IBM System x Systems Overview:
System x3400 M3 and System x3500 M3
XTW1010q
This presentation is intended for the education of IBM and Business Partner sales personnel. It should not be distributed to customers.
©
IBM&Corporation
IBM2006
Systems
Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Topic Overview
Upon the conclusion of this topic, you should be able to :
> Describe the attributes of the IBM System x3400 M3 and x3500 M3 servers
> Identify and describe the subsystem components that make up the IBM System x3400 M3
and x3500 M3 servers
> Identify and describe the systems management tools available for the System x3400 M3 and
x3500 M3 servers
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Topic Agenda
> *IBM System x3400 M3 and x3500 M3 Product Overview*




x3400 M3 and x3500 M3 At a Glance
x3400 M3 Product Overview
x3500 M3 Product Overview
Feature Comparison
> IBM System x3400 M3 and x3500 M3 Architecture Overview
 Processor Subsystem
 Memory Subsystem
 Disk Subsystem
> IBM System x3400 M3 and x3500 M3 System Management






uEFI
Integrated Management Module
Systems Director 6.1
Active Energy Manager
IBM Preboot Dynamic System Analysis
Operating Systems
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – At a Glance
> Introducing the x3400 M3 and x3500 M3
 Dual Socket
 Choice of Dual, Quad or Six Core Intel® Xeon 5500 and 5600 series
processor
 Up to 3.33GHz and 12MB cache. (Model dependent).
 4.8 GTS, 5.86 or 6.4 GTS Intel Quickpath Interconnect (QPI) support
> Large capacity high-performing memory
 Supports DDR-3 Low voltage 1.35V Memory DIMMs
–
–
–
–
IBM x3400 M3
Up to sixteen DIMM slots
Up to 128 GB on x3400 M3 and 192 GB* on x3500 M3 maximum
Memory Mirroring
Chipkill
> Up to twenty four hot-swap SAS or SATA HDDs
 Up to sixteen hot-swap SAS or SATA on x3400 M3
> IMM and uEFI BIOS
> Operator Information Control Panel
> High-availability features
 Redundant power/cooling optional
IBM Systems & Technology Group Education & Sales Enablement
IBM x3500 M3
© 2009 IBM Corporation
IBM x3400 M3 - Product Overview (1 of 2)
5 UP Tower with flexible configuration options for business growth
Processor
>Up to two processors – 1 standard
>Choice of dual or quad core Intel Xeon 5500 and 5600 series processor
Up to 2.66GHz standard; up to 2.93Ghz via CTO
4 or 12MB L2 cache.
Up to 5.86 GTS with Intel QuickPath Interconnect (QPI) standard ; up to 6.4 GTS via CTO
Memory
>16 DIMM sockets
8 DIMM per processor
Up to 128 GB RDIMMs memory
Up to 48 GB* UDIMM memory
>1 GB, 2 GB, 4 GB, 8GB RDIMM memory options
2 or 8 GB Standard (model dependant)
–800/1066/1333 MHz DDR3 SDRAM
>1, 2, or 4 GB* UDIMM memory options
>Memory Mirroring
>Chipkill
IBM x3400 M3
* Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2Q 2010.
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 - Product Overview (2 of 2)
Storage Capacity
>Four 3.5-inch hot-swap or simple-swap OR
Eight hot-swap drive bays (Model dependent)
 Up to 16.0 TB total capacity using eight 2 TB
SATA 3.5-inch HS HDD options
 Up to 4.8TB total capacity using eight 600 GB
3.5-inch SAS HS HDDs options
>Up to eight OR Sixteen 2.5-inch hot-swap drive
bays (Model dependent)
 Up to 8 TB total capacity using sixteen 500 GB
2.5-inch SAS or SATA SFF slim-line HDDs
 RAID Support
> ServRAID-BR10il v2 on four SAS/SATA 3.5inch HS Models supports RAID 0/1/1E
> ServRAID-M1015 on eight SAS/SATA 2.5-inch
HS Models supports RAID 0/1/10 optional 5
> Optional ServRAID-M5015/1014 SAS
 RAID 0/ 1/ 10/ 5/ 50 optional 6/ 60
IMM with remote presence enabled via
optional hardware key
IBM Systems & Technology Group Education & Sales Enablement
Six to Eight expansion slots
> Five PCI Express Gen2 x8 slots
 One x16
 Four x8
 Optional extender board supports two-PCI-X
or one PCI-E slot
> One PCI 32-bit/33 MHz slot
Dual port Gigabit Ethernet
> Wake on LAN
> Without TOE supported
Optical Drives
> One half-high DVD-ROM drive installed.
