High Reliability Solder Ball M770
Simultaneously realizes high thermal fatigue resistance and drop impact reliability
Features
●
Solves problems with contrary demands by means of technology
controlling the separation strengthening and interface response
●
Excellent affinity with all kinds of surface treatment materials
(Cu, Ni, Au)
●
Optimized for mobile devices such as smart phones and
in-vehicle ball packaging
Specifications
● Evaluation on Cu-OSP PCB
Drop impact reliability (Cu-OSP PCB)
Thermal fatigue resistance (Cu-OSP PCB)
99.9
Cumulative failure rate (%)
Cumulative failure rate (%)
99.9
M60
Interface
Surface
Ni
10
10
M60
1
● Material structures
1
M705
M770
10
M61
100
M60
M705
M770
1
1000
1000
Number of drops (times)
M61
Number of cycles (cycles)
10000
M61
Ni
● Evaluation on electrolytic Ni/Au plated PCB
Drop impact reliability (electrolytic Ni/Au plated PCB) Thermal fatigue resistance (electrolytic Ni/Au plated PCB)
99.9
10
Cumulative failure rate (%)
Cumulative failure rate (%)
99.9
M60
M770
M61
1
0.01
M770
10
M705
1
10
100
Number of drops (times)
1000
Ni
M705
1
0.1
M61
1000
M60
M770
Number of cycles (cycles)
10000
● Material selection according to purpose and application
Drop impact reliability
Thermal fatigue resistance
M60
M61
M770
×
◎
◎
○
◎
×
Results from relative evaluation with M705 as basis.
JPCA13-02
Focus on thermal fatigue resistance: M60
Focus on drop impact reliability : M61
Satisfies both characteristics in a reliable manner: M770
M705-RGS800HF T5
Type 5 powder realizes packaging of microscopic components
Features
●
Our original fine powder and flux ensure good printability
●
Stable printability suppresses fusion defects at BGA joints
●
Halogen-free, which suppresses fusion defects at BGA joints
even with air reflow
Specifications
● Excellent printability for fine patterns ensured ● Type5 has a high filling rate,
ensuring proper soldering
Type4
【Φ250μｍ】
Type4
μ
Type4 solder powder
Type5
Type5 solder powder
Type5
【250×250μｍ】
Type4
φ20～38μｍ
Type5
φ15～25μｍ
● Short circuiting of narrow-pitch patterns is suppressed ● Air reflow is possible and fusion defects are suppressed
Conventional Type4 paste
RGS800HF Type5 paste
Type5 with conventional halogen-free flux
Type 5 using RGS800HF
● Stable printability preventing fusion defects caused by insufficient solder amount
■ Type5
with conventional halogen-free flux
Solder paste
Flux
BGA
Solder ball
Oxide film
BGA
①
PWB
Printing/Mounting
■ Type5 using RGS800HF
PWB
PWB
Reflow
BGA
Printing/Mounting
Joint
BGA
③
PWB
②
BGA
RGS800HF
Solder paste
JPCA13-01
Fusion failure
BGA
PWB
Reflow
PWB
③
Joint
③
① If the solder amount is insufficient, the oxide film removal effectiveness of
the flux becomes weak, resulting in
fusion defects.
② Conventional halogen-free flux has weak
oxide film removal ability, so it is easy for
fusion defects to form.
③ Good halogen-free flux with a uniform
amount of solder allows for the oxide film
to be removed for all balls, so there are
not fusion defects.
NSV320
Transfer paste for 3D PoP (Package of Package) packaging NSV320
Features
●
Possesses excellent transferability and significantly reduces
contact non-wet failures in ball-to-ball stacking
●
Accommodates PoP and TMV packaging
and realizes excellent solderability
●
Robust against warping, achieves higher performance than
that of conventional products while being halogen-free
Specifications
● NSV320 provides excellent solder transfer in specific amounts
Insufficient solder amount
Print
Transfer1
Transfer2
Transfer3
Mount
Joint
Mount
Joint
Solder printing paste lacking transferability
Sufficient solder amount Print
Transfer1
Transfer2
Transfer3
● PoP Packaging using NSV320
Conventional
product
NSV320 with excellent transferability
Contact non-wet past
Contact non-wet
failures are
observed
Contact
non-wet past
Contact
non-wet past
NSV320
Contact non-wet
failures are
ignificantly
reduced
● Stable transcript level after dwell time of 300ms or more
5
dwell time 50ms
Weight(mg)
4.5
4
3.5
3
2.5
2
0
100
200
300
400
500
600
700
Dwell time(ms)
JPCA13-03
800
900 1000
dwell time 300ms
dwell time 999ms
S101-S4-HF
Solves “Non-Wet Open (NWO)”, a new non-wet type BGA solder joint defect
Features
●
Optimal alloy and flux were developed
by understanding the NWO mechanism
●
Resolves NWO defects with surface treatment materials
for Cu-OSP boards, etc.
