Advance Program and Registration on-line: www.imaps.org/devicepackaging
IMAPS International Conference and Exhibition on
Device Packaging
March 7 - 10, 2011
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona - USA
in conjunction with the Global Business Council (GBC) Spring Conference
March 6 & 7, 2011 - www.imaps.org/gbc
Courtesy of Rensselaer Polytechnic Institute
General Chair:
Phil Garrou, Microelectronic Consultants of NC
Technical Chairs:
Paul Siblerud, Applied Materials
Ron Huemoeller, Amkor Technology, Inc.
Peter Elenius, E&G Technology Partners
Alan Huffman, RTI International
Robert Dean, Auburn University
Tracy Hudson, U. S. Army RDECOM AMRDEC
Ted Tessier, FlipChip International, LLC
Rey Alvarado, Maxim Integrated Products
Courtesy of U. S. Army RDEDCOM AMRDEC
DEVICE PACKAGING PROGRAM OVERVIEW
Monday, March 7
8 Professional Development Courses - 1/2 Day
Four - 8:00 am - Noon & Four - 1:00 pm - 5:00 pm
Tuesday, March 8 - Thursday, March 10
Technical Sessions
Tuesday, March 8
Fan-Out and Embedded Panel Discussion: 7:00 pm - 8:30 pm
Wednesday, March 9
Poster Session in Exhibit Hall: 1:30 pm - 4:30 pm
3D Panel Discussion: 6:00 pm - 7:30 pm
Memory Cube Readiness, Use and Logistical Challenges
Jeff Perkins, Yole Developpement
Robert Heistand, AVX
EXHIBITION
Tuesday, March 8
Wednesday, March 9
10:00 am - 7:00 pm
12:00 pm - 4:30 pm
Organized by: International Microelectronics And Packaging Society (IMAPS)
Bringing Together the Entire Microelectronics Supply Chain!
Conference Overview
The Seventh Annual Device Packaging Conference (DPC2011) will be held in Scottsdale, Arizona, on March 7-10, 2011. It is
an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
This year’s conference will feature technical sessions, four plenary speakers, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum
on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip
Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; Passive Integration; and LEDs. Technical
presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these topical areas of microelectronics
and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 6-7, focusing on the business aspects of these technologies. There will be several networking receptions and
gatherings throughout the week, including the opening reception, meals, and other social events.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking
opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry
and academia. It provides a chance for educational interactions across many different functional groups and experience
levels. People who will benefit from this conference include: scientists, process engineers, product engineers,
manufacturing engineers, professors, students, business managers, sales and marketing.
Organizing Committee
3D Packaging
Flip Chip
Wafer Level
Packaging
MEMS
Emerging Tech. LEDs
Technical Chairs:
Paul Siblerud, Applied
Materials
Technical Chairs:
Peter Elenius, E&G
Technology Partners
Technical Chairs:
Ted Tessier, FlipChip
International
Technical Chairs:
Robert Dean, Auburn
University
Technical Chair:
Jeff Perkins, Yole
Developpement
Ron Huemoeller, Amkor
Technology, Inc.
Alan Huffman, RTI
International
Rey Alvarado, Maxim
Integrated Products
Tracy Hudson, U.S. Army
Committee:
Dave Saums, DS&A LLC
Committee:
Rozalia Beica, Applied
Materials
Committee:
Steve Adamson, Asymtek
Committee:
Lars Boettcher, Fraunhofer
IZM
Jeff Calvert, DOW
Electronic Materials
Flynn Carson, STATS
ChipPAC, Inc.
Kuan-Neng Chen, National
Chiao Tung University
Kathy Cook, Ziptronix, Inc.
Yann Guillou, ST-Ericsson
Jon Aday, Amkor
Technology, Inc.
Linda Bal, Freescale
Semiconductor
Lou Nicholls, Amkor
Technology Inc.
Thorsten Teutsch, PacTech
USA
Committee:
Thomas Baginski, Auburn
University
Luu Nguyen, National
Semiconductor Corp.
Michael Toepper,
Fraunhofer IZM
John Hunt, ASE
Li-Anne Liew, NIST
Horatio Quinones, Asymtek
Barry Gallacher, Newcastle
University
Frank Shi, University of
California - Irvine
Mathias Nowottnick,
University of Rostock
Frank Wall, Philips
Lumileds Lighting
Company
Philip Reiner, CGI Inc.
Tom Strothman, STATS
ChipPAC, Inc.
Peter Tortorici, Medtronic
Andrew Strandjord, Pac
Tech USA
Alexander Trusov,
University of California Irvine
James J.-Q. Lu,
Rensselaer Polytechnic
Institute
Keith Warren, MEMS
Consultant
Thorsten Matthias,
EVGroup
Bob Patti, Tezzaron
Semiconductor
Peter Ramm, Fraunhofer
IZM, Munich
Nicolas Sillon, CEA LETI
Lee Smith, Amkor
Technology, Inc.
1
Genevieve Martin, Philips
Applied Technologies
Emerging Tech. Passive Integration
Technical Chair:
Robert Heistand, AVX
Committee:
Franck Murray, IPDIA
Kai Liu, STATS ChipPAC,
Inc.
Grit Sommer, Infineon
Program at a Glance
Sunday, March 6
GBC Registration: 6:00 pm - 7:00 pm
GBC Industry Reception: 6:00 pm - 7:30 pm
Monday, March 7
Registration: 7:00 am - 7:00 pm
GBC Conference: 8:00 am - 5:00 pm
Professional Development Courses (1/2 Day)
8:00 am - Noon
PDC1
3D Integration: Technology,
Applications & Markets for 3D
Integrated Circuits
Course Leader: Philip Garrou,
Microelectronic Consultants of NC
PDC2
PDC3
PDC4
Guide to Component Chip Attach Including Flip Chip
Course Leader: Phillip Creter, Creter
& Associates
MEMS Reliability and Packaging
Course Leader: Slobodan Petrovic,
Oregon Institute of Technology
Fundamentals of Microelectronic
Packaging
Course Leader: Casey Krawiec,
Consultant
Professional Development Courses (1/2 Day)
1:00 pm - 5:00 pm
PDC5
PDC6
PDC7
Introduction to MEMS Design and
Fabrication
Course Leader: Philip J. Reiner, CGI
Federal
Polymers in Semiconductor
Packaging
Course Leader: Jeff Gotro,
InnoCentrix, LLC
Hermetic Sealing and Testing of
Small Volume MEMS Packages
Course Leader: Thomas J. Green, TJ
Green Associates LLC
PDC8
Area Array Microelectronics
Package Reliability
Course Leader: Amaneh Tasooji,
Arizona State University
Welcome Reception: 5:00 pm - 6:30 pm
2011 Texas Hold’em Tournament: 7:00 pm - 10:00 pm
(Separate Registration - Limited Seating) See Page 9 for more information.
To Benefit the IMAPS Microelectronics Foundation
Tuesday, March 8
Wednesday, March 9
Thursday, March 10
7:00 am - 7:00 pm
Registration
7:00 am - 6:00 pm
Registration
7:00 am - 11:30 am
Registration
8:20 am - 9:55 am
Keynote Presentations
8:00 am - 9:30 am
Keynote Presentations
8:00 am - 11:00 am
Technical Sessions
THA2
10:00 am - 7:00 pm
Exhibits Open
10:00 am - 12:00 pm
Technical Sessions
WA1, WA2, WA3
10:30 am - 12:30 pm
Technical Sessions
TA1, TA2, TA3
12:30 pm - 2:00 pm
Lunch In Exhibit Hall
(Food served from 12:30 pm - 1:30 pm)
2:00 pm - 5:45 pm
Technical Sessions
TP1, TP2, TP3
5:45 pm - 7:00 pm
Reception In Exhibit Hall
7:00 pm - 8:30 pm
Fan-Out and Embedded
Panel Discussion
12:00 pm - 1:00 pm
Lunch In Exhibit Hall
12:00 pm - 4:30 pm
Exhibits Open
1:30 pm - 4:30 pm
Poster Session in Exhibit Hall
Poster setup: 1:00 pm - 1:30 pm)
2:00 pm - 6:00 pm
Technical Sessions
WP1, WP2, WP3, WP4
6:00 pm - 7:30 pm
3D Panel Discussion:
Memory Cube Readiness,
Use and Logistical Challenges
2
8:00 am - 11:30 am
Technical Sessions
THA1, THA3
11:30 am - 11:45 am
Closing Remarks
1:00 pm - 7:00 m
IMAPS Microelectronics Foundation
Spring Golf Invitational
(Separate Registration)
Desert Canyon Golf Club
(www.desertcanyongolf.com)
1:00 pm Shotgun Start
“Best Ball” Scramble
See page 11 for more information.
Preceding the Device Packaging Conference...
2011 Spring Conference
The Business of Semiconductor Packaging
in the Era of 3D and Energy Efficiency
March 6 - 7, 2011
Radisson Fort McDowell Resort and Casino
Please visit www.imaps.org/gbc to register for the GBC Conference.
Sunday, March 6
6:00 PM - 7:30 PM - Opening Industry Reception
Monday, March 7
7:00 AM - 8:00 AM - Continental Breakfast
7:00 AM - 7:00 PM - Registration
The IMAPS GBC is pleased to announce its 2011 Spring Conference. Presentations by industry leaders will provide valuable content on
supply chains, market analysis, and technology node shifts. Participants will gain industry and technical insight to achieve a competitive
advantage for product development, marketing, and sales. Participants can network in two receptions and at meals.
