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EC600M-CN QuecOpen Reference Design

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EC600M-CN QuecOpen
Reference Design
LTE Standard Module Series
Version: 1.2
Date: 2023-02-24
Status: Released
EC600M-CN_QuecOpen_Reference_Design
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LTE Standard Module Series
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a)
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d)
We acknowledge no liability for any injury or damage arising from the reliance upon the information.
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LTE Standard Module Series
About the Document
Revision History
Version
Date
Author
Description
-
2022-04-27
Andy ZHAO
Creation of the document
1.0
2022-08-31
Andy ZHAO
First official release
Andy ZHAO
Updated related information of ADC interface:
Added ADC voltage divider and related notes (Sheet 3);
Updated ADC voltage domain from 1.8 V to 1.2 V (Sheet 1
and 3).
Howell KANG
1. Updated the UART Level-shifting Circuit in IC Solution
(Sheet 7).
2. Added a note about the capacitors of the signal pins
(Sheet 13).
1.1
1.2
2022-09-14
2023-02-24
EC600M-CN_QuecOpen_Reference_Design
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LTE Standard Module Series
Contents
About the Document .................................................................................................................................. 3
Contents ...................................................................................................................................................... 4
1
Reference Design ................................................................................................................................ 5
1.1.
Introduction ............................................................................................................................... 5
1.2.
Schematics ............................................................................................................................... 5
EC600M-CN_QuecOpen_Reference_Design
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LTE Standard Module Series
1 Reference Design
1.1. Introduction
This document provides the reference design for Quectel EC600M-CN QuecOpen® module.
1.2. Schematics
The schematics illustrated in the following pages are provided for your reference only.
EC600M-CN_QuecOpen_Reference_Design
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Block Diagram
MCU
D
Main Antenna
EC600M-CN
D
Bluetooth Antenna
ANT_MAIN
Main UART
VDD_MCU
VDD
GPIO06
PWRKEY
VBAT_EN
GPIO01
GPIO07
RESET_N
VBUS_CTRL
GPIO02
GPIO08
CODEC_POWER_EN
GPIO03
GPIO09
W_DISABLE#
CAM_GPIO1_MCU
GPIO04
GPIO10
AP_READY
PCM
Transistor
I2C
ASR5801
Headset
or
Handset
ALC5616
WAKEUP_IN
Circuit
SPK
MIC
Handset
Microphone
C
C
CAM_GPIO2_MCU
GPIO05
12-bit ADC
0–1.2 V
ADC1
RESET_N
Debug UART
PWRKEY
USB
Test Points
B
Download
Control
UART
Level-shifting Circuit
USIM
USIM Card × 2
CAM_SPI
Matrix Keypad
Camera
Matrix Keypad
5×5
NET_STATUS/USB_BOOT
SLEEP_IND
VBAT
GPIO1
NET_MODE
NET_STATUS/USB_BOOT
B
Status Indication
STATUS
VDD_EXT
1.8 V / VDD_MCU
LCM
GND
GPIO2
USB 2.0
SPI
ADC0
USB 2.0
VBAT_BB
Main UART
3.8 V/ 2.0 A
VBAT
VBAT_RF
NOTE
A
A
NOTE:
A level-shifting circuit or a voltage-level translator TXS0108EPWR provided by Texas Instruments is recommended.
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Power System Block Diagram
D
D
AUDIO_PA_EN
EN
TPA6205A1
USIM1_VDD
e.g. DC 12 V Input
DC-DC
DC 5 V Output
VBAT_EN
DC 3.8 V @ 2.0 A
MIC29302WU
EC600M-CN
USIM1
USIM2_VDD
EN
USIM2
C
C
CAM_VDD
CAM_VDDIO
VBUS_CTRL
USB_VBUS
MOS ON/OFF
EN
External LDO
VDD_EXT
Camera
CAM_VDDIO
LCD_VDD
LCM
LCD_VDDIO
