ieee transactions on power electronics

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Call for Papers
IEEE Transactions on Power Electronics
Special Issue on Robust
Design and Reliability in Power Electronics
Scheduled Publication Time: August 2015
In recent years, the automotive and aerospace industries have brought stringent reliability constraints on power electronic systems
because of safety requirements. The industrial and energy sectors are also following the same trend, and more and more efforts are
being devoted to improving power electronic systems to account for reliability with cost-effective and sustainable solutions.
The paradigm shift in reliability research in power electronics is going on in terms of the design methodologies, reliability testing
concepts, and robustness validation approaches. Research on active switching devices, passive components, and interconnections
is of interest to have a better understanding on the component level reliability physics. Furthermore, with the consideration of
reliability as performance, the existing or new power converter topologies and control schemes are to be studied in multi-physics
domains. The fault-tolerant design and prognostic health management are also interesting research areas to provide additional
opportunities to ensure the reliable field operation of power electronic systems, especially in reliability-critical applications.
Prospective authors are invited to submit original contributions or survey papers for review for publication in this special issue.
Topics of interest include (but are not limited to):
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Robustness design – design for reliability in power electronics
Reliability in Capacitors, Power electronics devices – challenges
Handling reliability in embarked systems: automotive, aircraft and space applications
Modelling of life-time – life time prediction
• Stressors in reliability – impact and status
Failure mechanism in power semiconductor devices
• Testing for reliability – how to accelerate test activities
Mission profile modeling in renewable energy systems
• Optimization for reliability in power electronics
Design of modular power electronics systems for reliability • Reliability in wind turbine systems
Fault tolerant design of power electronic converters
• Life cycle cost analysis of power electronic systems
Prognostic methods in power electronics
• And other related topics to the title
All manuscripts must be submitted through Manuscript Central at http://mc.manuscriptcentral.com/tpel-ieee. Submissions must be
clearly marked “Special Issue on Robust Design and Reliability in Power Electronics, 2015” on the cover page. When uploading
your paper, please indicate, under step 4 – Details & Comments, that it is for the “Special Issue on Robust Design and Reliability
in Power Electronics 2015.” Refer to http://www.pels.org for general information about electronic submission through Manuscript
Central. Manuscripts submitted for the special issue will be reviewed separately and will be handled by the guest editorial board
noted below.
Deadline for Submission of Manuscript: April 1, 2014
Guest Editor-in-Chief: Frede Blaabjerg, Aalborg University, Denmark (fbl@et.aau.dk)
Guest Editor-in-Chief: Michael Pecht, CALCE, University of Maryland, US (pecht@calce.umd.edu)
Guest Associate Editors:
• Robert Balog, Texas A&M, US
• Maryan Saeedifard, Purdue Univ., US
• Huai Wang, Aalborg University, Denmark
• Rik De Doncker, RWTH, Aachen, Germany
• Tim Zgonena, Underwriters Laboratories, US
• Stan Atcitty, Sandia National Laboratories, US
• Barry Mather, NREL, US
• Aminul Huque, Electric Power Research Institute, US
• Thomas Levitsky, First Solar, US
• Pedro Rodriguez, Abengoa Research, Spain
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Faisal Khan, Univ. Utah, US
Alejandro Dominguez-Garcia, UIUC, US
Peter P. D. Rimmen, Danfoss Power Electronics, Denmark
Suresh Perinpanayagam, Boeing Prognostic Center, UK
Meir Adest, SolarEdge Technologies Inc., US
Henry S. H. Chung, City University of Hong Kong, HK
Sarah Kurtz, NREL, US
Thomas Key, Electric Power Research Institute, US
Thierry Lebey, LEGT, France
Timeline:
• December 2013 – April 2014 – Call for Papers in the Transactions and Newsletter
• April 1, 2014 – Manuscripts Submission Deadline
• August 1, 2014 – First Review Complete
• September 15, 2014 – Revised Manuscripts Due
• October 1, 2014 – Final Acceptance Notification
• December 15, 2014 – Final Manuscripts Due
• January 1, 2015 – Manuscripts Forwarded to IEEE for Publication
• August 2015 – Special Issue Appears in Transactions
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