Conference Co-Chairs: Iris Labadie, Kyocera America; Rich Rice, ASE, Inc.
Session Chairs: Lee Smith, Amkor Technology, Inc.; Jan Vardaman, TechSearch International, Inc.;
Cecilia Aguillon, Kyocera America; Steve Ziolkowski, ASE, Inc.
Morning Market Presentations: Business of 3D Packaging
1) Applications driving 3D IC adoption. Industry trends & forecasts (panel)
• Jan Vardaman of Tech Search & Jeff Perkins of Prismark.
• Yole and Gartner staff have been invited.
2) Status of consortia work in 3D IC including equipment and materials supply chains
• Rosalia Beica, Global 3D Interconnect Director, SemiTool
• Sitarem Arkalgud, Director of Interconnect, SEMATECH
3) Status in development of 3D Standards
• James Malatesta, Micron Technology, Inc.
4) Road mapping for 3D packaging and 3D IC technologies
• Bill Bottoms, Chairman-CEO, NanoNexus Inc.
5) Collaboration in development of new FPGA platform with Si interposer architecture
• Arifur Rahman, Senior Member of Technical Staff, Xilinx (invited)
• Lunch Keynote Presenter: Bill McClean, President of IC Insights
“Reasons for Optimism in 2011 and 2012”
Afternoon Market Presentations: Market Drivers for Energy Efficiency in Microelectronics
1) Increasing energy efficiency through power semiconductor
• Oleg Khaykin, CEO, International Rectifier
2) Power management IC market opportunities
• Chris Bull, Marketing Manager of Power Stage, Texas Instruments
3) Semiconductor opportunities with hybrid / electric automobiles
• Marques McCammon, Chief Marketing Officer, Aptera Motors
4) Emerging technologies to enable utility-scale solar power growth
• Eelco Bergman, Vice President of Business Development, Cyrium Technologies
• Evening reception for participants of the GBC and the Device Packaging Conference.
7:00 pm - 10:00 pm: Texas Hold‘em Poker Tournament (Separate Registration - Limited Seating).
See Page 9 for more information.
Thursday, March 10
IMAPS Microelectronics Foundation Spring Golf Invitational (Separate Registration).
Desert Canyon Golf Club (www.desertcanyongolf.com) - See page 11 for more information.
1:00 pm - 7:00 pm (1:00 pm Shotgun Start - “Best Ball” Scramble)
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MONDAY, MARCH 7, 2011
Professional Development Courses (PDCs)
7:00 am – 7:00 pm
Registration
7:00 am – 8:00 am
Continental Breakfast
8:00 am – 12:00 pm
Morning Professional Development Courses (PDCs)
PDC1: 3D Integration: Technology,
Applications & Markets for 3D
Integrated Circuits
Course Leader: Philip Garrou,
Microelectronic Consultants of NC
PDC2: Guide to Component Chip
Attach - Including Flip Chip
Course Leader: Phillip Creter, Creter &
Associates
PDC3: MEMS Reliability and
Packaging
Course Leader: Slobodan Petrovic,
Oregon Institute of Technology
PDC4: Fundamentals of
Microelectronic Packaging
Course Leader: Casey Krawiec,
Consultant
10:00 am – 10:20 am
Break
12:00 pm – 1:00 pm
Lunch (Only provided for those attendees registered for both Morning and Afternoon PDCs)
1:00 pm – 5:00 pm
Afternoon Professional Development Courses (PDCs)
PDC5: Introduction to MEMS Design
and Fabrication
Course Leader: Philip J. Reiner, CGI
Federal
PDC6: Polymers in Semiconductor
Packaging
Course Leader: Jeff Gotro,
InnoCentrix, LLC
PDC7: Hermetic Sealing and Testing
of Small Volume MEMS Packages
Course Leader: Thomas J. Green, TJ
Green Associates LLC
PDC8: Area Array Microelectronics
Package Reliability
Course Leader: Amaneh Tasooji,
Arizona State University
3:00 pm – 3:20 pm
Break
5:00 pm – 6:30 pm
Welcome Reception (All Attendees Are Invited To Attend)
7:00 pm – 10:00 pm
2011 Texas Hold'em Tournament (Separate Registration - Limited Seating) See Page 9 for more information)
To Benefit The Microelectronics Foundation
PDC1: 3D Integration: Technology, Applications & Markets for 3D Integrated Circuits
Course Leader: Philip Garrou, Microelectronic Consultants of NC
Course Description:
This course is based on the author’s activity over the past 7 years with numerous companies in the industry, his weekly 3D blog “Insights From the Leading
Edge” in Solid State Technology and the 2nd volume Wiley-VCH book “Handbook of 3D IC Integration: Technology and Applications of 3D IC Circuits” which
he authored. The course will begin by defining and contrasting 3D Integration (thinning, bonding and TSV) to 3D packaging (thinning, stacking and wire
bonding to the BGA base). The various drivers for 3D integration including the electrical performance and economic issues will be examined. We will
examine the various process sequences being proposed for 3D integration and the process unit operations necessary to fabricate a 3D stack. The process
sequences proposed by IDMs, Universities, and Institutes will be compared and contrasted. We will then examine applications and the evolving
infrastructure that will be necessary to accomplish this. The course will end by looking at the remaining technical and market barriers (design, thermal and
test) and looking at the current best sources of 3D information.
Who Should Attend?
The course will be aimed at technical personnel wanting a status review of the subject and marketing/management personnel looking for a status report to
help determine their position in the business food chain.
Dr. Garrou consults in the areas of 3D IC integration, thin film technology, IC packaging and microelectronic materials. Dr. Garrou is a fellow of IEEE & IMAPS and was President
of the IEEE CPMT (2003-2005) and IMAPS (1998). He is currently a contributing editor and weekly 3D IC blogger for Solid State Technology magazine “Insights From the
Leading Edge.” Dr Garrou is a Sr. Analyst and contributor for the Yole Developpment “i-Micronews” and Yole newsletters. He has authored / co-authored > 100 technical
publications and book chapters. He edited and authored the 2008 “Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits” for Wiley-VCH.
PDC2: Guide to Component Chip Attach - Including Flip Chip
Course Leader: Phillip Creter, Creter & Associates
Course Description:
This course provides a training guide to successful component chip attach based on industry proven methods with details of materials, processes and
equipment used in traditional component chip attachment of passives (capacitors, inductors, resistors), and actives (various silicon die including flip chips).
Core chip attachment processes and details are grouped as follows: polymer, silver-glass frit, eutectic, SMT solder and polymer, sintered nanosilver and flip
chip. Examples of actual process procedures and industry lot travelers are included. Special attention will be given to Flip Chip and Flip Chip packaging
applications. Students will learn definitions, techniques, processes, materials, substrates and equipment used in flip chip attachment and underfill using both
solder and polymers. Included: types of wafer bumping, pick/place, solder reflow, underfilling, and process control methodology. Reliability testing and
screening methods as well as analysis techniques for various types of component attach are discussed using optical, die shear, scanning electron
microscopy and scanning acoustic microscopy. Recommendations are made based on lessons learned, avoiding common pitfalls and tips on how to solve
problem areas. Figures, photos, video clips and actual pass around microcircuit samples enhance the learning experience. The class handout includes a
glossary and an extensive list of over a hundred technical references.
Who Should Attend?
Engineers new to the field or those needing a running start in chip attach/flip chip packaging technology. No prior knowledge required.
Phillip Creter has over 30 years of microelectronics packaging experience. He is a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer
Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (received the highest GTE Corporate Technical
4
Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager, and Manufacturing Engineer. He has published more than
a dozen technical papers, holds a U.S. patent, has given numerous technical presentations, and has chaired many technical sessions for symposia. He has been teaching college
level microelectronics since 1997 and has continuously taught courses at various symposia, workshops, and online microelectronics webinars. He is an active certified instructor
for the Department of Homeland Security currently teaching courses locally. He is a Life member of IMAPS and was elected Fellow of the Society, National Treasurer and
President of the New England Chapter (twice).
PDC3: MEMS Reliability and Packaging
Course Leader: Slobodan Petrovic, Oregon Institute of Technology
Course Description:
The intended outcome of the course is to provide a comprehensive overview of the MEMS packaging and reliability principles; with a particular emphasis on
sensors and actuators used in industrial, medical, and automotive applications. Examples of these applications include accelerometers, pressure sensors,
angular rate sensors, micropumps, valves, and thermal inkjet heads. The packaging discussion will also cover a wide range of other MEMS principles and
devices such biological and chemical sensors, optical imaging and displays, as well as photonic applications used in the fiber-optics industry. These
applications will be illustrated using examples such as lab-on-a-chip, DNA sensor, radiation imager, micromirror device, tunable laser, and wavelength
locker. Three extensive case studies that will be used to most effectively demonstrate diverse packaging principles are: accelerometers, pressure sensors,
and digital micromirror devices.
Who Should Attend?
