2012 Advisory Panel
Power Electronics
Mark Flynn
Center for Electromechanics
The University of Texas at Austin
12/4/2012
Outline
•
•
•
•
•
Introduction
Recent/current work
Capabilities
Vision for future
Summary
Introduction
• Power electronics is multi-disciplinary
– Semiconductors, circuit theory, electromagnetics,
control theory, software, machines, simulation,
signal processing, power systems, thermal, structural
• Power electronics is rapidly developing
• Success requires
– Wide breadth of personnel capabilities
– Equally wide support infrastructure
– Vision/leadership to invest in strategic development
of personnel and infrastructure capabilities
Introduction
• Innovation and customization are what
separate power electronics R&D from
commercially available solutions
– Electrical (e.g. power, voltage, topology)
– Controls (very end user specific)
– Packaging (e.g. size, cooling, application)
– Cost
Challenge – Maturing an Emergent
CEM Core Technology
• CEM excels in power electronics innovation and customization
• Traditionally power electronics at CEM
– Ad hoc, supporting role rather than core technology
– Exception: controllers
• Recent growth in power-electronics-support of sponsors
– Smart technologies
– Higher efficiencies
• Targeted, concurrent growth of CEM facilities capabilities in P.E.
• Prompted natural transition of P.E. to Center-wide focus
• Proper development of P.E. into core technology is key challenge
Outline
•
•
•
•
•
Introduction
Recent/current work
Capabilities
Vision for future
Summary
What we have done and
are doing in the area
• Sampling of recent power electronics projects
• Highlighted active projects
– Silicon Carbide Switch Development
– 2 MW ARCP Soft Switching Converter
– 60 kW Bidirectional DC-DC Converter
Sampling of Recent Power
Electronics Projects
Multiphase, Bidirectional DC-DC
Converter
Algal Cell Lyser
Pressure Tolerant Subsea Inverter
Sampling of Recent Power
Electronics Projects
ARCP Soft-Switching Converter
Bidirectional, Solid State Marx
Generator
DC Inline Fault Generator
Sampling of Recent Power
Electronics Projects
5.6 kV, 3-Level Inverter
Silicon Carbide Switch
Development
Motor Controllers
SiC SGTO Switch Development
and Failure Investigation
ARL SGTO Pulse
Test Results
ANSYS Conduction
Current Coupled
Simulations
Thermal Imaging
Experiments
Polyimide
Damage
EMAP3D Semiconductor
Physics Simulations
SiC Device Design
Improvements
11
2 MW ARCP Soft-Switching
Converter
2MW “ARCP” converter
(Auxiliary Resonant Commutated Pole)
10 kW tabletop test-bed converter
with advanced ARCP topology
Soft-Switching Research at CEM
• Largest (2MW) ARCP converter in the world, to the
best of our knowledge
• A new, modified technology is under investigation
via a 10 kW test prototype
• The 2MW converter to be upgraded to new
technology
• Full characterization of prototype is expected by
Spring 2013
• Upgrade of 2 MW unit to start in Summer 2013
60 kW 3-Phase Bidirectional
DC-DC Converter
High-Performance Controller
Max and Min Inductor Current vs. Inductance
VHi = 750 V, fs = 3 kHz, P batt = -40 kW
150
100
0
41
50
0
22
Current (A)
Imax
0
41 0
-50
-100
410
22 0
41 0
410
220
220
220
0
41
22 0
Imin
-150
-200
200
VIN
220 –
410 V
VOUT
700 –
850 V
> 97 %
Efficient
< 0.2 %
ripple
400
600
800
1000
1200
1400
Inductance (H)
1600
1800
2000
Outline
•
•
•
•
•
Introduction
Recent/current work
Capabilities
Vision for future
Summary
Define the CEM Niche
• Analysis and Design: Electrical, Thermal,
Magnetic, Structural
• Solid modeling
• Controllers
• Fabrication
Detailed Electrical Simulations
IGBT Model
Diode Model
Thermal Analysis of Complete
Systems
Magnetic Analysis
Compute stray inductances
Stress Analysis of Bus Bar
Stress concentrations result in 26 ksi VM stress
Deflection due to load
Solid Modeling Capabilities
• Optimize electrical performance
• Optimize thermal management
• Optimize ergonomics
Solid Model Assembly
Real World Hardware
Embedded Controllers
•
•
•
•
•
•
Customized to demand
Circuit design, capture
PCB layout, assembly
SMT, TH soldering
Software, controls
Numerous licenses to
partners
Controller
Verified Pressure Tolerant
Controller
• Monitors 2 IGBT
junction
temperatures in
real-time
• Tested to 4200 psi
hydrostatic
pressure
• 16-bit processor
Outline
•
•
•
•
•
Introduction
Recent/current work
Capabilities
Vision for future
Summary
How we Plan to Develop this Field
•
•
•
•
•
Vision for CEM and power electronics
Who might our partners be
Near term steps to achieve the vision
Key challenges
Longer term considerations
Vision for CEM and Power
Electronics
• To achieve and maintain a high level of
expertise in the design, construction, and
operation of all aspects of power electronic
assemblies
• Offer development, integration, and testing
of power-electronic/electromechanical
systems with world-class competency
Who Might our Partners be
•
•
•
•
•
•
•
•
•
•
ARL
Coda Energy, Inc.