 Optional one full-high internal tape drives
OR
 Two half-high internal tape drives
Fixed Power Supply
> One 670 or 920 Watt (model dependent)
> Active Energy Manager (AEM)
Three speed-controlled hot-swap
fans
© 2009 IBM Corporation
IBM x3500 M3 - Product Overview (1 of 2)
5U Tower with flexible configuration options for business growth
Processor
>Up to two processors – 1 standard
>Dual, Quad or Six-core Intel Xeon 5500 and 5600 series
processor with Quick Path Interconnect (QPI) architecture
Up to 3.33GHz
Up to 12MB cache.
Up to 6.40 GTS with Intel QuickPath Interconnect (QPI)
Memory
>16 DIMM sockets
8 DIMM per processor
Up to 128 GB RDIMM memory with future support for 192 GB
Up to 32 GB UDIMM memory with future support for 48 GB
>1 GB, 2 GB, 4 GB, 8GB, 16GB* RDIMM memory options
4 or 8 GB Standard (model dependant)
–800/1066/1333 MHz DDR3 SDRAM
IBM x3500 M3
>1, 2 or 4GB* UDIMM memory options
>Memory Mirroring
>Chipkill
* Maximum RDIMM support for 192 GB when 16 GB DIMMs are available 2Q 2010
* Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2Q 2010.
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3500 M3 - Product Overview (2 of 2)
Storage Capacity
> Up to twenty four 2.5-inch SAS/SATA HS
HDDs
 Up to 12TB using twenty four 500 GB 2.5-inch
SAS SFF slim-line HDDs (model dependent)
OR
> Up to eight 3.5-inch, SAS/SATA HS HDD
 Up to 16.0 TB total capacity using 2 TB SATA 3.5inch HS HDDs (model dependent)
RAID Support (Model dependent)
> ServRAID-M1015 supporting RAID 0/1/10
optional 5
> ServRAID-M5014 supporting RAID
0/1/10/5/50, Optional 6, 60 with 256 MB
cache
> ServRAID-M5015 supporting RAID
0/1/10/5/50, Optional 6, 60 with 512 MB
cache
Seven to Eight expansion slots
> Five PCI Express Gen2 x8 slots
 one x16
 four x8
> One PCI Express Gen 1 x* slots
> One PCI 32-bit/33 MHz slot
> Optional extender board supports two-PCI-X
(CTO only, need to remove 1PCIe x8)
Media Support
> DVD-ROM standard
> Two 5.25-inch half-high support tape backup
or other devices
920-watt Hot-swap Power Supply and
three hot-swap fans standard
 Optional hot-swap redundant power and cooling
with hot-swap upgrade
 Active Energy Manager (AEM)
IMM with remote presence Standard
Integrated Dual Gigabit Ethernet
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 Feature Comparison
x3400 M3
x3500 M3
Intel® 5520 Chipset
Intel® 5520 Chipset
Processor
Intel 5500 and 5600 series dual, quad and sixcore
Intel 5500 and 5600 series quad and six-core
Memory
DDR III : 16 DIMM / 128 GB maximum - Up to
48 GB UDIMM memory
DDR III : 16 DIMM / 128 GB maximum with future support
for 192GB - Up to 48 GB UDIMM memory
Tape
Support
One half-high DVD-ROM drive installed. Optional
