Keysight Technologies
Medalist i3070 Series 5
In-Circuit Test System
Test Methods and Specifications
Notices
© Keysight Technologies, Inc. 2010
No part of this manual may be reproduced in any form or by any means (including electronic storage
and retrieval or translation into a foreign language) without prior agreement and written consent
from Keysight Technologies, Inc. as governed by United States and international copyright laws.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Medalist i3070 Series 5 Family Description . . . . . . . . . . . . . . . . . . . . . 2
Medalist i3070 Series 5 UnMux System Summary . . . . . . . . . . . . . . . 4
Medalist i3070 Series 5 Mux System Summary . . . . . . . . . . . . . . . . . . 6
System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Medalist i3070 One-Module Systems . . . . . . . . . . . . . . . . . . . . . . 8
Medalist i3070 Two-Module Systems . . . . . . . . . . . . . . . . . 9
Medalist i3070 Four-Module Systems . . . . . . . . . . . . . . . . . . . . . 10
System Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testhead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Support Bay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
13
13
13
13
Test Features and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Test Development Software on UnMux Platform . . . . . . . . . . . . 14
Test Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Test Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Operator Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Test Development Software on Mux Platform . . . . . . . . . . . . . . . 16
Board Consultant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Test Consultant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Fixture Consultant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Pushbutton Debug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
IPG-II Program Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Keysight Short-wire Fixture Technology . . . . . . . . . . . . . . . . . . . 19
Device Test Library . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Multiple Board Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
VTEP v2.0 Powered! . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Connect Check (Mux Systems) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
In-circuit Boundary-Scan (IEEE 1149.1) . . . . . . . . . . . . . . . . . . . . 23
Access Consultant . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Board Test Grader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Coverage Analyst . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Pushbutton Q-STATS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
System Confirmation and Hardware Diagnostics Software . . . . 25
Optional Test Features and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DriveThru Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PanelTest . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Throughput Multiplier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Polarity Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Limited Access Test Solutions – Super 7 Suite . . . . . . . . . . . . . . 27
ScanWorks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Flash70 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
MagicTest (Mux Systems) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Unpowered Test Measurement Specifications . . . . . . . . . . . . . . . . . . 32
Analog In-circuit Test Specifications . . . . . . . . . . . . . . . . . . . . . . 32
Shorts and Opens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Potentiometer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Inductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Zener Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
High Voltage Zener . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Bipolar Transistor (Beta Test) . . . . . . . . . . . . . . . . . . . . . . . . . 35
Depletion Field Effect Transistor . . . . . . . . . . . . . . . . . . . . . . 35
Fuse, Switch, and Jumper . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
TestJet and VTEP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Polarity Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Powered Test Measurement and Specifications . . . . . . . . . . . . . . . . . 38
Analog Functional Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Built-in Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Universal Source (Four Quadrant) . . . . . . . . . . . . . . . . . . . . . 39
Auxiliary DC Voltage Source (Four Quadrant) . . . . . . . . . . . . 39
Differential Detector DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Differential Detector AC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Waveform Digitizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Frequency/Time Interval Counter . . . . . . . . . . . . . . . . . . . . . 42
Power Monitoring Circuit (PMC) . . . . . . . . . . . . . . . . . . . . . . . 42
External Functional Test Instruments . . . . . . . . . . . . . . . . . . . . . . 43
Functional Test Access Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Digital In-circuit Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Digital In-circuit and Functional Test . . . . . . . . . . . . . . . . . . . . . . 47
Additional Digital Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 50
ControlXTP Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Debug Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
General-Purpose Relays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Mixed Signal Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin Cards and Test Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Pin Cards for Medalist i3070 UnMux Systems . . . . . . . . . . . . . . 53
Hybrid-144 Non-multiplexed Pin Card . . . . . . . . . . . . . . . . . 53
Pin Cards for Medalist i3070 Mux Systems . . . . . . . . . . . . . . . . . 56
HybridPlus-DD Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
AnalogPlus-DD Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
AccessPlus Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Performance Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Utility Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Device Under Test (DUT) Power Supplies . . . . . . . . . . . . . . . . . . 63
Power Supplies Maximum Combinations . . . . . . . . . . . . . . . 63
6621A Dual Output Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6634A Single Output Supply . . . . . . . . . . . . . . . . . . . . . . . . . 64
6624A Quad Output Supply . . . . . . . . . . . . . . . . . . . . . . . . . . 65
6642A Single Output Supply . . . . . . . . . . . . . . . . . . . . . . . . . 65
Input Voltage and Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Vacuum and Compressed Air . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Fixture Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Long Wire Fixture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Short Wire Fixture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
01 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Introduction
This document describes the warranted performance of Medalist i3070 Series 5
In-Circuit Test Systems. For the latest version of this document, log in to the
Technical Support website (www.keysight.com/find/ict) and look for Test Methods
and Specifications.
Specifications are set using the model shown below. In the diagram,
–– Product Margin is the difference between the average product performance (X)
and the test line limit, which is the pass/fail limit used by the production line at
final test under standard environmental conditions.
–– Environmental & Drift represents the potential change in performance over the
range of environmental extremes and the calibration period.
–– Measurement Uncertainty represents potential measurement errors in the
equipment used to characterize the product.
–– Customer Guardband is the margin necessary to ensure that, in a worst-case
scenario, a customer’s unit will perform better than the published specification.
All specifications are valid at the tester-to-fixture interface over the temperature
range 0°C to 40°C (32°F to 104°F). The system must be powered for at least
30 minutes and within ±5°C of the last system autoadjust temperature.
The specifications given describe a system’s warranted performance. Typical
performance specifications are identified by (typical) or (typ) in the specification
tables. These are values which the typical system can be expected to achieve in
most situations, but are not warranted.
02 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 Family Description
The Medalist i3070 Series 5 Board Test Family is the broadest and most compatible
family of board test systems available on the market today. Designed to handle a wide
variety of test strategies, technologies, printed circuit boards (PCBs), and budgets, the
Medalist i3070 Series 5 family offers a specific test system to fit your exact requirements.
The systems can be expanded in both hardware and software capabilities to meet future
growth needs.
–– Medalist i3070 One-Module Systems
Medalist i3070 one-module systems provide test capacity for up to 1296 nodes in
a compact, low-cost, ready-to-use package. Designed to provide a small footprint,
the controller and all hardware required for testing low node-count boards is located
directly in the testhead. Connect power, compressed air, and a vacuum source.
–– Medalist i3070 Two-Module Small Footprint Systems
Medalist i3070 two-module small footprint systems provide test capacity for up to
2592 nodes in a compact testhead. Module cards containing the tester hardware
resources, DUT power supplies, and the system controller are all located in the testhead, minimizing floor space.
–– Medalist i3070 Two-Module Systems
Medalist i3070 two-module systems provide test capacity for up to 2592 nodes
in an affordable testhead design. Module cards containing the tester hardware
resources, DUT power supplies, and the system controller are all located in
the testhead, minimizing floor space.
–– Medalist i3070 Four-Module Systems
Medalist i3070 four-module systems provide the most expandability, with
capacity for up to 5184 nodes. The testhead contains the module cards and
system controller. A support bay provides rack space for DUT power supplies
and optional instruments.
03 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 Family Description (continued)
Family Compatibility
Because all Medalist i3070 systems are based on a common hardware and software
platform, the Medalist i3070 family can share test programs, fixtures, and programming
resources.
All Medalist i3070 users can share key information and processes such as fixture build,
test development, custom device tests, quality data collection, training, and support.
Medalist 3070 test and fixtures can also be migrated for use on Medalist i3070 systems.
Today, global manufacturers have facilities spread throughout the world. Although each
site may use a different system from the Medalist i3070 family, the common platform
allows for the free exchange of resources and processes, regardless of different testing
capabilities. A common platform also means that a single site can use a combination
of Medalist i3070 family systems to optimize testing for a specific mix of boards and
manufacturing processes.
04 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 UnMux System Summary
Full System Node Capability
–– Maximum of 5184 nodes for 4-module;
2592 nodes for 2-module; 1296 nodes for 1-module
Full System Analog Capability
–– Shorts test programmable threshold: 2 Ω to 1000
–– Resistance measurements: 0.1 Ω to 10 M Ω
–– Capacitance measurements: 10 pf to 10 mf
–– Inductance measurements: 5 μH to 100 H
–– Diode, zener diode, transistor, FET, fuse, jumper, switch, potentiometer
measurements
–– Op-amp, comparator, voltage regulator, voltage reference, current source, optoisolator, oscillator, and RS-232 transceiver device tests from extensive library
–– Arbitrary waveform generator: 1 Hz to 20 kHz
–– Waveform digitizer: 40k samples/sec, 8192 samples
–– Function generator: DC, sine, square, and triangle: 0 to ±10 V, 0.5 Hz to 20 kHz
–– Auxiliary DC voltage source: 0 to ±10 V; 30 or 150 mA
–– DC detector: 0 to 160 V
–– Universal counter: frequency, pulse, and time interval measurements: 1 Hz to
60 MHz; 30 ns to 1s
–– Up to 8 analog functional test access ports
Full System Digital Capability
–– Maximum of 5184 drive and receive channels for 4-module;
2592 drive and receive channels for 2-module;
1296 drive and receive channels for 1-module
–– Pin-by-pin programmable drive and receive resources:
0 to +5.0 V drive level
0 to +4.875 V receive level
Pull-up/pull-down or AC termination loads
–– Logic analyzer, bit-by-bit, and CRC capture modes
–– Drive edge placement accuracy (any driver):
±15 ns (typical)
±750 mA peak, ±100 mA continuous backdrive current
–– Drive voltage accuracy:
20 mV programming resolution
±20 mV ± 2% of setting
–– Receive edge placement accuracy (any receiver):
2 ns (resolution)
±15 ns (typical)
–– Receive voltage accuracy:
20 mV programming resolution
±2% of setting ± 100 mV (typical)
–– Pattern rate: 6.25 million/second
–– Vector Processing Unit digital sequencer
–– ASIC test length no reload: > 4M vectors (typical)
–– Boundary-scan test length no reload: > 4.8M vectors (typical)
–– RAM test length no reload: > 64M vectors (typical)
–– ROM test length no reload: > 256M vectors (typical)
–– 625 kHz to 50 MHz clocks
–– 160 kHz to 80 MHz sync-to-clock
–– Flash RAM and PLD programming capability
05 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 UnMux System Summary (continued)
Standard Peripherals
–– Repair ticket printer
–– Guided hand-held probe
Controller
–– PC running Windows XP
Standard System Software/Features
–– Medalist i3070 Software
–– IPG-II Analog Program Generator
–– Pushbutton Digital Debug
–– Automatic 6-wire analog in-circuit tests
–– Automatic digital test generation
–– Automatic Analog Debug Software
–– Safeguard ICT analysis
–– Automatic multi-level disable
–– Automatic global digital disable
–– Extensive Device Test Library
–– Express Fixturing Technology
–– Multiple Board Versions
–– Vectorless Test EP/intelligent Vectorless Test EP
–– TestJet Technology
–– Boundary-scan (IEEE 1149.1)
–– Access Consultant
–– Board Test Grader
–– Coverage Analyst
–– Pushbutton Q-STATS
–– System Confirmation/Diagnostics Software
–– Relay Diagnostics (one year time-limited license)
Optional System Accessories and Software
–– Utility Card
–– Laser bar code reader
–– Programmable DUT power supply
–– High-current and high-voltage power supplies
–– Additional Test Development Licenses*
–– Drive Thru Test
–– Dual-well fixturing Technology
–– PanelTest
–– Throughput Multiplier
–– Polarity Check Technology
–– InterconnectPlus Boundary-scan (IEEE 1149.1 and 1149.6)
–– Automated Silicon Nails
–– Cover-Extend Technology
–– Bead Probe Technology
–– ScanWorks Software
–– Flash70 Software
–– In System Programming Software (Flash ISP and PLD ISP)
–– Functional Test (with Utility Card)
* Additional licenses are inexpensively gained by purchasing the Medalist i3070
development software for installation on individual PCs.
