Company Presentation – September 2012
Contents




Company Overview
Enpirion Technology Enablers of High Density PowerSoC
Featured Products
Back-up




Product Quality/Reliability
Supply Chain Summary
Key Contract Manufacturers Currently Supported
PowerSoC Differentiation: Quantifying Ease of Design
Proprietary and Confidential
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PowerSoC
Highly Integrated Power System-On-Chip
Target Markets
Integrated:
- Power FETs
- PWM Controller
- Compensation Circuit
- Inductor
Enterprise
•
•
•
•
<=15V DC-DC switching regulators
300mA to 15A
standard product & ASSP
www.enpirion.com
Storage/SSD
Hardware/Power Designer Challenges





Test &
Measurement
Embedded/
Industrial
Optical
Networking
PowerSoC Benefits
Increasing # of power rails
More function in smaller form factors
Noise sensitivity & lower power budgets
Time-to-market Pressures; fewer resources
While improving Cost & Reliability!
Proprietary and Confidential
Telecom
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
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High efficiency, smallest size
Excellent noise/transient performance
Simple, low risk power design
Highest reliability, fewest components
Enpirion: Focused on “Power Done Right!”
 The Leader of Integrated Power IC Solutions
driving the miniaturization of DC-DC power
systems
 The only semiconductor company with all key
enabling analog power technologies
 Broad patent & IP portfolio - 45 issued + 25 pending
 Private fab-less semiconductor company since 2001
 Our products lead the discrete-to-integrated
transition in the multi-billion dollar power IC
market
 Growing 7 times faster than the power IC market
Fabrication
 Our Power, Your Innovation
 Our power enables customers to maximize
innovation without compromise.
 Smallest, coolest, fastest, easiest, most reliable
integrated power IC solutions
Proprietary and Confidential
R&D
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Sales & Support
Test & Assembly
Broad Market Demand for Uncompromised Power
Enterprise
Telecom
Network
Router
Backhaul
Server
Optical
Transport
Storage
Array
Wireless
Access
Cloud Computing
Increased density; uncompromised efficiency
Smart Phones, IPTV, Tablets
Increased density; uncompromised reliability
Highest Power Density
Combined with
High Efficiency
Low Thermals, Noise, Ripple
Fast TTM
Affordable Reliability
Industrial
Controllers
Test &
Measurement
Embedded
Computing
Solid State
Drives
Automation & monitoring sophistication, many SKUs
Increased density; uncompromised TTM & noise
Proprietary & Confidential
Storage
Memory capacity, I/O speed, & Reliability
Increased density; uncompromised TTM
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Target Markets & Our Value Proposition
Markets
Key Applications
Enterprise
Servers
NIC cards
Storage Controllers
Office Automation
Embedded,
Industrial
Telecom
Storage
Key Customers
Embedded Computing, Test
& Measurement
Revenue
Small Footprint
Energy Efficiency
Performance
Reliability
26%
Ease of Use
Small Footprint
Reliability
DSL/GPON CPE, MSAN
& Gateways
Cellular Base Stations
Solid State Drives
USB 3.0 Pen Drives
Secure USB sticks
Proprietary and Confidential
Value Proposition
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21%
Reliability
Small Footprint
Energy Efficiency
12%
Small Footprint
Ease of Design
Reliability
25%
Key Enablers of High Density PowerSoC
High Frequency
IC Technology
3 Focused
Technology
Developments
Power
Packaging
& Construction
Magnetics
Engineering
DC-DC System Engineering
Proprietary and Confidential
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Delay Box
Enpirion’s Power Technology Roadmap
2004-2010
2011
2012
2014
10V 0.25um CMOS w/ LDMOS
(up to 20MHz )
20V 0.18um CMOS w/ LDMOS
(up to 15MHz )
Semiconductor
Process
40V 0.18um LDMOS
(up to 10MHz )
Magnetics
Wire Copper on
Wound
Ferrite
SMT
Chip
Open
Bar
