Analog VLSI Design
Nguyen Cao Qui
Introduction to the course
• Name:
“ Analog VLSI Design ”
• Instructor: Nguyen Cao Qui
email: ncqui@ctu.edu.vn
• Goals:
The goal of this course is to introduce the principles of
operation, design and technology of Analog Integrated
Circuits to Electrical Engineering students at Senior level.
VLSI technology and analog integrated circuit design is
covered with an emphasis on CMOS Technology. CMOS
layout design and analog simulation tools (Cadence) are
demonstrated and used. Students will do a design project and
final exam at the end.
Introduction to the course
• Number of credits : 3
(1: theory ; 2: homework + project +Seminar)
• Textbooks:
“CMOS: Circuit Design, Layout, and Simulation”
R. Jacob Baker
• Other Books:
"CMOS Analog Circuit Design"
Phillip E. Allen and Douglas R. Holdberg
Introduction to the course
• Course Policies:
* Homework + Project : 40%
* Final Test
:60%
Conversion
10 ‘ Scale
ABCB
0.0
F
4.0
D
4.5
D+
5.0
C
6.0
C+
7.0
B
7.8
B+
8.5
A
CONTENTS
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Chapter 1: Introduction to CMOS Design
Chapter 2: The Well
Chapter 3: The Metal Layers
Chapter 4: The Active and Poly Layers
Chapter 5: CAD Tools (Cadence)
Chapter 6: Resistors, Capacitors, MOSFETs
Chapter 7: Models for Analog Design
Chapter 8: The Inverter
Chapter 9: VLSI Layout Examples
Chapter 10: Current Mirrors
Chapter 11: Amplifiers
Chapter 12: Differential Amplifiers
Chapter 13: Operational Amplifiers I
Chapter 14: Voltage References
Chapter 15: Data Converter Fundamentals (ADC)
Chapter 16: Data Converter Fundamentals (DAC)
Chapter 1
Introduction to CMOS Design
• CMOS (complementary metal oxide semiconductor)
• CMOS is used in most very large scale integrated
(VLSI) or ultra-large scale integrated (ULSI)
• "VLSI" : chips containing thousands
or millions of MOSFETs.
• "ULSI" : containing billions, or more, MOSFETs.
• We focus simply on analog CMOS circuit design
Introduction to CMOS Design
1. The CMOS IC Design Process
The CMOS IC Design Process
1.1 Fabrication
• CMOS integrated circuits are fabricated silicon wafers.
• Each wafer contains chips or "die"
• The most common wafer size is 300 mm
2. CMOS Background
• CMOS circuit design was invented in 1963 by Frank
Wanlass
• Circuit could be made with discrete complementary
MOS devices, an NMOS and a PMOS
NMOS
PMOS
2. CMOS Background
* Ex: CMOS Inverter
2. CMOS Background
•
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Advantages of CMOS:
Low power
Layout on small area
Can be fabricated with few defects and low cost.
95% of ICs are fabricated in CMOS
3. Technology Scale Down
* The Moore’s Law : Doubling every 18 months
3. Technology Scale Down
Chapter 2: The Well
* Studying the well to:
• Understanding CMOS integrated circuit layout
and design.
• Understanding the performance limitations and
parasitics.
• Understanding the details of each fabrication
(layout) layer.
Chapter 2: The Well
* The Substrate (The Unprocessed Wafer)
• CMOS circuits are fabricated on and in a silicon wafer
• N-type wafer: doping with donor atoms, exp: phosphorus
• P-type wafer: doping with acceptor atoms, exp: boron
• P-type wafer: the most common substrate used
• NMOS are fabricated directly in the p-type wafer
• PMOS are fabricated in an "n-well."
Chapter 2: The Well
* A Parasitic Diode
Chapter 2: The Well
* Using the N-well as a Resistor
2.1 Patterning
CMOS integrated circuits are formed by patterning different layers
on and in the silicon wafer.
2.1 Patterning
2.1 Patterning
2.1.1 Patterning the N-well
2.2 Laying Out the N-well
2.2.1 Design Rules for the N-well
2.3 Resistance Calculation
2.3 Resistance Calculation
2.3 Resistance Calculation
* Layout of Corners
2.4. PN Junction Physics Capacitance
2.4. PN Junction Physics Capacitance
2.5. Design Rules for the Well
Chapter 3: The Metal Layers
• The metal layers: connect circuit elements
(MOSFETs, capacitors, and resistors).
• There are several metal layers when layout
• These levels of metal are named metal1 (M1),
metal2 (M2)…
3.1 The Bonding Pad
• The interface between the die and the package
3.1.1 Laying Out the Pad
Capacitance of Metal-to-Substrate
Insulator - Overglass layer
3.2 Design and Layout Using the
Metal Layers
3.2.1 Metal1 and Via1
An Example Layout
3.2.2 Parasitics Associated with the
Metal Layers
Intrinsic Propagation Delay
The velocity
The delay of the metal line
Where
3.2.3 Design Rules for the Metal
Layers
A Layout Trick for the Metal Layers
3.2.4 Contact Resistance
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
Chapter 4:
The Active and Poly Layers
• The active, n-select, p-select, and poly:
form n-channel and p-channel MOSFETs.
• Metal layers can make an contact to the
substrate or well.
• The n-select layers indicate where to implant
n-type.
• The p-select layers indicate where to implant
p-type.
Chapter 4:
The Active and Poly Layers
• The active defines an opening in the oxide.
• The active and select layers are always used
together.
• The poly layer forms the gate of the MOSFETs.
• Poly is a short name for polysilicon.
4.1 Layout using the Active and
Poly Layers
• The Active Layer
The P- and N-Select Layers
The P- and N-Select Layers
The Poly Layer
• The poly layer is used for MOSFET formation.
• The gate of the MOSFET is formed with the
polysilicon.
• The source and drain of the MOSFET are
formed with the n+ implant.
Layout and cross-sectional views
of a MOSFET.
Layout and cross-sectional views
of a MOSFET.
Layout and cross-sectional views
of a MOSFET.
The Poly Wire
• The poly layer can also be used, as a wire.
• Poly is routed on top of the FOX.
• The main limitation when using the poly layer for
interconnection is its sheet resistance.
• The sheet resistance of the metal layers is
approximately 0.1 Ohm/square; The poly layer:
200 Q/square.
• The delay through a poly line can be considerably
longer than a metal line.
The Poly Wire
4.1.1 Process Flow
4.1.1 Process Flow
4.2 Connecting Wires to Poly and Active
4.2 Connecting Wires to Poly and Active
Connecting the P-Substrate to Ground
Layout of an N-Well Resistor
Layout of an NMOS Device
Layout of a PMOS Device
Design Rules
Design Rules