FDN361BN 30V N-Channel, Logic Level, PowerTrench® MOSFET General Description Features These N-Channel Logic Level MOSFETs are produced using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance. • 1.8 A, 30 V. RDS(ON) = 110 mΩ @ VGS = 10 V RDS(ON) = 160 mΩ @ VGS = 4.5 V • Low gate charge These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. • Industry standard outline SOT-23 surface mount package using proprietary SuperSOTTM-3 design for superior thermal and electrical capabilities • High performance trench technology for extremely low RDS(ON) D D S S G G TM SuperSOT -3 Absolute Maximum Ratings Symbol TA=25oC unless otherwise noted Ratings Units VDSS Drain-Source Voltage Parameter 30 V VGSS Gate-Source Voltage ± 20 V ID Drain Current 1.4 A – Continuous (Note 1a) – Pulsed 10 Power Dissipation for Single Operation PD TJ, TSTG (Note 1a) 0.5 (Note 1b) 0.46 W –55 to +150 °C (Note 1a) 250 °C/W (Note 1) 75 Operating and Storage Junction Temperature Range Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient RθJC Thermal Resistance, Junction-to-Case Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity 361B FDN361BN 7’’ 8mm 3000 units ©2005 Fairchild Semiconductor Corporation FDN361BN Rev A(W) www.fairchildsemi.com FDN361BN 30V N-Channel, Logic Level, PowerTrench® MOSFET October 2005 Symbol Parameter TA = 25°C unless otherwise noted Test Conditions Min Typ Max Units Off Characteristics BVDSS ΔBVDSS ΔTJ IDSS Drain–Source Breakdown Voltage Breakdown Voltage Temperature Coefficient ID = 250 μA VGS = 0 V, ID = 250 μA,Referenced to 25°C Zero Gate Voltage Drain Current VDS = 24 V, 30 V 26 VGS = 0 V VDS = 24 V, VGS = 0 V, TJ = 55°C IGSS Gate–Body Leakage On Characteristics VGS = ±20 V, VDS = 0 V ID = 250 μA mV/°C 1 μA 10 μA ±100 nA (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, RDS(on) Static Drain–Source On–Resistance ID(on) On–State Drain Current VGS = 10 V, ID = 1.4 A ID = 1.2 A VGS = 4.5 V, VGS = 10 V, ID = 1.4 A, TJ = 125°C VGS = 4.5 V, VDS = 5 V gFS Forward Transconductance VDS = 5 V, ID = 1.4 A 4 VDS = 15 V, f = 1.0 MHz V GS = 0 V, 145 193 pF 35 47 pF 15 23 pF 1 2.1 3 V 92 120 114 110 160 150 mΩ 3.5 A S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance RG Gate Resistance Switching Characteristics td(on) Turn–On Delay Time tr Turn–On Rise Time Ω VGS = 15 mV, f = 1.0 MHz 1.6 VDD = 15 V, VGS = 10 V, ID = 1 A, RGEN = 6 Ω 3 6 ns 8 16 ns (Note 2) td(off) Turn–Off Delay Time 16 29 ns tf Turn–Off Fall Time 2 4 ns 1.3 1.8 Qg Total Gate Charge Qgs Gate–Source Charge Qgd Gate–Drain Charge VDS = 15 V, VGS = 4.5 V ID = 1.4 A, nC 0.5 nC 0.5 nC Drain–Source Diode Characteristics VSD trr Drain–Source Diode Forward Voltage Diode Reverse Recovery Time Qrr Diode Reverse Recovery Charge VGS = 0 V, IF = 1.4 A, IS = 0.42 A (Note 2) diF/dt = 100 A/µs 0.8 1.2 11 22 4 V nS nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 250°C/W when mounted on a 0.02 in2 pad of 2 oz. copper. b) 270°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2.0% FDN361BN Rev A(W) www.fairchildsemi.com FDN361BN 30V N-Channel, Logic Level, PowerTrench® MOSFET Electrical Characteristics 5 2.8 VGS = 10V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 4.5V ID, DRAIN CURRENT (A) 6.0V 4 3 3.5V 2 1 3.0V 2.6 2.4 VGS = 3.5V 2.2 2 1.8 1.6 4.0V 4.5V 1.4 5.0V 1.2 6.0V 10V 1 0.8 0 0 0.5 1 1.5 0 2 1 2 Figure 1. On-Region Characteristics. 5 0.25 ID = 1.4A VGS = 10V ID = 0.7A RDS(ON), ON-RESISTANCE (OHM) RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 4 Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 1.6 1.4 1.2 1 0.8 0.6 0.225 0.2 0.175 TA = 125oC 0.15 0.125 0.1 TA = 25oC 0.075 -50 -25 0 25 50 75 100 125 3 150 4 5 TJ, JUNCTION TEMPERATURE (oC) 6 7 8 9 10 VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. On-Resistance Variation with Temperature. Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 10 5 IS, REVERSE DRAIN CURRENT (A) VDS = 5V ID, DRAIN CURRENT (A) 3 ID, DRAIN CURRENT (A) VDS, DRAIN TO SOURCE VOLTAGE (V) 4 3 2 TA = 125oC 1 25oC -55oC 0 VGS = 0V 1 TA = 125oC 0.1 25oC 0.01 -55oC 0.001 0.0001 2 2.5 3 3.5 VGS, GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics. FDN361BN Rev A(W) 4 0 0.2 0.4 0.6 0.8 1 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. www.fairchildsemi.com FDN361BN 30V N-Channel, Logic Level, PowerTrench® MOSFET Typical Characteristics 10 200 VGS, GATE-SOURCE VOLTAGE (V) ID =1.4A VDS = 10V 180 15V 8 CAPACITANCE (pF) 20V 6 4 140 120 100 2 80 60 COSS 40 20 CRSS 0 0 0 0.5 1 1.5 2 2.5 0 3 5 Qg, GATE CHARGE (nC) 15 20 25 30 Figure 8. Capacitance Characteristics. 100 5 P(pk), PEAK TRANSIENT POWER (W) ID, DRAIN CURRENT (A) 10 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. 100μs 10 RDS(ON) LIMIT 1ms 10ms 100ms 1 1s VGS = 10V SINGLE PULSE RθJA = 270oC/W 0.1 DC TA = 25oC 0.01 0.1 1 10 100 SINGLE PULSE RθJA = 270°C/W TA = 25°C 4 3 2 1 0 0.01 0.1 1 VDS, DRAIN-SOURCE VOLTAGE (V) 10 100 1000 t1, TIME (sec) Figure 9. Maximum Safe Operating Area. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE f = 1 MHz VGS = 0 V CISS 160 Figure 10. Single Pulse Maximum Power Dissipation. 1 D = 0.5 RθJA(t) = r(t) * RθJA 0.2 RθJA = 270 C/W 0.1 o 0.1 P(pk) 0.05 t1 0.02 0.01 t2 TJ - TA = P * RθJA(t) Duty Cycle, D = t1 / t2 0.01 SINGLE PULSE 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec) Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDN361BN Rev A(W) www.fairchildsemi.com FDN361BN 30V N-Channel, Logic Level, PowerTrench® MOSFET Typical Characteristics TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16