This is a survey course structured in such a way to provide a comprehensive overview of a broad array of packaging and reliability issues. While some prior
knowledge by the participants of MEMS in general is helpful, the packaging discussion will require a fairly detailed explanation of the principles of operation,
fabrication methods, and materials used in building MEMS structures. The course is therefore open to participants with no prior MEMS knowledge and would
provide a reasonably broad general introduction into the field.
Dr. Slobodan Petrovic is an associate professor at the Oregon Institute of Technology in Portland, Oregon. Prior to that he was an associate professor at Arizona State
University, where he was teaching courses in MEMS, Sensors, and alternative energy. His research interests are in the areas of MEMS fuel cells, sensor media compatibility,
hydrogen generation and storage, and nanocatalysts for energy applications. Prior to joining ASU Dr. Petrovic held appointments at Clear Edge Power (formerly Quantum Leap
Technology) as a Vice President of Engineering; at Neah Power Systems as Director of Systems Integration; and Motorola, Inc. as a Reliability Manager. Dr. Petrovic has over 25
years of experience in MEMS, sensors, energy systems; fuel cells and batteries; industrial electrochemical processes; and catalysis. He has over 50 journal publications and
conference proceedings; 2 book contributions and 24 pending or issued patents.
PDC4: Fundamentals of Microelectronic Packaging
Course Leader: Casey Krawiec, Consultant
Course Description:
This course provides the fundamentals of microelectronics packaging technology to entry-level engineers, technicians, and others involved in manufacturing,
purchasing, processing, R&D, quality, sales, and marketing. No prior knowledge of microelectronics is required. This course will provide the student with an
overview of the history of microelectronics, core terminology and concepts, and the critical functions of electronic packaging. Students will learn the basic
types of microelectronic packaging from a materials perspective. Regarding materials and package technology selection, students will gain an appreciation
of the trade-offs between cost, performance, and reliability. The course will provide an overview on package assembly and test, and will conclude by
reviewing the future/emerging technologies of packaging.
What Will Be Learned?
At the conclusion of this course, the student will: Be familiar with Microelectronic Packaging terminology; Know the function and purpose of Microelectronic
Packaging; Understand the conditions that drive package selection (performance, cost, reliability); Understand the conditions that determine the materials
used in the package construction; and Understand why so many packages are custom designs.
Casey Krawiec has been deeply involved with microelectronics and packaging for over 15 years. Most recently, he was Vice President of North American Sales at StratEdge
Corporation, a packaging OEM and assembler in San Diego. Prior to that, he worked for Kyocera America, including a stint as the Offshore (International) Sales Manager. He
began his career as a design engineer for the Department of the Navy. He has an MBA from the University of Louisville and a BS in Mechanical Engineering from the University of
Kentucky. He is an officer in the local chapters of both International Microelectronics And Packaging Society and the American Society of Mechanical Engineers.
PDC5: Introduction to MEMS Design and Fabrication
Course Leader: Philip J. Reiner, CGI Federal
Course Description:
This course provides a comprehensive overview of the design and fabrication of Micro-electrical and Mechanical Machine Systems (MEMS). The
fundamentals of good MEMS design will be presented with numerous examples illustrating how to go about designing a MEMS device and the processing
steps that lead to a functioning part. Discussions will include in-depth descriptions of various microlithography processing equipment such as reactive ion
etchers, coaters, spinners, mask aligners, pattern generators, dicing equipment, etc. The student will also learn the basics of microlithography wafer
processing, bonding, and finishing processes such as dicing and packaging. The student will be taken through a typical MEMS design problem step by step
from concept to finished product. At the end of the course, the student will have a firm grasp of the tools and techniques available for fabricating MEMS
devices and the knowledge required to make sensible choices in process design and product flow.
Who Should Attend?
This course is offered at the introductory level for anyone interested in getting into MEMS design and fabrication.
Dr. Philip J. Reiner is the Chief Scientist for the Advanced Engineering Technology Division for Stanley Associates Inc. in Huntsville, Alabama. His group provides full spectrum
design, development, and fabrication support services for systems based on MEMS/NEMS, fiber optic, and electro-optic technologies. He holds a BS in Physics from RIT and a
PhD in Physics from the University of Rochester in New York. His research interests include Nano-technologies, MicroElectroMechanical Systems (MEMS) development, Liquid
Crystal Polymers, and Thin and Thick Film Technologies development. Dr. Reiner is currently developing advanced MEMS-based components and systems for commercial and
defense applications. He also develops advanced research programs for multiple US agencies. He is a member of IEEE, ISA, and NDIA and currently holds five patents. He also
served as a Captain in the US Army Ordnance Corp. and was awarded the Meritorious Service Medal in 1989.
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PDC6: Polymers in Semiconductor Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC
Course Description:
This course will provide a broad overview of polymers and the important structure-property-process-performance relationships for electronic packaging.
Topics to be covered are thermosetting polymers versus thermoplastics, thermosetting polymer curing, curing mechanisms (heat and light cured), network
formation, and an overview of key chemistries used (epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts). The course will provide a
more in-depth discussion of the chemistries, material properties, and process considerations for adhesives (both paste and film), capillary underfills,
packaging substrate materials, encapsulants (mold compounds), and coatings. In most cases, adhesives, underfills, mold compounds and coatings are
applied as a viscous liquid and then cured. The flow properties are critical to performance in high volume manufacturing. The final portion of the PDC will
provide an introduction to rheological characterization methods (various types of rheometers and viscometers) and the properties of adhesives (shear
thinning, viscosity, time dependence, rheology changes during curing), underfills, and mold compounds.
Who Should Attend?
Packaging engineers and R&D professionals involved in the development, production, and reliability testing of semiconductor packages would benefit from
the course.
Dr. Jeffrey Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal,
Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success solving complex polymer problems, directing new product
development, and enabling clients to improve the financial impact of their polymer technologies. Jeff has consulting experience with companies ranging from early-stage start-ups
to Fortune 50 companies. Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to present lectures and short courses at national
technical conferences. He has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds
13 issued US patents, and has 8 patents pending. Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical
Engineering/Materials Science from Marquette University.
PDC7: Hermetic Sealing and Testing of Small Volume MEMS Packages
Course Leader: Thomas J. Green, TJ Green Associates LLC
Course Description:
Reliable packaging of MEMS requires the ability to create and maintain a suitable inert atmosphere or vacuum inside the package cavity for the expected
lifetime of the device. Traditional hermetic ceramic/metal packages are being replaced by wafer level packaging techniques, which present unique
challenges from a hermeticity testing perspective. This course begins with an overview of traditional hermetic sealing processes along with wafer level
MEMS packaging processes and methods. In some cases near-hermetic packages, such as LCP are suitable in some applications. Testing of small cavity
MEMS packages according to the traditional Mil Spec TM 1014 requirements may not be sufficient to guarantee reliable operation. Difficulties and limitations
in fine leak testing of small volume packages will be addressed. Recent advances in Optical Leak Testing (OLT), Cumulative Helium Leak Detection (CHLD)
along with other hermeticity techniques are reviewed in light of the new, tighter leak rate hermeticity specifications. Moisture ingress is of primary concern for
a small volume MEMS cavity packages. Moisture level vs. surface area to volume ratio is an important concept, along with material outgassing and the
potential to mitigate these problems with getters. These along with other critical MEMS packaging issues are addressed in this PDC.
Who Should Attend?
This PDC is intended as an introductory level course for process engineers, designers, quality engineers, and managers responsible for packaging and
hermetic testing of cavity style MEMS.
Thomas J. Green is an independent consultant and respected teacher. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com) a veteran owned small business
specializing in teaching and consulting for the microelectronics industry. Tom previously worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he
was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites.
Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented many technical
papers and co-authored the latest release of MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow and has worked as a hermeticity consultant for a
variety military and medical companies. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah.
PDC8: Area Array Microelectronics Package Reliability
Course Leader: Amaneh Tasooji, Arizona State University
Course Description:
The objective of this workshop is to provide an overview on area array package reliability analysis and tools, and bestow awareness on critical factors
impacting microelectronics packaging integrity. Area Array microelectronic packages with small pitch and large I/O count grid array are used in commercial
and military applications. Reliability and risk assessment analysis of these widely used packages is a critical element of product design and field support.
Current practice in reliability focuses on accelerated-testing of manufactured components (representing the factory and OEM assembly, shipping and
storage, on/off environment, and user interface) and monitors component failure under these conditions. Acceleration Factor (AF) is determined using the
accelerated test data, and the performance/reliability of the package under “use condition” is then predicted. Statistical methods and Life prediction
methodologies are used in conjunction with local/global elastic- and/or inelastic-stress/strain analysis for component reliability assessment. This workshop
briefly reviews area array design and discusses reliability approach, focusing on solder joints and reviewing the impact of various parameters (e.g.,
materials, design, and processing parameters) on joint reliability. Deformation and failure mechanisms (e.g., creep and fatigue) influencing reliability of
solder joints are discussed in detail.
Who Should Attend?
Engineers in R&D, QA, QC, manufacturing, process development, and advanced technicians. It is assumed that participants have some familiarity with area
array packages and general device assembly technologies.
