Trends in Semiconductors for Power
Conversion and Energy Efficiency
INEMI Workshop
October 20, 2010
Dan Kinzer
Senior Vice President
Technology
www.fairchildsemi.com
Energy and Environmental Challenges
•Power capacity is not keeping pace with consumption
• At the current rate, total world energy consumption is expected to increase
57% from 2004 to 2030
• United States and China are the
world’s largest energy consumers
•Developing countries consume nonrenewable resources at an
accelerating pace
•Resulting greenhouse gas emissions
heighten environmental concerns
2
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Greenhouse Gas Emissions
Global Emissions by Sector in 2004
Greenhouse Gas Emissions by End Use
in the Residential Sector, 2007
Source: Energy Information Administration (EIA)
Annual Energy Outlook, 2009.
Source: Climate Change 2007: Mitigation. Contribution
of Working Group III to the Fourth Assessment Report of
the Intergovernmental Panel on Climate Change
*Note: “Other Energy Uses” includes small electric devices, heating
elements, and motors; such appliances as swimming pool and hot tub
heaters, outdoor grills, and outdoor natural gas lighting; wood used for
primary and secondary heating in wood stoves or fireplaces; and
kerosene and coal. “other electric Uses” includes color TVs(6%), PCs(2%),
furnace fans (2%), dishwashers (1%), freezers (1%), and clothes
washers (1%).
3
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Regulation and Policy Drive our Market
• Eco-friendly policies are moving the market WW
•
•
•
•
•
Energy Labeling, Energy Efficiency
80+ program driving converter efficiency toward 90%
Adoption of inverters in motor control applications
Change from traditional lighting to LED, CFL
Regional Examples:
• EU: EPBD (Energy Performance of Building Directive) : All new
buildings should consume zero energy from 2019
• EU: New Energy Labeling system
• For Eco-Design: <B grade prohibited for sale after July 2010
• Only A-20% & A-40% products can be sold after July, 2013/14
• US: Energy Star strengthening (eg, SEER12  SEER16 for A/C)
• China: New Energy Labeling System from June, 2010
• Japan: ‘Top Runner’ program with APF since 2006
•
Clean energy and IT advances create whole new markets
• Renewable energy: PV Inverter
• Smart Grid: E-Vehicle Charger and Smart Metering
4
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Fairchild Energy Savings Businesses
Fuel Efficiency
Induction
Heating
Variable
Speed Motors
Lighting
Higher
Efficiency Through
Innovative
Semiconductor
Solutions
Alt. Energy;
Smart Grid
Power
Supplies
Flat Panel
Displays
“Our greatest energy resource is the energy we currently waste.”
Former U.S. Secretary of Energy Spencer Abraham
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Why Smart Grids?
Variable Generation
High levels of penetration of
embedded wind and solar
generation on the horizon
(Feed-in-Tariffs)
Empowering The Customers
Choice
Customers want to
shop for the best
price…
Infrastructure Renewal
Current system either
reaching end of service life
or operating at maximum
capacity
Sustainability
They want to lower the
impact of their energy
consumption on the
environment…
PHEVs
Demand Response,
Storage and Distributed
Generation. All in one
Convenience
They want to do so with
little effort and no
noticeable impact on
quality of life…
Environmental Concerns
Public looking to our
industry to provide solutions
to climate change
6
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Current Grid vs Future Grid
Transmission Lines Carry
Electricity Long Distances
Power Plant
Generates
Electricity
Transformer Steps Up
Voltage For
Transmission
Distribution Lines
Carry Electricity
To Houses
Today’s Grid
 Centralize power generation
 Limited 2-way binary demand response
 Limited real-time data
 Reactive outage management system
 Limited customer choices
 Limited energy storage
Neighborhood
Transformer
Steps Down
Tomorrow’s Grid
 Distribute energy resources
 Flexible demand response
 Real-time distribution & customer data
 Real-time price signals
 Smart distribution system and processes
 Better customer information, choice & tools
 Energy storage devices
7
