Wideband 4 GHz, 43 dB Isolation at 1 GHz,
CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT Switches
ADG918/ADG919
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
Wideband switch: −3 dB @ 4 GHz
Absorptive/reflective switches
High off isolation (43 dB @ 1 GHz)
Low insertion loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 µA)
ADG918
RF1
RFC
50Ω
RF2
CTRL
50Ω
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
ADG919
RF1
RFC
RF2
03335-A-001
CTRL
Figure 1.
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG918 is an absorptive (matched) switch having
50 Ω terminated shunt legs, while the ADG919 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless
applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. –43 dB Off Isolation @ 1 GHz.
2. 0.8 dB Insertion Loss @ 1 GHz.
3. Tiny 8-Lead MSOP/LFCSP Packages.
–0.4
0
–10
–0.6
VDD = 2.5V
TA = 25°C
–0.8
–1.0
INSERTION LOSS (dB)
–20
ISOLATION (dB)
–30
–40
–50
S12
–60
–70
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
S21
–100
10k
100k
1M
10M
100M
FREQUENCY (Hz)
–3.0
1G
10G
03335-A-003
–90
Figure 2. Off Isolation vs. Frequency
–3.2
10k
VDD = 2.5V
TA = 25°C
100k
1M
10M
100M
FREQUENCY (Hz)
1G
10G
03335-A-004
–80
Figure 3. Insertion Loss vs. Frequency
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
ADG918/ADG919
TABLE OF CONTENTS
ADG918/ADG919–Specifications ................................................. 3
Absorptive vs. Reflective ........................................................... 12
Absolute Maximum Ratings............................................................ 4
Wireless Metering....................................................................... 12
ESD Caution.................................................................................. 4
Tuner Modules............................................................................ 12
Pin Configuration and Function Descriptions............................. 5
Filter Selection ............................................................................ 12
Terminology ...................................................................................... 6
ADG9xx Evaluation Board ........................................................... 13
Typical Performance Characteristics ............................................. 7
Outline Dimensions ....................................................................... 14
Test Circuits..................................................................................... 10
Ordering Guide .......................................................................... 14
Applications..................................................................................... 12
REVISION HISTORY
9/04—Changed from Rev. 0 to Rev. A
Updated Format..................................................................Universal
Change to Data Sheet Title …………………………………….1
Change to Features…………..…………………………………...1
Change to Product Highlights…………………………………...1
Changes to Specifications.……..………………………………...3
Change to ADG9xx Evaluation Board section...……………….13
Changes to Ordering Guide…………………………………….14
8/03 Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG918/ADG919
SPECIFICATIONS
Table 1. VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1
Parameter
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3
3 dB Frequency4
Input Power4
Symbol
tON
tOFF
tRISE
tFALL
P–1 dB
IP3
0 V dc Bias
0.5 V dc Bias
DC to 100 MHz; VDD = 2.5 V ± 10%
500 MHz; VDD = 2.5 V ± 10%
1000 MHz; VDD = 2.5 V ± 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
900 MHz/901 MHz, 4 dBm
VINH
VINH
VINL
VINL
II
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
0 ≤ VIN ≤ 2.75 V
CRF ON
CCTRL
f = 1 MHz
f = 1 MHz
IDD
Digital inputs = 0 V or VDD
S21, S12
Isolation—RFC to RF1/RF2
(CP Package)
S21, S12
Isolation—RFC to RF1/RF2
(RM Package)
S21, S12
Isolation—RF1 to RF2 (Crosstalk)
(CP Package)
S21, S12
Isolation—RF1 to RF2 (Crosstalk)
(RM Package)
S21, S12
Return Loss (On Channel)4
S11, S22
Return Loss (Off Channel)4
ADG918
S11, S22
Input Low Voltage
Input Leakage Current
CAPACITANCE4
RF1/RF2, RF Port On Capacitance
CTRL Input Capacitance
POWER REQUIREMENTS
VDD
Quiescent Power Supply Current
Min
B Version
Typ2
DC
Insertion Loss
On Switching Time4
Off Switching Time4
Rise Time4
Fall Time4
1 dB Compression4
Third Order Intermodulation Intercept
Video Feedthrough5
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
Conditions
57
46
36
55
43
34
55
41
31
54
39
31
21
22
22
18
17
16
30
0.4
0.5
0.8
60
49
43
60
47
37
58
44
37
57
42
33
27
27
26
23
21
20
6.6
6.5
6.1
6.1
17
36
2.5
Unit
2
4
7
16
0.7
0.8
1.25
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
10
9.5
9
9
1.7
0.65 VCC
± 0.1
0.7
0.35 VCC
±1
1.6
2
1.65
1
Max
0.1
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
V
V
V
V
µA
pF
pF
2.75
1
V
µA
Temperature range B Version: −40°C to +85°C.
Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
3
Point at which insertion loss degrades by 1 dB.
4
5
Guaranteed by design, not subject to production test.
The dc transience at the output of any port of the switch when the control voltage is switched from high to
low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
2
Rev. A | Page 3 of 16
ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS1
Table 2. (TA = 25°C, unless otherwise noted.)
Parameter
VDD to GND
Inputs to GND
Continuous Current
Input Power
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
θJA Thermal Impedance
206°C/W
LFCSP Package
θJA Thermal Impedance (2-layer board)
84°C/W
θJA Thermal Impedance (4-layer board)
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
Rating
–0.5 V to +4 V
–0.5 V to VDD + 0.3 V2
30 mA
18 dBm
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those listed
in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device
reliability. Only one absolute maximum rating may be applied at any one
time.
2
RF1/RF2 Off Port Inputs to Ground .............................. –0.5 V to VDD – 0.5 V
–40°C to +85°C
–65°C to +150°C
150°C
48°C/W
300°C
235°C
1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 4 of 16
ADG918/ADG919
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VDD 1
8 RF1
ADG918/
ADG919
7 GND
GND
3
RFC
4 (Not to Scale) 5 RF2
TOP VIEW
6 GND
03335-A-002
CTRL 2
Figure 4. 8-Lead MSOP (RM-8)
8-Lead 3 mm x 3 mm LFCSP (CP-8)
Table 3. Truth Table
CTRL
0
1
Signal Path
RF2 to RFC
RF1 to RFC
Table 4. Pin Function Descriptions
Pin No.
1
2
Mnemonic
VDD
CTRL
3, 6, 7
4
5
8
GND
RFC
RF2
RF1
Function
Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND.
CMOS or TTL Logic Level;
0->RF2 to RFC
1->RF1 to RFC
Ground Reference Point for All Circuitry on the Part
COMMON RF Port for Switch
RF2 Port
RF1 Port
Rev. A | Page 5 of 16
ADG918/ADG919
TERMINOLOGY
Table 5. Terminology
Parameter
VDD
IDD
GND
CTRL
VINL
VINH
IINL (IINH)
CIN
tON
tOFF
tRISE
tFALL
Off Isolation
Insertion Loss
P–1 dB
IP3
Return Loss
Video
Feedthrough
Description
Most positive power supply potential
Positive supply current
Ground (0 V) reference
Logic control input
Maximum input voltage for Logic 0
Minimum input voltage for Logic 1
Input current of the digital input
Digital input capacitance
Delay between applying the digital control input and the output switching on.
Delay between applying the digital control input and the output switching off.
Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.
Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.
The attenuation between input and output ports of the switch when the switch control voltage is in the OFF condition.
The attenuation between input and output ports of the switch when the switch control voltage is in the ON condition.
1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB.
Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced tones
are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By
measuring return loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates
degree of matching present at a switch RF port.
Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to
high without an RF signal present.