one full-high internal tape drives OR Two halfhigh internal tape drives
One half-high DVD-ROM drive installed. Optional one fullhigh internal tape drives OR Two half-high internal tape
drives
Hard Disk
Drives
4 SS/HS SAS/SATA OR 8 HS HS SAS/SATA
8 or 16 HS SFF SAS/SATA
4 SS/HS SAS/SATA OR 8 HS HS SAS/SATA
8, 16, or 24 HS SFF SAS/SATA
RAID
Supporting H/W RAID 0, 1, 5, 6, 10, 50, 60 (model dependent)
Supporting H/W RAID 0, 1, 5, 6, 10, 50, 60 - (model
dependent)
Ethernet
Integrated Dual Gigabit Ethernet without TOE
Integrated Dual Gigabit Ethernet with TOE
PCI Slots
One x16, four x8, one PCI 32bit/33MHz,
Optional extender board supports two-PCI-X or
one PCI-E slot
One x16, five x8, one PCI 32bit/33MHz, Optional two 64bit/133MHz PCI-X slots (Requires removal of one x8 PCI-E)
IMM with optional hardware key for remote
presence
IMM standard with remote presence (no hardware key
required)
Fixed one 670 Watt OR
one 920 Watt hot swap Power with optional hotswap redundant power supply upgrades
One 920 W hot swap Power with optional hot-swap
redundant power and cooling with hot-swap upgrade
Chipset
Systems
Management
Power
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Executive Overview
Positioning
Target Markets and Industries
> High performance dual, quad and six core 2-socket tower
>Distributed enterprise and mid-size environments
>Small to medium businesses
>Retail, Banking, Insurance, and small business
server offering high availability and resiliency
> Ideal for mid-size to emerging enterprise and virtualized
environments
Business Benefits
> Delivers high availability features and integrated systems
management tools to maximize uptime
> Combines stability with flexible growth options for increased
investment protection
> Lower IT acquisition and lifecycle costs while providing
outstanding performance
Key Product Features
Target Applications
>File and print services
>Email and collaboration
>Distributed branch office applications
Competitive Advantages
> Latest generation high-efficiency Intel Xeon processors
HP ML 350/370 G5/G6
> Up to 128GB via 16 DIMM slots of DDR3 memory with future >HPs comparable 1U server to support only 4x 2.5” HDD
>
>
>
>
>
>
support for up to 192GB memory
Flexibility with up to 24 or 16 high-performance Hot swap
Serial Attached SCSI (SAS) or low-cost Serial hard disk
drives
RAID support
Hot swap/redundant power supplies
Hot swap/redundant cooling
Integrated Dual Gigabit Ethernet
IMM with hardware key for remote presence
IBM Systems & Technology Group Education & Sales Enablement
standard with option to support additional 2x HDD for a fee
>HP does not offer a full hardware-based encryption RAID
solution.