DC 3.3 V
SGM2019-ADJYN5G/TR
CODEC_POWER_EN
CAM_VDD
EN
Codec
B
B
ALC5616
DC 1.8 V
SGM2019-ADJYN5G/TR
VDD_EXT
EN
A
A
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Module Interface
D
D
[14] KP_MKIN[3]
[18] NET_MODE
[14] KP_MKOUT[3]
[14] KP_MKIN[2]
[18] STATUS
[14] KP_MKOUT[4]
[18] NET_STATUS/USB_BOOT
AP_READY [4]
R0341
NM-0R
R0303
NM-0R
KP_MKOUT[2] [14]
R0312
0R
R0349
0R
WAKEUP_IN [4]
R0314
NM-0R
R0336
NM-0R
KP_MKIN[1] [14]
R0339
0R
R0320
NM-0R
AUDIO_PA_EN [17]
77
R0347
0R
MAIN_DCD [7]
78
U0301-B
79
80
82
39
NM_0R
41
0R
R0345
40
NM_0R
R0340
42
R0308
43
0R
44
NM_0R
R0322
46
0R
R0332
45
R0301
48
NM_0R
47
R0326
49
0R
50
R0354
53
NM_0R
52
0R
R0318
51
R0330
81
MAIN_DTR [7]
56
[15] I2C_SCL
[13] BT_I2C_SCL
MAIN_DTR
MAIN_RI
RESERVED13
RESERVED14
GND5
GND6
GND7
ANT_MAIN
GND8
MAIN_DCD
AP_READY
WAKEUP_IN
W_DISABLE#
STATUS
SLEEP_IND
MIC_N
GND9
SPK_P
PWRKEY
SPK_N
RESET_N
ADC1
GND10
GND25
GND11
GND24
GND12
GND23
GND13
GND22
GND14
GND21
GND15
GND20
GND16
GND19
GND17
GND18
38
91
90
89
88
87
86
85
VBAT
36
35
34
33
32
31
30
29
VBAT
28
USB_VBUS
R0348
NM_0R
BT_UART_RTS [13]
R0306
0R
MAIN_RTS [7]
R0302
NM_0R
R0304
0R
R0305
NM_0R
R0310
0R
BT_UART_RXD [13]
MAIN_TXD [7]
R0311
NM_0R
BT_UART_TXD [13]
R0307
0R
MAIN_RXD [7]
BT_UART_CTS [13]
MAIN_CTS [7]
C
R0309
NM-0R
3
27
26
2
25
MIC_BIAS
24
C0301
100nF
MIC_P [8]
23
C0302
100nF
MIC_N [8]
22
SPK_P [8,17]
21
SPK_N [8,17]
20
ADC1 [3]
19
ADC0 [3]
L0301
USB_DM_TEST [18]
4
USB_DM [4]
1
USB_DP [4]
DLM0NSN900HY2B
NM-0R
R0334
USB_DP_TEST [18]
NOTE 1
GND1
U0301-C
NOTE 3
[6] USIM2_RST
145
[6] USIM2_DATA
146
[6] USIM2_CLK
147
USIM2_VDD
148
[12] SPI_CLK
B
92
EC600M-CN_QuecOpen
37
18
1
ADC0
CAM_VDD
VDD_EXT
17
76
DBG_RXD
CAM_PWDN
VDD_EXT
MIC_P
CAM_SPI_DATA1
75
MIC_BIAS
DBG_TXD
16
74
GPIO2
SPI_CLK
[4,18] PWRKEY
[4,18] RESET_N
USB_DP
CAM_SPI_DTAT0
73
GPIO1
CAM_SPI_CLK
72
USB_DM
15
[18] DBG_RXD
USB_VBUS
14
71
EC600M-CN_QuecOpen
CAM_VDDIO
13
[18] GPIO2
[18] DBG_TXD
VBAT_BB
LCD_SPI_CLK
CAM_I2C_SDA
70
LCD_SPI_DOUT
CAM_I2C_SCL
69
[18] GPIO1
GND2
U0301-A
12
68
CAM_VDDIO
MAIN_RXD
LCD_SPI_CS
CAM_MCLK
67
[9] LCD_SPI_CLK
LCD_RST
11
[9] LCD_SPI_DOUT
MAIN_TXD
10
66
LCD_SPI_RS
USIM1_DET
65
MAIN_CTS
9
64
LCD_TE
USIM1_VDD
[9] LCD_RST
[9] LCD_SPI_CS
GND3
MAIN_RTS
USIM1_RST
[9] LCD_SPI_RS
VBAT_RF1
USIM1_DATA
63
GND4
PCM_CLK
8
62
PCM_DOUT
7
C
PCM_DIN
84
VBAT_RF2
6
61
PCM_SYNC
USIM1_CLK
60
I2C_SCL
SPI_CS
59
SPI_TXD
58
5
57
NET_MODE
I2C_SDA
83
4
[15] PCM_CLK
KP_MKIN[0] [14]
0R
54
NM_0R
[13] BT_PCM_CLK
W_DISABLE# [4]
NM-0R
R0324
55
R0344
[13] BT_PCM_DOUT
0R
R0325
MAIN_RI [7]
[14] KP_MKIN[5]
[15] PCM_DOUT
R0355
NM-0R
0R
NM_0R
[13] BT_PCM_DIN
0R
R0316
ANT_MAIN [11]
R0342
[13] BT_PCM_SYNC
[15] PCM_DIN
R0343
NM_0R
[13] BT_I2C_SDA
[15] PCM_SYNC
KP_MKOUT[0] [14]
NET_STATUS/USB_BOOT
R0329
NM-0R
SPI_RXD
[15] I2C_SDA
R0315
R0327
3
[14] KP_MKOUT[5]
NM-0R
2
NOTE 2
R0346
[12] SPI_RXD
CAM_VDD
[12] SPI_TXD
CAM_PWDN [10]
[12] SPI_CS
CAM_SPI_DATA1 [10]
[6] USIM1_CLK
CAM_SPI_DATA0 [10]
[6] USIM1_DATA
R0337
NM_0R
[6] USIM1_RST
R0335
0R
BT_HOST_WK_INT [13]
CAM_SPI_CLK [10]
USIM1_VDD
R0333
NM_0R
[6] USIM1_DET
BT_LDO_EN [13]
R0331
0R
CAM_I2C_SDA [10]
R0328
NM_0R
BT_RST [13]
R0323
0R
CAM_I2C_SCL [10]
R0321
NM_0R
HOST_BT_WK [13]
R0317
0R
CAM_MCLK [10]
USIM2_RST
RESERVED1
USIM2_DATA
RESERVED2
USIM2_CLK
RESERVED3
USIM2_VDD
RESERVED4
109
110
111
B
112
EC600M-CN_QuecOpen
ADC
VDD_MCU
VDD_MCU
NOTE:
1. A common mode choke L0301 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission, and it
R0350
R0352
should be placed close to the module. Meanwhile, reserve the test points for upgrading the firmware over USB interface and minimize the extra
ADC0 [3]
stubs of the trace. The two resistors R0309 and R0334 should be placed close to the module to ensure the integrity of USB signal.