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Emerging Smart Grid Market
 Phase Ⅰ(in place)
- Smart metering (AMR :
Auto Meter Reading)
 Phase Ⅱ (2010~)
- Renewable energy
system (solar, wind etc)
- Battery charger/system
 Phase Ⅲ (2013~)
- Bi-directional converter &
inverter connected
battery systems
- Communication systems
for electricity monitoring
& control (AMI :
Advanced Meter
Infrastructure)
Source: SEGIS : Solar Energy Grid Integration Systems
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Emerging EV Charger in Smart Grid
home
wind power
solar
PHEV
charging stand
cogeneration
charging station
EV
power grid
Battery exchanging station
Power Source
-
Power Utilities
Wind power
Solar Energy
Cogeneration
Etc…
-
Charging Infra
Vehicle
Residence
Parking area
Shopping mall/hotel
Express way
Petrol
-PHEV
-EV
9
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Types of Green Car
10
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Charging Technology
11
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Example Plug-in HEV Configuration
120/140V
HV Battery +
BMS
(180V-400VDC)
650V
DC-DC
boost
Converter
DC/AC
Inverter
M
DC/DC
Converter
12V Battery
3-Phase
AC 220V(JP)
380V(KR)
440V(NA)
DC Charge Port
DC 400V 110A
AC/DC Quick
Charger
(50kW)
AC Link
DC Link
Off-board Charger - Installed in garage or carport etc
12
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Smart Metering
Smart Meter Shipment by Region
Block Diagram
Source: Pike Research
M.East/Africa
L.A.
Asia
Pacific
Europe
N.A.
Trends/Requirements
Products for Smart Meters
 High voltage tolerant, >1250V standoff voltage
 PWM Controllers
 < 5 watts majority of meters, but smaller volume at about
16 Watts
 Fairchild Power Switch (FPS)
 Power storage for radio after power fail, 20 minutes with
bursts of communication
 DC/DC, OPTO
 PWM+BJT+MOSFET
 Clean power for radio communication:
• DC to DC switched
• High efficiency for after grid power loss
13
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A Smart Home Example
Bidirectional Converter and
Home Energy Management Console
Plug-In
Hybrid EV
Energy
Storage
Solar PV
Grid
DC Bus
(380V)
DC Bus(48V)
Consumer Electronics,
TV, PC & etc
Smart Appliances,
Washers, A/C, Refrigerator & etc
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LED
Lighting
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Smart Grid Timeline
Application/
Market Segment
AMI
Demand
Response
Grid
Optimization
Distributed
Generation
Integration
Energy Storage
PHEV
Consumer
Energy
Management
Systems
2010
2015
2020
The first large-scale
deployments underway
Substantial and growing market
penetration and network
infrastructure build-out
Significant and wide-ranging
implementation
Limited reach(mainly
commercial and industrial
customers)
Substantial market penetration for
residential, commercial and industrial
Commonplace with a wide
variety of end-user service
programs
A handful utilities beginning
distribution/substation
automation projects
Sensor technology embedded on the
distribution network; automation
becoming routine
Dynamic Sensing everywhere;
Grid becomes an Intelligent
Utility Network
Nascent
Maturing, but still a small % of power
generation
Approaching Mainstream
More substantial presence;
A few pilots among
progressive utilities
Expected technology advancements
and increased Distribution Generation
penetration will boost storage’s role
Vital role in supporting
Distributed Generation
N/A
Smart Charging
V2G(vehicle-to-grid)
Successful pilots continue
to highlight consumer
demand
Gaining transaction as “self-it-andforget” technologies make energy
management simple to use and costeffective
Routine, Web-based
(Source: GTM Research)
15
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Renewable Energy Growth
10~25%
10~55%
10~55%
25~75%
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Renewable Energy Systems
Block Diagram
 Opportunities in PV
Inverter Market
• The PV inverter market is the
performance driven market
requiring high performance
power semiconductors including
IGBTs, SuperFET and SiC
diode/switches.
• The shipments of microinverters and distributed MPP
tracking solutions are forecast
to grow strongly. (77% CAGR
for CY 2010-2015)
Solar Panels
Wind
Power Gen.