Rev. A | Page 6 of 16
ADG918/ADG919
TYPICAL PERFORMANCE CHARACTERISTICS
–0.2
–0.2
–0.4
–0.4
–0.6
–0.6
–1.0
–1.2
–1.2
INSERTION LOSS (dB)
INSERTION LOSS (dB)
–0.8
VDD = 2.5V
–1.0
–1.4
–1.6
VDD = 2.75V
–1.8
–2.0
–2.2
–2.4
–2.6
+25°C
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–2.8
TA = 25°C
–3.2
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
10G
VDD = 2.5V
–3.0
03335-A-017
–3.0
+85°C
–3.2
10k
100k
1M
10M
100M
FREQUENCY (Hz)
1G
10G
03335-A-018
VDD = 2.25V
–0.8
–40°C
Figure 8. Insertion Loss vs. Frequency over Temperature
(RF1/RF2, S12, and S21)
Figure 5. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
–0.30
0
–0.35
VDD = 2.75V
VDD = 2.5V
–10
–0.40
VDD = 1.65V TO 2.75V
TA = 25°C
–20
ISOLATION (dB)
–0.50
VDD = 2.25V
–0.55
–0.60
–0.65
S12
–50
–60
TA = 25°C
100k
–80
1M
10M
100M
FREQUENCY (Hz)
1G
10G
03335-A-019
–0.80
10k
–90
10k
S21
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
03335-A-020
–0.75
Figure 9. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
Figure 6. Insertion Loss vs. Frequency over Supplies (RF1/RF2,
S12, and S21) (Zoomed Figure 5 Plot)
0
–0.2
–0.4
–10
–0.6
VDD = 1.8V
–30
–1.2
ISOLATION (dB)
–1.4
–1.6
–1.8
–2.0
–2.2
VDD = 1.95V
–2.4
–2.6
–3.0
–3.2
10k
–40
–50
S12
–60
–70
–80
100k
S21
–90
TA = 25°C
1M
10M
FREQUENCY (Hz)
100M
1G
10G
03335-A-021
–2.8
VDD = 1.65V TO 2.75V
TA = 25°C
–20
VDD = 1.65V
–1.0
INSERTION LOSS (dB)
–40
–70
–0.70
–0.8
–30
–100
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
Figure 7. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
Rev. A | Page 7 of 16
03335-A-022
INSERTION (dB)
–0.45
ADG918/ADG919
–10
VDD = 2.5V
–20
CH1
–30
S12 (+85°C)
–50
CH2/3
–60
S12 (+25°C)
–70
–90
S21
(–40°C, +25°C, +85°C)
–100
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
CH1 = CTRL = 1V/DIV
TRISE = 6.1ns
CH2 = RF1 = 100mV/DIV
TFALL = 6.1ns
03335-A-024
S12 (–40°C)
–80
03335-A-023
ISOLATION (dB)
–40
CH3 = RF2 = 100mV/DIV
Figure 14. Switch Timing
Figure 11. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
0
–5
TA = 25°C
VDD = 2.5V
RETURN LOSS (dB)
–10
–15
OFF SWITCH (ADG918)
CTRL
–20
–25
–30
RFC
ON SWITCH
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
CH2 p-p
2.002mV
03335-A-026
–40
10k
CH1 500mV
Figure 12. Return Loss vs. Frequency (RF1/RF2, S11)
–20
CH2 1mVΩ
m 10.0ns
Figure 15. Video Feedthrough
40
–10
–15
03335-A-027
–35
TA = 25°C
VDD = 2.5V
35
–25
30
–30
25
IP3 (dBm)
–40
–45
–50
20
15
–55
–60
10
5
–70
–75
–80
10k
100k
1M
10M
100M
FREQUENCY (Hz)
1G
10G
0
250
VDD = 2.5V
TA = 25°C
350
450
550
650
FREQUENCY (MHz)
Figure 16. IP3 vs. Frequency
Figure 13. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
Rev. A | Page 8 of 16
750
850
03335-A-029