Cree
EE/ME departments
General Electric
Giant Magellan Telescope
Horstman
U.S. Air Force
U.S. Navy
Vycon, Inc.
Near term Steps to Achieve the
Vision – Market vs. Competencies
• Examine and respond to market demand
– Understand present market requirements
– Identify upcoming technologies
– Maintain forward looking business model
• Identify desired CEM competencies
– Basic power electronic topologies: ac/dc, dc/dc, single
pulse, dc/ac, etc.
– Enabling agents: controllers, software, analysis, assembly,
etc.
– Capacity range: power levels: W to MW, voltage range: V
to kV, etc.
– Etc.
Near term Steps to Achieve the
Vision – Personnel and Facilities
• Match desired competencies to personnel
–
–
–
–
Identify where resources are lacking
Develop master plan to invest in training of personnel
Establish metrics for on-going personnel development
Hire personnel in needed areas as required/have funding
• Match desired competencies to facility
–
–
–
–
Identify where resources are lacking/aging
Develop plan to invest acquiring/maintaining equipment
Establish metrics for training personnel on equipment
Purchase/upgrade equipment in areas as needed
Near term Steps to Achieve the
Vision – Methodology 1 of 2
• Capture and employ CEM’s intellectual property
– Designs produced should be recorded and taught to
targeted personnel as part of continuing education
– Develop CEM-standard designs/methods where possible
• CEM-standard controller is in development
• No need to re-invent converters for each project
• Eliminate unnecessary diversity in techniques
– Wasteful of time and sponsor funds
– Reduces benefit of Center-wide expertise
• Eliminate fiefdoms
– Leverage Center experts
– Adhere to strategic plan for developing personnel
Near term Steps to Achieve the
Vision – Methodology 2 of 2
• Prepare timeline for execution of vision
– Compare employee/facility development to plan
– Commit to investing in personnel and facilities
• Leverage growth opportunities via projects
– Match potential employee development
opportunities afforded by a given project to the
master plan
– Require projects to grow Center capabilities along
the direction of the master plan to the extent
possible
Key Challenges
• Internal
– Tangible and implementable vision required
– Time/funds for personnel development
– Eliminate waste/increase Center collaboration
– Facilities improvements
– Power electronics not a traditional Center focus
• External/Marketing
– Reputation as world class player must be grown
Key Challenges – Attracting and
Maintaining Sponsors
Expertise
Presentation
Reputation
Client
Entry
Longer term Considerations
• Update and maintain vision according to market
demands
• Commit to personnel and facilities investments
• Establish and verify metrics regularly
• Take on projects with a Center-wide focus
– Center leaders should pursue projects in cooperation to
meet the demands of the master plan to achieve the vision
desired
– Each project should permit extraction of some means of
advancing the master plan
• Establish leadership positions to maintain
accountability
Outline
•
•
•
•
•
Introduction
Recent/current work
Capabilities
Vision for future
Summary
Summary
• Importance of power electronics
– Sponsors demand ever-capable and efficient solutions
– CEM seeks to leverage power electronics capabilities
• Strengths
– Technical skills: design, analysis, fabrication
– Intellectual property: internal libraries/designs
– Facilities: service power, supplies, tools
• Challenges
– Managing growth and direction of new department