To AC Loads
Charge
Control
Battery
Inverter
AC Load
Center
Battery
Charger
AC Generator
Transfer
Switch
AC Loads that only
run on Generator
Products Required :
 Superjunction MOSFETs, Field Stop Trench IGBTs, Stealth Diodes
 High voltage (600 & 1200V) and Low Voltage (30V) Drivers
 Optocouplers, PWM Controllers, MPPT Tracking, Smart Power Modules
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Energy Waste in Automobiles
Only about 15%
of the fuel energy
is used to move
the car or run
useful accessories
Source: www.fueleconomy.gov
18
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Automotive Power Solutions
Robust Auto Solutions for energy efficient applications
Engine Management
Ignition, Glow Plug
Injector control and supply
HID Lighting
El. Parking Brake
Engine Cooling
Electric Power Steering
Transmission and
Braking (ABS, ESC)
Gearbox
Electric pumps (water, fuel, oil)
DC/DC in HEV / EV
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Automotive Power Modules for EPS
•
EPS/EHPS:
• Saves fuel (up to 7%)
• Improves performance
• Simplifies mechanical design
Increasingly adopted in new vehicles conventional as well as EV/Hybrid
•
APM Modules help to:
•
•
•
•
20
Optimize power output
Improve reliability
Ease design through integration of
components
Ease installation due to compact
design
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Inverters in HVAC Compressors & Fans
 Energy Savings and High Performance
Energy Saving
Inverter control can save
average 40% electricity
than conventional on/off
control
Comfortable
In air conditioner,
Inverter can
- save cooling time
(50% faster)
- Precise temperature
control (±1ºC control)
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Silent
In fan motor, Inverter can
reduce audible noise
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Fairchild Solutions for Motor Control
d1
wsy
wtb
d3
Rectifier, PFC
d2
ds
wt
 ms
p
ws
Rrm
Rs
R ri
lm
wsi
wsb
R so
R ro
AC input
m
s
8
6
4
2
0
Power Supply
-2 1
46
91
136
-4
-6
-8
Communication
Interface & I/O
Motor Control IC
Power Module,
HVIC, MOSFET,
IGBT
BLDC,
PMSM
Motor
Fairchild provides all semiconductor
products required for driving BLDC Motor
Fairchild Shorted Anode Field-Stop IGBT
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Motion Smart Power Module Portfolio
Application
Mid. Power
Industrial Inv.
System A/C
 Save space
 Compact design
 Easier to meet efficiency & EMI
regulations
 Save development time
 Reduce time to the market
SPIM
600V / 50A ~ 100A
1200V / 30A ~ 75A
SPM2
Low Power
Industrial Inv.
600V / 15A ~ 75A
1200V / 10A ~ 20A
Package A/C
SPM3
600V / 3A ~ 30A
Room A/C
SPM45
W/M
Refrigerator
E-bike
Power tool
Vacuum
Cleaner
Pump
Dish washer
Fan motor
600V / 3A ~ 15A
40V / 60A
60V / 40A
SPM45H
SPM45L
SPM4
600V / 20A ~ 30A
SPM7
500V / 1A
SPM5





Easier procurement
Lower assembly cost
Higher yield
Higher efficiency
High quality and reliability
500V / 1A, 3A
250V / 3A
0.1kW
0.5kW
2kW
1kW
23
5kW
10kW
Capacity
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Application of Motion-SPM
 Motion-SPM is ideal for all types of motor driving solutions,
especially 3-phase motor drive applications.
