展趨勢
High Current
60A
40A
Green Compliance
Miniaturization
20A
REACH
01005
RoHs
0201
HF
0402
<10m
1.5mm
<5m
1.0mm
< 1m
0.5mm
Low Rdc
Low Profile
10
獲得產品認証與客戶的肯定
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




Best Partner Award from Coolpad (2012)
Best “Cooperate To Win” Award from Lenovo (2011)
Outstanding Supplier Award from SerNet (2011)
Best Supplier Award from New Kinpo (2010)
Best Supplier Award from Asus (2005)(2007)
Best Supplier Award from Solectron (2007)
 Best Supplier Award from Zyxel (2006)(2007)



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TS16949 Certification (2005)
ISO 14001 Certification (2004)
Samsung Eco-Partner Certificate (2005)
Sony Green Partner Certificate (2003)
11
值得信賴的合作夥伴
Competitive Products
 Full Range of Magnetics Series
 Sufficient Capacity Support
 Vertical integration from powder mixing to inductor manufacturing
 World-class Quality
 Cost Competitiveness
 Quick Delivery & Flexible Logistic Support
Value-added Service
 Total Solution Provider for EMI, power and RF
 Design-in Capability
 Professional Engineering Support
 Material Research & Development
 Concurrent Product Innovation
12
Thank you!
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