Uploaded by tan.cb

Surfactant solution for Die

advertisement
SOLUTION FOR DICING SAW PROCESS
Page 2
1
COMPARE DICING PROCESS
I - CONTENTS
2
LAYOUT NEW PROCESS
…
1. Compare Dicing process.
New process
Old process
Method cleaning method with D.I water.
- Silicon dust was not cleaned during cutting.
- Drying does not clean the surface and dirty, leading to nonstick Bump ( Bump Open ).
Bump Open
Effective cleaning surface when using aeration method of
CO2 and Tose solution :
- Silicon dust was cleaned during cutting
- Improve the surface condition of Die / Chip and Pad.
CLEAN = Dissolving + Removing
2. Layout new process
• Below is layout connection :
The customer can install 1 or Both equitment for Dicing saw process.
D.I
Water
resistor
CO2
Injector
machine
•
Sub tank
and Pump
Mix water
and Bi-O
Clean
Resistance of Water in range : 0.2 ~ 0.8M
Dicing
Saw
Contact us
Website
www.ariatec.vn
Phone number
+84 (028) 73 085 568
Address: 110 Cao Thang, District 3, HCMC, Vietnam
Download
Random flashcards
State Flags

50 Cards Education

Countries of Europe

44 Cards Education

Art History

20 Cards StudyJedi

Sign language alphabet

26 Cards StudyJedi

Create flashcards