Dr. Amaneh Tasooji has more than 23 years of industrial and academic experience in engineering and manufacturing. She received her Ph. D. in Materials Science and
Engineering from Stanford University in 1982 and has B. S. degree in Physics. Dr. Tasooji has extensive/diverse technical knowledge in materials and processing, component
design, manufacturing, and quality/reliability in many industries such as microelectronics, aerospace, and nuclear. She has had many technical and leadership responsibilities
while at Honeywell/AlliedSignal and has developed many materials behavior, deformation, and fracture models for reliability analysis. Dr. Tasooji was the recipient of many
technical/engineering and leadership awards including ASTM Sam Tour Award for distinguished contribution to research, development, and evaluation of corrosion testing and
modeling. Dr. Tasooji has developed and delivered many graduate engineering courses (e.g., Introduction to Micro-electronic Packaging, Overview of Materials Science and
Engineering for Microelectronics Packaging, Advanced Packaging Analysis and Design: Material Considerations, Nuclear Materials) and many undergraduate courses at Arizona
State University (ASU). She has leveraged new technology and e-learning concepts in developing and offering conventional (face-to-face) and hybrid courses (on-campus and
distance training) at ASU, emphasizing Interactive Learning concept, and providing professionals with tools/opportunity for continuous learning.
6
TUESDAY, MARCH 8, 2011
Morning Technical Sessions
7:00 am – 7:00 pm
Registration
7:00 am – 8:00 am
Continental Breakfast
8:00 am – 8:20 am
OPENING COMMENTS
KEYNOTE – 3D Packaging
8:20 am – 9:05 am
Demand and Applications for 3D TSV
Jerome Baron, Analyst
Yole Développement, Inc.
KEYNOTE – Flip Chip & Wafer Level Packaging
9:10 am – 9:55 am
Flip Chip and Wafer Level Packaging - Past, Present and Future
Peter Elenius, Managing Partner
E&G Technology Partners LLC
10:00 am – 10:30 am
Break in Exhibit Hall
10:00 am – 7:00 pm
Exhibition and Technology Showcase
3D Packaging
10:30 am – 11:00 am
11:00 am – 11:30 am
MEMS
TA1:
3D: Marketing & Products
Chair: Ron Huemoeller, Amkor Technology, Inc.
TA2:
MEMS: Laminate and Polymer MEMS
Chairs: Stefan Gassmann, University of Rostock; Robert
Dean, Auburn University
TA3:
Wafer Level Packaging – Process Technologies
Chairs: Lars Boettcher, Fraunhofer-IZM; Andrew
Strandjord, Pac Tech USA
3D TSV Products
TBD
High Throuput Fluidic PCBs for Medical Devices
SUEX Laminates for Fan-Out and eWLB Development
Stefan Gassmann, Lienhard Pagel, University of Rostock
Donald W. Johnson, Bin-Hong Tsai, DJ DevCorp.
Can High Density 3D Through Silicon Stacking
Replace Lithography-Driven CMOS Scaling as the
Engine for the Semiconductor Industry
Flexible Metamaterials RF Filters Implemented through
Micromachining LCP Substrates
Evaluation of Low Stress Photo-Sensitive Spin On
Dielectric Layers for Through Silicon Via (TSV)
Copper Redistribution Layers
Jonathan Richard, Robert Dean, Auburn University
Matt Nowak, Qualcomm, Inc.
11:30 am – 12:00 pm
Christopher Jahnes, IBM, T. J. Watson Research Center; Eric
Huenger, Scott Kisting, The Dow Chemical Company
EMC3D Products
3D Transmission Line Design for High Power RF
Components in Laminates
P. Sibelrud, Applied Materials
Sungjun Kim, Arthur Yang Zhang, Mark Bachman, G. P. Li,
University of California, Irvine
12:00 pm -12:30 pm
12:30 pm – 2:00 pm
Wafer Level Packaging
Results and Learning from 3D-IC MPW Runs
Flex PCB Based Microsystems for Mobility Applications
Robert Patti, Tezzaron Semiconductor Corporation
David Fries, Liesl Hotaling, Geran Barton, Stan Ivanov, Michelle
Janowiak, Matt Smith, University of South Florida
300mm Wafer-Level Image Sensor Packaging
Thorsten Matthias, Bioh Kim, Gerald Mittendorfer, Paul
Lindner, Moshe Kriman, Andrey Grinman, Alex Feldman, EV
Group
Process and Cost Reduction Improvements in Tin
Silver Electroplating of Wafers
Bob Forman, The Dow Chemical Company
Lunch in Exhibit Hall
(Food served from 12:30 pm – 1:30 pm)
Welcome Reception
Monday, March 8th
5:00 pm - 6:30 pm
All Attendees are Invited!
Exhibition and Technology Showcase
Tuesday, March 8th
10:00 am - 7:00 pm
Wednesday, March 9th
12:00 pm - 4:30 pm
7
TUESDAY, MARCH 8, 2011
Afternoon Technical Sessions
3D Packaging
2:00 pm - 2:30 pm
2:30 pm - 3:00 pm
3:00 pm – 3:30 pm
MEMS
TP1:
3D: Assembly & Packaging
Chair: Ron Huemoeller, Amkor Technology, Inc.
TP2:
MEMS Fabrication and Packaging
Chairs: Philip Reiner, CGI Federal; Bruce C. Kim,
University of Alabama
TP3:
Embedded Die and Fan-Out Wafer Level
Packaging
Chairs: Theodore Tessier, FlipChip International;
Eric Huenger, The Dow Chemical Company
Logic Assy on Interposer for TSV
Permanent Attachment of Silicon Structures via Joule
Heat Induced Welding
Cost Comparison of Fan-Out WLP vs. Embedded
Die
Adam R. Schofield, System Planning Corporation; Alexander A.
Trusov, University of California, Irvine; Andrei M. Shkel, DARPA
Alan Palesko, SavanSys Solutions LLC; Jan Vardaman,
TechSearch International, Inc.
Advanced 3DIC Stacking for Memory and Mobile
Applications
Packaging Related Failure Modes of Microelectronic
Components
Realization of Power Modules by Chip Embedding
Technology
Dave Hiner, Amkor Technology, Inc.
Michael Hertl, Insidix
Lars Boettcher, D. Manessis, S. Karaszkiewicz, A.
Ostmann, Fraunhofer IZM
Novel Die-to-Wafer Interconnect Process for 3DIC Utilizing a Thermo-Decomposable Adhesive
and Cu-Cu Thermo-Compression Bonding
Packaging Strategies for Mitigation of Mechanical Noise
in Sensor Systems
300mm Large Scale eWLB (embedded Wafer
Level BGA): Cost Effective Solution with
Performance
Mike Kelly, Amkor Technology, Inc.
Philip Reiner, Calvin W. Long, CGI Federal
Daniel N. Pascual, SEMATECH
Seung Wook Yoon, Yaojian Lin, Pandi C. Marimuthu,
Yeong J. Lee, STATS ChipPAC Ltd.
Break in Exhibit Hall
3:30 pm – 4:15 pm
4:15 pm - 4:45 pm
4:45 pm – 5:15 pm
A Novel Approach to 3D Chip Stacking
Mark Vandermeulen, Andrew Smith, Ron Csermak, ON
Semiconductor
Hetero-Structure Integration using an Atmospheric
Plasma Treatment for Surface Preparation before
its Interconnection
Packaging of MEMS for Integrated RF Circuit
Verifications
Ultrathin WLP Die Embedded Polyimide MultiLayer Wiring Board
Bruce C. Kim, Sai Evana, University of Alabama; Rahim Kasim,
Intel Corporation
Satoshi Okude, Masahiro Okamoto, Yoshinori Sano,
Nobuki Ueta, Osamu Nakao, Fujikura Ltd.
Cu MEMS
Impact of Process Improvements on Reliability of
RCP Technology During Scale-up to Large Panel
Format
Charles Ellis, Aubrey Beal, Robert Dean, Auburn University
Barbara Charlet, B. Charlet, L. Di Cioccio, N. Rochat, O.
Renault, L. Clavelier, C. Deguet, CEA-LETI / MINATEC
5:15 pm – 5:45 pm
5:45 pm – 7:00 pm
Wafer Level Packaging
George R. Leal, Scott Hayes, Dominic Koey, Tony Gong,
Doug Mitchell, Gao Wei, Jason Wright, Tony Vessa,
Freescale Semiconductor Inc.
Commercial-off-the-Shelf 3-Dimensional
Integration using Low Temperature Wafer Bonding
Silica Diatom Nanopore Membranes Combined with
Silicon MEMS
Stacking of Known Good Rebuilt Wafers without
TSV Industrial Applications
Sang Hwui Lee, Michael Khbeis, University of Maryland
Michael Goryll, Xiaofeng Wang, Shankar Ramakrishnan, KaiChun Lin, Kaushal Rege, Sandwip Dey, B. L. Ramakrishna,
Arizona State University
Christian Val, Pascal Couderc, Nadia Boulay, 3D PLUS
Reception in Exhibit Hall (sponsored by Williams Advanced Materials)
Fan-Out and Embedded Panel Discussion
Please join us for an interactive panel discussion on Fan-Out and Embedded Technologies. An executive panel has been assembled from several
of the leading microelectronics companies and institutes from around the world to discuss the latest Technologies, Market Trends, and
Infrastructure. The panel will be soliciting questions from the audience. See page 9.