R0351
2. NET_STATUS/USB_BOOT cannot be pulled down to low level before the module starts up successfully.
C0303
1nF
ADC1 [3]
R0353
C0304
1nF
3. The voltage input range of ADC0 and ADC1 is 0–1.2 V. A voltage divider with resistance of more than 100 kΩ must be used for ADC interface application. The accuracy of
the two resistors in each voltage divider affects the sampling error of the ADC. It is recommended to use resistors with an accuracy of 1 %; if the accuracy of the ADC needs
to be higher, resistors with an accuracy of 0.5 % are recommended.
A
A
4. All GND pins should be connected to the ground, and unused and RESERVED pins should be kept open.
5. For details of GPIO multiplexing function, see the GPIO configuration document of the module.
6. Ensure there is a complete reference ground plane below the module. The ground plane should be placed as close to the module layer as possible, and at least four-layer design is recommended.
7. The 6.0.1 and above version of QFlash tool must be used for firmware upgrading.
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MCU Interface
D
D
It is used to turn on/off the module.
VDD
1
It is used to reset the module.
VDD_MCU
PWRKEY [3,18]
TXD
3
TXD_MCU [7]
4
RXD_MCU [7]
5
CTS_MCU [7]
6
RTS_MCU [7]
7
RI_MCU [7]
Q0404
DTC043ZEBTL
[4] ON/OFF_MCU
RXD
CTS
RTS
RI
DCD
DTR
USB_VBUS
USB_D+
USB_D-
8
DCD_MCU [7]
9
DTR_MCU [7]
10
USB_VBUS
C0404
10nF
12
It is used to set the module into the airplane mode.
USB_DP [3]
USB_DM [3]
WAKEUP_IN [3]
GPIO01
GPIO02
GPIO03
GPIO04
GPIO05
GPIO06
GPIO07
GPIO08
GPIO09
GPIO10
GPIO11
GPIO12
14
VBAT_EN [5]
15
VBUS_CTRL [4]
16
CODEC_POWER_EN [5]
17
CAM_GPIO1_MCU [10]
18
CAM_GPIO2_MCU [10]
19
ON/OFF_MCU [4]
20
RESET_MCU [4]
21
WAKEUP_IN_MCU [4]
Q0406
DTC043ZEBTL
[4] WAKEUP_IN_MCU
VDD_EXT
GPIO13
C0403
10nF
Q0405
DTC043ZEBTL
[4] W_DISABLE_MCU
C
C0401
10nF
5 V power supply from motherboard.
VDD_EXT
Q0401
DC_5V
22
23
R0403
4.7K
W_DISABLE_MCU [4]
R0401
4.7K
S
C0402
1nF
C0405
470nF
SLEEP_STATUS_MCU [4]
24
USB_VBUS
D
R0404
100K
25
[3] AP_READY
B
W_DISABLE# [3]
13
1
B
USB_ID
MCU
Q0407
DTC043ZEBTL
[4] RESET_MCU
It is used to wake up the module.
11
C
U0401
RESET_N [3,18]
2
G
GND
26
3
2
C
Q0403 E
2SC4617
SLEEP_STATUS_MCU [4]
R0402
10K
B
Q0402
DTC043ZEBTL
[4] VBUS_CTRL
NOTE:
1. U0401 represents your MCU. The power domain of GPIO interfaces of the module is 1.8 V. If the power domain of GPIO interfaces of U0401 is also 1.8 V, then the related level-shifting circuit is not needed.
2. The USB interface of the module can only serve as a slave device and supports full-speed and high-speed modes of USB 2.0. To communicate with the USB interface, MCU needs to support USB host mode or OTG function.
The USB_VBUS pin of the module should be powered by an external power system for USB detection, and VBUS_CTRL is used to turn on/off the USB_VBUS power supply.
3. It is recommended to select the default low-level GPIO pins of MCU as the control pins for PWRKEY and RESET_N of the module. Please ensure that the load capacitance does not exceed 10 nF on PWRKEY and RESET_N pins.
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Power Supply Design
VBAT Design
DC-DC Application
D
D
VBAT
When the input voltage is above 7.0 V, use a DC-DC converter to convert the high input voltage to 5.0 V,
VBAT
Close to VBAT_BB pins.
VBAT
Close to VBAT_RF pins.
and then use LDOs to convert it to 3.8 V, 3.3 V and 1.8 V to power the module, audio PA and Codec. The
supply current of the module must be at least 2.0 A.
