2016-01-29
OSLON Black Series (940 nm) - 90°
Version 1.5
SFH 4725S
Features:
•
IR lightsource with high efficiency
•
Double Stack emitter
•
Low thermal resistance (Max. 11 K/W)
•
Centroid wavelength 940 nm
•
Superior Corrosion Robustness (see chapter package outlines)
•
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•
Infrared Illumination for cameras
•
Machine vision systems
•
Surveillance systems
•
Eye tracking systems
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Ordering Information
Type:
Radiant Intensity
Ordering Code
Ie [mW/sr]
IF = 1 A, tp=10 ms
SFH 4725S
Note:
425 (≥ 320)
Q65111A2800
measured at a solid angle of Ω = 0.01 sr
2016-01-29
1
Version 1.5
SFH 4725S
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Values
Operation and storage temperature range
Top; Tstg
-40 ... 125
°C
Junction temperature
Tj
145
°C
Reverse voltage
VR
1
V
Forward current
IF
1000
Surge current
(tp = 500 µs, D = 0)
IFSM
5
A
Power consumption
Ptot
3.4
W
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2
kV
Thermal resistance junction - solder point
RthJS
11
K/W
Note:
Unit
mA
For the forward current and power consumption please see "maximum permissible forward current"
diagram
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
Peak wavelength
(IF = 1 A, tp = 10 ms)
(typ)
λpeak
950
nm
Centroid wavelength
(IF = 1 A, tp = 10 ms)
(typ)
λcentroid
940
nm
Spectral bandwidth at 50% of Imax
(IF = 1 A, tp = 10 ms)
(typ)
∆λ
37
nm
Half angle
(typ)
ϕ
± 45
°
Dimensions of active chip area
(typ)
LxW
1x1
mm x
mm
Rise and fall times of Ie ( 10% and 90% of Ie max)
(IF = 5 A, RL = 50 Ω)
(typ)
tr / tf
10/15
ns
Forward voltage
(IF = 1 A, tp = 100 µs)
(typ (max)) VF
2.75 (≤ 3.4)
V
Forward voltage
(IF = 5 A, tp = 100 µs)
(typ (max)) VF
3.4 (≤ 4.5)
V
Total radiant flux
(IF = 1 A, tp = 100 µs)
(typ)
2016-01-29
2
Φe
990
mW
Version 1.5
SFH 4725S
Parameter
Symbol
Values
Unit
Temperature coefficient of Ie or Φe
(IF = 1 A, tp = 10 ms)
(typ)
TCI
-0.3
%/K
Temperature coefficient of VF
(IF = 1 A, tp = 10 ms)
(typ)
TCV
-2
mV / K
Temperature coefficient of wavelength
(IF = 1 A, tp = 10 ms)
(typ)
TCλ
0.3
nm / K
Grouping (TA = 25 °C)
Group
Min Radiant Intensity
Max Radiant Intensity
IF = 1 A, tp=10 ms
IF = 1 A, tp=10 ms
Ie, min [mW / sr]
Ie, max [mW / sr]
SFH 4725S -CB
320
500
SFH 4725S -DA
400
630
SFH 4725S -DB
500
800
Note:
measured at a solid angle of Ω = 0.01 sr
Only one group in one packing unit (variation lower 1.6:1).
Relative Spectral Emission 1) page 12
Irel = f (λ), TA = 25 °C, IF =1A, tp = 10 ms
Relative Total Radiant Flux 1) page 12
Φe/Φe(1A) = f (IF), TA = 25 °C, Single pulse,
tp = 100 μs
OHF04133
100
OHF04187
101
I rel %
Φe
Φe (1 A)
80
100
5
60
10-1
40
5
10-2
20
5
0
800
850
900
950
10-3 -2
10
nm 1050
λ
2016-01-29
5 10-1
5 10 0
A
IF
3
10 1
Version 1.5
SFH 4725S
Forward Current 1) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current
IF = f (TS), RthJS = 11 K/W
OHF05030
1100
mA
IF
IF
OHF05545
101
A
900
800
100
700
600
500
400
10-1
300
200
100
0
0
20
40
60
80 100
10-2
˚C 140
Permissible Pulse Handling Capability
IF = f (tp), TS = 85 °C, Duty cycle D = parameter
IF
OHF05031
tP
tP
D= T
4.0
3.5
3.0
2.5
2.0
1.5
IF
T
4.5
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
1.0
0.5
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
2016-01-29
2.5
3
V
VF
TS
5.5
A
2
4
3.5
Version 1.5
SFH 4725S
Radiation Characteristics 1) page 12
Irel = f(ϕ), TA= 25°C
40˚
30˚
20˚
10˚
ϕ
0˚
OHL04470
1.0
50˚
0.8
60˚
0.6
70˚
0.4
80˚
0.2
0
90˚
100˚
1.0
0.8
0.6
0.4
0˚
Package Outline
Dimensions in mm [inch].
Package
OSLON Black Series
2016-01-29
5
20˚
40˚
60˚
80˚
100˚
120˚
Version 1.5
SFH 4725S
Approximate Weight:
32 mg
Package marking
Anode mark: Anode pad has chamfered edge, which points to cathode Approx. weight: 32 mg
Note:
IRED is protected by ESD device which is connected in parallel to chip.
Note:
Package is not suitalbe for ultra sonic cleaning.
Note:
Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh
/ 15ppm H2S / 336h
Note:
Anode mark: Anode pad has chamfered edge, which points to cathode
Recommended Solder Pad
Dimensions in mm [inch].
Note:
For superior solder joint connectivity results we recommend soldering under standard nitrogen
atmosphere.
2016-01-29
6
Version 1.5
SFH 4725S
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
50
0
100
150
200
250
s 300
t
OHA04612
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
)
Ramp-up rate to preheat*
25 °C to 150 °C
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Recommendation
Maximum
2
3
100
120
2
3
Unit
Einheit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
s
3
6
K/s
10
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2016-01-29
°C
7
s
Version 1.5
SFH 4725S
Taping
Dimensions in mm [inch].
Tape and Reel
12 mm tape with 600 pcs. on ∅ 180 mm reel
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
2016-01-29
8
Version 1.5
SFH 4725S
Tape dimensions [mm]
Tape dim ensions in m m
W
P0
12 + 0.3 / - 0.1 4 ± 0.1
P1
P2
D0
E
F
4 ± 0.1
or
8 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm]
Reel dim ensions in m m
A
W
Nmin
W1
W2max
180
12
60
12.4 + 2
18.4
Barcode-Product-Label (BPL)
OSRAM Opto
EX
A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
ML Temp ST
X XXX °C X
(9D) D/C: 1234
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
Dry Packing Process and Materials
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
AM
OSR
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
2016-01-29
9
Version 1.5
SFH 4725S
Transportation Packing and Materials
Barcode label
D/
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(X
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110 0
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
195 ± 5
195 ± 5
30 ± 5
2016-01-29
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10
OHA02044
Version 1.5
SFH 4725S
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-01-29
11
Version 1.5
SFH 4725S
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-01-29
12
Version 1.5
SFH 4725S
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2016-01-29
13