7:00 pm – 8:30 pm
Moderators: Andrew Strandjord, Pac Tech USA; Linda Bal, Freescale Semiconductor
Panelists:
Tom Strothmann, Director of Business Development, STATS ChipPAC, Ltd.
Lars Boettcher, Embedded Die Manager, Fraunhofer IZM
Navjot Chhabra, Director of Advance Packaging, Freescale Semiconductor
John Hunt, Director of Engineering, ASE, Inc.
Thorsten Meyer, eWLB Project Manager, Infineon Technologies AG
A SPECIAL THANKS
TO THE
DEVICE PACKAGING CONFERENCE
SESSION CHAIRS, ORGANIZERS & SPEAKERS!
YOUR COMMITMENT IS GREATLY APPRECIATED!
8
Fan-Out and Embedded Panel Discussion
Tuesday, March 8, 2011
7:00 pm - 8:30 pm
Moderators: Andrew Strandjord, Pac Tech USA; Linda Bal, Freescale Semiconductor
Please join us for an interactive panel discussion on Fan-Out and Embedded Technologies. An executive panel has been
assembled from several of the leading microelectronics companies and institutes from around the world to discuss the
latest Technologies, Market Trends, and Infrastructure. The panel will be soliciting questions from the audience.
Images Courtesy of: Stats ChipPAC, IZM, Freescale, ASE, & Infineon
Panelists:
Tom Strothmann
Director of Business
Development
STATS ChipPAC, Ltd.
Lars Boettcher
Embedded Die Manager
Fraunhofer IZM
Navjot Chhabra
Director of Advance
Packaging
Freescale Semiconductor
John Hunt
Director of Engineering
ASE, Inc.
Thorsten Meyer
eWLB Project Manager
Infineon Technologies AG
2011 Texas Hold’em Tournament
Benefits The Microelectronics Foundation
Monday, March 7, 2011
7:00 pm - 10:00 pm
(Separate Registration - Limited Seating)
For more information and to sign up visit www.imaps.org/DevicePackaging/holdem2011.htm
Foundation Chair: Steve Adamson, Asymtek
Foundation Hold'em Chair: David Virissimo, Coining Inc/SPM
Calling all Poker players...
(Experience not required, Casino will hold a short training on the rules and strategy of the game for anyone interested)
Following the highly successful Ca-Si-No Night at the IMAPS 2010 Raleigh Symposium, we are now hosting our first Texas Hold'em
Tournament. The number of seats at the tables is limited to the first 30 players. A $50 entry fee buys you one of the limited seats at
the table. Seats at the tables are on a first come first served basis, so sign up now. Prizes will be awarded to the top players.
Come join us for a great evening of fun and a chance to claim bragging rights as the IMAPS Texas Hold’em Champion. The IMAPS
Microelectronics Foundation thanks you in advance for your support.
Sign up today - www.imaps.org/DevicePackaging/holdem2011.htm
9
WEDNESDAY, MARCH 9, 2011
Morning Technical Sessions
7:00 am – 6:00 pm
Registration
7:00 am – 8:00 am
Continental Breakfast
KEYNOTE – MEMS
8:00 am – 8:45 am
Advanced Packaging for Multi-Axis Resonant MEMS Gyroscopes
Dr. Farrokh Ayazi, Professor & Co-Director
Georgia Institute of Technology
KEYNOTE – Passive
8:45 am – 9:30 am
RF System-in-Packages: History and Trend
Kai Liu, Senior Engineering Manager
STATS ChipPAC Ltd.
Break in Foyer
9:30 am – 10:00 am
3D Packaging
10:00 am - 10:30 am
MEMS
Emerging Technologies - LEDs
WA1:
3D: Materials & Processing
Chair: Paul Siblerud, EMC3D
WA2:
MEMS Gyroscope Devices & Systems
Chairs: Barry J. Gallacher, Newcastle University; A. A.
Trusov, University of California, Irvine
WA3:
LED Packaging
Chair: Jeff Perkins, Yole, Inc.
Aerosol Jet® Printer as an Alternative to Wire
Bond and TSV Technology for 3D Interconnect
Applications
Fundamentals of a MEMS Rate Integrating Gyroscope
that Exploits Wave Inertia
Silicon-Based Wafer-Level Packaging for Cost
Reduction of High Brightness LEDs
B. J. Gallacher, Newcastle University
Thomas Uhrmann, B. Kim, T. Matthias, P. Lindner, EV Group
Cost Effective Production of Glass Interposers for
3D ICs Using APEX™ Glass Ceramic
Temperature and Humidity Effects on MEMS Vibratory
Gyroscope
Advanced Laser Scribing for Emerging LED Materials
Jeb H. Flemming, Kevin Dunn, James Gouker, Carrie
Schmidt, Life MicroFab
Chandradip Patel, F. Patrick McCluskey, David Lemus,
University of Maryland
3D-IC Integration Using C2C or C2W Alignment
Schemes Together with Local Oxide Reduction
Towards a Parametrically Pumped Xylophone
Microbar Magnetometer: Design Optimisation of
Xylophone Bar Resonators
Michael O'Reilly, Michael J. Renn, Stephen Barnes,
Optomec, Inc.
10:30 am - 11:00 am
11:00 am - 11:30 am
Gilbert Lecarpentier, Jean-Stephane Mottet, Keith
Cooper, Michael Stead, SET - Smart Equipment
Technology
11:30 am - 12:00 pm
Marco Mendes, Jeffrey Sercel, Mathew Hannon, Cristian
Porneala, Xiangyang Song, Jie Fu, Rouzbeh Sarrafi, JP
Sercel Associates, Inc. (JPSA)
Packaging of High Brightness LED's
Lidia Lee, Paul Panaccione, Luminus Devices, Inc.
Harry T.D. Grigg, Newcastle University
Cu-Cu Thermocompression Bonding using Ultra
Precision Cutting of Cu Bumps for 3D-SIC
Design and Packaging of Ultra-High Q-Factor MEMS
for Inertial Applications
Taiji Sakai, Akamatsu Toshiya, Nobuhiro Imaizumi,
Miyajima Toyoo, Masataka Mizukoshi, Fujitsu
Laboratories Ltd.
A. A. Trusov, I. P. Prikhodko, S. A. Zotov, University of
California, Irvine; A. M. Shkel, DARPA
12:00 pm – 1:00 pm
Lunch in Exhibit Hall
12:00 pm – 4:30 pm
Exhibition and Technology Showcase
Packaging HB LEDs with Integrated Beamshaping
Michael Schilling, Plan Optik AG
$100 Discount
When you register for the "Combo Registration"
Device Packaging Conference & the Global Business Council Conference (GBC).
Early Registration Deadline: February 3, 2011
All registration fees increase after the deadline.
www.imaps.org/devicepackaging
10
WEDNESDAY, MARCH 9, 2011
Poster Session in Exhibit Hall
1:30 pm – 4:30 pm
Poster setup: 1:00 pm to 1:30 pm
High Temperature Gold Based Lead Free Solder
Heiner Lichtenberger, Williams Advanced Materials
Advances in Carrier Technologies for WLP and TSV Stacking
Thorsten Matthias, Jurgen Burggraf, Burgstaller Daniel, Paul Lindner, EV Group; Garrett Oakes, EV Group Inc.
Integrated Design and Full-Wave Analysis of Mixed Signal 3D Package Designs
Antonio Ciccomancini Scogna, CST of America; Taranjit Kukal, Brad Griffin, Cadence Design Systems, Inc.
Towards Making 3D Submicron Interconnects by Motion Controlled Direct-Writing of Metal Wires
Min-Feng Yu, Jie Hu, University of Illinois at Urbana-Champaign
Effect of Abnormal Intermetallic Compounds Growth of Component Side on Board Level Mechanical Reliability
Jae-Hoon Choi, Jeong-Sam Lee, Hui-Soek Kim, Samsung Electronics
New Cleaning Technology Solutions for Lead-Free Micro-Bumping Processes
Kimberly D. Pollard, Nichelle Wheeler, Allison Rector, Dynaloy LLC
Anisotropic Conductive Adhesive for Wafer-to-Wafer Bonding
M.M.V. Taklo, T. Bakke, H.R. Tofteberg, L.G.W. Tvedt, SINTEF ICT; H. Kristiansen, Compart
Low-Cost and High Throughput PR Stripping Solutions for Bumping Processes
John Moore, Jared Petit, Alex Brewer, Daetec, LLC; Neil Yoshizawa, Walter Albers, CBC (America)
Vertical LED with Diamond-Like Carbon (DLC) Interface for High-Power Illumination
Michael Sung, Chien-Min Sung, Kevin Kan, SinoDiamond LED
High Power Module Packaging Design for Harsh Environments
Andreas Larsson, O. Storstrom Barros, T.A.T. Seip, M.M.V. Taklo, T. Fallet, SINTEF ICT
IC Packaging Trends Causing Concern in Complete Removal of Solder Flux
Rich Brooks, Mike Bixenman, Kyzen Corporation
IMAPS Microelectronics Foundation Spring Golf Invitational
Benefits The Microelectronics Foundation
Thursday, March 10, 2011
1:00 pm - 7:00 pm
Desert Canyon Golf Club (www.desertcanyongolf.com)
1:00 pm Shotgun Start - “Best Ball” Scramble
(Separate Registration - Sign up today!)