06 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 Mux System Summary
Full System Node Capability
–– Maximum of 5184 nodes for 4-module;
2592 nodes for 2-module;
1296 nodes for 1-module
Full System Analog Capability
–– 5184 AnalogPlus-DD nodes for 4-module;
2592 AnalogPlus-DD nodes for 2-module;
1296 AnalogPlus-DD nodes for 1-module
–– Opens test for ICs, connectors, switches, fuses
–– Shorts test programmable threshold: 2 Ω to 1000 Ω
–– Resistance measurements: 0.1 Ω to 10 MΩ
–– Capacitance measurements: 10 pf to 10 mf
–– Inductance measurements: 5 μH to 100 H
–– Diode, zener diode, transistor, FET, fuse, jumper, switch, potentiometer measurements
–– Op-amp, comparator, voltage regulator, voltage reference, current source,
opto-isolator, oscillator, and RS-232 transceiver device tests from extensive library
–– Arbitrary waveform generator: 1 Hz to 20 kHz
–– Waveform digitizer: 40k samples/sec, 8192 samples
–– Function generator: DC, sine, square, and triangle:
0 to ±10 V, 0.5 Hz to 20 kHz
–– Auxiliary DC voltage source: 0 to ±10 V; 30 mA or 150 mA
–– DC detector: 0 to 160 V
–– Universal counter: frequency, pulse, and time interval measurements:
1 Hz to 60 MHz; 30 ns to 1s
–– Analog functional test access ports: 3 db bandwidth 15 MHz;
up to 8 access ports for 4-module;
up to 4 access ports for 2-module;
2 access ports for 1-module
Digital Test Capability
–– Maximum of 576 hybrid channels for 4-module (144/module);
288 hybrid channels for 2-module (144/module);
144 hybrid channels for 1-module
–– Pin-by-pin programmable drive and receive resources:
1 ns programming resolution
−3.5 to +5.0 V logic levels
25 to 250 V/μs slew rate in 25 V/μs steps
–– Pull-up/pull-down loads
–– Logic analyzer, bit-by-bit, and CRC capture modes
–– HybridPlus-DD pin drive and receive edge placement accuracy:
±5 ns (typical)
±10 ns (warranted)
–– 700 mA sourcing, 500 mA sinking backdrive current
–– Pattern rate: 6.25 million/second
–– Vector Processing Unit digital sequencer
–– ASIC test length no reload: > 4M vectors (typical)
–– Boundary-scan test length no reload: > 4.8M vectors (typical)
–– RAM test length no reload: > 64M vectors (typical)
–– ROM test length no reload: > 256M vectors (typical)
–– 625 kHz to 20 MHz clocks
–– 160 kHz to 20 MHz sync-to-clock
–– Flash RAM and PLD programming capability
07 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Series 5 Mux System Summary (continued)
Standard Peripherals
–– Repair ticket printer
–– Guided hand-held probe
Controller
–– PC running Windows XP
Standard System Software/Features
–– Board Consultant
–– Test Consultant
–– IPG-II Analog Program Generator
–– Pushbutton Debug
–– Fixture Consultant
–– Short-wire Fixturing Technology
–– Automatic 6-wire analog in-circuit tests
–– Automatic digital test generation
–– Safeguard ICT analysis
–– Automatic multi-level disable
–– Automatic global digital disable
–– Device test libraries
–– Multiple Board Versions
–– Vectorless Test EP/intelligent Vectorless Test EP
–– TestJet Technology
–– Connect Check
–– Boundary-scan (IEEE 1149.1)
–– Access Consultant
–– Board Test Grader
–– Coverage Analyst
–– Pushbutton Q-STATS
–– System Confirmation/Diagnostics Software
–– Medalist i3070 Software
Optional System Accessories and Software
–– HybridPlus-DD cards (144 nodes, 16 D/R)
–– AnalogPlus-DD cards (144 nodes, 0 D/R)
–– AccessPlus card
–– Utility Card
–– Pin Verification Fixture
–– Laser bar code reader
–– Programmable DUT power supply
–– Drive Thru Test
–– Dual-well Fixturing Technology
–– PanelTest
–– Throughput Multiplier
–– Polarity Check Technology
–– InterconnectPlus Boundary-scan (IEEE 1149.1 and 1149.6)
–– Automated Silicon Nails
–– Cover-Extend Technology
–– Bead Probe Technology
–– Magic Test
–– ScanWorks Software
–– Flash70 Software
–– In-System Programming (Flash ISP and PLD ISP)
–– Functional Test (with Utility Card)
08 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
System Architecture
The common architecture of the Medalist i3070 Series 5 systems provides:
–– Compatibility across the entire family for flexibility in test development and production
–– Tester resources located directly behind the fixture interface for optimum performance
–– Short-wire fixture technology to deliver the tester specifications to the device under
test (DUT) with superior test repeatability and transportability
–– Controller and external equipment interfaces built on standards for seamless
integration on the manufacturing floor
Medalist i3070 One-Module Systems
Medalist i3070 one-module board test systems consists of a testhead, testhead controller, DUT power supplies, and vacuum control, all integrated in a compact package.
The system is designed for rapid installation and removal, providing maximum flexibility
on the manufacturing floor. It is comprised of a single module with hardware resources
which can be configured to test boards with up to 1296 nodes. The muxed and
unmuxed architecture provides in-circuit and functional capability for analog, digital,
and mixed-signal boards.
09 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Two-Module Systems
The two-module board test system consists of a testhead, testhead controller, and an
optional board handler. The system is designed with a modular, parallel architecture
that provides flexibility for expansion and parallel test capability for optimum test speed.
The system hardware architecture features:
–– Up to two expansion modules (for up to 2592 nodes) for fast upgrades as test
requirements change
–– Synchronous operation of modules to test high-pin-count boards
–– Asynchronous operation of modules for parallel testing of multiple boards on
the same system
–– Built-in testhead LAN and high-speed module link for high-performance
testhead-to-controller communication
All hardware is contained in the testhead and the controller is mounted inside the
testhead pod to minimize floor space.
10 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 Four-Module Systems
The Medalist i3070 four-module board test system consists of a testhead, support bay,
testhead controller, and an optional board handler. The system can be configured with
up to four modules to test high node-count boards of up to 5184 nodes.
11 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
System Components
Testhead
The Medalist i3070 testhead design is optimized with:
–– A small footprint to minimize floor space requirements.
–– An ergonomic design for manual operation and integration into automation.
–– Integrated hardware for high performance, reliability, and single-vendor support.
Medalist i3070 Two-and Four-Module Systems
Medalist i3070 Two-Module Small Footprint System
12 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Medalist i3070 One-Module System
The testhead contains the card cages or modules which hold the tester hardware
resources. Each testhead contains one module as standard equipment. The monitor
arm and keyboard tray can be placed on either side of the testhead to hold the display,
keyboard, and mouse.
The testhead is motorized and allows any rotation position in the 0–90° range for
production test, board handling integration, and service support. The DUT power
supplies are located inside the testhead for the one- and two-module systems, and
in the support bay for the four-module system. The support bay is optional for the
one- and two-module systems.
An error message printer is provided with every system and rests on a tray. The
controller is located inside the testhead pod. The testhead contains additional
hardware resources for fixture verification, external test equipment access, and
internal test signal access.
The guided probe is connected to the side of the testhead and is used for:
–– Digital test debugging (to capture the device response on actual device pins)
–– Identifying tester resources connected to a node
–– Fixture wiring verification
Auxiliary relays located on the system card in the Medalist i317x and i307x testheads
provide control of the vacuum ports. Every testhead module has an independent
vacuum port for individual control in fixturing applications such as dual-well testing.
Every testhead has a compressed air quick-connect tap to activate the fixture locks.
Two functional test access ports per module are connected by coaxial cables to the
testhead for connecting external instrumentation to any tester pin.
Three debug ports are provided at the side of the testhead. BNC connectors allow
access to internal system signals for digital and mixed-signal test debug.
13 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Modules
The tester resources are provided by module cards mounted in the testhead modules.
Each module has eleven slots, with two slots reserved for the standard ASRU and
ControlXTP cards. These standard cards provide independent analog and digital test
subsystems integrated on the same backplane.
The latest ASRU Revision N card includes two measurement circuits. One is the original
Analog Measurement Circuit which is equipped with a Measurement Operation Amplifier
(MOA) and the other is a Digitized Measurement Circuit (DMC) which uses a micro-controller to digitize the measured analog stimulus and response during testing. In-circuit
and functional test capability is supplied by the optional pin cards. All the pin cards are
SMT designs for hardware reliability and up to nine cards can be added to a module.
The distributed, parallel architecture provides several advantages in test speed:
–– Independently programmable resources for quick test debug and engineering
changes
–– Parallel test capability for panelized boards and for testing multiple boards
simultaneously
–– Fast expansion of test resources as needs change
–– A variety of optional pin cards for a range of test applications
Pin Cards
The pin card is the interface between the fixture and the testhead electronics.
The cards for the Mux and UnMux systems are:
Mux System
UnMux System
HybridPlus-DD Card
Hybrid Non-multiplexed 144 Card
AnalogPlus-DD Card
AccessPlus Card
Utility Card
All the cards are specified in detail in Pin Cards and Test Access.
Controller
The Medalist i3070 testhead controller is a high-performance PC running Microsoft
Windows XP. The standard system controller provides the operator interface, test control, and communication with the testhead and external instruments.
Support Bay
The Medalist i3070 support bay is standard with four-module systems and provides racking space for testhead power distribution, DUT power supplies, and external instruments.
14 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Test Features and Tools
Test Development Software on Unmux Platform
The default test development software on UnMux systems is the Medalist i3070
Software, which provides the following:
–– Developer Interface for test development,
–– Debug Interface for debugging, and
–– Operator Interface for testing.
The test development process is designed to shorten the time required before beginning
to test. To facilitate this, the amount of data required to get to the point of sending out
for a fixture has been reduced. This allows the test developer to do a large portion of the
development work in parallel with the
fixture build task.
All necessary information for unpowered tests and all wiring information for powered
tests are completed initially, so that the fixture build process can be started. While
the fixture is being developed, the test developer can then work on digital library,
boundary-scan, and PLD tests. This allows debug to begin immediately on receipt
of the completed fixture.
Test Development
From the Developer Interface, test development is completed in five phases:
–– Configuration
–– Data Input
–– Initial Test Generation
–– Fixture Generation
–– Final Test Generation
Each phase contains tasks that must be completed in the order presented. Each phase
must be completed before going on to the next task. This ensures that the information
required for each step is available when it is needed. Tests are automatically generated
by IPG-II Test Generator (see “IPG-II Program Generator” on page 18).
15 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Test Debugging
The Debug Interface allows the test developer to evaluate, debug, and fine-tune:
–– Pins and shorts tests
–– Unpowered analog in-circuit tests (capacitors, diodes, FETs, fuses, inductors,
jumpers, potentiometers, resistors, switches, transistors, and zeners)
–– VTEP and TestJet tests
Digital test debugging capability is provided by Pushbutton Debug (see “Pushbutton
Debug” on page 17 for information on Pushbutton Debug features).
AutoDebug Capabilities
An AutoDebug utility can automatically debug analog in-circuit tests, reducing the
time it takes to get the tests into production. It provides the following features:
–– Debugs unpowered analog devices (capacitors, diodes, FETs, fuses, inductors,
jumpers, potentiometers, resistors, switches, transistors, and zeners) by adding
or deleting measurement options.
–– Allows the test developer to set the minimum stability requirement for tests
during debugging.
–– Provides a highly flexible Rule Editor to customize the debugging rules to suit
different test requirements.
16 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Operator Interface
The Operator Interface provides a graphical user interface for running board tests on
the Medalist i3070 system. The labels and messages in the Operator Interface can be
localized into any language supported by the Windows operating system.
Test Development Software on Mux Platform
The default test development software on Mux systems include the following:
Board Consultant
Board Consultant is a data entry, editing, and verification tool that reduces test development time by identifying testability problems before fixturing and testing are attempted.
Board Consultant’s features include:
–– A step-by-step flowchart to guide the test developer through the entry and
verification of board data.
–– Graphical representation of board data to visually identify entry and CAD data
errors.
Board Consultant lets the test developer define the test strategy for each device, including the use of TestJet, Connect Check, Polarity Check, digital in-circuit, or in-circuit
boundary-scan. Once the board and test description information is entered, test data
verification and testability analysis is done. A testability report and the graphical display
enable fast isolation of testability problems.
17 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Test Consultant
Test Consultant offers intelligent guidance through the test and fixture development
process. Testing of multiple boards on one fixture and automatic test generation is
supported. Test Consultant manages process interdependencies so the test developer
can focus on testing boards, not process details.
Test Consultant also manages interactive or batch mode test development for new
boards, as well as incremental development for existing boards. The test programmer
can control which tests are regenerated following an engineering change. Hence,
implementation of changes is fast and the impact on production is minimal. The
modifications to tests and fixture wiring necessitated by engineering changes are
documented automatically.
The test development menu is organized into the exact process steps required to
generate test and fixture files and to prepare for program verification and debug on the
test system. Single-step control is provided for test development analysis and editing
changes. Multiple-step execution is also offered to allow fast step-through of the
development process.
Tests are automatically generated by IPG-II Test Generator, as described in “IPG-II
Program Generator” on page 18.
Fixture Consultant
Fixture Consultant enables the test developer to customize the board test fixture. It
provides a graphical display and object-oriented approach to help access and modify
fixture information.
Pushbutton Debug
On Mux systems, Pushbutton Debug provides the capability for debugging entire board
tests. Failed tests are automatically identified and listed for debug. Dynamic test control
allows test adjustments to be made in a matter of seconds, without re-compiling. Test
adjustments can be made interactively and either saved or displayed once the test is
debugged.
Quick Report
This is a tool in Pushbutton Debug that provides information to help improve test
throughput. It evaluates a board directory, identifies areas where changes could be
made to reduce test time, and suggests strategies to maximize throughput. The r
eport lists possible improvements to be made in the testplan, the board config file,
and individual TestJet, analog, digital, mixed, and functional tests.
18 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
IPG-II Program Generator
IPG-II Program Generator automatically generates the board shorts/opens test, TestJet,
VTEP, and analog in-circuit tests from topology information about the board. Digital
in-circuit and in-circuit boundary-scan tests are generated from the device libraries. The
software integrates and automates the preparation of functional tests, boundary-scan
interconnect tests, and Polarity Check tests.
Automatically generated tests (in-circuit, VTEP and TestJet) for the following devices
provide a high fault coverage test program solely from the entered board description
data:
– Resistors
– comparators
– switches
– Capacitors
– voltage regulators
– connectors
– Inductors
– voltage references
– sockets
– parallel R and C
– current sources
– SSI
– parallel R and L
– jumpers
– MSI
– Diodes
– fuses
– LSI
– zener diodes
– resistor packs
– VLSI
– Transistors
– opto-isolators
– TTL/CMOS/ECL/ACT ICs
– FETs
– RS-232 transceivers
– custom ICs
– Potentiometers
– clock oscillators
– custom analog ICs
– operational amplifiers
– delay lines
– custom mixed ICs
Automatic Analysis
The generated digital device tests typically require minimal debug and include disabling
for bus devices and stimulus adjustment for tied pins or other topology variations and
constraints. The percentage of pin states reached is maximized and reported. Pins which
can reach only a single state or neither state due to topology constraints are reported.
In addition, digital test development options include:
–– Board level disabling
–– Multiple level disabling and conditioning
–– Multiple vector disabling
When writing the analog tests, the software performs a complete network analysis
of the board to define the optimum test for each analog component. Many potential
sources of testing errors are taken into consideration in the analysis and are corrected
in the test written, ensuring test reliability and system-to-system transportability.
Specific corrections are made for:
Alternate guard points if inaccessible nodes exist
–– Source lead impedance
–– Guard lead impedance
–– Input lead impedance
–– Settling delays
–– Intrinsic measurement inaccuracies
–– Tolerances of guarded components
–– Non-ideal performance of the measuring operational amplifier
–– Residual system noise
–– Thermal variations on environment and system
The software also performs multi-system simulation of the test path to determine measurement tolerances for optimum throughput, accuracy, and repeatability. The simulation
involves modeling the production variations in multiple systems and performing a statistical analysis of measurement path uncertainty. Tolerance limits are determined from the
analyzed simulation to produce tests that usually require minimal debug.
19 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Safeguard ICT Analysis
To minimize potential for device damage from overdriving, the Keysight Technologies, Inc.