●
Resolved by developing a material without changing
the reflow profile
Specifications
● Thin BGA packages cause large, complicated warping at low temperatures
Shorter larger
Example of thin BGA warpage during heating
● Difference in fusion defect mode between “HIP and “ＮＷＯ”
Defect mode differs according to differences in warpage behavior during preheating and the adhesion status.
HIP（Head in pillow）
HIP（Head in pillow）
Board warpage (Type A)
BGA
BGA
BGA
BGA
Fusion defect
BGA
Flux
Powder
PCB
PCB
Occurs when the BGA solder bump and
solder paste become detached during preheating
PCB
Printing
NWO（No wet open）
PCB
Mounting
NWO（No wet open）
BGA
BGA
BGA
PCB
Printing
PCB
Mounting
● Photos showing pealed surface with “HIP” and “ＮＷＯ”
【BGA side】
JPCA13-04
【PCB side】
Head in pillow
Head in pillow
No wet open
No wet open
Fusion defect
BGA
Flux
Powder
Flux
Powder
PCB
Fusion
Board warpage (Type B)
BGA
Occurs when the board electrode and solder paste
become detached during preheating
PCB
Reflow
PCB
Reflow
PCB
Fusion
● NWO defect improvement
Photos of “ＮＷＯ”
NWO（No wet open）
Cross-section
Good joint
X-ray
Confirmed that NWO defects were improved compared to conventional products when using the developed S101HF(N)
M53
M53 series solder paste that is capable of being applied to small-sized and lightweight on-board products
Features
●
Exhibits superior thermal fatigue resistance and maintains
high bond strength even under severe environments
●
Prevents crack propagation due to thermal fatigue
and maintains electrical conductivity after long term use
●
Ensures high quality even in products with small-sized
and lightweight designs having small land areas
Specifications
● Comparison of thermal fatigue resistance using a chip resistor ● Comparison of thermal fatigue resistance using a chip capacitor
Using a 3216 chip resistor and a large-sized pattern
90
Shear strength (N)
Shear strength (N)
60.0
70
M53
60
50
40
30
20
SAC305
10
0
Using a 3216 chip resistor and a medium-sized pattern
70.0
80
0
500
1000
1500
2000
2500
3000
Temperature cycle (cyc.)
3500
50.0
M53
40.0
30.0
20.0
SAC305
10.0
4000
4500
0 0
500
1000
1500
2000
Temperature cycle (cyc.)
TCT;-40/+124℃(30min)
M53 containing Bi and In exhibits a much lower decrease in
strength compared to SAC305
2500
3000
3500
TCT;-40/+124℃(30min)
M53 containing Bi and In maintains superior shear strength
compared to SAC305
● Ensures strength even on a small surface
90.0
80.0
Using a 3216 chip resistor and small-, medium- and large-sized patterns
M53 In
Shear strength (N)
70.0
60.0
M53 3000cyc.
50.0
40.0
SAC305 In
30.0
20.0
10.0
0.0
35
SAC305 3000cyc.
L
M
3
25
S
2
Surface area (mm2)
15
1
TCT;-40/+125℃ (30min)
● Comparison of cross sectional photographs
SAC305
M53
Initial stage
Solder alloy with greater strength and stress relaxation properties 3000cyc
Initial
stage
Temperature
cycle
Temperature
cycle
Chip
Chip
Crack has grown
during soldering
JPCA13-05
3000cyc
Larger structure
compared to that of
SAC305
Chip
Chip
No cracks
MACROS
"MACROS" that prevents migration
Features
●
No cracking of flux residue occurs even under environment with
rapid temperature changes, such as in on-board equipment
●
Flux residue with high adhesiveness and water repellency
prevents the occurrence of migration
●
Excellent for laser soldering,
prevents flux spattering peculiar to laser soldering
Specifications
● Cracks on flux become the cause of migration
Water passage in cracks
Migration
Flux residue
Cracks or breaking occur
or breakage
Dew
Voltage
Temperature
condensation application cycle
Ion migration
Crack
Flux residue
Water Migration
Solder
Occurrence of cracks
or breakage
Soldering
Water passage is formed
in cracks or breakage
● Prevents the occurrence of cracks
Short circuit due
to migration
in flux residue during temperature cycle tests
JIS Grade A product
MACROS
When condensed water remains,
ion migration easily occurs.