DC-DC
DC 5 V Output
LDO1 DC 3.8 V Output
+
+
D0501
EC600M-CN
e.g. DC 12 V Input
C0502
C0512
C0501
C0509
C0508
C0520
C0506
C0519
100uF
100nF
33pF
10pF
100uF
100nF
33pF
10pF
TPA6205A1
DC 3.3 V Output
LDO2
Codec
NOTE:
DC 1.8 V Output
LDO3
1. The power supply should be able to provide sufficient current of at least 2.0 A for the module.
Codec
2. The VBAT trace should be connected to VBAT_BB and VBAT_RF pins in a star configuration.
C
C
3. The width of VBAT_BB trace should be not less than 1 mm; and the width of VBAT_RF trace should be not less than 2 mm.
4. The recommended operating voltage of VBAT ranges from 3.4 V to 4.3 V, and the typical voltage is 3.8 V.
LDO Application
Power Supply for Codec
U0502
SGM2019-ADJYN5G/TR
1
When the input voltage is below 7.0 V, use an LDO to convert the input voltage to 3.8 V.
C0513
1uF
C0511
100nF
3
DTC043ZEBTL
IN
EN
FB
VDD_3V3 = 1.207 × (1 + R0504 / R0509) = 3.3 V
5
VDD_3V3
R0504
4 73.2K +/-1%
C0521
4.7uF
C0518
100nF
C0507
33pF
2
Q0502
OUT
GND
DC_5V
U0503
2
DC_5V
IN
OUT
EN
ADJ
[4] VBAT_EN
GND2
51K
1
GND1
100nF
R0507
R0505
3
470uF
C0514
6
C0504
VBAT
+
+
B
R0510
10K
VBAT = (R0507 / R0503 + 1) × 1.24 = 3.88 V
4
5
C0522
[4] CODEC_POWER_EN
B
R0511
100nF
330R
U0501
SGM2019-ADJYN5G/TR
DC_5V
R0503
47K +/-1%
VDD_1V8
C0516
100K +/-1%
470uF
R0509
42.2K +/-1%
NOTE
1
Q0501
R0502
C0503
1uF
C0505
100nF
0R
3
EN
OUT
FB
VDD_1V8 = 1.207 × (1 + R0501 / R0508) = 1.8 V
5
4
VDD_1V8
R0501
39K +/-1%
C0510
4.7uF
C0515
100nF
C0517
33pF
2
DTC043ZEBTL
IN
GND
MIC29302WU
R0506
100K
R0508
75K +/-1%
VDD_EXT
NOTE:
NOTE:
The recommended load current should exceed 10 mA.
1.VDD_EXT and CODEC_POWER_EN are used to turn on/off VDD_1V8 and VDD_3V3 respectively.
2.The following power-up/down sequences should be followed to ensure the audio codec works normally.
Power-up sequence: power up VDD_1V8 first, and then VDD_3V3.
Power-down sequence: power down VDD_3V3 first, and then VDD_1V8.
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Kelly WANG
A2
5
4
3
2
1
USIM Interface Design
D
D
USIM1
USIM1_VDD VDD_EXT
4
0R
100nF
J0601
6
8
USIM2_VDD
VCC
GND
RST
VPP
CLK
I/O
PRESENCE
7
C0607
1
2
[3] USIM2_RST
3
[3] USIM2_CLK
6
R0604
0R
5
R0605
0R
4
8
7
R0603
VCC
GND
RST
VPP
CLK
I/O
PRESENCE
7
1
2
3
7
C
USIM Card Connector
USIM Card Connector
[3] USIM1_DATA
100nF
J0602
15K
51K
C0608
5
0R
[3] USIM1_DET
C
USIM2_VDD
USIM1_VDD
R0608
R0609
R0602
15K
[3] USIM1_CLK
R0601
R0607
[3] USIM1_RST
USIM2
0R
[3] USIM2_DATA
R0606
0R
U0601
U0602
33pF
33pF
33pF
C0605
33pF
33pF
C0603
33pF
C0604
C0601
C0606
C0602
NOTE:
1. U0601 and U0602 are recommended to be used to offer good ESD protection, and the parasitic capacitance should be less than 15 pF.
2. The pull-up resistors R0607 and R0608 can improve anti-jamming capability, and should be placed close to the USIM card connector.
3. R0601–R0606 are used for debugging, and C0601–C0606 are used for filtering out RF interference.
B
B
4. The capacitance of C0607 and C0608 should be less than 1 μF and they should be placed close to the USIM card connector.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
6 OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
UART Interface Design
D
D
UART Level-shifting Circuit - Transistor Solution
VDD_EXT
VDD_EXT
C0703
R0701
R0702
R0705
C0704
R0703
1nF
4.7K
10K
10K
1nF
4.7K
[4,7] TXD_MCU
C
VDD_MCU
VDD_EXT
MAIN_RXD [3,7]
Q0702
[4,7] RXD_MCU
2SC4617TLQ
2SC4617TLQ
Q0701
MAIN_TXD [3,7]
C
UART Level-shifting Circuit - IC Solution
51K
R0708
100nF
C0702
51K
R0709
U0701
B
1
2
VDD_EXT
3
[3] MAIN_DCD
4
[3,7] MAIN_TXD
5
[3,7] MAIN_RXD
[3] MAIN_RI
6
[3] MAIN_DTR
7
[3] MAIN_CTS
8
[3] MAIN_RTS
9
VDD_EXT
10K
R0704
120K
R0706
10
A1
B1
VCCA
VCCB
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
OE
GND
20
100nF
C0701
B
19
VDD_MCU
18
DCD_MCU [4]
17
RXD_MCU [4,7]
16
15
14
13
12
TXD_MCU [4,7]
RI_MCU [4]
DTR_MCU [4]
CTS_MCU [4]
RTS_MCU [4]
11
TXS0108EPWR
NOTE:
1. There are two level-shifting solutions: transistor solution and IC solution, and it is recommended to select the latter one.