Safeguard ICT Analysis software does an analysis on each powered device test. This
software analyzes each digital device and calculates the expected maximum safe overdriving time for the overdriven devices based on bond-wire and junction heating. The
actual length of the test is compared to this calculated safe overdriving time. Should
a hazard exist, the test is flagged and reported. The programmer can easily create a
safe test by using the digital test control commands. The proper cooling period is also
calculated and scheduled into the test program so that repeatedly overdriven devices
can recover from the heat generated.
Factors automatically analyzed by Safeguard ICT Analysis are:
–– Overdrive power to reach logic levels
–– Base-emitter junction area on output transistors (heat source)
–– Number of emitters for output transistors (heat source)
–– Bond wire heating and cooling (package type)
–– Overdrive current per output pin
–– Junction-to-case thermal resistance
–– Operating temperature of die
Keysight Short-wire Fixture Technology
The Medalist i3070’s short-wire fixture software generates a complete description of
the test fixture, with documentation to help automate the fixture build process. Board
electrical connectivity and device XY-location data are used to automatically generate
the drill, wire, probe insertion, and material reports. Fixture build parameters can be
described during test development, to provide fixture design information suited to
your constraints. The fixture software automates and simplifies the fixture generation
process, resulting in reduced fixture assembly time and assembly costs. Fixture file
generation is provided for the following applications:
–– Dual-well
–– Dual-sided
–– Dual-stage (some manual work is required)
–– Keysight VTEP/TestJet Technology
–– Keysight Polarity Check Technology
–– Keysight PanelTest and Keysight Throughput Multiplier
–– Hinged lid, long-wire fixtures
–– Limited access testing (edge connector or boundary-scan)
Probe Selection
The fixture software automatically selects the optimum probe points according to electrical and mechanical analysis of the board-under-test. Probe spring force and density is
specified to control probe point selection. Probe points are chosen to minimize the use of
50-mil probes, top-side probes, low spring force probes, and probes close to the board
edge. To test dense SMT boards, top-side probe points are selected automatically if necessary. Points which are inaccessible can be specified and are reported. A node’s primary
test point is determined, with alternate points identified and partially drilled. Engineering
changes are easily implemented since the fixture software will minimize fixture changes
by using existing alternate probe locations.
Board Placement
Boards are automatically located on the fixture for optimum vacuum and mechanical
fixture operation. Board placement can also be done manually through a graphical
interface to meet specific fixture needs.
20 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Resource Assignment
Critical pins used for high-speed functional tests are assigned first to tester resources
to obtain minimum wire lengths of typically 25 mm (1 in.). Remaining assignments are
performed while minimizing wire lengths to typically less than 75 mm (3 in.). A report of
average and maximum wire lengths is generated after the assignments are completed.
For high-throughput applications where panelized boards are to be placed on the same
fixture, the fixture software automatically generates the resource assignments. The
system can also restrict the resource assignments to a user-defined mapping (device
pin-to-module pin).
The tester hardware resources can be specified for a specific local or remote
system. If the number of required resources exceeds the specified tester
configuration, the assignments will be done for the required resources and the
new configuration will be reported.
Fixture Tooling
The fixture software provides complete fixture wiring and build documentation. Top and
bottom plate drilling, probe and personality pin (pin interfacing with tester pins) insertion
guide, wiring guide, material requirements, and wiring debug reports are automatically
generated.
The various fixture build reports provide information to quickly produce a high-quality
fixture for high-speed combinational test. These reports are designed to be integrated
into an automated fixture drill and wiring process, which further reduces fixture build
times.
Dual-Well Fixtures
Dual-well fixturing strategies can significantly improve test throughput, thereby reducing
overall test costs. Dual-well fixtures allow for parallel testing and board handling while
a board is being tested, so the test operator can remove and re-load a second board.
Manual board handling time is eliminated for maximum tester efficiency.
Dual-well, shared-wire fixtures provide the added benefit of reducing the cost of the test
system. Tester resources can be double-wired, effectively reducing the required system
node count by 50%. Dual-well, shared-wire fixtures can be used to test and handle two
identical boards, allowing one board to be tested while the operator replaces another
board on the fixture.
Test developers can select a dual-well or dual-well/shared-wire fixture strategy during
the test development process. The design of these fixtures is fully automated within the
fixture software.
Dual-well shared wiring must be used with PanelTest; Dual-well shared wiring can be
used with Throughput Multiplier.
21 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Device Test Library
The Medalist i3070 device library contains digital in-circuit test programs for VLSI, LSI,
MSI, and SSI, flash devices from all logic families. Library tests include the patterns
required to ensure all input, bi-directional, and output lines change states, with most
internal device functions verified. Libraries are written for combinatorial, sequential,
and functional test applications.
Most SSI and MSI devices are contained in the library. The VLSI device library includes
popular 8-bit, 16-bit, and 32-bit microprocessors, a variety of microprocessor peripheral tests, and most commonly used static and dynamic RAM devices. Several popular
boundary-scan BSDL files are included.
Analog and mixed signal libraries contain a variety of devices, including:
– Op-amp
– Comparator
– Voltage regulator
– Voltage reference
– Current source
– Opto-isolator
– Oscillator
– RS-232 transceiver
User-developed tests for custom devices can be easily added to a custom library. The
test development automatically searches standard and custom libraries and modifies
the test for the board topology.
SMT Devices
Popular surface mount technology (SMT) device tests for a variety of package types are
included in the libraries. Because some large SMT devices have pin-outs which vary with
the vendor, the library tests are written to handle different schemes of pin numbering for
the same device.
Multiple Board Versions
Keysight Multiple Board Versions software is used to develop and maintain one test and
fixture for multiple versions of a PC board. This is useful when an engineering change
order (ECO) is applied to a board but you still need to support the previous version of
the board (without the ECO) in test, or if you have a common blank PC board that can
be loaded with different configurations of devices.
The differences between board versions can include analog device values, devices which
are not included on the PC board (not placed), and a different test library or test method
for a device, for example:
–– An analog board when “R2” can be any one of three values
–– A memory board that might be configured with different amounts of memory
–– A complex digital device that you might want to test with a digital library or TestJet
The differences between board versions cannot include X-Y locations of devices or
probes and connectivity changes. Multiple Board Versions requires the same blank PC
board for all versions.
22 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
VTEP v2.0 Powered!
VTEP, iVTEP, NPM, and CET are collectively known as VTEP v2.0 Powered!
–– Vectorless Test EP (VTEP) is a combination of advanced measurement hardware and
improved software algorithms which dramatically improve the noise characteristics,
stability, accuracy and repeatability of TestJet measurements. With these enhancements, reliable measurements down to single-digit femtofarads can now be made.
You can use VTEP/TestJet to test most devices that have a lead frame or metallic
pins or leads to which the VTEP/TestJet probe can capacatively couple. (Refer to the
specifications for “TestJet and VTEP” on page 36.)
–– Intelligent VTEP (iVTEP) extends the measurement capability of VTEP. More accurate
measurements can be made using existing VTEP hardware. These measurements
are less dependent on lead-frame geometries than VTEP or TestJet.
–– Network Parameter Measurement (NPM) extends the measurement capability of
VTEP for connectors and sockets. This capability will be essential as signal speeds
increase and defects on ground return paths cause signal integrity problems.
–– Cover-Extend Technology (CET) extends the measurement capability of VTEP into
powered testing by using the boundary-scan output cell to test the connectors and
socket signal pins.
The following table lists the device types that can be tested with VTEP v2.0 Powered!,
TestJet, and Connect Check.
VTEP v2.0 Powered!
Devices
VTEP
iVTEP
Devices with an internal lead frame
(most digital and hybrid devices)
✓
✓
Devices with an internal ground plane
(usually ceramic packages)
✓
✓
Most Ball Grid Arrays (BGAs) (except ceramic
and stadium packages)
✓
✓
Some Ball Grid Arrays (CBGAs) (ceramic and
stadium packages only)
✓
✓
Connectors and sockets
✓
NPM
CET
Connect Check1
✓
✓
✓
✓
✓
Connectors; socket power and ground pins
TestJet
✓
✓
Devices with grounded heat sink
✓
Flip chip devices or chip-on-board (COB)
✓
Dip switches
✓
✓
Pushbuttons
✓
✓
✓
1. Mux systems only. It is recommend that VTEP or TestJet be used instead of Connect Check whenever possible.
✓
23 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Connect Check (Mux Systems)
Keysight Connect Check is an unpowered and vectorless test method that detects
manufacturing defects, such as:
–– Open connections between the device under test and the PC board (including
broken bond wires)
–– Missing devices
–– Improperly positioned (skewed) devices
Connect Check automatically generates the tests for devices you specify to be tested
with it, as well as generating the appropriate fixture wiring information.
Because vendor-to-vendor and batch-to-batch device ariation decreases the reliability
and repeatability of Connect Check tests and necessitates frequent adjustments during
production test, it is recommend that TestJet be used to detect open connections and
missing devices whenever possible. TestJet tests are also faster and more transportable
from system to system.
In-circuit Boundary-Scan (IEEE 1149.1)
Boundary-scan is a test technique which can be used on devices that have “boundary-scan logic” incorporated into the device. The “logic” consists of shift registers that
are placed between each device pin and the internal logic of the device. Each shift register location is called a cell. These cells allow control and observance of activity at each
input and output pin. When these cells are connected together, they form a data register
chain, called the Boundary Register. The four boundary-scan logic pins control device
testing (TCK, TMS, TDI and TDO; TRST is optional).
Boundary-scan testing advantages include:
–– Verification of the correct part and its orientation on the circuit board without
complete physical access
–– Automated test development for opens and shorts on all I/O pins without any
knowledge of the internal logic of the device
–– Improved fault diagnostics on the input pins; traditionally, input pins can be tested
only by observing the output pins
–– Detection and isolation of device pin opens (unsoldered pins) to the circuit board
and location of shorts between pins
The Medalist i3070’s built-in in-circuit boundary-scan test capability requires no
additional hardware and provides:
–– BSDL (Boundary-Scan Description Language) verification
–– Test generation from BSDL and board topology
–– Automatic test documentation in test source
–– Automatic upstream device disabling to speed test development
–– Deterministic algorithm for fast, safe fault diagnostics
24 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
In-circuit Boundary-Scan (IEEE 1149.1) (continued)
The Keysight In-circuit Boundary-Scan software automatically generates an in-circuit
test for boundary-scan devices (that exist but are not treated as a chain). An interactive
interface based on the IEEE 1149.6 state diagram (shown below) allows test developers
to create a custom test. Macros are provided to automatically generate tests such as
Running Toggle, ID test, and walking 0s. For some tests such as Running Toggle, the
software automatically modifies the test for topology constraints and inserts disabling
vectors to minimize test debug. The test developer can select macros that trade off
faster versus more thorough tests.
In-circuit boundary-scan diagnostics are accurate to the device level, as is true for all
in-circuit tests. InterconnectPlus Boundary-Scan may be used to achieve pin-level
diagnostics.
Access Consultant
Access Consultant takes advantage of DriveThru, Boundary-Scan, Silicon Nails
Boundary-Scan, and MagicTest1 test techniques by automating node analysis and access
selection for eligible devices.
When enabled, the Access Consultant software can be used in Update Mode or Design
for Test Mode. Design for Test Mode allows you to intentionally remove access to
selected nodes. Use Access Consultant in Update Mode to:
–– Analyze a board directory for unnecessary probing locations
–– Examine nodes with potential for access removal
–– Mark selected nodes for access removal
–– Remove selected nodes that can be tested with the DriveThru, Boundary-Scan,
Silicon Nails Boundary-Scan, and MagicTest1 techniques.
1. Available on Mux systems only.
25 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Board Test Grader
Board Test Grader automatically detects unstable or marginal in-circuit and functional
tests, and provides a test coverage report. This information can be used to modify or
repair tests and complete a higher quality board test in a shorter period of time. Board
Test Grader evaluates the following types of tests:
–– Opens
–– Shorts
–– Preshorts (switches, potentiometer, etc.)
–– Analog in-circuit
–– Digital in-circuit
–– Digital functional
–– Analog functional
Coverage Analyst
Coverage Analyst is a single test coverage reporting and analysis tool It provides an
overall coverage score for both devices and joints. The device score is based upon tests
that verify the following characteristics: presence, correctness, orientation, live (basic
device functionality), and alignment. The joint score is based upon tests verifying: shorts,
opens, and quality. Coverage Analyst scores all in-circuit tests.
Coverage Analyst is also a tool for analyzing the test program to identify areasfor
coverage improvement. It allows quick navigation from a high level executivesummary
to device or connection coverage details. Color coding is used toquickly identify the
level of device coverage.
Pushbutton Q-STATS
Pushbutton Q-STATS provides automatic data collection and reporting. Test and
measurement results are logged automatically. The amount of logged information can
be varied to suit different production environments. Pushbutton Q-STATSprovides the
following types of reports:
–– Yield – shows the overall yield per board type.
–– Production – provides an overview of your production process.
–– Failure – shows which tests are failing per board type.
–– Repair – shows the most frequent causes of repairs, which is why tests arefailing.
–– Histogram – shows the distribution of measurements and other statistical information associated with sampled analog tests.
System Confirmation and Hardware Diagnostics Software
The system confirmation and diagnostics software provides complete system operation verification and board-level fault isolation. The Confirmation software for system
verification can be run by the test programmer. The Diagnostics software used to isolate
system faults can be run by service-trained personnel or a Keysight-Authorized Service
Representative.
The Diagnostics software provides the flexibility to run specific tests on selected cards,
choose tightened test limits, do subsystem verification, run confirmation, or run complete diagnostic tests on the entire system. A pin verification fixture is available and is
used in conjunction with the Confirmation and Diagnostics software to provide verification of system pin electronics.
Board-level fault isolation and replacement is quickly done with troubleshooting from
the first failing test. Time to repair a fault, from the invocation of confirmation and
diagnostics software to isolating the fault to board replacement and system verification,
is typically less than two hours.
26 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
System Confirmation and Hardware Diagnostics Software (continued)
The system auto-adjust software automatically adjusts the system measurement capability for a change in temperature of ± 5° K. This compensates for any thermal variations
throughout the operating range of the test system. An auto-adjust is also automatically
done after every 1,000 hours of operation (a default which can be changed by service
personnel).