>HP uses proprietary alerts forcing customers into HP SIM
environment
>HP lacks capability for Systems Admin’s to create
bootable media for software updates
>HP Insight Manager power monitoring only available at
additional cost
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Front Bezel View
Service Processor Bus
Microprocessor (CPU)
Voltage Regulator Module
USB Ports
Configure (CPU or Memory
Memory
NMI (Non-Maskable Interrupt)
DASD / RAID
Power Supply
Fan
PCI Bus
IBM Systems & Technology Group Education & Sales Enablement
NMI / System Error Log
Temperature
System Board
© 2009 IBM Corporation
IBM x3400 M3 – Front View with Bezel Removed
System Indicators
System Indicators
System Indicators
USB 1 - 2
USB 1 - 2
DVD
Drive
SAS/SATA
Hard Disk
Drives
DVD
Drive
DVD
Drive
HDD
Activity
LED
SAS/SATA
Hard Disk
Drives
2.5 inch SAS/SATA
Hot-Swap Hard Disk Drive Model
3.5 inch SAS/SATA
Hot-Swap Hard Disk Drive Model
IBM Systems & Technology Group Education & Sales Enablement
SimpleSwap Hard
Drive
3.5 inch SATA
Simple-Swap Hard Disk Drive Model
© 2009 IBM Corporation
IBM x3500 M3 – Front View with Bezel Removed
System Indicators
DVD Drive
USB 1 & 2
2.5 inch Hot Swap SAS Hard Drives
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – Component View
Power Supply Cage
Processors 1 & 2
Air Baffle
Rear Adapter
Retention Bracket
IBM Systems & Technology Group Education & Sales Enablement
Air Baffle
Release Clip
Hot-Swap Fans
Fan Assembly
Hard Drive
Housing
DVD Drive
Housing
© 2009 IBM Corporation
IBM System x3400 M3 System-board View
DIMM Slots 9-16
Processor 2
Front Panel
Connector
Processor 1
Power
Main Power
Virtual Media Key
Connector
DIMM Slots 1-8
Front USB
Connector
PCI-E Slots 1-5
Simple swap SATA
cable connector
PCI Slots
Hot Swap Main Fan
Connector
SATA
Connectors
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM System x3500 M3 System-board View
DIMMs slots 9-16
Diagnostics
Processor 2
Power
Serial
System Power
Video
USB
DIMMs slots 1-8
Virtual media key
connector
Processor 1
PCI-E slots 1-5
Fan
PCI – 32 Slot 6
SATA 2-5
PCI-E Slot 7
Battery
IBM Systems & Technology Group Education & Sales Enablement
SATA 0 & 1
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Rear View
Power
Connector
Serial 1
Serial 1
Video
Power Connector
Video
Systems
Management
Systems
Management
Power LED
AC / DC LED’s
Power LED
AC / DC LED’s
USB 1 - 4
USB 1-4
Ethernet 1 & 2
X3400 M3
IBM Systems & Technology Group Education & Sales Enablement
Ethernet 1 & 2
X3500 M3
© 2009 IBM Corporation
Topic Agenda
> IBM System x3400 M3 and x3500 M3 Product Overview




x3400 M3 and x3500 M3 At a Glance
x3400 M3 Product Overview
x3500 M3 Product Overview
Feature Comparison
> *IBM System x3400 M3 and x3500 M3 Architecture Overview*
 Processor Subsystem
 Memory Subsystem
 Disk Subsystem
> IBM System x3400 M3 and x3500 M3 System Management






uEFI
Integrated Management Module
Systems Director 6.1
Active Energy Manager
IBM Preboot Dynamic System Analysis
Operating Systems
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – 5500 Series Processor
> Enhanced Micro-architecture 45nm
 Dual and Quad-core processing
Up to 25.6 GB/sec
bandwidth per link
> Intel® 5520 Chipset
 Up to 6.4 GTs
 Dual x16 Gen2 or quad x8 PCI Express 2.0
Xeon
processor
Xeon
processor
graphics card support
QPI
Up to 16 slots
DDR3 Memory
> Integrated DDR3 three-channel memory
controller per processor
> Two Intel® QuickPath Interconnect (QPI)
links per component
Intel 5520
Hub
PCI Express
Gen 1, 2
ICH
 Six total High Speed Serial link between
CPUs/chipset
> Single die quad core
> Three cache levels:
 32 KB of L1 Data cache per core
 256 KB L2 memory cache per core
 Shared 4 or 8MB L3 cache
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – 5600 Series Processor (1 of 2)
32nm Technology with 2nd Generation High-k Process
> Intel 5520 Chipset
 IOH (Northbridge) + ICH10 (Southbridge)
New Processor,
Proven Platform
 Up to 6.4 GT/sec speeds
 Dual x16 Gen2 or Quad x8 PCI Express 2.0
graphics card support
Up to 25.6 GB/sec
bandwidth per link
> Integrated DDR3 three-channel memory
controller
Intel®
Xeon® 5600
 2nd CPU required to use all 18 DIMMs
> Two Intel QuickPath interconnect (Intel QPI)
links per components
 High Speed Serial link between CPUs/chipset
 Up to 25.6 GB/sec bandwidth per link
Up to 18 slots
DDR3 Memory
Intel®
Xeon® 5600
QPI
Intel® 5520
Chipset
Intel® Data Center
Manager
Intel® Node Manager
Technology
PCI Express* 2.0
> Single die four or six core
> Three cache levels:
 32 KB data / 32 KB instruction L1 cache per core
ICH 9/10
Intel® 82599
10GbE Controller
 256 KB L2 memory cache per core
 Shared 4MB or 12 MB L3 cache
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – 5600 Series Processor (2 of 2)
Building on Xeon® 5500 Leadership Capabilities
130W*
95W
80W
Intelligent Power
Technology
Lower Power CPUs
Better performance/Watt
Lower power consumption
Intel®
Xeon® 5600
Integrated Power Gates and
Automated Low Power States with
Six Cores
Intel®
Xeon® 5600
CPU Power Management
Lower Power
DDR3 Memory
Optimized power consumption through
more efficient Turbo Boost and memory
power management
Up to 10% reduction in
memory power†
Nehalem Micro-architecture + 32nm CPU + Enhanced Power Mgt
= Greater Energy Efficiency
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 – Processor Options
Intel® Dual, Quad and Six-core Xeon® processor 5500 and 5600 series featuring the
latest generation micro-architecture technologies:
>
>
>
>
>
>
>
Intel QuickPath Interconnect
Turbo Boot Technology
Intel Hyper-threading Technology
Intel Virtualization Technology
Intel Intelligent Power Technology
Intel Smart Cache
Intel I/O Acceleration Technology
Usage
Advanced
Standard
Value
Processor
Cores
Cache
Processor
Speed
Link Speed
Max Memory
Speed
TDP
Intel Xeon X5680
6
12
3.33 GHz
6.4 GT/s
1333MHz
130w
Intel Xeon X5677
4
12
3.46 GHz
6.4 GT/s
1333MHz
130w
Intel Xeon X5670
6
12
2.93 GHz
6.4 GT/s
1333MHz
95w
Intel Xeon X5660
6
12
2.80 GHz
6.4 GT/s
1333MHz
95w
Intel Xeon X5650
6
12
2.66 GHz
6.4 GT/s
1333MHz
95w
Intel Xeon E5640
4
12
2.66 GHz
5.86 GT/s
1066MHz
80w
Intel Xeon E5630
4
12
2.53 GHz
5.86 GT/s
1066MHz
80w
Intel Xeon E5620
4
12
2.40 GHz
5.86 GT/s
1066MHz
80w
Intel Xeon E5507
4
4
2.26 GHz
4.8 GT/s
800MHz
80w
Intel Xeon E5506
4
4
2.13 GHz
4.8 GT/s
800MHz
80w
Intel Xeon E5503
2
4
2.0 GHz
4.8 GT/s
800MHz
80w
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Memory Subsystem
DDR3 Memory technology
> Twice the data rate of DDR2
> Lower operating Voltage (1.5V vs 1.8V for DDR2)
> Lower power (30%) than DDR2 or FBD for the same speed
> Higher speed than DDR2 (spec is 800, 1066, 1333MHz)
16 DIMM Sockets standard
> Up to 128 GB or 192GB* maximum memory
 1GB, 2 GB, 4 GB, 8 GB, 16GB* memory options
- PC3-10600 1333 MHz DDR-3 ECC
- PC3-8500 1066 MHz DDR-3 ECC
- PC3-6400 800 MHZ DDR-3 ECC
> Up to 32 GB UDIMM
 1, 2 GB and 4GB* UDIMM memory options
Chipkill memory protection
> Detects full DRAM memory errors
and increases system availability
Memory Mirroring
> Reduces system downtime by keeping a
real-time copy of data in memory
* Maximum RDIMM support for 128 GB when 8 GB DIMMs are available 2Q 2010
* Maximum UDIMM support for 48 GB when 4 GB DIMMs are available 2Q 2010.