2. The power supply of TXS0108EPWR's VCCA should not exceed that of VCCB. For more information, see the datasheet of TXS0108EPWR.
A
A
3. The transistor solution is not suitable for applications with high baud rates exceeding 460 kbps. The capacitors C0703 and C0704 of 1 nF can improve the signal quality.
4. MAIN_RTS and MAIN_DTR level-shifting circuits are similar to that of the MAIN_RXD.
MAIN_CTS, MAIN_RI and MAIN_DCD level-shifting circuits are similar to that of the MAIN_TXD.
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
7 OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Analog Audio Design
D
D
Microphone Bias Circuit
Microphone Application
MIC_BIAS
100nF
C0818
R0802
510R
C0803
R0801
1.5K
C0807
C0805
10pF
33pF
C0814
C0815
10pF
33pF
C0809
C0812
10pF
33pF
Close to microphone interface
D0801
2.2uF
[3,8] MIC_P
MIC_P [3,8]
[3,8] MIC_N
MIC_N [3,8]
[3,8] MIC_P
J0801
MIC
[3,8] MIC_N
R0803
1.5K
D0802
R0804
C
C
510R
33pF
10pF
33pF
C0806
C0804
C0808
[3,8] MIC_P
[3,8] MIC_N
[3,17] SPK_P
B
C0810
C0813
C0816
33pF
10pF
33pF
B0803
0R
B0802
0R
B0804
0R
B0801
4
1
J0802
HANDSETCON
3
B
2
5
C0811
10pF
0R
D0806
C0801
33pF
D0805
C0819
10pF
[3,17] SPK_N
Close to handset interface
6
10pF
C0802
D0804
33pF
C0820
D0803
10pF
C0817
Handset Application
NOTE:
1. Both the MIC and SPK signal traces need to be routed as differential pairs.
2. All MIC and SPK signal traces should be surrounded with ground on the layer and ground planes above and below, and far away from noises.
3. An external microphone bias circuit must be added when using electret microphone.
A
A
4. It is recommended to use 10 pF and 33 pF capacitors to filter RF interference.
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
8 OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
LCM Interface Design
D
D
PWM
40510W90-26N-SHL2ETBR
0R
NOTE 4
1
26
2
25
3
24
4
23
5
22
6
21
J0901
7
20
VDD_EXT
8
19
LCD_VDD
9
18
10
17
11
16
12
15
13
14
R0904
0R
R0905
0R
R0903
0R
C0901
C0902
C0903
C0908
C0909
2.2uF
2.2uF
100nF
100nF
28
C0904
NM_33pF
C
C0907
[3] LCD_SPI_RS
NM_33pF
[3] LCD_SPI_CLK
NM_33pF
[3] LCD_SPI_CS
NOTE 3
27
NOTE 1
VDD_EXT
R0902
0R
R0901
0R
LCD_RST [3]
LCD_SPI_DOUT [3]
C0905
51R
R0906
C0906
R0907
NM_33pF
LED-A
NM_33pF
Q0901
DTC043ZEBTL
NOTE 2
C
NOTE 3
NOTE:
1. It is recommended to design LCM power supply by yourself.
2. To avoid abnormal LCM display caused by power fluctuation, it is recommended to mount filter capacitors.
3. The 33 pF capacitors of the signal pins should be reserved, and be used according to the actual debugging situation.
4. The LED-A backlight power supply is designed by youself, and you can select the approriate resistor (R0907) according to the
B
B
digital transistor rated current and LED-A voltage value.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
9 OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Camera Interface Design
CAM_VDDIO
2.2uF
NOTE 3
C1006
C1007
17
1
C1002
100nF
D
100nF
D
2
CAM_VDD
3
CAM_VDDIO
4
CAM_I2C_SCL [3,10]
5
J1001
C
FH34SRJ-16S-0.5SH(50)
CAM_I2C_SDA [3,10]
6
7
R1005
0R
R1003
0R
R1002
0R
R1008
0R
R1010
0R
R1006
33R
R1004
33R
C
CAM_SPI_CLK [3]
8
4.7K
4.7K
R1001
R1009
9
CAM_MCLK [3]
10
11
CAM_SPI_DATA0 [3]
CAM_SPI_DATA1 [3]
12
13
CAM_I2C_SDA [3,10]
CAM_PWDN [3]
14
15
R1007
C1008
C1005
C1003
C1004
NM_33pF
NM_33pF
NM_33pF
C1009
NM_33pF
18
Q1002
VBAT
0R
1uF
C1001
16
NM_33pF
CAM_I2C_SCL [3,10]
CAM_GPIO1_MCU [4]
NOTE 2
DTC043ZEBTL
Q1001
NOTE 2
CAM_GPIO2_MCU [4]
DTC043ZEBTL
NOTE 1
B
B
NOTE:
1. By controlling the triode switching circuit, CAM_GPIO1_MCU controls the cathode of the positioning light of the camera, and CAM_GPIO2_MCU controls the cathode of the supplement light of the camera.