Optional Test Features and Tools
DriveThru Test
Keysight DriveThru Test allows you to use TestJet or VTEP to test devices through series
components, such as resistors, capacitors, and inductors. DriveThru extends the capabilities of TestJet/VTEP by providing a means to test integrated circuits and/or connectors
when there is no direct access on the device under test. It is particularly suited for high
node-count board designs in which small-valued series damping resistors are placed at
driver pins to absorb reflections in high-speed digital designs.
DriveThru Test helps you resolve limited access test problems by allowing you to:
–– use TestJet/VTEP to test boards with limited nodal access, and
–– selectively remove probe access from digital device outputs.
DriveThru can be utilized in conjunction with Access Consultant, which performs a node
analysis on a board, identifies nodes with potential for access removal, and automates
the process of removing access from selected nodes.
PanelTest
Keysight PanelTest reduces test development time and increases test speed by eliminating redundant tasks associated with testing boards in a panel. Data entry for a panel
of the same board type requires that only the description for one board be entered. The
software automatically generates the tests for all of the boards in the panel. For test
debug, a change to a specific test is automatically replicated for the other boards in
the panel. Finally, the fixture file generation software will help multiplex the DUT power
supplies and provides the ability to test partial panels.
Combined with the Throughput Multiplier software, PanelTest can test up to four boards
in a panel in parallel, greatly improving in-circuit test throughput. For quick repair,
“X-out” boards are shown on the monitor display and boards on the panel are highlighted
in green or red for pass or fail identification.
Throughput Multiplier
Keysight Throughput Multiplier employs parallel system architecture to allow asynchronous operation of the testhead modules. Four independent analog and digital subsystems provide the ability to test up to four boards simultaneously, dramatically improving
test throughput. Shorts, opens, TestJet, analog in-circuit, and digital in-circuit tests can
be run in parallel. PanelTest is required for development of Throughput Multiplier tests.
Polarity Check
Keysight Polarity Check provides the ability to safely and automatically detect reversed
polarized capacitors. Capacitors connected in parallel are tested and individually identified if reversed. The Polarity Check test technique uses a combination of several VTEP/
TestJet and analog in-circuit measurements to determine capacitor orientation.
Only tantalum and aluminum polarized capacitors in SMT or axial packages are testable.
Capacitors mounted on the top-side or bottom-side of the board can be tested if access
with a VTEP/TestJet probe is available.
27 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Limited Access Test Solutions – Super 7 Suite
The Medalist i3070 ICT platform’s most comprehensive limited access offers seven powerful test tools and methodologies to help users overcome challenges caused by limited
access. This Super 7 suite consists of the following:
–– Access Consultant (see “Access Consultant” on page 24)
–– Drive Thru (see “DriveThru Test” on page 26)
–– IEEE 1149.1 InterconnectPlus Boundary-Scan
–– IEEE 1149.6 InterconnectPlus Boundary-Scan
–– Automated Silicon Nails
–– Cover-Extend Technology
–– Bead Probe Technology
InterconnectPlus Boundary-Scan (IEEE 1149.1 and 1149.6)
Keysight InterconnectPlus Boundary-Scan software can be added to Medalist i3070
systems to take advantage of advanced boundary-scan test coverage. The InterconnectPlus software allows testing of several boundary-scan components that are interconnected through a boundary-scan chain. The cells in the boundary register can be
used as resources. These resources use the output cells of one boundary-scan device as
drivers and the input cells of another boundary-scan device as receivers in order to test
for manufacturing defects. High fault coverage tests can be automatically generated for
faults such as opens, shorts, stuck-at faults, wrong, rotated, or missing components, and
ESD damaged components.
Below is an example of boundary-scan devices connected for interconnect testing:
Test and diagnostics data generation is automatically generated by the InterconnectPlus
software from the Boundary-Scan Description Language (BSDL) information of
the boundary-scan devices and the “netlist” or connectivity. InterconnectPlus provides
the following tests:
–– Automatic
–– TAP integrity
–– Interconnect shorts and some opens testing
–– Bus-wire opens testing
–– In-circuit boundary-scan (i.e., connect tests) with pin diagnostics
–– Prerequisite for Automated Silicon Nails non boundary-scan device testing
(with purchase of Automated Silicon Nails)
–– Semi-automated
–– Custom, e.g. BIST
–– Silicon Nails cluster tests
–– Silicon Nails device tests from manually generated ITL files
28 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Automated Silicon Nails Software
Automated Silicon Nails software can be added to Medalist i3070 systems to take advantage of boundary-scan testing by automatically expanding coverage to non boundary-scan parts. The user only needs to specify the devices to be tested and ensure that
library tests are available for them.
The tests optionally combine boundary-scan resources with any available probe access.
The cells from a boundary-scan device in the boundary register can be used as resources.
These resources use the cells of one boundary-scan device as drivers and the cells of
the same or another boundary-scan device as receivers to test a non boundary-scan
component for manufacturing defects. High fault coverage tests can be automatically
generated for faults such as opens, shorts, stuck-at faults, wrong or missing components, and ESD damaged components, depending on the quality of the library test and
circuit topology.
Note: Not all Medalist i3070 libraries and VCL constructs are supported.
Cover-Extend Technology
Cover-Extend Technology (CET) is a hybrid between VTEP and boundary-scan. The key
contributions of the constituent technologies are:
–– VTEP – Simple, robust and fast measurement using VTEP sensors and amplifiers.
–– Boundary-Scan–Limited-access capability, the ability to control the I/O functions
of individual pins through the use of only four pins of the test access port.
Keysight CET automatically generates test vectors on the target device under test.
Bead Probe Technology
A Bead Probe is a small hemi-ellipsoid structure made of solder which lies on top of
signal traces. The bead is only a few mils tall and clears the surrounding solder mask by
several mils. Beads are made with standard solder paste/reflow processes in parallel
with other solder features.
The benefits of the Bead Probe technology are:
–– Improved test access and test coverage, especially for high density and high speed
designs.
–– Excellent probe contact, equal or better than standard probing, resulting in excellent
test reliability and repeatability.
–– Minimized trace re-routing which eliminates the need for PCB layout changes typically required to accommodate traditional test pads. And bead probes have
no impact on PCB signal integrity, even at high speeds.
–– Simpler, cheaper test fixtures that are faster to build.
Bead probe technology is simple, reliable, and requires no changes to existing SMT
processes. For more details, visit www.keysight.com/find/beadprobe.
29 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
ScanWorks
The ScanWorks boundary-scan solutions for the Medalist i3070 offer a full suite of tools
for volume manufacturing environments. Keysight created this solution by integrating the
ScanWorks boundary-scan system from ASSET InterTech Inc. with the Medalist i3070
test development and test execution environment. This integrated ICT solution is the
industry’s only in-circuit test implementation that seamlessly leverages test vectors from
design/prototype directly to manufacturing, and makes possible a consistent boundary-scan and programming test strategy throughout the product life cycle.
Key features of the ScanWorks/Medalist i3070 integration include:
–– Full ScanWorks boundary-scan test development, runtime execution, and diagnostics
–– Fast vector speeds (25 MHz and higher)
–– Excellent boundary-scan test stability
–– PLD and flash programming via the boundary-scan chain
–– Memory interconnect and cluster test generation
–– Support for multiple logic families (1.8, 2.5, 3.3, 5 V)
–– Full integration on the Medalist i3070 test platform including single test plan,
integrated reporting, and automatic fixturing
–– Complete hardware integration on the Medalist i3070 platform
–– Fully compliant with IEEE 1149.1 industry standards
–– Keysight sold and supported
Flash70
Flash70 software provides a way to use the Medalist i3070 to program memory (flash
RAM or EEPROM) after the device has been attached to the board. Flash70 eliminates
production line delays to individually program devices,assembly defects that occur when
devices are handled too many times, andtechnician costs for re-programming devices in
inventory.
A flash test is a standard VCL digital test that uses an external data source toprogram a
flash device. Unlike standard digital tests in which the data values areexplicitly defined
by internal vectors, flash programming uses data values froman external file. The external file is a formatted data record which the compileruses to program the flash device.
The Medalist i3070 flash compiler works with Motorola (S-Records), Intel (Hex Records)
and integer data.
Flash devices can be programmed individually, or multiple devices can beprogrammed
simultaneously, either with a custom library, a single board, ormultiple boards using
Throughput Multiplier. Large data widths are handledeffortlessly, including 128 pins of
address and data.
Flash libraries include tests of the following types in a test suite:
– ID Check
– Program using attached file
– Blank Test
– CRC test
– Erase
– Verify
30 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
In-System Programming (ISP) Products
The Keysight ISP products can be fully integrated into the Medalist i3070, so devices
can be programmed at the same time a PCB assembly is being tested for manufacturing
defects. This system-embedded capability eliminates the time and cost of extra steps
that were previously required to program flash components and PLDs. Devices are now
programmed right on the Medalist i3070 in a single manufacturing step with the ISP
products.
Results are:
–– Faster programming. Flash devices and PLDs can be programmed inline at
near-databook speeds. No more production line detours to discretely program
devices.
–– Greater flexibility. Devices can be reprogrammed on-the-fly, after they are mounted,
causing little or no interruption on the line when engineering change orders need to
be implemented.
–– Reduced inventory. Device personalities are embedded as needed, after devices are
mounted on boards, so a limited inventory can be used across a greater number of
end products.
–– Less rework and scrap. Boards and devices are handled less, so fewer defects are
introduced by repair operators, reducing the potential for downstream failures while
limiting expensive scrap.
The ISP products are:
–– Flash ISP
When upgrading to Flash ISP from Flash70 (Keysight’s standard flash solution), users
typically see production run-time improvements of 20 to 80 percent immediately.
Flash ISP requires less memory in the testhead, so existing test systems can handle
higher complexity boards. Flash ISP also provides more complete information on input data files at compile time, so programmers can correct problems early and save
additional time at debug and production test.
–– PLD ISP
PLD ISP accelerates programming to near-databook speeds with embedded language (SVF, STAPL and Jam) byte players and boundary-scan support. Programmers need only one Medalist i3070 Vector Control Language (VCL) test file plus
the configuration data file to program with PLD ISP. Compile time takes just several
seconds to a few minutes, so programs are developed faster and implemented easier
in the manufacturing environment.
31 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
MagicTest (Mux Systems)
Keysight MagicTest is a limited access solution for Mux systems only, developed to
increase test coverage on PCBs that have limited access to passive analog components.
Before MagicTest, a passive analog device could not be tested in-circuit without a way
to electrically probe both ends of the device. Although MagicTest is a very different test
technology from regular in-circuit testing, it offers similar benefits, such as automatic
test generation and diagnostics.
MagicTest works by automatically defining clusters of passive analog components and
writing tests for these clusters. MagicTest uses similar voltage stimulus levels as a
full-access in-circuit test, and tests the components without powering the PC board. At
the applied stimulus level, some components’ active device junctions behave as though
they are not present on the board (as though they are open).
MagicTest performs the following tasks:
–– Analyzes the circuitry and topology of the PCB, models silicon devices as opens, and
uses that information to define analog clusters from the remaining components
–– Automatically creates test programs that contain the necessary test limits including consideration of component tolerances to differentiate a passing cluster from a
failing cluster
–– Reports the expected fault coverage
–– Creates a single test statement that executes a suite of stimulus/response subtests
in the cluster and determines whether the cluster passes or fails
–– Diagnoses the faulty components of these clusters either to a single component fault
or to a small group of components.
32 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Unpowered Test Measurement Specifications
Analog In-circuit Test Specifications
Shorts and Opens
The shorts/opens test is automatically generated and performs checks for unexpected
shorts between nodes and for opens where shorts are expected. The expected values are
calculated by the software on a node-by-node basis and a known reference board is not
required.
A short is defined as a measured resistance between nodes which is less than a defined
threshold value. An open is defined as a measured value greater than a defined threshold
value. The short and open thresholds are automatically calculated and can be programmed on a node-by-node basis. The variable thresholds allow the test developer to
fine-tune the test for maximum repeatability.
The software also automatically determines how much settling time is required on a
node-by-node basis, to allow for capacitive or inductive settling. The settling times are
variable, based on throughput options.
Source Impedance: 100 Ω
Parameter
Specification
Programmable Threshold Range
Short
2–1000 Ω
Open
2–1000 Ω
Programming Resolution
1.0 Ω
Accuracy
±(0.25% + 2.2 Ω)
Programmable Settling Time
Minimum
0 μs
Maximum
3.2768 s
Default
50 μs
Programming Resolution
50 μs
Test Voltage
0.1 V DC
An opens test is run first to check connectivity between all known shorted nodes. For
maximum test speed, shorts are tested by measuring the resistance between a single
node and all remaining untested nodes which are shorted together. If any failures are
detected during this phase, searching is stopped and an automatic shorts diagnostic
routine is executed to determine the exact node(s) which are shorted to the node
under test.
Keysight CHEK-POINT uses a subset of the shorts test to verify that the board under
test is contacting the fixture properly during production testing. CHEK-POINT applies
a voltage to each node while grounding all other nodes and looks for leakage current.
If leakage current exists, the test passes. For failures, open nodes are identified and
should be checked to determine if the board is properly contacting the fixture or if no
leakage path from the node exists due to circuit topology. CHEK-POINT can be run for
each board, or set to run only on failing boards.
33 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Resistor
High Guard Ratio Tests
Source Voltage: 0.1 VDC
Guard Ratio: 1000 to 1 on both legs
of guard circuit
Unguarded Tests
Source Voltage: 0.1 VDC
Range
Measurement Type
Accuracy
0.1 Ω–10 Ω
4-wire (using ED, EN, & OXT options)
±1.0% (ASRU C)
±1.5% (ASRU-N MOA)
10 Ω–300 Ω
4-wire (using ED, EN, & OXT options)
±1.0%
300 Ω–10 kΩ
4-wire (using ED, EN, & OXT options)
2-wire
±0.25%
±1.0%*
10 kΩ–100 kΩ
2-wire (using ED, EN, & OXT options)
2-wire
±0.25%
±1.0%
100 kΩ–1 MΩ
2-wire (using ED, EN, & OXT options)
2-wire
±0.5%
±2.5%
1.0 MΩ–10 MΩ
2-wire (using ED, EN, & OXT options)
±5.0%
Value
Measurement Type
Accuracy
10 kΩ
6-wire (using ED, EN, &
±2.5%
OXT options)
High guard ratio and ultra-high guard
ratio are not supported in tests using
DMC on the ASRU-N card.