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 and x3500 M3 - Memory Population Order
Notes:
3
2
1
Ch0
Ch0
9
10
11
Ch1
12
13
14
Ch2
15
16
> Each CPU has its own memory
DIMM bank and requires at least
one installed DIMM per
microprocessor
6
5
4
8
7
> For best performance, populate in
order recommended in tables
Ch1
CPU 1
QPI
Ch2
CPU 2
> Minimum of one DIMM must be
installed for each microprocessor
for the server to operate. Three
DIMMs per microprocessor
improves server performance
DIMM Slots
Installed microprocessors
> Server supports a maximum of 16
single, dual, or quad-rank*
DIMMs.
> Only the x3500 M3 supports
quad-rank DIMMs the server and
the maximum supported is 12.
> DIMMs do not have to be added in
DIMM Slots
DIMM connector
population sequence
Microprocessor 1
3, 6, 8, 2, 5, 7, 1, 4
Microprocessor 2
11, 14, 16, 10, 13, 15, 9, 12
Microprocessor 1
and
Microprocessor 2
3, 11, 6, 14, 8, 16, 2, 10, 5, 13, 7, 15,
1, 9, 4, 12
pairs however mixing single and
dual rated DIMMS within a
channel is not supported
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Memory Mirroring
Memory-mirroring replicates and stores
data on two pairs of DIMMs within two
channels simultaneously
X3400 M2 Memory Mirroring Sequence
X3500 M2 Memory Mirroring Sequence
DIMMs
Number of
installed processor
DIMM
Connector
DIMMs
Number of
Processor
DIMM
Connector
First Pair
1
3, 6
First Pair
1
3, 6
Second Pair
1
2, 5
Second Pair
1
2, 5
Third Pair
1
1, 4
Third Pair
1
1, 4
Fourth Pair
2
14, 11
Fourth Pair
2
14, 11
Fifth Pair
2
13, 10
Fifth Pair
2
13, 10
Sixth Pair
2
12, 9
Sixth Pair
2
12, 9
NOTE: DIMM connectors 7, 8, 15, and 16 are not used in
memory-mirroring mode
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Disk Subsystem
Eight or Sixteen SAS or SATA HDD
> Up to 24 2.5- inch bays available using upgrade
option
 Up to 8 TB capacity with x3400 M3
 Up to 12 TB capacity with x3500 M3
> SAS






146 and 300 GB 10K 6Gbps SAS 2.5" SFF Slim-HS HDD
73 and 146 GB 15K 6Gbps SAS 2.5" SFF Slim-HS HDD
146GB 15K 6Gbps SAS 2.5" SFF Slim-HS SED
500GB 7200 6Gbps NL 2.5“ SFF Slim-HS HDD
73, 146 and 400 GB 15K 3.5" Hot-Swap SAS
300, 450 and 600 GB 15K 6Gbps SAS 3.5" Hot-Swap HDD
RAID Support
> ServRAID-M1015 supporting
RAID 0/1/10 optional 5
> ServRAID-M5014 supporting
RAID 0/1/10/5/50, Optional 6, 60
with 256 MB cache
> ServRAID-M5015 supporting
RAID 0/1/10/5/50, Optional 6, 60
with 512 MB cache
> SATA





160 and 500 GB 7200 NL 2.5" SATA SFF Slim-HS HDD
250 and 500 GB 7200 RPM 3.5" Simple-Swap SATA II
250 and 500 GB 7200 RPM 3.5" Hot-Swap SATA II
1TB 7200 SATA 3.5'' HS HDD
2TB 7200 NL SATA 3.5" HS HDD
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Topic Agenda
> IBM System x3400 M3 and x3500 M3 Product Overview




x3400 M3 and x3500 M3 At a Glance
x3400 M3 Product Overview
x3500 M3 Product Overview
Feature Comparison
> IBM System x3400 M3 and x3500 M3 Architecture Overview
 Processor Subsystem
 Memory Subsystem
 Disk Subsystem
> *IBM System x3400 M3 and x3500 M3 System Management*






uEFI
Integrated Management Module
Systems Director 6.1
Active Energy Manager
IBM PreBoot Dynamic System Analysis
Operating Systems
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
uEFI – Unified Extensible Firmware Interface
The Next Generation of BIOS
Allows OS’s to take full advantage of the hardware
>
Architecture Independent
> Modular
64 bit code architecture
16 TB of memory can be addressed
More functionality
> Adapter vendors can add more features in their options (e.g., IPv6)
> Design allows faster updates as new features are introduced
> More adaptors can be installed and used simultaneously
> Fully backwards compatible with legacy BIOS
Better user interface
> Replaces ctrl key sequences with a more intuitive human interface
> Moves adaptor and iSCSI configuration into F1 setup
> Creates Human readable event logs
Easier management
> Eliminates “beep” codes; all errors can now be covered by Light Path