Closed
Bar
Alloy on
Silicon
Copper on Alloy
Hybrid Cores
Inductor
On Silicon
Gen 6
Bumped Die
RDL
Gen 7
Monolithic
Chip Scale
Packaging
Gen 1
Gen 2
Laminate Leadframe
Proprietary and Confidential
Gen 3
Stacked
Gen 4
Clips
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Gen 5
Spiral
Enpirion FET Technology = Efficiency + High Density
90%
90%
80%
80%
60%
100%
90% Line
90%
>90% Efficiency
Efficiency (%)
100%
Efficiency (%)
Efficiency (%)
100%
70%
Efficiency vs. Load Current @
Vin=12.0V
Efficiency vs. Load Current @
Vin=5.0V
Efficiency vs. Load Current @
Vin=3.3V
70%
60%
50%
50%
Vout= 1.8V
40%
2
3
4
5
6
7
Load Current (A)
6V, 0.25u LDMOS
60%
Vout= 1.8V
40%
1
70%
50%
Vout= 1.8V
0
80%
8
40%
0
1
2
3
4
5
6
7
Load Current (A)
6V, 0.25u LDMOS
8
0
1
2
3 4 5
Load (A)
6
7
12V, 0.18u LDMOS
State of the art products built with industry’s fastest performing power FET technology
Proprietary and Confidential
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8
Enpirion PowerSoC = Uncompromised Power
PowerSoC
Enpirion
75 mm2
1.85 mm height
94% @ Peak
Modules/PSiP
Competitor A
Competitor B
4-6x larger area
2.5x taller
94% @ Peak
4-5x larger area
1.25x taller
92% @ Peak
Discrete Regulators
Competitor C
7x larger area
2x taller
96.5% @ Peak
Highest Density without Compromising Performance, Reliability, Cost
Proprietary and Confidential
| 10 |
Enpirion PowerSoC  Uncompromised Power
Smallest Solution Footprint
• 50 to 80% size reduction; very low profile
Increased Reliability; Lower Total Cost
• Fully simulated/characterized/validated/production
tested power system
• >35,700 years MTBF (10x improvement); FIT 3.2
• True Industrial-rated; No de-rate, heat sink, airflow
• Fewer components/Higher assembly yield
High Performance + Low Noise
•
•
•
•
Very High Efficiency: up to 97%
Low EMI & Conducted noise (10dB margin)
Up to 95% less ripple
Secondary filtering not required
Ease-of-use
•
•
•
•
Simple Design Flow; nearly 100% 1st pass success
45% fewer Design steps
Significantly less exposure to design iteration
Fully-validated PCB files
Proprietary and Confidential
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FEATURED PRODUCTS
Proprietary and Confidential
| 12 |
Select Featured Products – 5V
Part Number
Description
Package Size (mm)
L
W
H
Solution
Size Est.
(mm2)
Device Capacity
5V Input PowerSoC Product Offering
EP5348QI
Ultra-Small Power SoC, 8MHz, "LDO Killer"
2.00
1.75
0.90
20
EP5357xUI
5MHz PowerSoC, VID, "light load mode"
2.50
2.25
1.10
20
0.6A
EP5358xUI
5MHz PowerSoC, VID
2.50
2.25
1.10
20
0.6A
EP53A7xQI
5MHz PowerSoC, VID, "light load mode"
3.00
3.00
1.10
21
1.0A
EP53A8xQI
5MHz PowerSoC, VID
3.00
3.00
1.10
21
1.0A
EN5311QI
4MHz PowerSoC, VID
4.00
5.00
1.10
40
1.0A
EP53F8QI
4MHz PowerSoC, VID
3.00
3.00
1.10
40
EN5322QI
4MHz PowerSoC, VID
4.00
6.00
1.10
60
EN5337QI
5MHz PowerSoC
4.00
7.00
1.85
75
3.0A
EN5339QI
Low Profile
4.00
6.00
1.10
60
3.0A
EN6337QI
"High Efficiency" PowerSoC
4.00
7.00
1.85
75
3.0A
EN6347QI
"High Efficiency" PowerSoC
4.00
7.00
1.85
75
EN5364QI
4MHz PowerSoC
8.00
11.00
1.85
160
6.0A
EN5367QI
Low Cost 6A
5.50
10.00
3.00
160
6.0A
EN6360QI
"High Efficiency" PowerSoC
8.00
11.00
3.00
195
EN5394QI
4MHz PowerSoC
8.00
11.00
1.85
190
EN63A0QI
"High Efficiency" PowerSoC
10.00
11.00
3.00
227
Proprietary and Confidential
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0.4A
1.5A
2.0A
4.0A
8.0A
9.0A
12A
Select Featured Products – 12V
Part Number
Description
Package Size (mm)
L
W
H
Solution
Size Est.
(mm2)
Device Capacity
12V Input PowerSoC Product Offering
EN2340QI
4A PowerSoC
8.00
11.00
3.00
191
EN2360QI
6A PowerSoC
8.00
11.00
3.00
191
EN2390QI
9A PowerSoC
10.00
11.00
3.00
235
EN23F0QI
15A PowerSoC
12.00
13.00
3.00
308
Proprietary and Confidential
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4.0A
6.0A
9.0A
15A
Select Featured Products – Application Specific
Package Size (mm)
Part
Number
Description
L
W
H
Solution
Size Est.