It is recommended to select GPIO pins which are in pull-down status by default as the two control pins.
2. The 33 pF capacitors of the signal pins should be reserved, and be used according to the actual debugging situation.
The values of current limiting resistors of positioning light and supplement light (R1004 and R1006) should be varied according to the required brightness.
3. The capacitors (C1002 and C1006) of the CAM_VDD power supply should be connected to the GND layer directly. Otherwise, power supply noise may lead to abnormalities such as white dots on the preview screen.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
10OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Antenna Interface Design
D
D
J1101
R1101
ANT_MAIN [3]
0R
C
C
C1102
C1101
NM
NM
NOTE:
The single-ended impedance of the RF antenna is 50 Ω.
B
B
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
11OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
SPI Interface Design
D
D
Module As Slave
Module As Master
C
C
EC600M-CN
U1202
SPI_CS
EC600M-CN
SPI_CLK [3,12]
SPI_CLK
2
SPI_RXD [3,12]
SPI_MISO
1
SPI_TXD [3,12]
SPI_MOSI
SPI_CS [3,12]
3
SPI_CLK [3,12]
2
SPI_TXD [3,12]
1
SPI_RXD [3,12]
C1202
NM
D1202
D1205
D1201
C1201
NM
D1207
Peripheral
D1204
Peripheral
4
D1206
SPI_MOSI
SPI_CS [3,12]
3
D1203
SPI_CLK
SPI_MISO
4
D1208
SPI_CS
U1201
B
B
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
12OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Bluetooth Interace Design
D
D
BT_HOST_WK_INT [3]
1
0R
2
[3] BT_PCM_CLK
R1307
0R
3
[3] BT_PCM_SYNC
R1302
0R
4
5
[3] HOST_BT_WK
6
4.7K
7
8
NC4
25
26
27
GPIO12
FM_OUTL
FM_OUTR
30
28
29
GPIO13
32
31
PCM_DOUT
NC3
PCM_DIN
NC2
PCM_CLK
NC1
U1301
PCM_SYNC
FM_IP
ASR5801
GPIO5
FM_IN
MODE0
AVDD_BT
MODE1
RF
HWRESET
LDO_EN
24
23
22
21
J1301
20
ANT_BT
19
C
AVDD_1V8_BT
C1304
18
17
10pF
C1315
10pF
BT_LDO_EN [3]
C1319
NM
12
C1309
NM
D1301
GESD1005H5R5CR10GPT
1
AVDD_18
L1301
NM
16
DVDD_12
AVDD_FM
15
14
XEN_OUT
I2C_SCL
I2C_SDA
XTAL
13
12
9
BT_I2C_SCL [3,13]
11
BT_I2C_SDA [3,13]
10
XIN_32K
2
[3] BT_RST
HOST_WAKE
0R
R1301
UART_TX
33
GND
R1305
UART_RX
C1314 NM
[3] BT_PCM_DIN
R1304
R1306
C1318 NM
BT_UART_RTS [3]
[3] BT_PCM_DOUT
4.7K R1303
C
BT_UART_CTS [3]
[3] BT_UART_RXD
0R
VDD_EXT
C1306 NM
C1317 NM
NOTE 3
[3] BT_UART_TXD
AVDD_1V8
[13] BT_CLK_32K
[3,13] BT_I2C_SDA
AVDD_1V8_FM
[3,13] BT_I2C_SCL
DVDD_1V2
[13] BT_CLK_26M
X1302
4
AVDD_1V8
C1321
B
220nF
1
VCC
NC
OUT
GND
3
DVDD_1V2
AVDD_1V8
BT_CLK_26M [13]
2
C1311
C1301
C1303
C1322
C1312
C1313
100pF
470nF
1uF
100pF
470nF
1uF
C1320
C1310
C1316
C1302
C1305
C1307
100pF
470nF
1uF
100pF
470nF
1uF
B
TCXO 26MHz +/-10ppm
X1301
4
AVDD_1V8
C1308
220nF
1
VCC
OUT
NC
GND
3
BT_CLK_32K [13]
AVDD_1V8_FM
2
AVDD_1V8_BT
TCXO 32kHz +/-10ppm
NOTE 2
NOTE 1
NOTE:
1. 1.8 V power supply of the Bluetooth chip (AVDD_1V8) shall be designed by yourself.
And the other three (DVDD_1V2, AVDD_1V8_FM and AVDD_1V8_BT) are the internal power supply pins of the chip, which are used to connect external filter capacitors.
