Heterogeneous
Technology
Alliance
Template
HTA General Assembly
November 12 – 13, 2013
Project Idea: RF MEMS SWITCH TECHNOLOGY
FOR SPACE APPLICATION
EU call: ESA
The Heterogeneous Technology Alliance HTA
Contact:
christophe.billard@cea.fr
Project Idea short description HTA common proposal for ESA call aiming at selecting best RF
MEMS switch process in Europe
Short Description:
→ benchmark RF MEMS suppliers with a common standardized procedure
→ select the optimum RF MEMS switch process for further reliability testing
→ prepare it for further space qualification
Potential Applications: Space, defense, telecom
Potential Consortium/Competences needed:
RF MEMS switch process
Hermetic packaging
Reliability testing, Space
qualification
Project Idea: RFID Acoustic Sensors
EU call: H2020
Contact:
christophe.billard@cea.fr
The Heterogeneous Technology Alliance HTA
Project Idea short description Wireless battery free sensor system for harsh environment
Short Description:
→ Lamb wave sensors enabling measurements of pressure, temperature, viscosity, or humidity
→ Operation in harsh environment (T°>600°C) and eventually in liquids
→ Develop packaged RFID sensor modules and their interrogation system
Potential Applications: automotive, medical, industry, space, aeronautic …
Potential Consortium/Competences needed:
Acoustic technology
(Lamb wave, SAW, BAW)
Process bricks for harsh
environment
(electrodes, packaging…)
RFID
System deployment
(reader, antenna)
(monitoring software, tag
identification)
Project Idea: Flexible self-powered RFID sensor tag
EU call: H2020
The Heterogeneous Technology Alliance HTA
Contact:
christophe.billard@cea.fr
Project Idea short description Flexible sensor tag with integrated energy harvester
Short Description:
→ shape memory alloys (SMA) can detect and harvest from temperature variation
→ Magnetostrictive materials detect and harvest from a movement (moving magnet)
→ Idea is to build flexible sensor tag which can detect an event and harvest energy to send the
information or write in an embedded memory
Potential Applications: traceability in medical, food, industry…
Potential Consortium/Competences needed:
Materials for
harvester/sensor
(SMA, magnetostricitve)
Flexible technology
(encapsulation, memory)
RFID
System deployment
(reader, antenna)
(monitoring software, tag
identification)
Project Idea: OPEN3D
EU call: Other initiatives
The Heterogeneous Technology Alliance HTA
Contact:
yann.lamy@cea.fr
Idea short description: Provide an European complete 3D & packaging integration platform
Short Description: Open 3D™ is a CEA LETI 3D technology offer, targeting industrial (SMEs)
& academic customers:
3D mature technologies, no NRE, short cycle time, 200 mm & 300 mm, Global offer from 3D
design to component final packaging. Possibility to make proof-of-concept, prototyping & small
volume production
Potential Applications: niche market for 3D: Space, defense, telecom, fundamental physics
(CERN…)
Competences needed:
Wafer-level TSV-last and
RDL process
Balling, stacking &
packaging
Testing
Reliability
Project Idea: 3DIC thermal management
EU call: H2020
The Heterogeneous Technology Alliance HTA
Contact:
Patrick.leduc@cea.fr
Project Idea short description Thermal Management with microfluidic / High performance
computing (HPC)
Short Description: Ambitious µ-fluidic project for HPC. Investigation innovative new fluidic
compound thermal evacuation in micro-cooling channels in silicon interposers. New nanofluids
synthesis and modelling, interposer fabrications, Test & validation
10-100µm channels in silicon – LETI examples
Potential Applications:
HPC, servers, micro-servers, particle physics detection
Potential Consortium/Competences needed:
- New fluid synthesis and fabrications / simulation modeling
- µ-channels fabrication, Si interposer, Si-si bonding at CEA LETI
- strong expertise on fluidic connectors (e.g: CSEM)
Project Idea: 4-side buttable 3D detectors
EU call: H2020
The Heterogeneous Technology Alliance HTA
Contact:
Yann.lamy@cea.fr
Project Idea short description 3D integration for particles physics & medical imaging
Short Description: realize a generic 3d technology for 4-side buttable ultra fine pitch detectors for
particle physics and/or X-rays
-
Start with 130-nm existing ROIC
Prepare the 65nm shift with ultra fine pitch TSV
Large surface bow/warp management of thin modules
Compliant and high yield 2nd level interco for flip chio
Strategy for high yield assembly and pre-industrialization
Dead zone free
detection
Potential Applications:
Large area particle detection, / X-rays detection
 HEP, medical, X-rays cristallography, synchrotron
Improvement of sensitivity / reduction Idark
Courtesy from Advacam
Potential Consortium/Competences needed:
TSV fabrication (last/middle), thin module hanlding, fine pitch interco, bumping and report
capabilities
Project Idea: 3D Silicon and smart system on foil
for medical
EU call: H2020
The Heterogeneous Technology Alliance HTA
Contact:
Yann.lamy@cea.fr
Project Idea short description Heterogeneous smart system on flexible foils
Short Description: Merge 3D silicon electronics for high speed/freq. with electronics on foils,
development of integrated interconnects and packaging/encapsulation solutions in order to ensure
enhanced durability of these heterogeneous smart systems. First levels of intelligence with passives
components and organic thin film transistors, and biocompatible coating.