(mm2)
Device Capacity
DDR VTT PowerSoC Product Offering
EV1320
DDR VTT, Low Vin Power SoC Solution
3.00
3.00
0.55
40
EV1340
DDR VTT, Low Vin Power SoC Solution
10.00
5.50
3.00
125
EV1380
DDR VTT, Low Vin Power SoC Solution
11.00
8.00
3.00
200
Part Number
2A
5A
8A
Package Size (mm)
Description
L
W
H
Solution Size
Est. (mm2)
Samples
Production
Release
0.90
25
1Q13
4Q13
Current Monitoring and Protection
EQC1241
4 Channel Current Monitor, I2C I/F, programmable sense amp gain
Note: Availability dates for yet to be released products subject to change.
Proprietary and Confidential
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5.00
5.00
EV1320 High Efficiency 2A VTT Converter
DDR Memory Termination
| 16 |
Specifications:
 Sources/Sink up to 2A
 VDDQ Input Voltage Range: 0.95V – 1.8V
 Output Voltage = ½ VDDQ; tracks VDDQ
 40 mm2 total solution size
100
98
96
94
Features
92




90
VDDQ=1.8V
88
VDDQ=1.5V
86
VDDQ=1.35
84
VDDQ=1.2V
82
80
0
0.25
0.5
Proprietary and Confidential
0.75
1
1.25
1.5
1.75
2
| 16 |
Solution complies with JEDEC for DDR2/3/4
Ultra high 96% peak efficiency
Parallel up to 4 devices for 8A VTT load
High reliability; 4.1 FITs; 28,200 years MTBF
EV1320 Competitive Comparison: Uncompromised Power!
DDR Memory Termination (VTT) Power Options
Linear
Regulator
Enpirion
EV1320
Converter
Switching
regulator
Solution Size (mm2)
~88
40
~200 - 300
Efficiency @ Peak (%)
50
96
88 to 92
Power Loss @ 2A (W)
1.8
0.08
~0.2
Relative Power Loss at 2A
24x
x
~2.6x
=>1x
1x
>2x
Published Price @ 1K
Nearly 2x efficiency of a VTT LDO in a smaller footprint and =< cost
Proprietary and Confidential
| 17 |
Tiny 400mA DCDC
2x1.75x0.9
0603 cap
4.4mm
0603 cap
4.4mm
0201
0201
Specifications:
• 400mA Minimum Output Current
• Input Voltage Range: 2.4V – 5.5V
• Output Voltage Range: 0.6V – (VIN-0.2V)
• Output Voltage Programming
• Tiny, 14-pin QFN Package
• Solution Footprint: 20mm2
0201
EP5348UI
Features:
• 66mW/mm2 Solution Power Density
• Compatible with Noise Sensitive RF
• Over-current Protection
• Thermal Protection: 150C/15C
• Under-voltage Lock-Out
2mm x 1¾mm x 0.9 mm QFN
Proprietary and Confidential
| 18 |
EN5339QI 3A Low Profile DCDC
Specifications:
• Input Voltage: 2.4V – 5.5V
• Output Voltage: 0.8V – 3.3V
• 3% accuracy over Line, Load, and Temp
• VOUT Programming
• 3A Continuous Output Current
Solution Footprint: 60mm2
Features:
• Pin Compatible with EN5322QI
• High Efficiency; 95% Peak
• Very Low Ripple
• Over-current Protection: 5A Typical
• Thermal Protection: 155C/15C
• Under-voltage Lock-Out
• Enable and POK
•
4 mm x 6 mm x 1.1 mm QFN Package
Proprietary and Confidential
| 19 |
EN6337(3A) / 47(4A) DC-DC w/ LLM
Specifications:
POK
VOUT
VOUT
VIN
PVIN
AVIN
• Input Voltage Range: 2.375V – 6.6V
22F
47F
• Output Voltage Range: 0.75V – (VIN-0.5V)
SS
XFB
• 2% Output Accuracy (line, load, temp)
AGND
PGND
15 nF
• Minimum Output Current
• 3A – EN6337QI (@2MHz)
• 4A – EN6347QI (@3MHz)
Features:
• Solution Footprint: 75 mm2
• 95% peak efficiency
• Low Ripple
• Over-current Protection
• Under-voltage Lock-Out
• Light Load Mode
• Enable and POK
• Directly interchangeable with EN5337QI
• Sync to External Clock
4mm x 7mm x 1.85 mm QFN
Proprietary and Confidential
| 20 |
EN5367QI “Cost Optimized” 6A DCDC
VOUT
Specifications:
• Input Voltage Range: 2.5V – 5.5V
• Output Voltage Range: 0.6V – (VIN-VDO)
• 3% Output Accuracy (line, load, temp)
• Resistor Divider VOUT Programming
• 6A Minimum Output Current
• Solution Footprint: 160mm2
PVIN
10Ω
47F
1206
47nF
0805
ENA
AVIN
PGND
EN5367QI
VIN
VOUT
RA
CA
VFB
SS
AGND
0.1µF
SYNC
CSS
Features:
• High efficiency up to 93%
• Low Ripple
• Excellent Transient Recovery
• Programmable Soft start
• Over-current Protection
• Under-voltage Lock-Out
• Enable and POK
• Sync to External Clock
10mm x 5.5mm x 3.0 mm QFN
Proprietary and Confidential
| 21 |
47F
1206
PGND
RB
Proprietary and Confidential
| 22 |
EN2300 12V Product Family Overview
EN2340QI
EN2360QI
EN2390QI
EN23F0QI
Max. Load (A)
4
6
9
15
Input Voltage
4.5 to 14
Output Voltage
0.75 to 5
0.60 to 5
0.60 to 5
0.60 to 3.3
Package Size (mm)
8 x 11 x 3
8 x 11 x 3
10 x 11 x 3
12 x 13 x 3
Solution area (mm2)
191
191
235
308
Proprietary and Confidential
| 23 |
EN2300 Family Features
Common Features
 Integrated inductor, MOSFETs, Controller
 Efficiency up to 94%
 2% Voltage Output Accuracy (line, load, temp)
 Input Voltage Range: 4.5V – 14V
 Resistor Divider Vout Programming
 Operating temperature range: -40oC to 85oC without airflow/lead de-rating
 Excellent total AC + DC regulation
 Frequency Synchronization (External Clock)
 Output Enable Pin and POK Signal
 Programmable soft start
 Protections: programmable over-current, UVLO, thermal
Scalability Features
 EN2340 and EN2360 are pin compatible
 EN23F0 may be paralleled – up to 4 devices, 60A (see next page)
Proprietary and Confidential
| 24 |
EN23F0 Parallel Operation
GND
S_OUT
EN6360QI
EN23F0QI
MASTER
VOUT
VOUT
VIN M/S
VIN
1.0V at 14A
VFB
Feedback &
Compensation
5.0V
GND
S_IN
EN23F0QI
EN6360QI
SLAVE
VOUT
VIN M/S
REXT
VFB
OPEN
51.1k
Up to 4x 15A EN23F0 devices can be paralleled for high load applications
Proprietary and Confidential
| 25 |
EN2300 Competitive Comparison
12V DC-DC POL Power DC-DC Alternatives (@ 15A)
12V DC-DC
Discrete
Regulator
Modules/
PSiP
Enpirion
PowerSoC
Solution Size (mm2)
>650
500
308
Solution Height (mm)
8
>4
3
Efficiency @ Peak (%)
95
92
94
Ripple (mVp-p)
24
15
15
# of Components
>30
16
16
Estimated Solution Cost @ 1K
0.8x
2x
1x
>2x Space Savings with Low Noise, Low Total Cost without
compromising Efficiency, Ease of Design and Reliability
Proprietary and Confidential
| 26 |
Got Footprint, Performance, Reliability Challenges?
DDR Non-Volatile DIMM
PCIe RAID Controller + SSD ‘s
PCIe Quad NIC
Server Blade
AV Receiver
Atom PCIe server board
PCIe Security Processor
Enterprise SSD
Notebook SSD
Get Power Done Right - Enpirion PowerSoC!