* Plus system residual ≤ 3.5 Ω
Unguarded Tests (Using DMC on ASRU-N)
Source Voltage: 0.1 VDC
Range
Measurement Type
Accuracy
1 Ω–300 Ω
4-wire (using ED option)
±1.0%
300 Ω–10 kΩ
4-wire (using ED option)
±0.25%
2-wire
±1.0%*
2-wire (using ED option)
±0.25%
2-wire
±1.0%
2-wire (using ED option)
±0.5%
2-wire
±2.5%
2-wire (using ED option)
±5.0%
10 kΩ–100 kΩ
100 kΩ–1 MΩ
1.0 MΩ–10 MΩ
* Plus system residual ≤ 3.5 Ω
Potentiometer
Potentiometers can be measured using the same methods as testing a resistor, with the
same accuracy results. A potentiometer measurement expects the wiper to be centered.
Potentiometers are measured twice. The first test requires the operator to center the
wiper of the potentiometer by observing a graphical view of the present measurement
and the desired value. This measurement checks the resistance between the wiper
and one leg. Then the test is executed again, without the adjust option, to measure the
resistance between the other leg and the wiper. The result of the each measurement is
compared to half of the potentiometer’s value. The second measurement has wider
tolerances to accommodate any inaccuracy of the adjustment.
S
A
10 kΩ
A
S
I
B
10 Ω
100 kΩ
I
B
0.1 Ω
3 kΩ
G
L
10 Ω
G
L
34 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Capacitor
160 kΩ
Unguarded Tests
Source Voltage: 0.1 VAC
Dissipation Factor: ≤ 1.0
S
Range
Measurement Type
Accuracy
10 pF–0.5 µF
2-wire (using ED & OXT options)
±2.0%*
0.5 µF–10,000 µF
4-wire (using ED, EN, & OXT
options)
±2.0%
A
1000 pF
B
≤ 1 µF
≤ 1 µF
* Plus system residual: ±1 pF with capacitor compensation, 0 to +40 pF typical without
capacitor compensation.
Unguarded Tests (using DMC on ASRU-N)
Source Voltage: 0.1 VAC
Dissipation Factor: ≤ 1.0
Range
Measurement Type
Accuracy
10 pF–0.5 μF
2-wire (using ED option)
±2.0%*
0.5 μF–100 μF
4-wire (using ED option)
±2.0%
* Plus system residual: ±2.5 pF with capacitor compensation, 0 to +40 pF typical
without capacitor compensation.
100k and 200k test frequencies are available when using DMC on
the ASRU-N card.
I
G
L
6-wire Guarded Tests
Source Voltage: 1.0 VAC
Test Frequency: 1024 Hz
Dissipation Factor: ≤ 1.0
Guard Ratio: 1000 to 1 on both legs of guard circuit
Value
Measurement Type
Accuracy
1000 pF
6-wire (using ED, EN, & OXT options)
±6.0%
Guard sense lines are not supported in tests using DMC on the
ASRU-N card. Tests using source and detector sense lines are
allowed.
Inductor
Unguarded Tests
Source Voltage: 0.1 VAC
Quality Factor: [ 1.0
S
Range
Measurement Type
Accuracy
5 μH–50 mH
4-wire (using EN option)
±2.0%*
50 mH–1.59 H
2-wire (using EN option)
±2.0%
1.59 H–10 H
2-wire (using ED and EN options)
±2.0%
10 H–100 H
2-wire (using ED and EN options)
±3.0%
A
100 mH
314 kΩ
I
B
≥10 mH
≥10 mH
G
L
* Plus system residual: 1 μH
Unguarded Tests (using DMC on ASRU-N)
Source Voltage: 0.1 VAC
Quality Factor: [ 1.0
Guarded Tests
Source Voltage: 0.1 VAC
Test Frequency: 8192 Hz
Dissipation Factor: ≥ 1.64
Range
Measurement Type
Accuracy
150 μH–50 mH
4-wire
±2.0%*
Value
Measurement Type
Accuracy
10 mH
6-wire (using ED and EN options)
±5.0%
50 mH–1.59 H
2-wire
±2.0%
1.59 H–10 H
2-wire (using ED option)
±2.0%
10 H–100 H
4-wire (using ED option)
±3.0%
* Plus system residual: 1 μH
100k and 200k test frequencies are available when using DMC on
the ASRU-N card.
Guard sense lines are not supported in tests using DMC on the
ASRU-N card. Tests using source and detector sense lines are
allowed.
35 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Diode
Unguarded Tests
The diode test supplies a constant current through the diode
under test and measures the forward voltage drop. The test
is appropriate for standard, Schottky, light emitting, or zener
diodes, and can detect open, shorted, or backwards diodes.
Default Current: 1 mA
Programmable Range: Up to 100 mA
Range
Accuracy
± 0 V–19 V
±(1.0% of reading + 4 mV)*
* Plus system residual: ≤ 3.5 mV/mA
Zener Diode
Unguarded Tests
The zener diode test measures the breakdown (reverse bias)
voltage across the diode at a specified current. Guarding is used
to minimize the effects of adjacent circuitry.
Default Current: 1 mA
Programmable Range: Up to 100 mA
Range
Accuracy
± 0 V–18 V
±(1.0% of reading + 4 mV)*
* Plus system residual: ≤ 3.5 mV/mA
High Voltage Zener
The High Voltage Zener (HVZ) test uses special circuitry on the
ASRU-N card. This test is executed in pre-powered mode, unlike
the zener test (unpowered mode).
Default Current: 1 mA to 5 mA
Programmable Range: Up to 50 mA
Range
Accuracy
18 V–60 V
± 3.0% of reading
Bipolar Transistor (Beta Test)
Unguarded Tests
Transistors are tested by a DC Beta test or junction verification
test.
Programmable DC Emitter Bias
Current Range: 100 μA to 100 mA
Beta Range
Accuracy
10–1000
±15%
Depletion Field Effect Transistor
Unguarded Tests
Depletion mode Field Effect Transistors (n channel and p channel) are tested by checking the on resistance with the gate tied
to source, Vgs = 0 V (Enhancement mode FETs are easily tested
using an analog powered test).
Voltage Range: 0 to 10 V
Default Voltage: 0.1 V
On Resistance Range
Accuracy
5 Ω–500 Ω
±1.0% (ASRU C)
±1.5%* (ASRU-N MOA)
* Plus system residual: ≤ 3.5 Ω
Fuse, Switch, and Jumper
Default Voltage: 0.1 V
Threshold Range
Accuracy*
0.1 Ω–500 Ω
±1.0% (ASRU C)
±1.5% (ASRU-N MOA)
1.0 Ω–500 Ω
±1.0% (ASRU-N DMC)
* Plus system residual: ≤ 3.5 Ω
36 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
TestJet and VTEP
Keysight TestJet and Vectorless Test EP (VTEP) provide test coverage for device pin
opens. VTEP delivers everything available with TestJet, plus the following:
–– Improved measurement accuracy which allows for increased pins coverage and
better overall test stability
–– Automatic debug software that sets both high and low limits for each pin tested
–– More robust sensor plates that will last longer, reducing fixture maintenance costs
Defects associated with complex or custom devices, such as ASICs, can be detected
without test vectors or power applied to the board. TestJet and VTEP detect opens by
measuring the small capacitance (1 × 10−15 Farads, or femtofarads) that exists between
each pin and a sensor plate placed over the device package. The capacitance measured
will be below the low threshold if the device pin is not properly connected to the circuit
board. Unconnected pins are automatically diagnosed.
Source Voltage: 200 mV
Test Frequency: 8192 Hz
Parameter
Specification
Programmable Low Threshold
1 fF–1000 pF
Programmable High Threshold
1 fF–1000 pF
Programming Resolution
1 fF
Test Speed (typical)
500 pins per second
TestJet and VTEP technology provides test coverage for both top-side and bottom-side
mounted devices, such as:
–– Digital, analog and mixed-signal ICs
–– PGAs (without ground plane)
–– BGAs (especially plastic types)
–– Connectors
–– Switches
–– Sockets
Several sensor plate sizes are offered for the TestJet probes to address most device
package types. The larger plates can be trimmed to size for larger IC and connectors.
Sensor Plate
Dimensions
TestJet Testable Packages*
Connector Test
155 mm x 13 mm
(6.1 in. x 0.5 in.)
Connectors (trim to size)
1.2 inch Square
30.5 mm x 30.5 mm
(1.2 in. x 1.2 in.)
PLCC20 – PLCC84, SOJ24 – SOJ32, SO24W – SO32UW,
QFP44 – QFP164, DIP14 – DIP64, PGA68, PGA84, capacitors
2.5 inch Square
63.5 mm x 63.5 mm
(2.56 in. x 2.56 in.)
PLCC100, PLCC124, QFP196, QFP244, PGA114 – PGA179, capacitors
B–C
6.29 mm x 3.73 mm
(0.248 in. x 0.147 in.)
TSSOP8 – TSSOP16
B and C size SMT capacitors
D
7.56 mm x 4.85 mm
(0.298 in. x 0.191 in.)
SO8, TSSOP20 – TSSOP28
D and E size SMT capacitors
* For additional testable package information, see the Building Board Test Fixtures guide.
37 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Polarity Check
Source Voltage: 200 mV
Parameter
Specification*
Test Range (total parallel capacitance)
up to 2000 μF
Test Range (stand-alone capacitance)
up to 4000 μF
Test Speed
10–15 capacitors per second (typical)
* Range varies with types of packaging used for capacitors.
Capacitors in larger axial and SMT packages are tested with VTEP/TestJet probes.
A small VTEP/TestJet probe provides Polarity Check test capability for SMT capacitors.
Two sensor plate sizes exist for the small VTEP/TestJet probe: a B-C plate for B or C size,
and a D plate for D or E size. The small probe can also be used for TestJet testing of ICs.
Sensor Plate
Dimensions
TestJet Testable Packages
B–C
6.29 mm x 3.73 mm
(0.248 in. x 0.147 in.)
TSSOP8 – TSSOP16
B and C size SMT capacitors
D
7.56 mm x 4.85 mm
(0.298 in. x 0.191 in.)
SO8, TSSOP20 – TSSOP28
D and E size SMT capacitors
38 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Powered Test Measurement and Specifications
Analog Functional Test
Analog Functional Testing provides a voltage stimulus to a circuit or device under test
and observes the circuit’s response with a detector. Checking the circuit components
together as a unit (cluster) gives high confidence that all components work together
properly.
Stimuli and detectors are built into Medalist i3070 systems, providing basic analog functional tests at any pin on the Hybrid-144 Non-multiplexed or HybridPlus-DD pin card. In
addition, two functional test access ports per module are provided to permit connection
of external instrumentation for DC and audio frequency analog functional testing. The
Medalist i3070 automatically handles the assignment for functional test resources.
The standard Medalist i3070 system provides analog measurement resources close to
the device under test to provide maximum signal quality.
39 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Built-In Instruments
Universal Source (Four Quadrant)
Programmable Current Limit: 30 mA or 150 mA
Programmable Termination: 5, 50, 500, or 5,000 Ω
Output Resistance: ≤ 2.2 Ω
Application
Characteristic
DC Voltage Source
Four Quadrant and Auto-ranging
Range
Programming Resolution
Accuracy
±0.1 V
50 μV
± 0.1% ± 3 mV
±10 V
5 mV
± 0.1% ± 10 mV
Functional Generator
Sine Wave
Distortion (THD): < 1%
Range
±7.071 Vrms
Square Wave
1
± 0–10 V
1
± 0–10 V
Jitter
2
DC Offset Voltage
5 mV (Mux)
2 mV (UnMux)
± 2.0% ± 5 mVAC
Programming Resolution
Accuracy
5 mV
± 2.0% ± 5 mVAC
Linearity (10%–90%): 2% (typical)
Range
Frequency
Accuracy
Rise Time (10%–90% of 0–5 V): 2.5 μs (typical)
Range
Triangle Wave
Programming Resolution
Programming Resolution
Accuracy
5 mV
± 3.0% ± 5 mVAC
Range
Resolution
Accuracy
1–20 kHz
1 Hz
±0.015%
Sine Wave
Square Wave
Triangle Wave
0.25 μs
2.2 μs
0.25 μs
1
Range
± 0–10 V
Accuracy
1
±15 mV
Arbitrary Waveform
Generator
1–1024 samples
4096 samples
Frequency Range
1–32,768 Hz
1–8,192 Hz 120 kHz
Voltage Range
−10.0 to 10.0 V
−10.0 to 10.0 V
3 dB bandwidth
1. Peaks of waveform plus programmed offset must be between ±10 V.
2. Maximum edge to edge.
Auxiliary DC Voltage Source (Four Quadrant)
Programmable Current Limit: 30 mA or 150 mA
Output Resistance: ≤ 2.2 Ω
Range
Programming Resolution
Accuracy
±10 V
5 mV ± 0.1%
± 10 mV
40 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Differential Detector DC
DC Voltage Detection
Autoranging: The DC detector will autorange up from the selected range when the input
is over-ranged. This provides flexibility to accommodate the occasional upranges while
providing the speed advantages of starting out on the expected range. Autoranging is
performed on readings and on the instantaneous peak level detector to ensure accurate
readings in the presence of noise and other transients.
Characteristic
Specification
Resolution
16 bits (15 bits plus sign), < 0.005% of range
Converter
Integrator for noise rejection.
Converter Speeds
Normal
500 μs integration (high-frequency noise rejection)
Line Rejection
16.667 ms or 20.000 ms (60 Hz or 50 Hz systems: power line, high-frequency rejection)
Normal
± (0.02% of reading + 0.05% of range + 300 μV)
± (0.05% of reading + 0.1% of range + 300 μV) for ASRU-N
Line Rejection
± (0.02% of reading + 0.05% of range + 300 μV)
Accuracy
1
Line Rejection
60 dB
Input Types
Differential, HI (I bus) and LO (L bus)
Peak Differential Input Voltage
< ±160 VDC
Maximum Voltage to Ground
±100 V peak
Input Capacitance
1000 pF 3
DC Common Mode Rejection Ratio
(1 kΩ imbalance in either lead)
Range
Specification
± (0.039 to 10) V
> 80 dB V/V
± (20 to 160) V
> 50 dB V/V
2
1. Add 0.12% of reading for attenuated ranges.
2. Line frequency within ± 0.1% and peak voltage is within expected range.
3. Either input referenced to system ground.
Range (volts)
Common Mode Range
Common Mode Input Resistance (ohms) (typical)
Differential Input Resistance (ohms) (typical)
160
± 100 V
240 k
1M
80
± 100 V
240 k
1M
40
± 100 V
240 k
1M
20
± 100 V
240 k
1M
10
± 10 V
> 100 M
> 100 M
5
± 10 V
> 100 M
> 100 M
2.5
± 10 V
> 100 M
> 100 M
1.25
± 10 V
> 100 M
> 100 M
0.625
± 10 V
> 100 M
> 100 M
0.3125
± 10 V
> 100 M
> 100 M
0.1562500
± 10 V
> 100 M
> 100 M
0.0781250
± 10 V
> 100 M
> 100 M
0.0390625
± 10 V
> 100 M
> 100 M
41 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Differential Detector AC
True RMS AC Detection
Autoranging: Autoranges up from the selected range when input is over-ranged using
the same detection approach as in DC detection.
