Process Change Notice #1104211
____________________________________________________________________________________________________
User Registration
Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document
updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content
available only to registered users. http://www.silabs.com/profile
PCN Date: 21Apr11
Effective Date: 26Jul11
Title: Si4702/03-C19 Family 3x3mm QFN Change to Copper Wire Bond Material - ASEKR
Originator: Sheila Alvarez
Phone: 65 6511 7757
Dept: Operations
Customer Contact: Kathy Haggar
Phone: 512-532-5261
Dept: Inside Sales
PCN Type:
Assembly
Discontinuance
Package
Test
Datasheet
Fabrication
Product Revision
Packing
Labeling
Location
Other
Last Order Date: 26Jul11
PCN Details
Description of Change:
Silicon Laboratories, Inc (Silicon Labs) is pleased to announce the adoption of copper wire used as
the wire bond material for the Si4702/03-C19 product family 3x3mm QFN packages at Advanced
Semiconductor Engineering in Korea (ASEKR).
ASEKR is an existing assembly site for Silicon Laboratories and is certified for ISO9001, ISO14001,
ISO/TS 16949 and is a Sony Green Partner.
Supplier
ASEKR (Au wire)
ASEKR (Cu wire)
SPIL
Unisem
Leadframe
Half Etched, Cu
C7025, Ring AgPlating
Half Etched, Cu
C7025, Ring Ag-Plating
Etched, EFTEC 64T
Pre-Plating
Cu C194, Half
Etched, Ring-Ag
Plating
Die Attach
Hitachi EN4900GC
Hitachi EN4900GC
Sumitomo 1033BF
Ablebond 8290
Wire bond
Mold
Compound
1.0 mil Au wire
0.9mil CuPd wire
1.0 mil Au wire
Sumitomo EME- G700
Sumitomo EME- G700
Sumitomo EME- G770
1.0 mil Au wire
Sumitomo EMEG7700HCD
Lead finish
Sn 100 (Matte Tin)
Sn 100 (Matte Tin)
Sn 100 (Matte Tin)
Sn 100 (Matte Sn)
Reason for Change:
This change provides equivalent electrical performance and minimizes the effect of cost increases
from gold.
Impact on Form, Fit, Function, Quality, Reliability:
There is no impact on form, fit, function, quality or reliability.
Devices assembled at ASEKR using copper wire as the bond material are identical to existing
products in form, fit and function. There is no change required for board layout or soldering
profiles. The devices meet all of the same Moisture Sensitivity Level (MSL) specifications and are a
direct drop-in replacement for existing packages. There are no changes to the mechanical
specifications or drawing. The devices continue to meet all RoHS requirements where applicable.
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
Process Change Notice #1104211
____________________________________________________________________________________________________
Product Identification:
This PCN applies to devices using the following ordering part numbers:
Affected Order Part Numbers (OPN)
SI4702-C19-GM
SI4703-C19-GM
SI4702-C19-GMR
SI4703-C19-GMR
The part number is marked on the device as shown in the example/s below:
Line 1 Mark:
Product ID
0219 for Si4702-C19-GM
0319 for Si4703-C19-GM
Line 2 Mark:
TTTT = Trace Code
Line 3 Mark:
YWW = Date Code
Line 2 of the Assembly Purchase Order form
Last digit of the current year (Y) and the work week (WW)
of the assembly date
Last Date of Unchanged Product: 26Jul11
Following the Effective Date of this PCN, Silicon Labs will utilize both copper wire and/or gold wire
as the bond material for Si4702/03-C19 product family 3x3mm QFN packages assembled at ASEKR.
Qualification Samples:
Available upon request. Please contact your local Silicon Laboratories sales representative to order
samples. A list of Silicon Laboratories sales representatives may be found at www.silabs.com.
Customer Early Acceptance Sign Off:
Customers may approve early PCN acceptance by completing the information below:
Early Acceptance Date:
Name:
Company:
Email your early Acceptance approval to: katherine.haggar@silabs.com
Qualification Data:
See Appendix A for the Qualification Report of all approved assembly materials. The Qualification
result is PASSED. ICP and MDDS reports are available upon request. A list of Silicon Laboratories
sales representatives is available at www.silabs.com.