–65
03335-A-028
X–TALK (dB)
–35
ADG918/ADG919
20
18
16
12
10
8
6
4
VDD = 2.5V
TA = 25°C
2
0
0
250
500
750
1000
FREQUENCY (MHz)
1250
1500
03335-A-025
P–1dB (dBm)
14
Figure 17. P-1dB vs. Frequency
Rev. A | Page 9 of 16
ADG918/ADG919
TEST CIRCUITS*
VDD
0.1µF
VDD
VDD
VDD
VS
RF1
50%
VCTRL
RL
50Ω
CTRL
50%
RF2
CTRL
90%
VOUT
VOUT
NETWORK
ANALYZER
50Ω
RFC
VOUT
RFx
RFC
RL
50Ω
ADG919
50Ω
VS
10%
tON
03335-A-009
GND
tOFF
VCTRL
GND
03335-A-012
0.1µF
VOUT
INSERTION LOSS = 20log
VS
Figure 21. Insertion Loss
Figure 18. Switch Timing: tON tOFF
VDD
0.1µF
VDD
VDD
RF1
VDD
50%
50%
10%
tRISE
RF2
CTRL
90%
RL
50Ω
10%
tFALL
03335-A-010
VOUT
90%
GND
VCTRL
VOUT
GND
CROSSTALK = 20log
Figure 19. Switch Timing: tRISE, tFALL
VOUT
VS
Figure 22. Crosstalk
VDD
VDD
0.1µF
0.1µF
VDD
50Ω
ADG919
RF1
RL
50Ω
RFC
VS
VDD
RF2
CTRL
RF1
NC
RFC
NETWORK
ANALYZER
50Ω
ADG919
VOUT
OSCILLOSCOPE
RF2
CTRL
NC
OFF ISOLATION = 20log
VOUT
VS
GND
Figure 23. Video Feedthrough
Figure 20. Off Isolation
Rev. A | Page 10 of 16
03335-A-014
VCTRL
GND
03335-A-011
VCTRL
VS
50Ω
VCTRL
RL
50Ω
CTRL
50Ω
RFC
VOUT
RFx
RFC
VS
NETWORK
ANALYZER
ADG919
03335-A-013
0.1µF
ADG918/ADG919
VDD
VDD
0.1µF
0.1µF
ADG919
VDD
RF1
50Ω
RFC
RF2
CTRL
VCTRL
RF1
RF
SOURCE
SPECTRUM
ANALYZER
RF2
CTRL
Figure 24. IP3
VCTRL
GND
Figure 25. P-1dB
* Similar setups for ADG918
Rev. A | Page 11 of 16
RF
SOURCE
VS
RF
SOURCE
GND
50Ω
RFC
COMBINER
03335-A-015
SPECTRUM
ANALYZER
ADG919
03335-A-016
VDD
ADG918/ADG919
APPLICATIONS
required isolation between the transmit and receive signals.
The SPDT configuration isolates the high frequency receive
signal from the high frequency transmit.
LNA
ANTENNA
ADG918
Other applications include switching between high frequency
filters, ASK generator, FSK generator, and antenna diversity
switch in many tuner modules.
TX/RX SWITCH
03335-A-005
The ADG918/ADG919 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications. The most obvious application
is in a transmit/receive block, as shown in the wireless metering
block diagram in Figure 26.
PA
Figure 26. Wireless Metering
ABSORPTIVE VS. REFLECTIVE
TUNER MODULES
The ADG918 is an absorptive (matched) switch with 50 Ω
terminated shunt legs, and the ADG919 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG918 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a
need for a good VSWR that is looking into the port but not
passing the through signal to the common port. The ADG918 is
therefore ideal for applications that require minimum
reflections back to the RF source. It also ensures that the
maximum power is transferred to the load.
The ADG918 can be used in a tuner module to switch between
the cable TV input and the off-air antenna.