On foil and si to foil
intercos
Foil-on-foil to
multifoils interco
Medium to high 3D
interco + multiple
sensors
User frinedly durable and
flexible packaging
Potential Applications:
Medical applications, health patch, telemonitoring, wireless communications, biosensors (glucose,
spO2, T°C…)
Potential Consortium/Competences needed:
Foil manufacturers, compliant and stretchable intercos, ultra thi si interposers, passives en foils,
thermomechanical modeling, reliability and test LETI, LITEN, VTT.
Project Idea: Glass hermetic biocompatible packaging Contact:
for medical implants
Yann.lamy@cea.fr
EU call: H2020
The Heterogeneous Technology Alliance HTA
Project Idea short description Highly integrated medical implantable sensors
Short Description: realize a full transparent biocompatible and hermetic glass packaging for SystemAdd-on: Integrated humidity sensor
in-Package for medical implants
- Antenna
Glass process investigation (etching, thining)
Heterogeneous assembly
Hermetic sealing
In vitro testing
Potential Applications:
Medical implants: cardiac probes, neural probes,
Ultra-thin package <
750µm
-
Cavity in glass
Glass cap
IC
Chip
ME
MS
Glass
interposer
Ex: hermetic sealing
SiO2/SiO2, Au/Au, Au/Si,
Au/Sn…
3D vertical electrical
connection. Through
Glas Via (TGV).
Biocompatible electrical
pads: 3D printing or ECD
<2mm
Potential Consortium/Competences needed:
Sensors development, glass interposer development, hybridation rdie report, Through-glass-Vias,
glass thinning and handling
Biocompatibility evaluation
Project Idea: ultra large interposer for HPC/data
The
Heterogeneous Technology Alliance HTA
servers
EU call: H2020 - LEIT
Contact:
lea.dicioccio@cea.fr
Project Idea short description: « ultra large and fine pitch Si interposer : from
simulations to fabrication »
Short Description:
Stress monitored ultra large ( >5cm) Si interposer realization
with possibility of fine pitch interconnect (<10 µm).
Simulation:
-stress and layer compensation.
- DRM for direct copper bonding on TSV fine pitch.
-Thermal dissipation simulation.
Demonstrator realization.
Smart interposer? ( open to consortium proposals)
Potential Applications:
3D interposer fine pitch for HPC , Leds, power devices, 3D devices.
Potential Consortium/Competences needed:
LETI (CNRS SIMAP , IMP Bordeaux) : interposer process, top die post process, simulation
Partners for : demonstrator design and characterization, design/fabrication or supply of top dies
thermo-mechanical material behavior expertise, characterization,., other proposals?
Project Idea: advanced non destructive failure analysis Contact:
EUHeterogeneous
call: H2020 (“STREP”-preferred)
The
Technology Alliance HTA
didier.bloch@cea.fr
Project Idea short description: Development of a « TOBIC » 3D failure
analysis tool
Short Description:
Problem to be solved: submicronic failure detection in buried layers (TOBIC offers additional
informations compared to existing techniques, and allows a better resolution)
→ Principle: Two-Photon Optical Beam Induced Current (TOBIC)
→ Electrical analysis of signal produced by carriers optically injected in the layers
→ Objective of the project: design and fabrication of a “demonstrator” equipment adapted to
various market segments
Potential Applications:
-Detection of crystalline defects, doping modifications, interco failures, 3D-imaging of
defects…
-3D reliability, package in package, WLP, MEMS…
Potential Consortium/Competences needed:
-Industrial partners: TEEM Photonics (Equipment Manufacturer, coordinator, F), SERMA
(Characterization Service provider, F), equipment end-user (Foundry? tbd), image
reconstruction (tbd), low current detection instrumentation (tbd)
-Academic partners: Grenoble Univ. IMEP-LAHC (F), understanding of materials-laser
interaction (tbd)
-HTA partners :CEA-LETI, image reconstruction (FhG?), Cross X-Ray analysis
(CSEM?)…(?)
Project Idea: Metamaterials for mmW SiP packages Contact:
EUHeterogeneous
call: H2020 LEIT
Yann.lamy@cea.fr
The
Technology Alliance HTA
Project Idea short description: Development smart interposer with
metamaterials for millimeter wave mmW applications
Short Description:
High Impedance Surface
Metamaterials
Integration and packaging of heterogeneous SiP for mmW applications.
- Integration of the mmw antenna directly on an interposer (Si or organic)
Antenna
- Replacement of the reflector by 3D metamaterials
- Subwavelength cavity reduction, (~l/50 ),
 Ultra directive antenna
Goals: improve diminution of package footprint
Costs, and antenna performances
PCB
Potential Applications:
- Wireless 60 GHz high data rate applications
- Automotive radar 77GHz
- Imaging 100-120 GHz
Potential Consortium/Competences needed:
- Mmw heterogeneous electromagnetic simulations
- Si/organic interposer fabrications, 3D integration: TSV, intercos
- Reliably assembly and wafer level packaging
- RF/mmw anechoic testing, 100 GHz