Semiconductor Packaging Market Expected to Reach $60.44 Billion
by 2030
“The semiconductor packaging market size in Asia-Pacific is expected to grow at the highest rate during
the forecast period, owing to increase in adoption of electric vehicles and high demand for automated
switching devices and power modules. Moreover, availability of high-end enhanced technologies, increase
in demand for smart electronics, and growth in manufacturing industries are projected to contribute to the
growth of packaging technology in Asia-Pacific.”
According to Avinash Savekar,
Semiconductor and Electronics
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KEY FINDINGS OF THE STUDY
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In 2020, the flip chip segment accounted for maximum revenue and is projected to grow at a
notable CAGR of 8.40% during the forecast period.
The consumer electronics segment accounted for more than 45% of the semiconductor packaging
market share in 2020.
The fan-out WLP segment is expected to witness the highest growth rate during the forecast
period.
Major key players profiled cover in Report:
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Taiwan Semiconductor Manufacturing Company
Jiangsu Changjiang Electronics Technology Co. LTD
ChipMOS Technologies, Inc.
Fujitsu Ltd.
Samsung Electronics Co., Ltd.
Texas Instruments and many more.
Market dynamics
Drivers
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Surging Internet of Things (IoT) technology
High adoption of consumer electronics devices
Evolving trends toward semiconductor wafers in the automotive industry
Restraints
• High-cost associated with semiconductor materials
Opportunities
• Evolving trends towards the fan-out wafer level packaging
⦁ Report Overview:
https://www.alliedmarketresearch.com/semiconductor-packaging-market-A09496
Analyst Review:
The semiconductor packaging market is expected to leverage high potential for consumer electronics and
automotive verticals. The current business scenario is witnessing an increasing demand for consumer
electronics devices, particularly in developing countries such as China, Japan, South Korea, India, and
others. Companies in this industry are adopting various innovative techniques, such as merger &
acquisition activities, to strengthen their business position in the competitive matrix.
Semiconductor packaging is steadily gaining traction, owing to rise in demand for enhanced technologies
in various industry verticals, such as integration of IoT & AI, and surge in demand for consumer electronics
products. Furthermore, technological development by emerging economies in Asia-Pacific boosts the
semiconductor packaging market growth. The semiconductor packaging market is competitive, owing to
the strong presence of existing vendors. Semiconductor packaging vendors who have access to extensive
technical and financial resources are anticipated to gain a competitive edge over their rivals, as they have
the capacity to cater to the global market requirements.
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