ANTENNA
ADG918/
ADG919
CABLE
TUNER
03335-A-006
VGA
Figure 27. Tuner Modules
FILTER SELECTION
The ADG919 can be used as a 2:1 demultiplex to switch high
frequency signals between different filters and also to multiplex
the signal to the output.
RFIN
WIRELESS METERING
RFC
The ADG918 can be used in wireless metering applications. It
can be used in conjunction with the ADF7020 transceiver IC for
a utility metering transceiver application, providing the
Rev. A | Page 12 of 16
ADG919
RF1
RF2
RF1
RF2
RFOUT
ADG919
Figure 28. Filter Selection
RFC
03335-A-007
The ADG919 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
This part is also ideal for use as an antenna diversity switch,
switching different antenna to the tuner.
ADG918/ADG919
ADG9XX EVALUATION BOARD
The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet the user’s requirements, the
user only requires a power supply and a network analyzer along
with the evaluation board. An application note is available with
the evaluation board and gives complete information on
operating the evaluation board.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062
inches. Two ground layers with grounded planes provide
ground for the RF transmission lines. The transmission lines
were designed using a coplanar waveguide with ground plane
model using a trace width of 0.052 inches, clearance to ground
plane of 0.030 inches, dielectric thickness of 0.029 inches, and a
metal thickness of 0.014 inches.
Rev. A | Page 13 of 16
03335-A-008
The RFC port (see Figure 29) is connected through a 50 Ω
transmission line to the top left SMA connector J1. RF1 and
RF2 are connected through 50 Ω transmission lines to the top
two SMA connectors J2 and J3, respectively. A through
transmission line connects J4 and J5 and this transmission line
is used to estimate the loss of the PCB over the environmental
conditions being evaluated.
Figure 29. ADG9xx Evaluation Board Top View
ADG918/ADG919
OUTLINE DIMENSIONS
3.00
BSC
8
3.00
BSC SQ
5
4.90
BSC
3.00
BSC
0.50
0.40
0.30
0.60 MAX
0.45
1
8
4
PIN 1
INDICATOR
TOP
VIEW
2.75
BSC SQ
0.50
BSC
PIN 1
PIN 1
INDICATOR
1.50
REF
BOTTOM
VIEW
5
1.90
1.75
1.60
4
0.65 BSC
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.23
0.08
0.80
0.60
0.40
8°
0°
SEATING
PLANE
0.90
0.85
0.80
SEATING
PLANE
0.25
MIN
0.80 MAX
0.65 TYP
12° MAX
1.60
1.45
1.30
0.05 MAX
0.02 NOM
0.30
0.23
0.18
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm x 3 mm Body
(CP-8)
Dimensions shown in millimeters
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG918BRM
ADG918BRM-500RL7
ADG918BRM-REEL
ADG918BRM-REEL7
ADG918BRMZ1
ADG918BRMZ-REEL1
ADG918BRMZ-REEL71
ADG918BCP-500RL7
ADG918BCP-REEL7
ADG919BRM
ADG919BRM-500RL7
ADG919BRM-REEL
ADG919BRM-REEL7
ADG919BCP-500RL7
ADG919BCP-REEL7
EVAL-ADG918EB
EVAL-ADG919EB
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Evaluation Board
1
Z = Pb-free part.
Rev. A | Page 14 of 16
Package Option
RM–8
RM–8
RM–8
RM–8
RM–8
RM–8
RM–8
CP–8
CP–8
RM–8
RM–8
RM–8
RM–8
CP–8
CP–8
Branding
W4B
W4B
W4B
W4B
W4C
W4C
W4C
W4B
W4B
W5B
W5B
W5B
W5B
W5B
W5B
ADG918/ADG919
NOTES
Rev. A | Page 15 of 16
ADG918/ADG919
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C03335–0–9/04(A)
Rev. A | Page 16 of 16
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