Characteristics
Specification
Resolution
16 bits (15 bits plus sign), < 0.005% of range
Converter
Uses 16-bit successive approximation converter running at
40,000 samples/second (nominal) to convert, store, and analyze
the rms value of the input waveform over one of the two user
selectable time windows. Digital Signal Processing (DSP) techniques are utilized to determine and remove the DC component.
Measurement speed for voltages with DC components is faster
than capacitor coupled AC converters.
Converter Modes
Normal
8192 samples at 40,000 samples/second (0.2048
sec window)
Fast
1024 samples at 40,000 samples/second (0.0256
sec window)
Input
Differential, HI (I bus) and LO (L bus)
Peak Differential Input Voltage
< ±160 VDC
Maximum Voltage to Ground
±100 V
peak
Input Capacitance
< 1000 pF (either input referenced to system ground, other lead
tied to system ground).
DC Rejection Ratio
Normal
78 dB (typical)
Fast
60 dB (typical)
Frequency Range
Accuracy *
Normal Mode
10–50 Hz
± (4% of reading + 0.02% of range + 100 μV)
50–300 Hz
± (1% of reading + 0.02% of range + 100 μV)
300 Hz–3 kHz
± (0.2% of reading + 0.02% of range + 100 μV)
3–10 kHz
± (2% of reading + 0.02% of range + 600 μV)
10–19 kHz
± (5% of reading + 0.02% of range + 600 μV)
Fast Mode
50–200 Hz
± (7% of reading + 0.02% of range + 100 μV)
200–400 Hz
± (2% of reading + 0.02% of range + 100 mV)
400 Hz–5 kHz
± (1% of reading + 0.02% of range + 100 μV)
5–10 kHz
± (2% of reading + 0.02% of range + 600 μV)
10–19 kHz
± (5% of reading + 0.02% of range + 600 μV)
* Add 0.12% of reading for attenuated ranges (> 7.07 VAC); see DC voltage detection specifications for impedance
of each voltage range.
42 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Waveform Digitizer
Parameter
Specification
Interval between samples
25 μs–51.2 ms
Number of samples
1–8192
Settling time
25 μs
Noise
0.2% of range + 10 mV
Trigger delay
10 μs
Frequency/Time Interval Counter
The frequency/time interval counter has two input channels (Channel A and Channel B)
and an external-internal arming trigger which can be switched to any clock receiver pin
on the ControlXTP, Hybrid-144 Non-multiplexed, or HybridPlus-DD card to perform time
interval, pulse width, and frequency measurements.
Input Voltage Range: 0
to 4.875 V (Hybrid-144 pin card)
−3.5 to 5.0 V (other pin cards)
Measurement
Specification
Range
Accuracy *
Time Interval
100 ns–1 sec
± (10 ns + 0.01% + 2 x trigger error)
Pulse Width
25 ns–1 sec
± (5 ns + 0.01% + 2 x trigger error)
Range
Threshold Accuracy *
1 Hz–20 MHz
± 0.1 V on any pin card
Positive or negative slope
2 Hz–60 MHz
TTL level on ControlXTP clock receivers
Positive or negative slope
Minimum Gate Delay
Resolution
Accuracy
0.5 ms
0.02%
0.03%
100 ms
0.0001%
0.01%
Frequency
* Input signals to tester must have a slew rate ≥ 100 V/μs in 0.2 to 3.5 V range.
Trigger error = 80 mV/(input signal slew rate).
Power Monitoring Circuit (PMC)
Parameter
Specification
Channels per ASRU card
3
Voltage limit range
1.0 to 50 V
Recommended voltage limit range
1.8 to 50 V
Accuracy
1.22% of reading
Positive or negative slope
43 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
External Functional Test Instruments
GPIB (IEEE 488)
Any IEEE 488 compatible instrument can be connected to the analog functional test
access port in a module to provide functional test capability. For more than eight instruments (two per module), the following options may be added to the system for instrument connections:
–– AccessPlus Card (Mux systems only) – This card provides for instrument connections
directly through eight 50 Ω high-frequency test ports. The AccessPlus card also
provides ten general-purpose instrument ports multiplexed to 28 module interface
pins.
–– Utility Card – This card provides differential signal connection through 75 Ω high
frequency test ports.
Functional Test Access Ports
A Medalist i3070 system that is fully configured with four modules has eight functional
test access ports for external sources and detectors to provide DC and low frequency
functional test capability beyond the built-in instruments. These ports may be used
single-ended (providing connections for eight grounded devices) or as floating pairs
(providing connections for four floating devices). Each port can be switched to any of
the Hybrid-144, HybridPlus-DD or AnalogPlus-DD card pins. The port connections are
not held between tests. The AccessPlus card can maintain connections between tests if
desired.
The digital subsystem can provide triggers to instruments connected to the functional
test access ports. External instruments can trigger frequency, pulse width, and time
interval measurements.
44 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Parameter
Specification
Characteristic Impedance
50 Ω (typical)
Minimum DC Insulation Resistance
1 MΩ
Maximum Voltage
±100 V peak (port to system ground)
Maximum Current
±500 mA peak per port
Maximum Power
7.5 VA per port
Minimum DC Insulation Resistance
10 MΩ
Total Capacitance
< 900 pF port to ground
3 dB Bandwidth
12 MHz (typical) to and from any HybridPlus-DD pin
Crosstalk at 1 MHz
< −45 dB (50 Ω source and load)
Trigger Input Mode
TTL levels
Trigger Output Mode
TTL levels with 50 Ω series back match resistor
Digital In-circuit Test
Digital Overdrive
Testing a digital device in-circuit requires the application of input patterns and the
observance of output responses while the circuit board is under power. Medalist i3070
pins apply input patterns for a brief time with sufficient current to overdrive all upstream
devices. This forces (drives) the pulsed state (0 or 1) on the digital node and effectively
isolates the device under test from the rest of the circuit. Devices one level upstream
which can be disabled are automatically disabled during the test. Multi-level and
multi-pattern disabling and conditioning can be specified. Keysight’s Safeguard in-circuit
analysis identifies any test which exceeds the safe backdrive time, inhibits that test, and
alerts the test developer.
The test patterns (vectors describing states driven and received) are customized to the
topology surrounding the device under test with the application controlled by the vector
processing unit (VPU). The time between consecutive drives—called “vector cycle” time—
is programmable for control of the test speed. The time between the drive of device
inputs and receive of the device output responses is called the “receive delay”.
45 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Programmable Receive Delay
Device propagation delays, backdrive time, edge rise time, edge placement accuracy,
and fixture propagation delay determine the minimum receive delay. The Medalist i3070
provides the capability to program the receive delay on a test-by-test basis for variations
in device response time.
On Mux systems, advanced in-circuit tests can be written using timing sets to change
the drive-to-drive time and the drive-to-receive time on a pattern-by-pattern basis.
Timing offsets can be applied to both drivers and receivers on a pin-by-pin basis.
Vector Processing Unit (Vpu)
The Medalist i3070 vector processing unit (VPU) pattern sequencing architecture
provides the capability to apply and receive millions of patterns for digital in-circuit and
functional testing of scan design, ASICs, and microprocessors. The patterns of 1s and 0s
programmed for the test are automatically compressed to “keeps” and “toggles” in the
pin RAM to minimize the number of unique vectors.
Repetitive sequences are determined and used by the VPU to automatically reconstruct
the programmed 1s and 0s, applied and received by the digital test resources, when the
test is run. This technique results in efficient use of RAM space, so test length is not limited to pin RAM depth. Test patterns for both in-circuit and functional tests are applied
with no dead time and without RAM reload.
Parameter
Specification
Directory RAM size
131072
(128 k)
Sequence RAM size
1048576
(1M)
Pin RAM Size
8,192
(8 k)
Theoretical Maximum Pattern Depth
137,438,953,472
(128 G)
Typical Maximum Pattern Depth
200,000–300,000
46 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Flash RAM
The Medalist i3070 standard digital test resources provide the ability to validate and
program flash devices and other non-volatile memory devices without special hardware.
In addition, optimized programming tools exist to address specific issues associated with
programming non-volatile devices.
Test Problem
Medalist i3070 Test Solutions
Programming algorithm
Optimized loop structures
Serial number encoding
On-the-fly variable passing
Large data streams
VPU sequencing and automatic test segmentation
Ease of data entry
S-Record/Intel hex formats
Flash70
Programming throughput
Optimized algorithms
Simplified test development
New library modules
47 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Digital In-circuit and Functional Test
Edge Placement Accuracy
The Medalist i3070 digital architecture and resources are designed to provide accurate
drive and receive edge placement for high-speed in-circuit and functional testing. The
Medalist i3070’s edge placement accuracy is defined as the accuracy to which a driver
or receiver will drive or receive a device state, referenced to the clock driving the DUT
(either a tester provided or DUT clock) or internal tester clock. Edge placement accuracy
specified in this manner provides the user with the driver and receiver edge uncertainty
referenced in time. Therefore, when the system is programmed to drive a node at a point
in time, the drive will occur within the edge placement accuracy at that point.
The edge placement accuracy specifications apply across all systems and include the
following:
–– Driver and receiver skew
–– Timing system resolution
–– Driver-to-receiver offset error
–– Rising and falling driver and receiver edge asymmetry
–– Rising and falling edge offset to clock receiver circuitry
–– Temperature drift
–– Frequency drift
–– Systematic offset including channel, card, and module offset
Test systems with a centralized architecture may specify an edge placement accuracy
that does not include all of the above error terms or other errors associated with the
architecture. In fact, other tester architectures may only specify driver skew (also known
as mean driver skew) and exclude phase-to-phase variances.
Mean driver skew describes the variation in driver edge location with respect to a randomly chosen driver of the same phase. The Medalist i3070’s edge placement accuracy
specification includes skew and describes the variation in edges with respect to a point
in time. This provides a repeatable, accurate and portable test with minimal debug since
the edges occur where you expect them.
48 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
–– Slot-to-Slot Skew
–– Phase-to-Phase
–– System Error
–– Temperature
–– Frequency
–– Drive-to-Receive Skew
The diagram below graphically represents the Medalist i3070 edge placement accuracy
when a tester-provided clock drives and when the DUT clock drives the DUT.
The edge placement accuracy specifications for the Hybrid-144 Non-multiplexed pin
card drivers and receivers as well as the guided probe receiver are as follows:
Edge Placement Accuracy for UnMux Systems
Parameter
Specification *
EPA Internally Referenced
±15 ns typical, ±20 ns warranted
EPA Externally Referenced
±17 ns typical, ±24 ns warranted
* Drivers are programmed to 3.5 V into 100 Ω non high impedance state and measured at 1.5 V. Receivers are
programmed to 1.5 V, 325 kHz DUT ≤ 20 MHz. Input signals to tester must have a slew rate ≥ 225 V/μs.
Edge Placement Accuracy for Mux Systems
Parameter
Specification *
EPA Internally Referenced
±5 ns typical, ±10 ns warranted
EPA Externally Referenced
±7 ns typical, ±15 ns warranted
* Drivers are programmed for 0.2–3.5 V and a 225 V/μs slew rate into 100 Ω non high impedance state and measured
at 1.5 V. Receivers are programmed to 1.5 V, 325 kHz DUT ≤ 20 MHz. Input signals to tester must have a slew rate ≥
225 V/μs.
49 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Pattern Rate
The pattern rate is defined as the rate at which patterns can be driven and received during
digital testing. A pattern includes the drive of input data and receipt of response data from the
DUT.
Pattern Rate for UnMux Systems
Parameter
Specification
Minimum Pattern Rate
330/sec
Maximum Pattern Rate
6.25 M/sec
Medalist i3070 drivers have fixed rise and fall times of approximately 15 ns.
Pattern Rate for Mux Systems
Parameter
Specification
Minimum Pattern Rate
330/sec
Maximum Pattern Rate
6.25 M/sec, 12.5 M/sec, or 20 M/sec
(determined by HybridPlus-DD card option)
Drivers are programmed for 0.2–3.5 V and a 225 V/μs slew rate into 100 Ω non high impedance
state and measured at 1.5 V. Receivers are programmed to 1.5 V, 325 kHz DUT ≤ clock [ 20
MHz. Input signals to tester must have a slew rate [ 225 V/μs.
Guided Probe
The Medalist i3070 guided probe provides automatic probing of analog and digital nodes for
functional test fault isolation and fixture verification. The probe can be used to capture the
actual digital test stimulus and responses for both bit-by-bit or CRC response comparisons.
Parameter
Programmable Receiver
Voltage Range
Specification
Low Threshold
−3.5 to 5.0 V
High Threshold
−3.5 to 5.0 V
Programming Resolution
5.25 mV
Accuracy
±150 mV
Maximum Input Voltage
±12 V
Bandwidth (using ground clip)
50 MHz
Input Resistance
20 kΩ
Input Capacitance
10 pF
50 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Additional Digital Specifications
The ControlXTP card together with the pin card1 provide resources for digital in-circuit
and functional testing. One ControlXTP card is included with each module. The other
module cards can be configured into the modules to meet test requirements. See Pin
Cards and Test Access.
1. Hybrid-144 Non-multiplexed pin card on UnMux systems; HybridPlus-DD card on Mux systems.
ControlXTP card
High-speed Clocks and Clock Receivers
A non-overdriving, high-speed clock resource is provided by each ControlXTP card.