For more information and to sign up visit www.imaps.org/DevicePackaging/golf2011.htm
Foundation Chair: Steve Adamson, Asymtek
Foundation Golf Co-Chairs: David Virissimo, Coining Inc./SPM; Ariel Torrente, St. Jude Medical
Arizona Chapter Golf Co-Chairs: Lee Smith, Amkor Technology, Inc.; Clark Fisher, LORD Corporation
Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for
six consecutive years.
A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00 pm. Golfers will tee off shortly after arriving at the course. Golfers are
welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.
Special Awards and Activities being planned: Closest to the Pin; Longest Drive; Longest Putt
Golf Sponsor: Teledyne Microelectronics
Sponsorship Opportunities Available, details online at www.imaps.org/DevicePackaging/golf2011.htm.
11
WEDNESDAY, MARCH 9, 2011
3D Packaging
2:00 pm - 2:30 pm
2:30 pm - 3:00 pm
3:00 pm - 3:30 pm
MEMS
WP3:
Flip Chip
Chairs: Alan Huffman, RTI
International; Linda Bal, Freescale
Semiconductor
WP4:
Passive Integration
Chairs: Bob Heistand, AVX
Corporation; Franck Murray, IPDIA
Through-Sapphire Via Development
A New Robust One-Shot Switch for
High-Power Pulse Applications
Flip-Chip Technology: Technologies,
Market Trends and Supply Chain
Low Profile 3D-IPD for Advanced
Wafer Level Packaging
Thomas A. Baginski, Robert N. Dean, Steven
P. Surgnier, Auburn University
Christophe Zinck, Jean-Marc Yannou,
Jérôme Baron, Phil Garrou, Yole
Développement
Catherine Bunel, Stephane Bellenger,
Sebastien Leruez, Lionel Lenoir, Franck
Murray, IPDIA
Laser Technology for Through-Silicon
Via and Microvia Drilling in Silicon for
3D Packaging Applications
Miniature MEMS Interface Circuits Using
Nanoparticle Conductors and Embedded
Components
Flip Chip Fine Pitch PBGA Yield
Study
Laser Processing of 2-D and 3-D
Structures for Tunable Embedded
Capacitors
Andy Hooper, Daragh Finn, Shane Noel,
Gregg Anderson, Jim O’Brien, Chi-Cheng
Lin, Electro-Scientific Industries
C. Paul Christensen, Potomac MesoSystems,
LLC
Novel Wet Chemical Copper
Metallization for Glass Interposers
Ultra High Temperature Sensor RFIDS
Syed Sajid Ahmad, Frederik Haring, Justin
Vignes, Kaycie Gestner, Aaron Reinholz,
North Dakota State University
Yang Zhang, Mark Bachman, G. P. Li,
University of California - Irvine
Tim Pham, Betty Yeung, Trent Uehling,
Brett Wilkerson, Freescale Semiconductor
Inc.
3D X-Ray CT Analysis of Solder
Joints in Area Array Electronic
Package Assemblies
Rajen Chanchani, Sandia National
Laboratories
Rabindra N. Das, Timothy E. Antesberger,
Francesco Marconi, Frank D. Egitto, Mark
D. Poliks, Voya R. Markovich, Endicott
Interconnect Technologies, Inc.
RF System in Packages (SiP) using
Integrated Passive Devices
Kai Liu, YongTaek Lee, HyunTai Kim,
Gwang Kim, Billy Ahn, STATS ChipPAC,
Ltd.
Break in Exhibit Hall
Evaluation of Electrodeposited
Photoresists for use in the Fabrication
of an Optochip Silicon Interposer
Cornelia K. Tsang, IBM, T. J. Watson
Research Center; Janet Okada, Eric
Huenger, The Dow Chemical Company
5:30 pm - 6:00 pm
Emerging Technologies - Passive
Integration
WP2:
MEMS Sensors and Actuators
Chairs: Tom Baginski, Auburn
University; Michael Kranz, Stanley
Associates
3:30 pm – 4:30 pm
5:00 pm - 5:30 pm
Flip Chip
WP1:
3D - Materials & Processing…cont.
Chair: Rozalia Beica, Applied
Materials
Simon Bamberg, Ralf Bruening, Johannes
Etzkorn, Frank Bruening, ATOTECH
Deutschland GmbH
4:30 pm - 5:00 pm
Afternoon Technical Sessions
TSV Resist and Residue Removal
Laura Mauer, John Taddei, Ramey
Youssef, Solid State Equipment
Corporation; Kimberly Pollard, Allison
Rector, Dynaloy
Formulation of Percolating Thermal
Underfill by Sequential Convective
Gap Filling
T. Brunschwiler, J. Goicochea, H. Wolf, C.
Kuemin, B. Michel, IBM Research GmbH
Electro-Magnetically Actuated
Frequency Addressable Switch
Effects of Under-Fill Curing on FlipChip Substrate Warpage
High-Frequency On-Chip Inductors
with Patterned CoZrTa Films
Minfeng Wang, Yang Zhang, G. P. Li, Mark
Bachman, University of California - Irvine
Robert L. Hubbard, Lambda Technologies
Inc.
Hao Wu, Wei Xu, Donald S. Gardner,
Saurabh Sinha, Tawab Dastagir, Bertan
Bakkaloglu, Yu Cao, Hongbin Yu, Arizona
State University
In-Situ Wafer-Level Polarization of
Electret Films in MEMS Acoustic Sensor
Arrays
Z-Axis Interconnection in Organic
Packaging
Silicon Interposers Enable High
Performance Capacitors
Michael Kranz, Mark Allen, Stanley
Associates; Tracy Hudson, U.S. Army
RDECOM AMRDEC
Frank Egitto, T. Antesberger, R. Das, V.
Markovich, S. Rosser, M. Schadt, W.
Wilson, Endicott Interconnect
Technologies
Sergey Savastiouk, Phil Marcoux, Jim
Hewlett, ALLVIA
A 0.18um CMOS Analog Front-End IC
for Gas Sensors
Flip Chip for Image Sensor
Packaging
Manufacturing Substrates with
Embedded Passives
Hyuntae Kim, Bertan Bakkaloglu, Arizona
State University
Deok-Hoon Kim, Young-Sang Cho,
OptoPAC; Peter Elenius, E&G Technology
Partners
Rabindra N. Das, Konstantinos I.
Papathomas, John M. Lauffer, Mark D.
Poliks, Voya R. Markovich, Endicott
Interconnect Technologies, Inc.
3D Panel Discussion: Memory Cube Readiness, Use and Logistical Challenges
Topics will cover the use of the Memory Cube in new products/applications, its readiness in the industry in general and all the associated challenges
with ownership of the logistical flow.
6:00 pm – 7:30 pm
Moderator: Matt Nowak, Qualcomm, Inc.
Panel Members: Ron Huemoeller, Amkor Technology, Inc., Bryan Black, Fellow, AMD; Dr. Philip. Garrou, IEEE Fellow, Yole
Developpment; Eric Strid, Cascade Microtech, Inc.
Do Not Miss Out On The Great Rates For 2011!
Register and Reserve Rooms On-line: www.imaps.org/devicepackaging
Hotel Deadline: February 3, 2011
Rates and availability will not be guaranteed after the deadline.
Early Registration Deadline: February 3, 2011
All registration fees increase after the deadline.
12
THURSDAY, MARCH 10, 2011
Technical Sessions
7:00 am – 11:30 am
Registration
7:00 am – 8:00 am
Continental Breakfast
3D Packaging
8:00 am - 8:30 am
8:30 am - 9:00 am
THA2:
Wafer Level Packaging - Applications
Chairs: Rey Alvarado, Maxim Integrated Products; In
Soo Kang, NEPES
THA3:
Flip Chip: Cu Pillar and Solder Bumps
Chairs: Peter Elenius, E&G Technology Partners
LLC; Steve Adamson, Asymtek
Failure Analysis and Reliability of 3D Integrated
System
3D SiP (System in Package) Solutions with Wafer
Level Package Technology
Cu Pillar Bumping Technology with Solder Alloy
Versatility
Peter Ramm, Armin Klumpp, Fraunhofer EMFT; German
Franz, Laurens Kwakman, FEI Electron Optics
In Soo Kang, Jong Heon (Jay) Kim, NEPES
Guy Burgess, Anthony Curtis, Tom Nilsson, Gene Stout,
Theodore G. Tessier, FlipChip International
3D Coaxial Through-Strata-Via (TSV) Evaluation
and Modeling
300mm Scaling of Critical Silicon Etches for Image
Sensor Wafer-Level Packaging Based on Tessera’s
MVP (TSV) Technology
fcCSP with Cu Pillar is Ready for Prime Time
10:30 am - 11:00 am
11:00 am - 11:30 am
Bernd K. Appelt, ASE Group Inc.; Harrison Chung,
Raymond Wang, Nantze Export Zone
Dave Thomas, Matthew Muggeridge, Mike Steel, Dorleta
Cortaberria Sanz, Hefin Griffiths, Oliver Ansell, SPP Process
Technology Systems Ltd.; Moshe Kriman, Andrey Grinman,
Hagit Gershtenman-Avsian, Tessera Technologies Inc.
