3D Semiconductor Packaging Market to Reach $8.9 Billion, Globally,
by 2022
“Increase in trend of miniaturization in portable electronic industry and rise in dependency on these devices
worldwide is shifting device manufacturers toward finding new methods of size reduction and overall efficiency
enhancement of these devices, thus driving the growth of 3D semiconductor packaging market”
According to Gaurav Shukla,
Semiconductor and Electronics
⦁ Request Sample : https://www.alliedmarketresearch.com/request-sample/1780
(We are providing report as per your research requirement, including the Latest Industry Insight's Evolution,
Potential and COVID-19 Impact Analysis)
KEY FINDINGS OF THE STUDY
•
•
•
3D wire bonded dominated the market in 2015 with over 43% of market share, however, 3D TSV is
expected to witness the highest growth rate of 17%
In 2015, Bonding wire accounted for the second largest share in 3D semiconductor packaging
technology segment although it will slowly be replaced by TSV technology in long run
Die attach materials is estimated to be one of the fastest growing segment in coming years, growing
at an estimated CAGR of 17.4%, owing to being a basic building block in several 3D packaging
techniques
Major key players profiled cover in Report:
•
•
•
•
•
Jiangsu Changjiang Electronics Technology Co., Ltd.
Siliconware Precision Industries Co., Ltd. (Spil)
Taiwan Semiconductor Manufacturing Company Ltd.
Stmicroelectronics N.V.
Amkor Technology, Inc.
Market dynamics
Drivers
•
•
•
Increase in number of portable electronic devices
Rise in demand of miniaturized circuits in microelectronic devices
Technological superiorities over 2D packaging technology
Restraints
• High initial capital investment required to set up a plant
• Thermal issues with devices
Opportunities
•
Growing trend of Internet of Things (IoT)
⦁ Report Overview:
https://www.alliedmarketresearch.com/3d-semiconductor-packaging-market
Analyst Review:
The global 3D semiconductor packaging industry is witnessing a high-paced growth due to the need to control
chip designing cost, which plays a major role in overall price of electronic devices, increase in demand for
miniaturized circuits, and short replacement period of electronics products, which are primarily constituted
of integrated circuits manufactured with 3D packaging technology.
The compact size and enhanced efficiency of 3D semiconductor packaged chips are key factors that drives the
3D semiconductor packaging market. The 3D semiconductor packaging industry in China is witnessing a fastpaced growth as the companies and the government of the country are investing heavily in advanced
packaging technology (i.e. 3D semiconductor packaging) lead in the semiconductor industry
About Us:
Allied Market Research is market research, consulting, and advisory firm of Allied Analytics LLP. Founded in
2013, the firm has been instrumental in offering high-quality syndicated and customized market research
reports, consulting services, and useful insights to leading market players, startups, investors, and
stakeholders. Driven by the aim to eliminate sub-standard data and become a successful partner for
organizations, Allied Market Research has been innovating continuously, expanding the product & service
portfolio, and implementing the client-first approach since its inception. With the clientele spanning more
than 7,000 organizations that also include a majority of Fortune 500 companies, AMR has a proven track
record of helping and serving the global clientele and playing a major role in their success.
Contact Us:
David Correa 1209 Orange Street,
Corporation Trust Center, Wilmington, New Castle
Delaware 19801 USA.
Int’l: +1-503-894-6022
Toll Free: +1-800-792-5285
Fax: +1-800-792-5285
help@alliedmarketresearch.com