● Water drop test result after temperature cycle
JIS Grade A product
MACROS
Ion migration occurs at cracks No cracks or ion migration occur
Cracks
No cracks
Ion migration
Crack
Water drop test 5 V of voltage applied
Temperature cycle test ; -30℃/110℃ 2000cyc.
● Provides good break-off, ensuring good drag soldering
1.00E+14
Insulation resistance [Ω]
MACROS
Conventional product
MACROS
Migration occurs in a short period
of time because water penetrates easily
Migration does not occur because
water does not penetrate easily
Conventional product
1.00E+12
Substrate only (Blank)
1.00E+10
MACROS
1.00E+08
Conventional
product
1.00E+06
1.00E+04
JPCA13-06
0
2
4
Time [h]
6
8
10
● Comparison of flux scattering
in laser soldering
[Test condition]
Temperature: 121°C
Humidity: 100% RH
Atmospheric pressure:
2 atm
Applied voltage: 50 V
Measuring voltage:
100 V
Measurement time:
every 0.5 h
Applied voltage mode:
DC
Flux scattering is prevented
by viscosity suppression
Solder Paste Containing Ni Balls
Achieves excellent heat dissipation characteristics in horizontal packaging that suppresses void formation
Features
●
Suppresses cracks related to solder thickness and angle,
excellent heat dissipation packaging
●
Highly reliable wire bonding possible for flat bare chips
●
Suppresses voids by optimal formulation of uniform
Ni balls using our original technology
Specifications
● Resolves issues related to power device packaging ● Achieves horizontal packaging using
Semiconductor
Solder
Insulated board
Heat sink
Resolves issues related to power device packaging
Uniform thickness
Void reduction
solder paste with Ni balls
Normal solder paste may cause the chip to become tilted
DIE
DIE
Powder
High-quality alloy
DIE
PCB
PCB
PCB
Printing
Mounting
Fusion
Solder paste with Ni allows for horizontal packaging by spacers
Cracks occur at thin portions
during the cooling cycle
Uniform Ni ball development
Increased voids ↓ Selection of a solder alloy that
Resistance and
can endure sever conditions Powder
heat dissipation decrease
Ni ball
Original paste development
DIE
DIE
PCB
Development of various alloys
according to usage
DIE
PCB
PCB
Printing
Mounting
Fusion
● Uniform Ni balls based on our original technology allow for excellent heat dissipation
●Without Ni ball
Air in cracks disrupt heat conductivity and decrease heat dissipation
Bare chip
Cracks caused by tilting
Chip is tilted and the solder thickness is uneven
●With Ni ball
Chip
Ni ball
Preform
Cracks caused by thin solder
Good heat dissipation
Ni Ball
Solder
Board
Ni balls ensure parts standoff
200
● Optimal formulation of Ni balls
Void images
With
Without
Solder thickness [um]
150
suppresses void formation
Spacer
Ni balls suppress uneven solder thickness
100
50
0
A
B
C
D
With Ni balls
E
A
B
C
D
E
Without Ni balls
Results of solder thickness at each measurement point
JPCA13-07
M705-NX001
Increases fluidity of solder in a melted state to eliminate voids
Features
●
Good wettability increases the fluidity of heated solder
●
Good wettability even with Cu-OSP boards,
voids are suppressed
●
Excellent insulation reliability while maintaining good wettability
Specifications
● Voids are bad because they disrupt ● Void formation mechanism
heat dissipation
Terminals such as LGAs and dies with few openings have many voids
Cu-OSP products with poor wettability have many voids
Void
Paste
Mounting
Au-plated product
Sufficient wetting is ensured at the Cu base material lead cross-section where soldering is difficult
Conventional Product
Void
Solidification
Fusion
The better the wettability, the better the fluidity
Cu-OSP product
● Excellent wettability
Solder flow
● Voids are greatly reduced by the optimal profile
of the fusion temperature range and NX001
Conventional Product
Au-platted product
N705-NX001
Cu-OSP product
Cu-OSP product
Power
transistor
M705-NX001
QFN bottom
electrode
Voids are greatly reduced even for Cu-OSP boards
● Excellent insulation reliability maintained while ensuring good wettability
Recommended optimal profile
85℃ 85％ RH1000hr
Applied Voltage 45V
1.E+10
At 220℃: 40 to 60 Sec.
250
1.E+09
1.E+07
Temperature [℃]
Resistance [Ω]
1.E+08
1.E+06
1.E+05
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
JPCA13-08
0
200
400
600
Elapsed time [hr]
800
1000
200
150
100
50
0
0
50
100
Time [sec]
150
200
250