TTL Compatible Input and Output
Parameter
Specification
Number of Clock Drivers/Control Card
1
1
Clock Driver Multiplex Ratio
2:1
2:1
Clock Driver Frequency Range
Minimum
625 kHz
Maximum
50 MHz 1
Resolution 2
± 1% of frequency
Number of Clock Receivers/Control Card
2
2
Clock Receiver Frequency
Minimum
160 kHz
Maximum
80 MHz 1
1. Maximum clock driver and receiver rates are 20 MHz.
2. Add ± 1 ns for periods over 100 ns.
Event Triggers
Hardware triggers provide asynchronous capability with the ability to wait for external
events before continuing a test sequence. The digital subsystem can provide triggers to
the internal and external analog sources and detectors. The built-in or external sources
and detectors can trigger the digital subsystem to drive or receive patterns.
Parameter
Specification
Number of Triggers/ Control Card
3
Trigger Multiplex Ratio
2:1
Start-up Delay
550 ns (11 events)
Capture RAM
A serial capture RAM provides the ability to capture a serial pattern from any digital test
pin. The response can be read back and processed for ROM, A/D, BIST, and telecommunications testing. Parallel capture and read-back is provided by the pin card receivers.
Parameter
Specification
Serial Capture RAM depth
1,048,576 (1 Mb)
51 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Debug Ports
Three debug ports are accessed through external BNC connectors on the side of the
testhead. Digital data and control signals are buffered and routed to trigger external
instrumentation and aid test debug.
Output Voltage: TTL levels
Parameter
Specification*
Clock Port
Sequencer or event clock
Data Port
Buffered data from a receiver
Synchronization Port
Sync pulses added in digital test debug
* Systematic delay is typically 100–200 ns.
General-Purpose Relays
The general-purpose relays on the ControlXTP cards can be used for controlling fixture
electronics, disabling oscillators, and other general test purposes.
Parameter
Specification
Number of General-Purpose Relays/Control Card
8
Maximum Voltage to Earth
±100 V peak
Maximum Switching Voltage
100 V peak
Maximum Switching Power
30 W
Maximum Switching Current
750 mA
Maximum Carry Current
750 mA
General-Purpose Relay Resistance
60 mΩ
Switching Time (typical)
50 ms
52 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Mixed Signal Test
Synchronization
Mixed-signal device tests require digital and analog stimulus and response capabilities
with synchronization of the digital and analog subsystems. The Medalist i3070’s integrated digital and analog subsystems, controlled by the same micro-controller on the
same backplane, provide synchronized mixed-signal test capability. VCL and ATL contain
programming constructs to transfer test control between subsystems. Control can be
passed multiple times during the same test for repeatable tests. Control can also be
passed to BT-BASIC from ATL or VCL to provide GPIB instrument programming or perform complex result manipulations and decision-making.
Keysight VCL
Keysight ATL and/or STL
Triggering
The digital subsystem can provide triggers to the internal and external analog sources
and detectors. The analog internal or external sources and detectors can trigger the digital subsystem to drive or receive patterns. Mixed-signal testing of digital-to-analog and
analog-to-digital devices is done by triggering the appropriate subsystem to provide the
required stimulus or response detection. The digital and analog subsystem control and
trigger commands are compiled into one executable test, which is stored and executed
in the test station for optimum execution speed and repeatability. External instruments
may be connected through functional test ports to provide triggers, stimulus, or receive
responses. All external trigger inputs and outputs are TTL compatible.
53 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Pin Cards and Test Access
Pin Cards for Medalist i3070 UnMux Systems
Medalist i3070 UnMux systems are based on the extremely versatile Hybrid-144
Non-multiplexed Pin Card, which is suitable for most applications. The tester pattern
rate, or speed, is 6.25 Mega-patterns per second.
1-Module
2-Module
4-Module
Pins
1,296
2,592
5,184
Drive Channels
1,296
2,592
5,184
Receive Channels
1,296
2,592
5,184
Maximum Number of Cards*
9
18
36
Maximum Number of Resources
* Maximum number of cards per module = 9.
Hybrid-144 Non-multiplexed Pin Card
On the UnMux system, analog and digital in-circuit and functional test capability is
delivered through the Hybrid-144 Non-multiplexed Pin Card. Each of 144 pins can be a
ground, a driver/receiver or an analog bus. The driver and receiver of a channel are always connected to the same pin for bi-directional test capability. Since all the driver-receivers are non-multiplexed, the capability to test high-pin-count devices and functional
clusters without complex relay multiplexing is possible.
Parameter
Specification
Number of Pins/Card
144
Number of Channels/Card
144
Number of Drive Channels/Card
144
Number of Receive Channels/Card
144
Number of Grounds/Card
156
Multiplexing Ratio
1:1
Overdrive Capability
Yes
VTEP/TestJet Technology Capability
Yes
The Hybrid-144 drivers provide digital waveforms to all module pins present. Each
driver-receiver channel has independently programmable voltage drive level, receive
level, clock generation, event triggering, and switchable pull-up, pull-down or AC load
capability. The flexibility of the individual pins provides simultaneous testing of multiple logic families with the same card. The pin flexibility also provides optimum testing
of complex devices and bus-architecture based boards, and makes digital guardband
testing possible.
Below is a block diagram of the Hybrid-144 card and control buses to the digital and
analog subsystems on the ControlXTP and ASRU cards.
54 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
The analog measurement buses can be routed to any Hybrid-144 pin to perform analog
in-circuit and functional testing. Access to the built-in functional test instruments and
the functional test access ports is also provided on all pins. The Hybrid-144 pin card
flexibility allows pins on the same card to perform digital and analog testing in the same
test for outstanding mixed-signal test capability.
Hybrid-144 Non-multiplexed Pin Card Receivers
Parameter
Specification
Programmable Receive
Minimum
0 ns
Delay Time
Maximum
Programmed vector cycle time
Resolution
2 ns (typical)
Accuracy (same card)
±8 ns typical, ±11 ns warranted
Input Voltage Range
0–4.875 V
Input Bias Current
+150 μA maximum 1
Parallel Capture RAM
128 bits
Response Compression
IEEE CRC-32 polynomial 2
Receiver Threshold Voltage
Termination
Range
0–4.875 V
Programming Resolution
20 mV (typical)
Static Accuracy
± 2% of setting ± 100 mV (typical)
Pull-Up Resistor
1000 Ω
Pull-Down Resistor
383 Ω
AC
150 pF, 68.1 Ω in series
1. Varies with voltage.
2. Polynomial is 1 + x2 + x4 + x5 + x7 + x8 + x10 + x11 + x12 + x16 + x22 + x23 + x26 + x32
55 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Hybrid-144 Non-multiplexed Pin Card Drivers
Parameter
Specification
Frequency Range as a Clock
Minimum
625 kHz
Maximum
10 MHz
Programming Resolution1
≤ 1% of frequency
Minimum
160 ns
Maximum
1.5 ms
Resolution1
1% of vector cycle
Programming Resolution
1 ns
Programmable Vector Cycle Time
Output Skew (same card)
±5 ns typical, ±8 ns warranted
Rise Time/Fall Time (no load)
15 ns (typical)
Driver Voltage (no load)
Output Backdrive Current
Range
0–5.0 V
Programming Resolution
20 mV
Static Accuracy
± 2% of setting ± 20 mV
Peak
2
±750 mA
Continuous
±100 mA
DC Output Resistance
1.0 Ω (typical)
Minimum Pulse Width Generation (TTL)
50 ns
High-Impedance State Leakage Current 3
−150 μA
Programmable Device Test Time-out
Minimum
5.0 μs
Maximum
429 s
1. Add ±1 ns for periods over 100 ns.
2. Maximum width 2 ms, maximum duty cycle 10%.
3. Varies with voltage.
Hybrid-144 Non-multiplexed Pin Card Drive/Receive Pins
Parameter
Specification
Capacitance: Tri-State
130 pF
Capacitance: Disconnected
24 pF
Hybrid-144 Non-multiplexed Pin Card Relays
Parameter
Specification
Maximum Voltage to Earth
±100 V peak
Maximum Current
750 mA
Maximum Switching Power
7.5 VA
56 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Pin Cards for Medalist i3070 Mux Systems
Medalist i3070 Mux systems can be configured with a variety of pin electronics for
various applications. The tester pattern rate, or speed, is determined by the module
card options 6, 12, or 20 for 6.25, 12.5, or 20 Mega-patterns per second, respectively.
All modules cards must be the same speed option.
Combinations of the HybridPlus-DD (Double-Density), AnalogPlus-DD, and AccessPlus
cards can be added to a module up to a maximum of nine cards per module. A minimum
of one HybridPlus-DD card per module is required for Medalist 3x73 and 3x75 systems.
Maximum Number of Resources
Medalist 327x
(1-Module)
Medalist 317x
(2-Module)
Medalist 307x
(4-Module)
Pins
1,296
2,592
5,184
Drive Channels
144
288
576
Receive Channels
144
288
576
Pins*
1152
2304
4608
Channels*
128
256
512
GP Relays
192
384
768
GP Ports
80
160
320
GP Interface Pairs
224
448
896
High-Frequency Ports
64
128
256
Card Type
HybridPlus-DD
AnalogPlus-DD
Maximum Number of Cards
Card Type
Medalist 327x
(1-Module)
Medalist 317x
(2-Module)
Medalist 307x
(4-Module)
Per Module
HybridPlus-DD
9
18
36
up to 9
AnalogPlus-DD
8
16
32
up to 8*
AccessPlus
8
16
32
up to 8
Utility Card
1
2
4
1
* Medalist 3x72 systems can contain up to nine AnalogPlus cards per module.
HybridPlus-DD Card
Analog and digital in-circuit and functional test capability is delivered through the
HybridPlus-DD pin cards. The split driver-receiver allows a single channel to drive and
receive on separate pins. Therefore, while a driver of a driver-receiver pair is active,
the receiver can be used to capture responses from one of the remaining eight pins.
The driver and receiver of a channel are automatically connected to the same pin for
bi-directional test capability.
Since the driver-receivers are split, the capacitive loading on the receiver is minimized for
high-speed signal capture. This independent operation provides the most efficient use of
pin electronics and the capability to test high-pin-count devices and functional clusters.
57 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Parameter
Specification
Number of Pins/Card
144
Number of Channels/Card
(Split Driver-Receiver)
32
Number of Drive Channels/Card
16
Number of Receive Channels/Card
16
Multiplexing Ratio
2:9
Overdrive Capability
Yes
TestJet Technology Capability
Yes
Keysight Pin Electronics
The HybridPlus-DD drivers (four quadrant) provide digital programmable waveforms to
all module pins present. Each driver-receiver channel has independently programmable
slew rate, voltage level, edge placement, shorts threshold, clock generation, event triggering, and switchable pull-up or pull-down load capability. The flexibility of the individual pins provides simultaneous testing of 16 logic families with the same card. The pin
flexibility also provides optimum testing of complex devices and bus-architecture based
boards, and makes digital guardband testing possible.
Below is a block diagram of the HybridPlus-DD card and control buses to the digital and
analog subsystems on the ControlXTP and ASRU cards.
58 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
The analog measurement buses can be routed to any HybridPlus-DD pin to perform
analog in-circuit and functional testing. Access to the built-in functional test instruments
and the functional test access ports is provided on all pins. The HybridPlus-DD pin flexibility allows pins on the same card to perform digital and analog testing in the same test
for optimum mixed-signal test capability.
HybridPlus-DD Relays
Parameter
Specification
Maximum Voltage to Earth
±100 V peak
Maximum Current (constant)
500 mA
Maximum Current (pulsing)
700 mA
Maximum Switching Power
7.5 VA
HybridPlus-DD Receivers
Parameter
Programmable Receive
Delay Time
Specification
Minimum
0 ns
Maximum
3.0 ms
Resolution
4 ns + 1% of vector cycle
Programming Resolution
1 ns
Maximum Input Voltage
12.0 V and −12.0 V
Parallel Capture RAM
128 bits
Pull-Up Curent Source
2.0 mA (typical)
Pull-Down Curent Source
5.0 mA (typical)
Receiver Threshold
Voltage Range
Low Threshold
−3.5 to 5.0 V
High Threshold
−3.5 to 5.0 V
Programming Resolution
2.2 mV (typical)
Accuracy
±100 mV
Input Bias Current
±30 μA
Input Capacitance
83 pF
Disconnected Capacitance
12 to 23 pF (typical)
Bi-directional Capacitance
160 pF (typical)
59 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
HybridPlus-DD Drivers
Parameter
Specification
Frequency Range as a Clock
Minimum
625 kHz
Maximum
6.25, 12.5, or 20 MHz
Programming Resolution2
≤ 1% of frequency
Programmable Vector
Minimum
160, 80, or 50 ns
Cycle Time
Maximum
1.5 ms
Resolution2
1% of vector cycle
Programming Resolution
1 ns
−3.5 to + 5.0 V source
750 mA
−3.5 to + 5.0 V sink
−500 mA
Maximum Continuous Source Current
100 mA
Maximum Continuous Sink Current
100 mA
Minimum
25 V/μs
Maximum
275 V/μs
Programming Resolution
25 V/μs
Range
−3.5 to 5.0 V
1
Peak Backdrive Current
Continuous Output Current
Slew Rate (into 100 Ω) Rising
and Falling
Driver Voltage
1
3
Programming Resolution
2.206 mV
Static Accuracy (no load)
±100 mV
Minimum Pulse Width Generation (TTL)
50 ns
High-Impedance State
Leakage Current
IL at VO = +3 V
25 to 150 μA
IL at VO = −2 V
−150 to 0 μA
VO at IL = 0 A
−0.7 to 0.7 V
Minimum
5.0 μs
Maximum
429 s
Programmable Device Test
Time-out
Programming Resolution
100 ns
DC Output Resistance (at 500 mA)
1.15 to 2.0 Ω
Driver High-Impedance State Capacitance
125 pF (typical)
Disconnected Capacitance
12 to 23 pF (typical)
Bi-directional Capacitance
160 pF (typical)
1. Frequency and cycle time depend on HybridPlus-DD Card options 6, 12, or 20.
2. Add ±1 ns for periods over 100 ns.
3. Driver overvoltage trip points: 7.0 V and −5.5V.
AnalogPlus-DD Card
The AnalogPlus-DD card provides analog in-circuit and functional test and TestJet technology capability. Any pin can be connected to the internal or external test instrumentation to perform shorts and analog testing.