> Reduces the number of error messages and eliminates out-dated errors
> Can be managed both in-band and out of band
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Integrated Management Module
More Management Features – Fewer Parts
> Combines multiple functions on
IMM
single chip
USB 1.1/2.0
Devices
 BMC / RSA-II functionality
 Video controller
CPU Core
Super I/O
 Remote Presence/cKVM function
 SuperIO
Crypto AES
 Common SP hardware across all
platforms
Video
Controller
 One IMM firmware applies to all
servers
 IMM can update other server firmware
components
> Additional benefits:
 No IBM drivers required
 Improved error logging
 Configurable both in and out of band
IBM Systems & Technology Group Education & Sales Enablement
BMC I/O
Video
Comp.
DDR2 Memory
Controller
Components








MIPS 4KEc 300MHz 32-bit Processor
BMC I/O
Matrox G400 Video Core
DDR2-250MHz Memory Controller
USB 1.1 and 2.0 Configurable Peripherals
Hardware Digital Video Compression
128-bit AES Hardware Encryption Engine
Super I/O
© 2009 IBM Corporation
Virtual Media Hardware Key
Remote Presence capability and
Blue-screen Capture Features:
Virtual Media Key
> Remotely viewing video with
graphics resolutions up to 1280 x
1024 at 75 Hz, regardless of the
system state
> Remotely accessing the server,
using the keyboard and mouse
from a remote client
> Mapping drives that are available
for use by server.




CD or DVD drive
Diskette drive
USB flash drive on a remote client
ISO and diskette image files as
virtual drives
> Uploading a diskette image to the
IMM memory and mapping it to the
server as a virtual drive
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM System Director 6.1
Easier and more efficient management
> Simplified deployment, installation and update
process
> Access anywhere with a consistent,
web-based user interface
> Easy-to-learn new tasks with intuitive wizards,
tutorials and integrated help
> Broad portfolio of systems managed
by a single tool reduce3s staff training and
operating expenses
> Monitoring and managing of energy
usage can lower costs with more efficient use of
available energy
> Integration of virtual and physical infrastructure
management and decrease administrative costs
Potential cost savings using IBM System Director 6.1 of up to
34.5 percent for Windows and 43.8 percent for Linux x86 servers
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM Active Energy Manager
Manage actual power consumption and resulting thermal loads
> Control and manage datacenter
server power utilization
> Hardware, embedded management
logic
> Sensors and alerts to warn the user
if limiting power to this server is
affecting performance
> More accurate data center planning:
 Actual power draw instead of
conservative “label/spec power”
estimates
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM PreBoot Dynamic System Analysis
> Provides problem isolation,
configuration analysis, error log
collection
 Collects information about:
–
–
–
–
–
–
–
–
–
System configuration
Network interfaces and settings
Installed hardware
Light path diagnostics status
Service processor status and
configuration
Vital product data, firmware, and
UEFI configuration
Hard disk drive health
RAID controller configuration
Event logs for ServeRAID controllers
and service processors
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
IBM x3400 M3 / x3500 M3 - Supported Operating Systems
Microsoft® Windows®
> Windows Server 2003 R2, Standard edition
> Windows Server 2003 R2, Enterprise edition
> Windows Server 2003 R2, Web edition
> Windows Server 2003 R2, Data Center edition
> Windows Server 2008, (32 bit and EM64T)
> Windows Server 2008 R2, (64 bit)
Redhat
> Red Hat Enterprise Linux 4 AS for AMD64/EM64T
> Red Hat Enterprise Linux 4 ES for AMD64/EM64T
> Red Hat Enterprise Linux 4 WS for AMD64/EM64T
> Red Hat Enterprise Linux 5 Server Edition
> Red Hat Enterprise Linux 5 Server x64 Edition
> Red Hat Enterprise Linux 5 Server Edition with Xen