P
Inrush
current
limit
Circuitry
AC
Power
Reference Design
R
for Motion-SPM
VNTC
5V
VDD
PFC Part
VTH
15V
(PFC-SPM,
PFC Controller)
VB
VS
P
RTH
VCC(H)
VCC
EMI
Filter
Part
μMini-DIP SPM
HVIC
VCC(L)
SMPS Part
VIN(H)
(FPS, Green FPS)
VIN(H)
VIN(L)
3Ø
V
V
W
W
BLDCM
VIN(L)
VFO
CSC
NU NV
3Ø
NW
5V
LPF
3Ø
MCU
Part
U
LVIC
COM
GND
U
3Ø
LPF
3Ø
FO
3Ø
N
[Application Example]
Air-Conditioner System Block Diagram using Motion-SPM
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Energy Savings in Heating Processes
Cooking Method
Efficiency
Induction
90%
Halogen
58%
Electric
47%
Gas
40%
Cost of heating ½ litre of water
from 20C to 95C
150
0.1
0.08
Power Consumption for heating ½
litre of water from 20°C to 95°C
100
0.06
50
0.04
0.02
0
gas
induction
halogen
radiant
induction
25
halogen
radiant
gas
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Induction Heating and Microwave Oven
•
•
•
The global penetration rate of inverter based
Microwave Ovens (MWO) was estimated to be
just over 10% in 2005
• Adoption of inverter technology for MWO
will improve the efficiency and the
performance of MWO
• The share of inverter based MWO is
projected to grow to 40 ~ 50%
Chinese manufactures start to design Induction
Heated (IH) rice cookers as the demand of
multifunction capabilities increase
Energy Efficiency labeling program in Asia
will also drive the market growth of IH rice
cooker and inverter based MWO
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Energy Efficiency in Computers
 80+ ATX: Energy Star program
for computer (V5.0) has affected
every tier since July, 2009
- Every ATX qualified Energy Star
should deliver > 82% of efficiency
@20, 50 and 100% of loads
- As EPA’s program, 80PLUS market is
dramatically increasing thru 2015
< 80+
80+ Gold Label
80+ Platinum Label
Major
Efficiency Level
N/A of regulation, but
70% efficiency of main
stream power
Over 88% at over 20%
load (gold) & start period
of platinum (Over 90% at
all load at 230V line)
Platinum (Over 90% at
over 20% load at 230V
line) will be major
Topology
Forward with schottky,
no active PFC
AHB, ACF, LLC with DCDC
for 3.3/5V and SR
LLC with DCDC and SR
will be major share
27
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Energy Savings in Servers
 Server Power Supply Unit Block diagram (600-800W)
> 90% efficiency for 600/700W Server Power
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MOSFET Power in Servers
Focus Areas
Server Vcore/DDR
PowerStage56 25V
Power33 25V PT8+
Power56 25V PT7/8+
Power56/33 Dual Cool
DrMOS Multi-ChipModule
Most Efficient Performance as Small as Possible
CPU 1
Romley VR Block Diagram
DIMM 1
12-19-07
KEY
Load
Jaketown (CPU)
VR12 Dual SVID
Vccp @ 126A
Vsa @ 3A
12V1a
5VSB
VCCP
DIMM3.3V3STBY
VDDR01
Zoar-Eathernet
1.0V AUX
1.0V @ 1.2A
Zoar
1.2V AUX
1.2V @ 0.8A
IBMC
VDDR23
DDR3 (4 DIMMs)
DDR3 VDDQ
VDDQ
1.5V @ 70A
DDR3 Vtt
0.75V @ 1.1A
VTT
DDR3 (4 DIMMs)
DDR3 VDDQ
Pattsburg (PCH)
VDDQ
1.5V @ 70A
DDR3 Vtt
OPTIONAL 12V SOURCE
1.8V AUX
1.8V @ 0.8A
VPLL
CPU VTT
1.05V @ 25A
OPTIONAL 12V SOURCE
PCI
3.3V @ 0.4A
VTT
CPU PLL
1.8V @ 1.2A
VR12 SVID combo
VR controler
DIMM 4
VSA
12V1b
VR
DIMM 2
Note: All currents are TDC (Thermal Design Current)
12V3
Server Point of Load
PowerStage56/34/33
Power33 PT7/8
Power56 PT7/8
TinyBuck Integrated