Parameter
Specification
Number of Pins/Card
144
TestJet Technology Capability
Yes
AnalogPlus-DD Relays
Parameter
Specification
Maximum Voltage to Earth
±100 V peak
Maximum Current (constant)
500 mA
Maximum Switching Power
7.5 VA
60 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
AccessPlus Card
The AccessPlus pin card provides high-performance measurement capability for many
analog and mixed-signal functional test applications. The interface and cabling can interconnect instruments through the system to the fixture for both differential and coaxial
measurements.
The following resources are provided with each card:
–– Eight 50 Ω high-frequency coaxial ports, each with a floating shield and ability to
remain connected between individual tests if required.
–– 10 general-purpose instrument ports multiplexed to 28 module interface pairs with
the ability to remain connected between individual tests if required. Software is
configurable for differential or coaxial operation.
–– 24 general-purpose relays for node-to-node connections, pull-ups, pull-downs,
fixture electronics, or specialized loads.
–– Instrument isolation for all ports, ensuring in-circuit test compatibility.
High-Frequency Ports
Parameter
General-Purpose Instrument Ports
Coax Mode
Differential Mode
Number of Ports
8
Bandwidth: 3 dB point
6 dB point
100 MHz
176 MHz
25 MHz
50 MHz
45 MHz
100 MHz
Crosstalk: < 1 MHz
−80 dB
−45 dB
−65 dB
Maximum Signal Voltage to Earth
100 V peak
100 V peak
200 V peak
Maximum Carrying/Switching Current
0.5 A
0.5 A
0.5 A
Maximum Power
7.5 VA
7.5 VA
40 VA 3
Maximum Standoff Voltage to Earth
200 V peak
200 V peak
200 V peak
Maximum Power
10 multiplexed to 28 pairs
82 dB
General-Purpose Relays
24
100 V peak
0 VA
200 V peak
61 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Performance Port
Performance Port allows the system to access functional test capabilities by modifying
both the test fixtures and the testhead. With these modifications, external instruments
can be attached to the test fixture. This technique can propagate much higher frequencies (2 GHz 6 db bandwidth, 50 or 75 Ω), higher voltages (200 V AC peak), and higher
current (20 A).
In addition, Performance Port can be used to route ScanWorks boundary scan signals
from the ScanWorks PCI-400 controller card (located in the testhead controller) to the
fixture and device under test.
62 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Utility Card
The Utility Card is an optional pin card that can easily integrate external plug-in modules
such as flash and EEPROM programming or any other functional testing purposes.
This card also includes flexible power supplies output for panelized boards, and provides
a cheaper alternative for control with additional eight pairs of GP relays and balanced
ports for differential signal connections.
The plug-in module to be developed by third party vendors must conform to the following specifications.
Parameter
Specification
Physical Dimensions
75 x 152.55 mm (2.953” x 6.006”)
(Nominal thickness of PCB = 0.062”)
Component Placement
Both sides allowed; not exceeding 3 mm on the top side and 10 mm on
the bottom side
Physical Interface
Samtec 30 position 1.27 mm Tiger Eye Header board-to-board connector with a stacking height of 6.35 mm (02 x 30 position connector used).
Inputs
1 USB port (via the 30 pin connector)
1 Ethernet port
Outputs
18 pins with disconnect relays to MINT pins (with 4 pins capable of up to
2 A each)
Power supply
5 V @ 500 mA (maximum), or 12 V @ 2 A (maximum), or externally
routed (maximum of 12 V @ 2 A)
Communication
Via USB 2.0 to the host PC/workstation or Ethernet communication via a
class 2 switch controller
Balanced Multiplexing Port
The Utility Card provides a balanced mux port which can be used to control external
differential signals equipment.
Specification
Balanced Mux
2 x 1:4 mux
3 db bandwidth (at 35 Mhz ± 3 Mhz)
Crosstalk < 1 MHz (–55 dB ± 2 dB)
2 ± 0.5 A (maximum current carrying capability)
Estimated impedance of balanced mux = 75 Ω per pair
63 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
System Specifications
Device under Test (DUT) Power Supplies
The following power supplies can be configured into the Medalist i3070 system to
provide DUT power:
–– 6621A dual output high current
–– 6624A quad output
–– 6634A high voltage
–– 6642A single output
The supplies may have high-and low-voltage outputs and high and low ranges for voltage and current flexibility. The software automatically selects and assigns the supply
outputs to the appropriate tester pins. Power supply connections with remote sensing at
the DUT are provided automatically by the test program. Supplies can be connected in
series and in parallel for high-voltage or high-current applications. Restrictions are:
–– Only supply outputs of the same model type (and high-or low-voltage) can be
paralleled.
–– Up to eight outputs can be paralleled if their overvoltage lines are connected.
–– Connections to the fixture are through the ASRU card with two power pins and two
ground pins per supply. These power and ground pins can carry a maximum of 5 A
per pair of pins.
Power Supplies Maximum Combinations
Physical limitations due to rack sizes and power supplies form factors must be considered when selecting power supplies combinations. Any modifications made to the system
to allow for more physical space to add power supplies are not supported. Power supplies configuration for a system assumes the maximum possible numbers of ASRU cards
are in place.
One-Module Systems
The Medalist i3070 one-module system without a support bay will support the following
maximum combinations of power supplies.
DUT Supply Source
Maximum Number of Supported Supplies
Combination A
Combination B
Combination C
Combination D
6621A
1*
1*
0
0
6624A
0
0
1*
1*
6634B
2
0
2
0
6642A
0
1
0
1
T otal E IA Rack Units Used
3, 2, 2
3, 2, 0
3, 2, 2
3, 2, 0
Total Supplies
3
2
3
2
* Connected to ASRU ports 1 to 4.
Available EIA rack units = 3, 2, and 2.
UnMux Systems: The one-module system has discrete rack units. The 3EIA rack is discrete due to the metal shield that is between the DUT power supply and the module and
it is mounted right next to the module. One of the 2EIA units is above the 3EIA. The last
2EIA is on the no-pod side of the testhead.
64 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Two- and Four-Module Systems
The Medalist i3070 two- and four-module systems support too many combinations of
power supplies to list here. The following tables list the limitations that must be considered when combining power supplies.
DUT Power Supplies Limitations
DUT Supply
Supply Outputs
ASRU Ports Required
Usable ASRU Ports
EIA Rack Units
6621A
2
4
1-6
3
6624A
4
4
1-6
3
6634A*
1
1
5 or 6
2
6642A*
1
2
5&6
2
* Can only be connected to Keysight special purpose ports.
Single power supplies can cross module boundaries and connect to more than one ASRU card.
System Limitations
Maximum Number
of ASRU cards
General Purpose
Ports1
Special Purpose
Ports2
Maximum EIA
Rack Units
One-Module
1
4
2
3, 2, 2
Two-Module
2
8
4
10
Four-Module
4
16
8
25
1. ASRU ports 1 to 4.
2. ASRU ports 5 and 6 (only available on ASRU C card).
6621A Dual Output Supply
The 6621A provides two outputs per supply. Each output may use any two of the ports
on the ASRU card.
Parameter
Low Range
High Range
Specification
Voltage
Current*
0–6.0 V
0–10.0 A
6.0–7.0 V
10 A (de-rated linearly to 5.0 A)
0–20.2 V
0–4.12 A
* Minimum current limit is 130 mA.
6634A Single Output Supply
The ASRU Revision C Card is required to use the 6634A supply. The output must use port
5 or 6 on the ASRU card.
Parameter
High Voltage Output
* Minimum current limit is 4.0 mA.
Specification
Voltage
Current*
0–100 V
0–1.0 A
65 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
6624A Quad Output Supply
The 6624A power supply provides four outputs, which can use any of the ASRU channels.
Parameter
Specification
Low Voltage Outputs
(1 and 2)
2 per supply
High Voltage Outputs
(3 and 4)
Voltage
Current
High Range
0–20.0 V
0–2.0 A
Low Range
0–6.0 V
0–5.0 A
6.0–7.0 V
5.0 A de-rated linearly to 2.5 A
Resolution
6.0 mV
25 mA
Accuracy
±(0.4% + 100 mV)
2 per supply
Voltage
Current
High Range
0–50.5 V
0–0.824 A
Low Range
0–20.2 V
0–2.06 A
Resolution
5.0 mV
Accuracy
±(0.4% + 100 mV)
Maximum Power/Output
40 W
Maximum Supply Power
160 W
Series Connected Supplies
Maximum Voltage
Differential or
Voltage to Earth
±42 V peak, ±100 V peak using safety shroud and lock
Parallel Connected Supplies*
Maximum Current
40 A
* Parallel supplies must be of the same type (high- or low-output).
6642A Single Output Supply
The 6642A provides one output per supply. The supply uses both ports 5 and 6 of the
ASRU card.
Parameter
Specification
Voltage
0–20.0 V
Current*
0–10.0 A
* Current will be de-rated linearly due to voltage drop associated path through testhead.
66 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Input Voltage and Current
Three-phase power options for Keysight systems require only one power connection. For information on power line conditioning,
input frequency, and voltage constraints, refer to the Medalist i3070 Site Preparation guide.
Medalist i3070 Power Option Matrix
Full-Load Amps (FLA) for:
Power Option
Voltage line-to-neut
4-Module System
2-Module System
1-Module System
3PD
200
220
230
240
24
24
24
24
18
18
18
18
13
13
13
13
Three-Phase Delta*
3PY
208
220
24
24
18
18
13
13
Three-Phase Wye*
3PN
220/380
230/400
240/415
16
16
16
10
10
10
9
9
9
Three-Phase Wye with Neutral
* Neutral is not used by the systems for power options 3PD and 3PY.
Neutral is shown in the diagrams because it is cabled into the PDU.
67 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Dimensions and Weights
Height
Width
Depth
Weight
Maximum Point Floor Loading
907 mm
(33.5 in)
1765 mm
(69.5 in)
794 mm
(31.3 in)
429 kg
(945 lb)
275 kg on a leg
(600 lb)
1600 mm
(63 in)
2095 mm
(82.5 in)
1080 mm
(42.5 in)
525 kg
(1160 lb)
1320 mm
(52 in)
600 mm
(24 in)
940 mm
(37 in)
209 kg
460 lb
1600 mm
(63 in)
1120 mm
(44 in)
860 mm
(34 in)
277 kg
(610 lb)
907 mm
(33.5 in)
1765 mm
(69.5 in)
794 mm
(31.3 in)
429 kg
(945 lb)
1600 mm
(63 in)
2095 mm
(82.5 in)
1080 mm
(42.5 in)
525 kg
(1160 lb)
907 mm
(33.5 in)
1529 mm
(60 in)
795 mm
(31 in)
394 kg
(868 lb)
1600 mm
(63 in)
2095 mm
(82.5 in)
1080 mm
(42.5 in)
593 kg
(1307 lb)
907 mm
(33.5 in)
1238 mm
(48.5 in)
794 mm
(31.3 in)
340 kg
(750 lb)
1600 mm
(63 in)
2095 mm
(82.5 in)
1080 mm
(42.5 in)
477 kg
(1050 lb)
Medalist i3070 Four-Module System
Testhead
Packaged for shipment
Support Bay
Packaged for shipment
185 kg on a leg
(400 lb)
Medalist i3070 Two-Module System
Testhead
Packaged for shipment
Medalist i3070 Two-Module System (Small Footprint)
Testhead
Packaged for shipment
Medalist i3070 One-Module
Testhead
Packaged for shipment
Vacuum and Compressed Air
The vacuum solenoid is built-in on Medalist i3070 systems.
Parameter
Specification
Number of Vacuum Ports/Module
2 ports for 1- and 2- module systems
4 ports for 4-module systems
Vacuum Connector Diameter
2.54 cm (1 in) male
Compressed Air Connector
Parker 20 or 30 series 0.25 inch coupler
Vacuum Value Control Voltage
24 VDC at 1 A maximum
Minimum Free Air Displacement (Vacuum)
68 m3/hr (40 SCFM)
Minimum Compressed Air Pressure
4.9 kg/cm2 (70 psi) non-lubricated
Maximum Compressed Air Pressure
10.6 kg/cm2 (150 psi) non-lubricated
275 kg on a leg
(600 lb)
68 | Keysight | Medalist i3070 Series 5 In-Circuit Test System
Environmental Requirements
Testhead over-temperature shutdown is typically at 55°C. Auto-adjust will occur automatically for ±5°C changes in temperature.
Operating Temperature
Operating Humidity
Storage Temperature
Testhead
0°C to 40°C (32°F to 104°F)
5 to 80 % non-condensing
−40°C to 70°C (−40°F to 158°F)
Support Bay
0°C to 40°C (32°F to 104°F)
5 to 80 % non-condensing
−40°C to 70°C (−40°F to 158°F)
Controller
5°C to 45°C (41°F to 113°F)
20 to 80 % non-condensing
−40°C to 65°C (−40°F to 149°F)
Fixture Specifications
Long Wire Fixture
Maximum
PC Board Size
Maximum
Probeable Area
Approximate Storage Dimensions L
xW x H
Kit Weight
Standard
450 x 396 mm
17.7 x 15.6 in
389 x 364 mm
15.3 x 14.3 in
457 x 401 x 147 mm
18.0 x 18.5 x 5.8 in
10.5 kg
23.1 lb
Large
450 x 757 mm
17.7 x 29.8 in
389 x 726 mm
15.3 x 28.6 in
457 x 775 x 147 mm
18.0 x 30.5 x 5.8 in
19 kg
41.8 lb
Fixture Kit
Short Wire Fixture
Maximum
PC Board Size
Maximum
Probeable Area
Approximate
Storage Dimensions L xW x H
Kit Weight
Standard
450 x 396 mm
17.7 x 15.6 in
414 x 374 mm
16.3 x 14.7 in
457 x 452 x 83 mm
18.0 x 17.8 x 3.25 in
10.7 kg
23.5 lb
Large
450 x 757 mm
17.7 x 29.8 in
414 x 735 mm
16.3 x 28.9 in
457 x 813 x 83 mm
18.0 x 32.0 x 3.25 in
18.6 kg
41.0 lb
Fixture Kit
This information is subject to change without notice.
© Keysight Technologies, 2010 – 2014
Published in USA, July 31, 2014
5990-5043EN
www.keysight.com