A
A
2. It is recommended to choose 26 MHz and 32 kHz oscillators and to design power supply circuits on your own.
3. The 33 pF capacitors of the signal pins should be reserved, and be used according to the actual debugging situation.
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
13OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Matrix Keypad Design
D
D
[3] KP_MKIN[1]
D1408
S1405
2
D1402
2
2
1
2
2
2
2
2
S1410
S1408
1
1
2
2
2
2
2
S1424
S1415
1
S1412
1
S1409
1
1
1
1
2
2
2
2
2
S1419
1
S1406
1
S1403
C
S1421
1
S1407
1
S1402
D1401
[3] KP_MKOUT[3]
D1405
1
S1404
D1403
[3] KP_MKOUT[2]
[3] KP_MKIN[5]
1
S1401
C
2
S1416
D1404
[3] KP_MKOUT[0]
D1409
S1414
S1420
2
[3] KP_MKIN[3]
S1413
D1410
[3] KP_MKIN[2]
S1411
[3] KP_MKIN[0]
1
1
1
1
1
2
2
2
2
2
NOTE
1
1
S1422
S1423
1
1
B
1
D1407
[3] KP_MKOUT[5]
S1425
S1418
B
S1417
15K
R1401
D1406
[3] KP_MKOUT[4]
NOTE:
When pin 55 of the module is multiplexed into KP_MKOUT[4], the pin must be pulled down to the ground by adding an external 15 kΩ resistor.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
14OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Audio Codec Design (ALC5616)
R1516
R1517
0R
0R
C1520
C1505
C1516
C1522
C1523
C1527
C1511
C1512
C1517 C1513
4.7uF
100nF
4.7uF
100nF
33pF
4.7uF
100nF
33pF
2.2uF
2.2uF
29
100nF
DBVDD
30
DCVDD
DACREF
MICBIAS
C
15
C1529
4.7uF
31
C1524
CPVDD
0R
6
R1513
MICVDD
0R
5
R1502
AVDD
VDD_1V8
VDD_1V8
VDD_1V8
D
VDD_3V3
D
C
R1503
C1528
510R
R1504
1.5K
R1509 0R
2
4.7uF
C1503
32
MICBIAS1
CPP1
IN1P/DMC_DAT
CPN1
14
C1515
2.2uF
C1521
2.2uF
13
MICBIAS
2.2uF
C1514
[16] MICP
CPP2
2.2uF
3
4
[16] MICN
C1530
2.2uF
IN2P
CPN2
HPO_R
25
R1515
[3] PCM_DOUT
R1520
[3] PCM_DIN
510R
0R
22
R1510
0R
21
R1518
0R
24
R1511
0R
23
[3] PCM_CLK
[3] PCM_SYNC
HPO_L
U1501
MCLK
ALC5616-CGT
DACDAT1
LOUTL/P
ADCDAT1
LOUTR/N
NM
NM
LRCK1
CPVPP
CPVEE
CPVREF
NM
VREF2
28
1
JD1
SCL
7
DGND
NM_10K
AGND
R1508
33
VDD_3V3
R1514
0R
C1508
1uF
20
R1507
0R
C1518
1uF
R1501
0R
C1531
1uF
R1521
0R
C1507
1uF
9
10
SPK_R [16]
SPK_L [16]
SPKP [16]
16
C1504
2.2uF
SPKN [16]
19
C1525
2.2uF
C1501
4.7uF
18
8
GPIO1/IRQ1
SDA
B
17
BCLK1
C1509 C1502 C1526 C1510
NM
11
IN2N/JD2
R1512
1.5K
12
27
I2C_SDA [3]
26
I2C_SCL [3]
B
C1506
NM_33pF
C1519
R1519
4.7K
R1506
4.7K
NM_33pF
VDD_1V8
R1505
0R R-0805
NOTE:
1. ALC5616 power-up sequence: DBVDD/I2C pull-up power/AVDD/DACREF/CPVDD → MICVDD → software initialization.
2. ALC5616 power-down sequence: disable Codec function by software → MICVDD → DBVDD/I2C pull-up power/AVDD/DACREF/CPVDD.
3. The module will automatically initialize the Codec via I2C interface after it is turned on successfully, so all power supplies for the Codec need to be powered up before that.
4. Please pay attention to the distinction between analog ground and digital ground. The analog ground and digital ground need to be connected with a 0 Ω resistor packaged as R-0805. For more details, please refer to sheet "Audio Codec Interface Design".
5. For more details, please refer to the datasheet of ALC5616.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
15OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
5
4
3
2
1
Audio Codec Interface Design
D
D
33pF
10pF
33pF
C1618
C1610
C1617
[15,16] MICP
[15,16] MICN
[15] SPKP
C1612
C1604
C1620
33pF
10pF
33pF
B1601
0R
B1602
0R
B1604
0R
B1603
4
J1601
1
HANDSETCON
3
2
5
C1603
10pF
0R
D1602
C1609
33pF
D1601
C1607
10pF
[15] SPKN
Close to handset interface
6
10pF
C1606
D1604
33pF
C1616
D1603
10pF
C1611
Handset Application
C
C
Headset Application
J1602
R1601
NM-0R
R1605
0R
JAF00-06227-0301
6
[15,16] MICP
1
[15] SPK_R
3
[15] SPK_L
5
B
C1613
33pF
D1605
C1621
10pF
C1605
33pF
D1607
C1602
10pF
C1601
33pF
D1606
C1608
10pF
[15,16] MICP
NM-0R
R1602
0R
C1615
10pF
4.7uF
R-AUDIO
L-AUDIO
GND
DETECT
CTIA
OMTP
R1601/R1604
NM
M
R1602/R1605
M
NM
R1603
[15,16] MICN
C1619 C1614
MIC
B
2
4
Closer to Headset
33pF
R1604
6
0R R-0805
NOTE:
1. The Codec analog output can drive handset and headset. For larger power loads such as loudspeaker, an audio power amplifier should be added in the design.