Thermal Analysis for a Novel 3D Heterogeneous
Integrated Platform MorPack
Processing and Reliability Assessment of Silicon
Based, Integrated Ultra High Density Substrates
Shih-Lun Chen, Chun-Ming Huang, Chien-Ming Wu, ChihChyau Yang, Jin-Ju Chue, Shih-Lun Chen, Chi-Shi Chen,
Jiann-Jenn Wang, Tzi-Dar Chiueh, National Chip
Implementation Center (CIC)
Brian J. Lewis, D. F. Baldwin, P. N. Houston, Engent Inc.; B.
Smith, P. Kwok, J. Thompson. A. Mueller, L. Racz, Draper
Laboratory
Electromigration Reliability of Cu Pillar on Substrate
Interconnects in High Performance Flip Chip
Packages
Rajesh Katkar, Michael Huynh, Laura Mirkarimi, Tessera
Inc.
Break in Foyer
9:30 am – 10:00 am
10:00 am - 10:30 am
Flip Chip
THA1:
3D - Design, Thermal & Metrology
Chair: Ahmer Syed, Amkor Technology, Inc.
Zheng Xu, James Jian-Qiang Lu, Rensselaer Polytechnic
Institute
9:00 am - 9:30 am
Wafer Level Packaging
Through Package Defect Localization by Lock-In
Thermography
Wafer Level Package for MEMS with TSVs and
Hermetic Seal
Rudolf Schlangen, Herve Deslandes, DCG Systems, Inc.;
Toru Toda, Toshinobu Nagatomo, DCG Systems, KK;
Shigeki Sako, J-Device Co., Ltd; Hiromichi Sawaya,
Toshiba Semiconductor
Akinori Shiraishi, Mitsutoshi Higashi, Kei Murayama, Yuichi
Taguchi, Kenichi Mori, Shinko Electric Industries Co., Ltd.
2D/3D Inspection of mBumps & mPillars
Strategies for WLCSP Board Level Reliability
Enhancement
Copper Migration in Flip-Chip Substrates Under
Biased-HAST Conditions
Tony Curtis, Senthil Sivaswamy, Ronnie Yazzie, David
Lawhead, Theodore G. Tessier, FlipChip International
Matthew E. Stahley, John W. Osenbach, LSI Corporation
Hubert Altendorfer, KLA - Tencor
3D-TSV Test Options and Process Compatibility
Electrolytic Solder Deposition for IC-Substrates:
From Deposition Uniformity to Solder Ball
Geometry
Bernd Roelfs, Kai Matejat, Atotech Germany
Electromigration in Solder Joints for High
Temperature Flip-Chip Application
Ken Smith, Peter Hanaway, Mike Jolley, Reed Gleason,
Eric Strid, Cascade Microtech, Inc.
Mathias Nowottnick, University of Rostock; Andreas Fix,
Robert Bosch GmbH
11:30 am – 11:45 am
Closing Remarks
1:00 pm – 7:00 pm
IMAPS Microelectronics Foundation Spring Golf Invitational (Separate Registration - See Page 11 for more information)
Desert Canyon Golf Club (www.desertcanyongolf.com)
1:00 pm Shotgun Start - “Best Ball” Scramble
SPEAKER/PRESENTATION INFORMATION (DETAILS ON-LINE AT WWW.IMAPS.ORG/DEVICEPACKAGING)
Extended Abstract due: January 28, 2011. Required for oral and poster presenters.
Send your extended abstract (2-6 pages) via email to jmorris@imaps.org, in PDF format only.
PowerPoint/Presentation file used during session: Speaker’s responsibility to bring to session on USB and/or CD (recommended having
back-up on personal laptop, CD-ROM, or memory stick). Laptops will be provided by IMAPS in the session room.
IMAPS will be producing a CD-ROM of presentations after the event. All speakers are asked to email a PDF copy of his/her presentation to
Brian Schieman (bschieman@imaps.org) prior to the event, if possible; or Speaker must submit presentation material (preferably in PowerPoint
format, on CD or memory stick) at the Registration Desk at conference opening; otherwise the speaker’s PowerPoint slides that were saved on
the session laptops will be used. Presentations not received prior to the event or on-site will not be on the CD.
Speakers must register for the conference at the reduced speaker rate. Early registration deadline is February 3, 2011. Visit
www.imaps.org/devicepackaging for more information.
13
Device Packaging Exhibition and Technology Showcase
“An opportunity to talk to industry leaders”
Device Packaging 2011 will feature one collective Exhibition and Technology Showcase for vendors and
suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during
this Conference. This venue features an ideal atmosphere for exhibiting companies to showcase their products
and services to key decision making professionals in the industry and for a large focused audience of attendees
to engage these companies about the solutions they need.
Full 8' by 10' exhibit booths will be on display. A list of exhibiting companies can be found on page 15 and the
exhibit hall floor plan can be found on page 16.
There are only a few exhibit booths still available in the hall. The exhibits have sold out each of the past five
years, and will sell out again this year. If you have questions about exhibiting with IMAPS, or about getting
signed up for the 2011 Device Packaging Conference, contact Michael O’Donoghue at
modonoghue@imaps.org (202-548-8707) or Brian Schieman at bschieman@imaps.org (202-548-8715).
Exhibit Hours:
Tuesday - March 8
10:00 am - 7:00 pm
Refreshment Breaks, Lunch, and a Reception will be held in the Exhibit Hall.
Wednesday - March 9
12:00 pm - 4:30 pm
Refreshment Breaks, Lunch and a Poster Session will be held in the Exhibit Hall.
For more information, visit:
www.imaps.org/devicepackaging or contact IMAPS at 202-548-4001
________________________________________________________________________________
Exhibitors on the Device Packaging 2011 CD-ROM
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion
information on the Conference CD-ROM. Exhibitors must submit ONE pdf or word file, via e-mail,
containing the information you want to appear to bschieman@imaps.org on or before March 4, 2011.
Files must be sent to Brian Schieman (bschieman@imaps.org). Submissions must be as stated and arrive by
the deadline. There is no charge for participation.
Conference CD-ROM
Conference Hotel
If you are unable to attend the Conference and would like a
copy of the CD-ROM of Presentations, you may purchase a
copy by using the registration form. Your copy will be mailed
to you after the event.
RADISSON FORT MCDOWELL RESORT & CASINO
10438 NORTH FORT MCDOWELL ROAD
SCOTTSDALE/FOUNTAIN HILLS, AZ 85264
PHONE: 480-789-5300 OR 800-333-3333
The cost is $200 for members; $300 for nonmembers,* plus
shipping and handling.
Single/Double: $149/night
On-line at: www.radisson.com/hotels/azmcdowe. Promo. Code - IMAP11
By Phone: please mention IMAPS-Device Packaging Conference.
Reserve your copy on-line at
www.imaps.org/devicepackaging or call 202-548-4001.
Hotel Deadline: February 3, 2011
Rates and availability will not be guaranteed after the deadline.
*includes a one-year IMAPS individual membership.
14
Device Packaging Exhibition and Technology Showcase
Exhibiting Companies
(as of January 7, 2011)
The exhibit hall is nearly sold out, with only a few booths still available. The following companies will be on display during
Device Packaging 2011. Please visit the companies’ websites listed below for more information. A floor plan of the exhibit hall
can be found on page 16. If you have questions about exhibiting with IMAPS, or about getting signed up for the 2011 Device
Packaging Conference, contact Michael O’Donoghue at modonoghue@imaps.org (202-548-8707) or Brian Schieman at
bschieman@imaps.org (202-548-8715).
Company
Booth(s)
3D Plus USA
www.3dplus.com
Amkor Technology
www.amkor.com
Atotech USA Inc.
www.atotech.com/en/region/americas/usa.html
Azimuth Electronics, Inc.
www.azimuth-electronics.com
Boschman Technologies
www.boschman.com
CPS Technologies
www.alsic.com
DuPont Electronic Materials
www.wlpsolutions.dupont.com
Dyconex A.G.
www.dyconex.com
EV Group Inc.
www.evgroup.com
FRT of America, Inc.
www.frtofamerica.com
Hesse & Knipps, Inc.
www.hesse-knipps.us.com
Interconnect Systems, Inc.
www.isipkg.com
Laser Tech, Inc.
www. laser-tech-inc.com
40
39
22
42
49
41
23-24
21
61
25
1-2
37
44
Company
NAMICS Technologies
www.namics.co.jp
Oneida Research Services Inc.
www.ors-labs.com
Palomar Technologies, Inc.
www.palomartechnologies.com
Pure Technologies, LLC
www.puretechnologies.com
S.E.T.
www.set-sas.fr
Souriau PA&E
www.pacaero.com
SPP Process Technology Systems
www.spp-pts.com
TechSearch International, Inc.
www.techsearchinc.com
Teledyne Microelectronics
www.teledynemicro.com
Torrey Hills Technologies
www.torreyhillstech.com
Williams Advanced Materials
www.williams-adv.com
XYZTEC
www.xyztec.com
Yole Developpment
www.yole.fr
A SPECIAL THANKS
TO THE
DEVICE PACKAGING CONFERENCE
EXHIBITORS!
YOU ARE THE “GAS FOR THE IMAPS ENGINE”!
15
Booth(s)
38
15
16
47
50
43
14
20
33
48
51
19
32
Upcoming
Events...Mark Your Calendar!