solution
CPU 2
0.75V @ 1.1A
VTT
12V3
1.1V PBG
5VSB
1.1V STBY
1.1V @ 1.1A
1.1V STBY
1.5V STBY
1.5V @ 0.4A
1.5V STBY
1.1V @ 21A
1.1V
1.5V
Jaketown (CPU)
VR12 Dual SVID
Vccp @ 126A
Vsa @ 3A
12V2a
VCCP
12V2b
VSA
VTT
CPU PLL
1.8V @ 1.2A
VPLL
VDDR01
VDDR23
DDR3 (4 DIMMs)
DDR3 VDDQ
VDDQ
1.5V @ 70A
DDR3 Vtt
OPTIONAL 12V SOURCE
0.75V @ 1.1A
DDR3 VDDQ
DDR3 Vtt
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2.5” HDD
VDDQ
1.5V @ 70A
OPTIONAL 12V SOURCE
VTT
DDR3 (4 DIMMs)
0.75V @ 1.1A
VTT
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MOSFET Power in Notebooks
Focus Areas
Notebook Vcore
PowerStage 5x6 Duals 30V
Power33 NCH 30V sub 3mOhm
Power56 30VPT8S
Cost Effective Performance as Small as Possible
Notebook DC:DC/Battery
PowerStage Dual 30V – 3x3,
3x4.5, 5x6
Power33 NCH 30V 3-30mOhm
Power56 NCH 30V 3-15mOhm
Power33 PCH 30V ST3
Power33 NCH 30V Dual CoolTM
N VDC Notebook/Tablet
PowerStage Duals – 25V
Power33 NCH 25V Dual CoolTM
Power33 PCH 25V ST3
Power22 NCH 25V PT7
CSP 20V NCH Zener PT7
Power33 NCH 100V (LED BLU)
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Display Market Trends
LCD TV [LED BLU] Mset
LCD TV [CCFL BLU] Mset
PDP TV Mset
CRT TV Mset
300
100%
90%
250
80%
2%
200
23%
150
39%
19%
39%
70%
56%
69%
72%
76%
51%
5%
60%
50%
63%
6%
57%
40%
43%
100
8%
72%
50
19%
7%
55%
41%
2008
15%
7%
17%
11%
0
2007
18%
7%
27%
2006
30%
31%
2009
2010
2011
20%
10%
7%
7%
7%
4%
7%
3%
7%
3%
2012
2013
2014
2015
0%
Source: Displaybank and iSuppli
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LED Backlight Unit for LCD TV
Reduced Thickness
More image producing
15 mm
Vividness
Slim
50 mm
Low power
Local dimming & scanning
42” LCD TV
(CCFL BLU)
55” LED LCD TV
LCD TV (CCFL BLU)
Better contrast
Dark black
Non-motion blur
LED LCD TV
46
”
32
55”
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MOSFET Power in LED LCD TVs
Efficient and Reliable Performance as Cool as Possible
Focus Areas
LED BLU : Main Switching FET
N-CH PT5 100V
N-CH PT5 150V
N-CH PT7 40V
Power33, Power56, SOT223
and DPAK
T-Con Board
PM IC
SMPS
Rectifier
Video Board
Isolated DCDC
Analog
VCOM Buffer
Boost
Gamma corrector
Boost
Level shifter
LLC
Buck
Micom
PFC
Buckboost
GPM
Buck
Buck
Timing controller
RF Tuner
Stand by
LDO
LDO
LDO
PCI
Interface
Source driver
Analog/
Digital I/O
AMP
Display
Gate driver
LED BLU : Sync MOSFET
N-CH PT5 100V
N-CH PT5 150V
N-CH PT5 200V
Power33, SOT223 and DPAK
LED Backlight
LED driver board
WLED backlight
& Optical structure
T-Con Board & Video Board :
PowerStage Duals – 30V
Power33 NCH 30V PT7
33
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Energy Saving in Notebook Adapter
Power Factor Correction High Side
Quasi-resonant Combo Driver
Synchronous
Rectifier Controller
• Next gen of NB adaptor solutions to meet
92%+ efficiency
• High integration provides cost effective
design
• Wider power range 75W~250W
• Allows for very slim design
ISR
VOUT
1
•
Current mainstream solution for NB
adaptors
•
Meets 90%+ efficiency, high integration ,
75W~150W
Q2
3
R1
FAN6921
5
VDD
R3
LPC
RES
8
R2
PFC + QR combo
GATE
FAN6204
4
GND
6
7
R4
AGND
Synchronous Rectifier Controller
34
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Energy Savings: Standby Power
Potential Energy Savings with
conversion to FCS IC
Why is this important?