A
A
2. In handset application, route the MIC and SPK signal traces as differential pairs respectively.
3. In headset application, route the MIC signal traces as a differential pair.
4. All MIC and SPK signal traces shall be surrounded with ground on the layer and ground planes above and below, and far away from noises such as clock and DC-DC signals.
5. Please pay attention to the distinction between analog ground and digital ground. The analog ground and digital ground need to be connected with a 0 Ω resistor
Quectel Wireless Solutions
packaged as R-0805 (short-circuit through single point grounding).
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
16OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
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5
4
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1
Analog Audio Design (Audio Power Amplifier)
D
D
NOTE 3
R1702 51K
R1704 51K
C1704
C1708
33pF
10pF
D1701
U1701
[3,8] SPK_N
[3,8] SPK_P
C1703
100nF
R1703
C1709
100nF
R1705
20K
20K
4
3
1
[3] AUDIO_PA_EN
C1710
C
100nF
2
11
R1701
100K
13
IN-
TPA6205A1
IN+
VO+
VOVDD
/SHUT_DOWN
GND
BYPASS
GND1
GND3
GND2
GND5
GND4
5
8
6
600Ω@100MHz
B1701
1
B1703
14
600Ω@100MHz
C1706
C1707
33pF
10pF
10pF
33pF
C1712
C1701
J1701
2
D1702
7
9
C
10
12
B1702
VBAT
600Ω@100MHz
C1702
C1705
C1711
10pF
33pF
4.7uF
NOTE:
1. SPK_P and SPK_N are differential output channels that can be used for an external audio power amplifier.
It is recommended to use MAIN_DCD of the module to control the enable pin of the audio power amplifier to eliminate POP noise. For more information about AUDIO_PA_EN, please contact Quectel Technical Support.
2. The type of power amplifier in this design is for reference only. Select the appropriate audio power amplifier according to actual needs.
B
B
3. Filter capacitors and ESD protection components should be placed close to the loudspeaker.
4. The selection of ESD protection components is related to the selection of audio power amplifier. Please ensure that the output voltage of audio power amplifier is
within the maximum reverse working voltage range of ESD protection components under normal working condition, so as to avoid damage to ESD protection components.
A
A
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
17OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
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A2
5
4
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1
Other Designs
D
D
Indicators
VBAT
VBAT
D1809
VBAT
D1803
R1804
2.2K
D1802
R1802
2.2K
3
D
R1803
2.2K
Q1802
DTC043ZEBTL
[3] STATUS
Q1801
RUM001L02T2CL
Q1803
DTC043ZEBTL
[3] NET_MODE
1
G
S
2
[3,18] NET_STATUS/USB_BOOT
C
C
NOTE:
1. For more details about STATUS , NET_MODE and NET_STATUS/USB_BOOT, see the hardware design document of the module.
2. If the low current consumption is required when your device is in sleep mode, replace the power supply VBAT of the STATUS, NET_MODE and NET_STATUS/USB_BOOT
indicators with the external controllable ones, which can be turned off when the module is in sleep mode to reduce the power consumption.
3. Note that the maximum value of Q1801's Vgs (th) should not exceed 1 V, since the NET_STATUS/USB_BOOT pin of the module outputs high level by default.
If the MOSFET is used, the pin's level will be lowered, and the module will enter the emergency download mode and cannot be turned on normally.
Reserved Test Points
USB_BOOT Interface
J1801
1
VBAT
2
3
B
B
PWRKEY [3,4]
4
5
6
USB_VBUS
J1802
USB_DP_TEST [3]
T-PIN-1X3
USB_DM_TEST [3]
7
4.7K R1805
DBG_RXD [3]
VDD_EXT
8
DBG_TXD [3]
9
GPIO1 [3]
10
NET_STATUS/USB_BOOT [3,18]
GPIO2 [3]
11
RESET_N [3,4]
D1807
12
D1813
D1805
D1811
D1804
D1812
D1810
D1808
D1801
D1806
13
T-PIN-1x13
NOTE:
NOTE:
1. Ensure to reserve the USB_BOOT interface design and test points.
1. Test points for both USB and debug UART interfaces are reserved for catching logs.
2. Before the module is turned on, pull NET_STATUS/USB_BOOT down to GND, and the module will enter emergency download mode
2. Test points for USB interface can also be reserved for firmware upgrading.
when it is turned on. In this mode, the module supports firmware upgrade over USB interface.
3. The junction capacitance of the ESD protection components on USB data lines should be less than 2 pF.
3. The 6.0.1 and above version of QFlash tool must be used for firmware upgrading.
4. The debug UART interface supports 1.8 V power domain, and a voltage-level translator should be used
A
A
if the power domain of your application is 3.3 V.
Quectel Wireless Solutions
PROJECT
VER
EC600M-CN QuecOpen
DRAWN BY
Howell KANG
DATE
5
4
3
2
SIZE
SHEET
18OF 18
Friday, February 24, 2023
1
1.2
CHECKED BY
Kelly WANG
A2
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