Global Business Council (GBC) Spring Conference
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona - USA
March 6 - 7, 2011
www.imaps.org/gbc
Co-located with Device Packaging Conference and Exhibition (March 7 - 10)
IMAPS/ACerS 7th International Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2011)
The Westgate Hotel
San Diego, California - USA
April 5 - 7, 2011
www.cicmt.org
ATW and Tabletop Exhibition on Think Thin: IC Packaging for the New Era of Mobile Devices
The Biltmore Hotel & Suites
Santa Clara, California - USA
May 4 - 5, 2011
www.imaps.org/thin
IMAPS/IEEE-CPMT ATW on Optoelectronic Packaging
McDonnell Douglas Engineering Auditorium
University of California - Irvine
Irvine, California - USA
June 28 - 30, 2011
www.imaps.org/opto
IMAPS/SEMI Joint Topical Workshop on Wire Bonding
Moscone Center
San Francisco, California - USA
July 14, 2011
www.imaps.org/wirebonding
Co-located with SEMICON WEST 2011
International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2011)
St. Catherine’s College Oxford
Oxford, United Kingdom
July 18 - 20, 2011
www.imaps.org/hiten
ATW and Tabletop Exhibition on RF and Microwave Packaging
The Crowne Plaza San Diego
San Diego, California - USA
September 20 - 22, 2011
www.imaps.org/rf
44th International Symposium on Microelectronics (IMAPS 2011)
Long Beach Convention Center
Long Beach, California - USA
October 9 - 13, 2011
www.imaps2011.org
17
IMAPS 2011 Symposium - Call for Papers
Bringing Together the Entire Microelectronics Supply Chain!
Long Beach Convention Center, Long Beach, California - USA
October 9 - 13, 2011
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach,
California, USA, and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS
Technical Committee seeks original papers that present progress on technologies “between the chip and the system.” The
44th Symposium on Microelectronics will cover four tiers of electronics: Industry, Systems & Applications, Design, and
Materials & Process. Abstracts should highlight the major contributions of the work in one or more of these four areas. All
abstracts submitted must represent original, previously unpublished work.
General Chair:
Mark Hoffmeyer, IBM Corporation
hoffmeyr@us.ibm.com
Technical Chair:
Richard Sigliano, Kyocera America, Inc.
rick.sigliano@kyocera.com
Technical Co-Chairs:
Europe: Ivan Ndip
Fraunhofer IZM
ivan.ndip@izm.fraunhofer.de
Industry
USA: Benson Chan
Endicott Interconnect Technologies, Inc.
benson.chan@eitny.com
Planned Sessions Include
Design
Consumer, Portable, and Wireless
Biomedical
Telecom
Defense and Security
Computing and Gaming
Automotive, Industrial, Harsh Environment Electronics
Applications
♦ Solar and Alternative Energy
♦
♦
♦
♦
♦
♦
Systems & Applications
♦ Flip-Chip and Wafer Bumping Processes and Reliability
♦ Underfill/Encapsulants and Adhesives
♦ Pb-Free Solder Materials, RoHS, Processes, and
Reliability
♦ Design for Reliability
♦ Package Reliability Testing
♦ Wirebonding and Stud Bumping
♦ Ceramic and LTCC Packaging
♦ Substrate Materials and Technology
♦ Printed Electronics
♦
♦
♦
♦
♦
♦
Electrical Modeling, Signal & Power Integrity
High Performance Interconnects and Boards
3D Packaging Approaches
Embedded and Integrated Passives
Wafer Level Packaging / CSP
Advanced Materials
Materials and Process
♦ Thermal Management
♦ Power Management
♦ Cost Reduction, Outsourcing and Supply Chain
Management
♦ Electromagnetic Interference (EMI)
♦ Sensors and Nano Packaging
♦ Emerging Technologies
♦ System Packaging
♦ Microwave & RF Applications
♦ Electrostatic Discharge (ESD) Protection
♦ Photonic / Optoelectronic Packaging
♦ Packaging for Extreme Environments
♦ MEMS Packaging
♦ LED Packaging
♦ Packaging of Compound Semiconductor Devices
Poster Session (Interactive Forum)
Outstanding papers that do not fit in planned or created sessions
will be considered for the interactive poster session.
Visit www.imaps2011.org for more information!
Please send your 250-300 word abstract electronically only using the on-line submittal form at: www.imaps.org/abstracts.htm
Abstract Cut-off Date: February 25, 2011
Notice of Acceptance: May 13, 2011
Final Manuscript Due: July 8, 2011
All Speakers are required to register for the symposium, but at a reduced registration fee in recognition of their contribution to the event.
Cash Awards Offered: $2000 for Best Paper of Symposium; $500 each for two Outstanding Papers of Symposium.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.
18
REGISTRATION FORM
REGISTER ON-LINE AT WWW.IMAPS.ORG/DEVICEPACKAGING
DEVICE PACKAGING CONFERENCE - MARCH 7 - 10, 2011
Member ID# _________________
‰ Dr. ‰ Mr. ‰ Ms.
First
Name________________________________M.I._____________Last
Company/Affiliation___________________________________________Job
Name_______________________________
Position___________________________
Address___________________________________________________________________________________________
City___________________________
Phone________________________
PAYMENT
State______
Zip____________
Country____________________________________
Fax_________________________
Email_____________________________________
DPC11
$_____________
$_____________
$_____________
$_____________
$_____________
$_____________
$_____________
Device Conference Fee:
GBC Only Fee:
Combo Fee:
Device Professional Course:
Device Additional Purchases:
Exhibit Booth Fee:
Total Payment Due:
‰ Enclosed is a check payable in US funds to IMAPS
REGISTRATION FEES: EARLY REGISTRATION ENDS 2/3/11
DEVICE CONFERENCE FEES
(On or before 2/3) (After 2/3)
‰Member (IMAPS)*
$650 $750
‰Non-Member*
$750 $850
‰Speaker* ‰Chair* ‰Chapter Officer*
$400 $500
‰Student*
$275 $375
‰Exhibits Only (does not include lunch)
FREE
$30
Exhibit Lunch (per person/per day) ‰Tuesday ‰Wednesday
GBC Only:
‰Member (IMAPS)*
‰Non-Member*
$525 $575
$725 $775
COMBO FEES (REGISTER FOR BOTH AND SAVE $100)
Charge my fees to:
‰ AMEX ‰ VISA ‰ MC ‰ Discover
Card#______________________________ Exp.___________
Signature __________________________________________
Card billing address, if different from above: (required)
_______________________________________________________
_______________________________________________________
Email address required to receive confirmation of registration.
For Wire Transfer information call 202-548-4001.
Mail this form with payment to: IMAPS * 611 2nd Street, NE * Washington, DC
20002-4909. For credit card transactions, register on-line: www.imaps.org; or
register by phone with your credit card by calling 202-548-4001; Fax: 202-5486115. Additional information? E-mail: IMAPS@imaps.org, or visit our web
site: http://www.imaps.org. Cancellations will be refunded (less a $50
processing fee) only if written notice is postmarked on or before Friday,
February 18, 2011. No refunds will be issued after that date.
Device & GBC: $100 savings already calculated in price below.
‰Member (IMAPS)*
$1075 $1225
‰Non-Member*
$1375 $1525
‰Speaker* ‰Chair* ‰Chapter Officer*
$825
$975
‰Student*
$450
$600
*Includes one-year IMAPS individual membership or membership renewal at
no additional charge. Does not apply to corporate or affiliate memberships.
Conference Fee includes an Abstract book, all meals listed and a CD-ROM of
presentations. CD will be mailed 15 business days after the event.
DEVICE PROFESSIONAL DEVELOPMENT COURSES - 1/2 DAY
Monday, March 7: 8 am - Noon
‰3D Integration: Tech, Apps & Markets....PDC1
‰Chip Attach, Flip Chip Technology....PDC2
‰MEMS Reliability & Packaging....PDC3
‰Fundamentals of Microelectronic Packaging....PDC4
Monday, March 7: 1 pm - 5 pm
‰Introduction to MEMS Design & Fabrication....PDC5
‰Polymers in Semiconductor Packaging....PDC6
‰Hermetic Sealing & Testing....PDC7
‰Area Array Microelectronics....PDC8
$400 $450
$400 $450
$400 $450
$400 $450
$400 $450
$400 $450
$400 $450
$400 $450
DEVICE ADDITIONAL PURCHASES
‰Guest/Family Member (meals only)
‰CD of Presentations (Member Rate)
‰CD of Presentations (Non-Member Rate)
‰Add to Ship $7 (US) $25 (Overseas)
$150 $150
$200 $200
$300 $300
DEVICE EXHIBIT BOOTH (MARCH 8 - 9)
‰IMAPS Corporate Member
‰Non-Corporate Member
$1300 $1500
$2000 $2200
HOUSING (Hotel Cut-off is February 3, 2011)
Radisson Fort McDowell Resort and Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Ph: 480-789-5300 or 800-333-3333
Single/Double: $149/night
Web: www.radisson.com/hotels/azmcdowe. Promotional Code - IMAP11
By Phone: please mention IMAPS-Device Packaging Conference
"Return Service Requested"
IMAPS Registration
611 2nd Street, NE
Washington, DC 20002-4909
Presorted
First-Class Mail
U.S. Postage
PAID
Merrifield, VA
Permit No. 6418