Intel Atom Module
USB Cellular Data Card
USB3.0 SSD
Embedded PC Module
Digital Receiver
Compact PCI DSP Card
Proprietary and Confidential
| 27 |
Back-up
Enpirion Power SoC has High Reliability
 Enpirion fully characterizes the integrated inductor/regulator pair
 This removes significant risk from the power supply design
 Enpirion Power SoC undergoes IC level testing
 FIT rate = 3.2
 @ 55 degrees C, 0.7eV activation energy, 60% confidence level, based on
HTOL data collected to date
 MTBF ~ 35,700 years (312.5M hours)
Proprietary and Confidential
| 29 |
Quality, Reliability & Environmental Management System
 Enpirion deploys a Total Quality Management System
 ISO 9001:2000 Certified
 Sony Green Partners
 Enpirion utilizes a proven fabless model with world-class global suppliers:
 ISO 9001/ TS16949 Certified
 ISO14001 Certified and RoHS Compliant
 Sony Green Partners
 Enpirion PowerSoCs maintain high reliability
 System level performance with IC Level Reliability
 Product design and qualification based on established industry standards & practices (JEDEC,
JESD,…)
 FIT rate = 3.2 (MTBF ≈ 35,700 years)
 Long Term Reliability ensured by Manufacturing Process Controls and Long Term Reliability
Monitoring
 Enpirion Environmental Management System includes:









Follows ISO14001 Principles
Sony Green Partner Certified
RoHS (EU Directive 2002/96/EC)
WEEE (Directive 2202/96/EC)
Lead Free assembly compatible, 10sec/260°C reflow profile
JIG101
PFOS/PFOA Ban (EU Directive 2006/122/EC)
Halogen Free (Bromine + Chlorine)
Sony SS-00259
Proprietary and Confidential
| 30 |
Customer Quality Issues & Failure Analysis
Failure Mode Analysis Flow
• Device Analysis
Request Form
• Problem Report
Number Assigned
Customer Request
• Component Supplier
/ Manufacturing
Subcontractor
• Automated Tester
Failure Report
Final Response < 15 days
Receipt of Failure
• Failure Analysis and
Corrective Action
Failure Verification
Initial Response < 2 days
• Manual Tester
• Hot / Cold / THB
Environmental
Chambers
• Visual Inspection
Internal Analysis
• Decapsulation
• Cross Section /
Delayering
Non-destructive
Testing
• Analytical (SEM,
Auger, FIB etc.)
• C-SAM Analysis
• Optical Inspection
• Optical Inspection
• Active Circuit Probe
Proprietary and Confidential
• X-ray
Radiography
• Curve Trace
Subcontracted Services
| 31 |
Supply Chain Summary




Enpirion utilizes a Fabless semiconductor manufacturing model
Finished wafers are procured from wafer fabrication facilities in Korea
Final products are assembled, tested, and drop shipped from factories in Asia
Order entry, planning, scheduling, shipment release occur in the USA
IC Controller
CMOS
8” Wafers
IC Controller
Wafer Test
Korea
Malaysia, Taiwan,
Thailand
Assembly
Module Package
Test
Module Package
Malaysia, Taiwan,
Thailand
Malaysia, Taiwan,
Thailand
Strategic Die Bank
Strategic Inventory
7 weeks
Proprietary and Confidential
Inductors
Finished Goods
& Shipping
Japan/Taiwan
Drop ship
3 weeks
1 week
| 32 |
1 week
Lead Time
12 Weeks
Key Contract Manufacturers Currently Supported
 >75 CM/ODM relationships
 Benchmark Electronics
 Celestica
 Flextronics
 Foxconn Technology Group
 Jabil Circuit
 Plexus Corp.
 Sanmina-SCI Corp.
 Quanta
 Zinwell
Proprietary and Confidential
| 33 |
QUANTIFIED EASE-OF-DESIGN
Proprietary and Confidential
| 34 |
Design Flow Comparison: 3 DC-DC Topologies
Common Pre-Design Steps (6)
Detailed Design Steps
~6
>18
Steps
~14
Steps
steps
Enpirion PowerSoC
Design Flow (~12)
DC-DC Regulator
Design Flow (~20)
Delay
Traditional Discrete
Design Flow (>24 steps)
Enpirion PowerSoC = Faster Design Time & High Probability of 1st Pass Success
Proprietary and Confidential
| 35 |
Enpirion PowerSoC Simplied Design Steps
Step 1
Step 2
Step 3
Step 4
Step 5
Step 6
• Review PowerSoC Specifications vs. Identified Requirements
• Select Device
• Select Components using Datasheet: Cin, Cout, Small Signal Components
• Accommodate for Load Change/Scope Creep
• PCB Design Using Validated /Guaranteed Design Files
• Prototype Testing
At least 40% fewer steps (i.e. 8 less)
Significantly (~1/3) lower exposure to design iteration
Proprietary and Confidential
| 36 |
Quantitative Comparison of PowerSoC vs. DC-DC
Regulator Design Effort
Source Darnell Group
* Sized for 1 DC-DC power rail
PwrSoC/PSiP reduces complexity & significantly improves time to market by 45%!
Proprietary and Confidential
| 37 |