•
Current specs for cell phone chargers
require <500mW under standby
conditions
Most chargers have standby power in
the range of 30-150mW
•
FCS has launched a <10mW solution
•
Typical chargers are in standby >20
hours every day
•
10,000
9,000
Energy Savings/Day (MWh)
•
8,000
7,000
6,000
5,000
4,000
3,000
2,000
1,000
More than 1B chargers are sold annually
30
Energy Rating System :
150
500
Standby Power of Comparison Charger (mW)
Most chargers are
rated 4-stars now
35
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Lighting Product Life Cycle
CFL
Electric
ballast
LFL
Electric
ballast
HID
Halogen
Lamp
Incandescent bulb
Dimmable
LFL & CFL
Mercury free
HID
Magnetic ballast
LED Lighting
Introduction
Growth
Maturity
Decline
Driving force : Energy saving, Environmental friendly and convergence
36
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LED Lighting
LED will replace Halogen & incandescent lamp in near future for
energy saving and there are new opportunities in special
applications (street lighting, architectural, decorative, window
display, channel letters, etc) using LED’s strong point.
•
Climate change and high Power demands push each governments to
release new regulations in Lighting and Building Industry world wide.
 Released EISA Act of 2007(USA) to focus performance standard
for selected light bulbs (72/53/43/29W new ones cover same light
outputs in 100/75/60/40W current ones)
•
Strong point of LED Lighting
High Efficiency( 1/3 power consumption against CFL )
Long life time guarantee (over 50K hours)
Better design flexibility
Easy to dim compared to CFL
•
Weak point of LED Lighting
Big price gap between LED and CFL ( 7 ~ 8 times higher )
No standard platform in specific applications
•
DOE, USA, offers $10M award to LED lighting suppliers to accelerate LED
industry
( Bright Tomorrow Lighting Prize )
Output : 90lm/W in operating mode, over 90 CRI, CCT is between
2750 ~ 3000K, 25Kh life time guarantee with screw type
37
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Evolution of IGBT Technology
Benefits of NPT over PT
• No Lifetime Control Process  Simpler Process
• Positive Temp Coefficient  Thermal Stability & Easy parallel operation
• Ruggedness  Large SOA (Safe Operating Area)
Benefits of Field Stop over NPT
• Buffer layer terminates electric field in a shorter distance
 enables reduced die thickness
• Reduced die thickness
 Reduced Vce(sat) for the same Eoff
• Buffer layer improves minority carrier recombination
Reduced Eoff due to reduced tail current
Benefits of Trench IGBT over Planar IGBT
• High current density  Reduce chip size !!
• Increase current rating of module with smaller chip
Retains NPT capability:
• Positive temperature coefficient  Thermal Stability & Easy parallel
operation
• Ruggedness  Large SOA (Safe Operating Area)
FS Trench IGBT
PTgate
emitter
NPTgate
n+
emitter
E
P - base
Emitter
emitter
p++
SA FS Trench
Emitter
Gate
n+
p++
Gate
n+
P – base
E
E
P – base
E
n+
P - base
E
n+
P - base
n-
FS Trench
FS Planar
gate
n+
n-
n-
n
x
n
FS-layer
collector
collector
FS IGBT
NPT IGBT
collector
300um
200um
n
FS-layer
FS-layer
collector
x
PT IGBT
n
P-collector
x
x
P-collector
x
P+ sub
n-
n-
WF
thickness
100um
38
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SuperJunction Technology Innovation
1.00
• Lower capacitance for reduced switching loss
Higher cell density
• Achieved less than 20mOhm/cm2 of A*RDS(on)
40% reduction in onresistance per specific
area over previous
generation
0.75
Normalized ARds(on)
New energy-saving superjunction technology
• Lower Rds(on) for reduced conduction loss
0.50
0.25
• P-epi filling after deep trench etching
0.00
Conventional
MOSFET
Source
Gate
Source
SuperFET
TM
SupreMOS
TM
Gate
Source
Source
SuperFET ®
SupreMOS®
Conventional
Multi-Epi Technology
Fairchild’s Deep Trench
Technology
Drain
Drain
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Medium Voltage MOS Technologies
UltraFET Trench
X1 Cell density
PowerTrench 3
X 2 Cell density
• Increased Cell Density
• Reduces Rds(on)
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Power Trench 5 & 7
X 4 Cell density
• Charge Balance technology
• Reduces Epi Resistance
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μMini-DIP Smart Power Module(SPM )
(26) VB(U)
(1) VTH
UVB
NTC
(2) RTH
(25) VS(U)
(24) VB(V)
UVS
(3) P
VVB
OUT(UH)
(23) VS(V)
(22) VB(W)
VVS
(21) VS(W)
WVS
(20) IN(UH)
IN(UH)
UVS
WVB
OUT(VH)
VVS
(19) IN(VH)
IN(VH)
(18) IN(WH)
IN(WH)
(17) VCC(H)
VCC
OUT(WH)
COM
WVS
(16) VCC(L)
VCC
(15) COM
COM
(14) IN(UL)
IN(WL)
(13) IN(VL)
IN(VL)
(12) IN(WL)
IN(UL)
(11) VFO
VFO
(10) CSC
CSC
OUT(UL)
OUT(VL)
OUT(WL)
(4) U
 Package Type : Transfer Mold PKG (Ceramic Substrate Type)
 Major Applications :
 Consumer appliance inverters
(Low power Air-conditioners, Washing Machines,
(5) V
Refrigerators etc.)
 Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing
machine, Door controller, etc)
(6) W
 Feature :
 Reduced package size (44% compare with Mini-DIP SPM)
 Integrated protection function
(7) NU
Current, Voltage, Temperature
 Improved power density with same die size
Improved short circuit ruggedness
(8) NV
 Built-in Bootstrap diode, NTC thermistor
 3-N terminal for low cost current sensing
(9) NW
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μMini-DIP SPM
LVIC
HVIC
3pcs of B/D
Cu Wiring Al Wiring Lead Frame
NTC
B/D
IC
IGBT
6pcs of IGBT
6pcs of FRD
FRD
Ceramic (Isolation material)
Adhesive
EMC(Epoxy Molding Compound)
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Packaging Challenges
•
Thinner ceramic & thicker Cu DBC to improve thermal and electrical performance
•
•
•
Higher thermal conductivity molding compound
•
•
•
Al2O3 – 24w/m.K or AlN DBC – 70W/m.K
Electrically and thermally enhanced IMS substrate
•
•
•
current : 5.5x7.5”  e.g 10x10” or 12x12”
breakthrough technology improving warpage and voiding
Thermally enhanced (100-200W/m.K) DBC substrates better than current materials
•
•
5-10 W/m.K by filling higher conductivity filler material such as AlN ceramic in it
current : max 3W/mK by adding Al2O3 ceramic
Lower cost DBC by increasing DBC manufacturing panel size
•
•
•
for example: 0.5mm top and bottom Cu with 0.2-0.3mm Al2O3 or AlN ceramic
current capability: Cu thickness should be equal to or thicker than ceramic thickness
300-500um top Cu metal (current : 50-100um) thickness
10-20W/m.K thermal conductivity insulator material
Thick Cu wire bonding
•
upgrade current 1-2mil Cu wire to 10-20mil Cu
Fig. 7 : Thermal simulation results
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Packaging Challenges
•
Delamination-free interconnection technology through interface surface
modification
• Addition of adhesion promoter
• Rougher surface materials (L/F, substrate, etc)
• Better adhesion materials (EMC, coating, etc)
•
Wire-less high power density module using new interconnection technology to
improve power density, electrical and thermal performance
•
•
•
•
Dual cool heat dissipation high power module that expose both top and bottom
metal outside to improve thermal performance
Press-fit interconnection high power module to improve soldering
interconnection reliability
Low cost Al clad interconnection packaging to improve wire bonding reliability
•
•
•
Clip or direct leadframe interconnect to die to improve electrical and thermal
performance
Current : Ni or Ni-NiP or Ag or NiPdAu or bare Cu)
Bare die embedded substrate multi-die packaging to reduce package size and to
improve power density
PQFN base high voltage power module meeting isolation voltage clearance
requirement
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Conclusion
 There are tremendous opportunities for energy savings
in all types of electricity use
 The smart grid is driving major changes in the way we
generate, transmit, store, and apply energy
 Energy awareness and new regulations are being
applied all over the world for better energy efficiency.
 New, highly efficient solutions are available for
appliances, lighting, computing, home entertainment
 Controlling power involves major packaging challenging
in thermal performance, cycling life performance
45
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