DISCO Corporation

DISCO Corporation
DISCO Mission
Bringing faraway science to comfortable living
through advanced Kiru, Kezuru, Migaku technologies
Universal Technologies
Kiru
Kezuru
Migaku
Cutting Grinding Polishing
One strand of hair cut into 35 sections
www.dicing-grinding.com
DISCO CORPORATION All rights reserved
Mother company DISCO Corporation : Headquarters and main factory in Japan
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DISCO Headquarters in Tokyo with
>800 R&D and application engineers
Kuwabata Building A+B
Size 200 x 100 m², 8 stories
120.000 m² assembly floor;
1.500 employees; >400 machines per month
www.dicing-grinding.com
DISCO CORPORATION All rights reserved
Company – Who we are, context, history
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DISCO Hi-Tec Europe GmbH in Munich, Germany
Established 1998 - 85 employees - New cleanroom opened 2014
New cleanroom
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DISCO CORPORATION All rights reserved
Strength - New Cleanroom for production services
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Highly experienced KKM-engineers carry out tests to find the best
solution and process combination for production runs, wafer
handling and prototype development.
Floor Size: 400 m²
Total Machines: >35
www.dicing-grinding.com
DISCO CORPORATION All rights reserved
DISCO Europe Applications Overview 1/2
Standard dicing, grinding and polishing from 2“ – 12“
Special solutions
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Dicing Before Grinding (DBG) for 20 µm thin dies
Plasma etching for high die strength
TAIKO grinding for power devices of down to 40 µm
and solutions for 3D-TSV
Surface planarization for bumps and
tapes (3D, W2W-bonding, TTV down)
Stealth dicing for Silicon, SiC, Glass
with expansion on flat frames or grip rings
Ultrasonic dicing and grinding of SiC
and brittle materials
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DISCO CORPORATION All rights reserved
DISCO Europe Applications Overview 2/2
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Edge Trimming and circle cut dicing
Mold grinding
Sapphire wafer supply
Solutions to avoid particles adhering to wafer front sides during
grinding and laser dicing
Tape development with new tape partner DENKA from Japan
Recent achievements:
New laser based solutions in the medical device market
(e. g. implants, blood analysis)
New solutions and production for thin smart card devices
New production for 50 µm thin glass dies
www.dicing-grinding.com
DISCO CORPORATION All rights reserved
Fully Automatic Optical Inspection
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Camtek optical inspection tool to examine wafers of various
thicknesses and material, including glass and MEMS.
This fully automated system scans and analyzes wafers for bump
height deviations, structural irregularities and other surface defects.
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DISCO CORPORATION All rights reserved
Quantity of processed wafers
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DISCO CORPORATION All rights reserved
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Let‘s bring more cool, very thin, very small and very powerful
applications and products from Europe to the global market!
Thank you for your attention!
Gerald Klug
DISCO Hi-Tec Europe GmbH
18.06.2015
www.dicing-grinding.com
DISCO CORPORATION All rights reserved