> Red Hat Enterprise Linux 5 Server with Xen x64 Edition
SUSE Linux
> SUSE Linux Enterprise Server 10 for AMD64/EM64T
> SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T
> SUSE Linux Enterprise Server 11 for AMD64/EM64T
> SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Course Summary
Upon the conclusion of this module, you should be able to :
> Describe the architecture attributes of the IBM System x3400 M3 and x3500 M3.
> Identify the subsystem components that make up the IBM System x3400 M3 and x3500 M3.
> Describe the attributes and advantages of the Intel 5500 and 5600 series processor.
> Describe the systems management options available for the IBM System x3400 M3 and
x3500 M3.
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Glossary
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
Intel® QuickPath Interconnect (Intel QPI)
Active Energy Manager (AEM)
Memory Mirroring
Chipkill
TCP Offload Engine (TOE)
Wake on LAN
DDR3 memory
Virtual media key
ServeRAID-MR10i
ServeRAID-MR10is
Simple Swap
Unified Extensible Firmware Interface (uEFI)
Dynamic System Analysis Diagnostics
Baseboard Management Controller (BMC)
Integrated Management Module (IMM)
IBM® Systems Director
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Additional Resources
IBM STG SMART Zone for more education:
> http://lt.be.ibm.com/smartzone
IBM System x Enterprise Servers
> http://www-03.ibm.com/systems/x/hardware/enterprise/index.html
IBM ServerProven
> http://www-03.ibm.com/servers/eserver/serverproven/compat/us/
IBM Redbooks – System Technical Introduction
> http://www.redbooks.ibm.com/abstracts/redp4260.html
IBM System x Support
> http://www-304.ibm.com/systems/support/supportsite.wss/brandmain?brandind=5000008
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation
Trademarks
The following are trademarks of the International Business Machines Corporation in the United States, other countries, or both.
Not all common law marks used by IBM are listed on this page. Failure of a mark to appear does not mean that IBM does not use the mark nor does it mean that the
product is not actively marketed or is not significant within its relevant market.
Those trademarks followed by ® are registered trademarks of IBM in the United States; all others are trademarks or common law marks of IBM in the United States.
For a complete list of IBM Trademarks, see www.ibm.com/legal/copytrade.shtml:
The following are trademarks or registered trademarks of other companies.
Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or
other countries.
Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom.
Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both.
Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both.
Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered
trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
UNIX is a registered trademark of The Open Group in the United States and other countries.
Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both.
ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office.
IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency, which is now part of the Office of Government Commerce.
•All other products may be trademarks or registered trademarks of their respective companies
Notes:
Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual
throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration,
the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to
the performance ratios stated here.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the
results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.
This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information
may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area.
All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and
cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to
the suppliers of those products
IBM Systems & Technology Group Education & Sales Enablement
© 2009 IBM Corporation