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2
Process Change Notice #1104211
____________________________________________________________________________________________________
Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report
Si4702/03-C19, TSMC Fabrication, ASEKR Assembly except as noted
Test Name
Lot ID
or Start
Fail/Pass
or End
Notes
Q23521
0/78
1
Q23544
0/78
1
3 lots
Vcc=3.6V, 96 hours
Q23548
0/78
1
0/234
JA104
Q25083
0/80
1
Q23546
0/78
1
Q23549
0/78
1
Q25083
0/80
1
Q25109
0/79
1
6 lots
Q25115
0/76
1
0/471
Q23616
0/78
1
Q23617
0/78
1
3 lots
Q23618
0/78
1
0/234
Test Condition
Qualification
Summary
Status
Test Group A – Accelerated Environment Stress Tests - ASEKR
JA110
HAST
130°C, 85%RH
Cond C: -65°C to 150°C
Temp Cycle
3 lots, N=>25
3 lots, N=>25
500 cycles
JA103
HTSL
150°C, 1000hr
3 lots, N=>25
Pass
Pass
Pass
Test Group A – Accelerated Environment Stress Tests - ASEKR - Copper Wire
JA110
HAST
Temp Cycle
HTSL
Q29856
0/29
1
Q29848
0/30
1
3 lots
Vcc=5.5V, 192 hours
Q29840
0/28
1
0/87
JA104
Q29858
0/26
1
Q29850
0/26
1
3 lots
2000 cycles
Q29842
0/26
1
0/78
JA103
Q29857
0/28
1
Q29849
0/28
1
3 lots
Q29841
0/28
1
0/84
Q24692
0/80
1
Q24774
0/80
1
3 lots
Vcc=3.6V, 96 hours
Q24469
0/80
1
0/240
JA104
Q24689
0/80
1
Q24772
0/80
1
3 lots
500 cycles
Q24470
0/80
1
0/240
JA103
Q24554
0/80
1
Q24714
0/80
1
3 lots
Q24788
0/80
1
0/240
130°C, 85%RH
Cond C: -65°C to 150°C
150°C, 2000 hours
3 lots, N=>25
3 lots, N=>25
3 lots, N=>25
Pass
Pass
Pass
Test Group A – Accelerated Environment Stress Tests - Unisem
JA110
HAST
Temp Cycle
HTSL
130°C, 85%RH
Cond C: -65°C to 150°C
150°C, 1000hr
3 lots, N=>25
3 lots, N=>25
3 lots, N=>25
Pass
Pass
Pass
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3
Process Change Notice #1104211
____________________________________________________________________________________________________
Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report (cont)
Si4702/03-C19, TSMC Fabrication, ASEKR Assembly except as noted
Test Name
Lot ID or
Start
Fail/Pass
or End
Notes
423506.1
0/25
1
423881.1
0/25
1
3 lots
Vcc=3.6V, 96 hours
424560.1
0/25
1
0/75
JA104
423506.1
0/25
1
423881.1
0/25
1
3 lots
500 cycles
424560.1
0/25
1
0/75
JA103
423506.1
0/25
1
423881.1
0/25
1
3 lots
424560.1
0/25
1
0/75
Q24610
0/80
Q24973
0/125
3 lots
Vcc=3.6V, 1000 hours
Q25007
0/130
0/335
JA108
Q24611
0/80
Test Condition
Qualification
Summary
Status
Test Group A – Accelerated Environment Stress Tests - SPIL
JA110
HAST
Temp Cycle
HTSL
130°C, 85%RH
Cond C: -65°C to 150°C
150°C, 1000hr
3 lots, N=>25
3 lots, N=>25
3 lots, N=>25
Pass
Pass
Pass
Test Group B – Accelerated Lifetime Simulation Tests
JA108
HTOL
LTOL
125°C, Dynamic
-10°C, Dynamic
3 lots, N=>77
1 lot, N=>32
1 lot
Vcc=3.6V, 1000 hours
0/80
JA108
125°C, Dynamic
ELFR
Vcc=3.6V, 1000 hours
3 lots, N=>500
Pass
Q24555
0/501
Q24713
0/502
Q24790
0/502
Q25008
0/502
Q25060
0/1003
Q27432
0/993
Pass
6 lots
3
0/4003
Pass
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4
Process Change Notice #1104211
____________________________________________________________________________________________________
Appendix A: Si4702/03-C19-GM Copper Wire Qualification Report (cont)
Si4702/03-C19, TSMC Fabrication, ASEKR Assembly except as noted
Test Name
Test Condition
Qualification
Lot ID
or Start
Fail/Pass
or End
Q24453
0/3
Q24454
0/3
Notes
Summary
Status
Test Group E – Electrical Verification
JA114
ESD-HBM
1 lot, N=>3
±1kV
2
±2kV
Pass
JA115
ESD-MM
1 lot, N=>3
Q25031
0/3
Q24455
0/3
±40V
2
±125V
Pass
JC101
ESD-CDM
1 lot, N=>3
JESD78
Latch Up
±200mA
1 lot, N=>6
Overvoltage = 5.8V
Q24452
0/3
ASEKR
±750V
Q29422
0/3
ASEKR, Cu
±1000V
Q28689
0/3
SPIL
±1250V
Q24752
0/6
2
25C
Q24753
0/6
2
85C
Pass
Pass
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 5