SOLUTION FOR DICING SAW PROCESS
Page 2
1
COMPARE DICING PROCESS
I - CONTENTS
2
LAYOUT NEW PROCESS
…
1. Compare Dicing process.
New process
Old process
Method cleaning method with D.I water.
- Silicon dust was not cleaned during cutting.
- Drying does not clean the surface and dirty, leading to nonstick Bump ( Bump Open ).
Bump Open
Effective cleaning surface when using aeration method of
CO2 and Tose solution :
- Silicon dust was cleaned during cutting
- Improve the surface condition of Die / Chip and Pad.
CLEAN = Dissolving + Removing
2. Layout new process
• Below is layout connection :
The customer can install 1 or Both equitment for Dicing saw process.
D.I
Water
resistor
CO2
Injector
machine
•
Sub tank
and Pump
Mix water
and Bi-O
Clean
Resistance of Water in range : 0.2 ~ 0.8M
Dicing
Saw
Contact us
Website
www.ariatec.vn
Phone number
+84 (028) 73 085 568
Address: 110 Cao Thang, District 3, HCMC, Vietnam