Circuit card assembly
FEATURES AND CAPABILITIES
BAE Systems has more than 30
years of experience assembling
circuit cards for a wide range
of highly complex electronic
products. The company
maintains highly flexible
procurement, qualification,
and assembly operations and,
with more than 500 computers
in space, has the expertise,
experience, and technology to
service almost any assembly
need. BAE Systems processes
and products are qualified to
J-STD-001 Class 3, IPC-610
Class 3, NASA-STD-8739.3 and
other customer standards.
Leading-edge processes and equipment to
cover circuit card assemblies from component
preparation through testing and conformal
coating including:
– Lead-forming and enhancement
– PROM programming
– Automated surface-mount and through-hole
soldering capabilities
– Automated optical and X-ray inspection
– Core bonding
– Automated adhesive dispense for
component bonding
– Flying probe, ICT, and functional testing
– Precision hot-gas rework
– Conformal coating: acrylic, urethane,
and Parylene
– Automated spray coating
– Comprehensive assembly, inspection,
and test strategy
– Dedicated new-product Introduction team.
– Rapid prototyping (as quickly as two weeks)
– Sustaining product support
– Quick response to engineering and
design changes
– Focus on continuous improvement using —
– Demand-flow technology
– Visual management systems
– Flexible manufacturing layout
– An empowered work force
INTEGRATED MANUFACTURING CYCLE
Customer specifications
Space material management
Sample BAE Systems capabilities
– Mission-specific material screening
– Guaranteed material quality
– Data review, management, and retention
Customer designs
Sample BAE Systems capabilities
– QML ASIC fabrication line
Customer designs
Wafer fabrication
BAE Systems’ expertise in radiation hardness, low-power
design techniques, and qualifying designs for space flight can
assist in optimizing algorithms, creating specifications and
plans, and estimating size, weight, power, and performance.
Component manufacturing
BAE Systems products offer the building blocks to implement
the design — e.g., RAD750 GP CPU, high-performance DSP,
reconfigurable computing architecture, custom ASICs,
advanced FPGAs, adaptive point-of-load power systems.
Sample BAE Systems capabilities
– QPL packaging line
Customer designs
Sample BAE Systems capabilities
– Space card assembly line
Space circuit card manufacturing
Customer designs
Sample BAE Systems capabilities
– Environmental test facilities
BAE Systems’ expertise in determining material screening
needs based on mission requirements has yielded excellent
material reliability.
Testing
BAE Systems’ semiconductor manufacturing line and flight
card assembly line are co-located within the design facility,
allowing interactive optimization of design, schedule, and
cost criteria.
Flight-certified test equipment and facilities accommodate test
of materials and assemblies at all stages of manufacturing.
FOR MORE INFORMATION, CONTACT:
BAE Systems
9300 Wellington Road
Manassas, Virginia 20110-4122
Telephone 800 RAD750A or 866 530 8104
www.baesystems.com
Cleared for open publication on 07/09
This document gives only a general description of the
product(s) or service(s) and, except where expressly
provided otherwise, shall not form any part of any
contract. From time to time, changes may be made in
the products or the conditions of supply.
©2009 BAE Systems
PUBS-09-D36