2016-02-29
Silicon NPN Phototransistor with Vλ Characteristics
Version 1.3
SFH 3716
Features:
•
Spectral range of sensitivity: (typ) 350 ... 950 nm
•
Special: Adapted to human eye sensitivity (Vλ)
•
Very small SMT package
•
SMT package 0805, colorless clear resin, 2 mm x 1.25 mm x 0.8 mm
Applications
•
For control and drive circuits
•
Ambient light detector
•
Exposure meter for daylight and artificial light
•
Sensor for backlight-dimming
Ordering Information
Type:
Photocurrent
Ordering Code
IPCE [µA]
VCE = 5 V, white LED 100 lx
SFH 3716
2016-02-29
35 ... 64
Q65111A9149
1
Version 1.3
SFH 3716
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Values
Unit
Operating and storage temperature range
Top; Tstg
-40 ... 100
°C
Collector-emitter voltage
VCE
5.5
V
Collector current
IC
20
mA
Emitter-collector voltage
VEC
0.5
V
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2000
V
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
570
nm
Wavelength of max. sensitivity
(typ)
λS max
Spectral range of sensitivity
(typ)
λ10%
Radiant sensitive area
(typ)
A
0.29
mm2
Dimensions of chip area
(typ)
LxW
(typ) 0.75 x
0.75
mm x
mm
Half angle
(typ)
ϕ
± 60
°
Capacitance
(VCE = 0 V, f = 1 MHz, E = 0)
(typ)
CCE
4
pF
IPCE
35 ... 64
µA
Dark current
(VCE = 5 V, E = 0)
(typ (max)) ICE0
3 (≤ 50)
nA
Temperature coefficient
(Std. Light A)
(typ)
TC
0.9
%/K
Temperature coefficient
(λ = 550 nm)
(typ)
TC
0.78
%/K
Photocurrent
(VCE = 5 V, white LED 100 lx)
2016-02-29
2
(typ) 350
... 950
nm
Version 1.3
SFH 3716
Grouping (TA = 25 °C)
Group
SFH 3716
Min Photocurrent
Max Photocurrent
White LED 100 lx
White LED 100 lx
IPCE, min [µA]
IPCE, max [µA]
35
64
Relative Spectral Sensitivity 1) page 11
Srel = f(λ)
Collector-Emitter Capacitance 1) page 11
CCE = f(VCE), f = 1 MHz, E = 0
OHF00851
100
C CE
%
Srel
80
OHF04052
4.0
pF
3.0
70
2.5
60
2.0
50
40
Vλ
1.5
30
1.0
20
0.5
10
0 -3
10
0
400 500 600 700 800 900 nm 1100
λ
2016-02-29
10 -2
10 -1
10 0
10 1 V 10 2
VCE
3
Version 1.3
SFH 3716
Directional Characteristics 1) page 11
Srel = f(ϕ)
40
30
20
10
ϕ
0
OHF01402
1.0
50
0.8
60
0.6
70
0.4
80
0.2
0
90
100
1.0
0.8
0.6
0.4
0
Package Outline
Dimensions in mm.
2016-02-29
4
20
40
60
80
100
120
Version 1.3
SFH 3716
Pinning
Pin
Description
1
Collector
2
Emitter
Approximate Weight:
3.76 mg
Recommended Solder Pad
1.25
3.2
1
Bauteil positioniert
Component location on pad
OHFP2578
Dimensions in mm.
2016-02-29
5
Version 1.3
SFH 3716
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
s 300
250
t
OHA04612
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Ramp-up rate to preheat*)
25 °C to 150 °C
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Recommendation
Maximum
2
3
100
120
2
3
Unit
Einheit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
s
3
6
K/s
10
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2016-02-29
°C
6
s
Version 1.3
SFH 3716
Taping
Dimensions in mm (inch).
Tape and Reel
8 mm tape with 3000 pcs. on ∅ 180 mm reel
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
2016-02-29
7
Version 1.3
SFH 3716
Tape dimensions [mm]
Tape dim ensions in m m
W
P0
P1
P2
D0
E
F
8 + 0.3 / -0.1
4 ± 0.1
2 ± 0.05
or
4 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
3.5 ± 0.05
Reel dimensions [mm]
Reel dim ensions in m m
A
W
Nmin
W1
W2max
180
8
60
8.4 + 2
14.4
Barcode-Product-Label (BPL)
OSRAM Opto
EX
A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
ML Temp ST
X XXX °C X
(9D) D/C: 1234
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
Dry Packing Process and Materials
Moisture-sensitive label or print
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
AM
OSR
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
2016-02-29
8
Version 1.3
SFH 3716
Transportation Packing and Materials
Barcode label
D/
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(X
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110 0
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5
195 ± 5
30 ± 5
2016-02-29
OD
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Barcode label
9
OHA02044
Version 1.3
SFH 3716
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-02-29
10
Version 1.3
SFH 3716
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-02-29
11
Version 1.3
SFH 3716
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2016-02-29
12