PC123XNNSZ0F Series
PC123XNNSZ0F
Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■ Description
■Agency approvals/Compliance
PC123XNNSZ0F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BSEN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as model No. PC123)
4. Approved by DEMKO, EN60065, EN60950, (as model No. PC123)
5. Approved by NEMKO, EN60065, EN60950, (as model No. PC123)
6. Approved by FIMKO, EN60065, EN60950, (as model
No. PC123)
7. Recognized by CSA file No. CA95323, (as model No.
PC123)
8. Approved by VDE, DIN EN60747-5-2(∗) (as an option), file No. 40008087 (as model No. PC123)
9. Package resin : UL flammability grade (94V - 0)
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Soldering)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5kV)
8. RoHS directive compliant
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different potentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A09501FEN
Date Sep. 1. 2006
© SHARP Corporation
PC123XNNSZ0F Series
■ Internal Connection Diagram
1
4
2
3
1
2
3
4
Anode
Cathode
Emitter
Collector
■ Outline Dimensions
(Unit : mm)
Rank mark
Factory identification mark
Date code
4
2
3
SHARP mark "S"
4.58±0.30
7.62±0.30
4.58±0.30
3.5±0.5
2.7±0.5
Epoxy resin
0.26±0.10
0.5±0.1
θ
θ
θ
θ : 0 to 13˚
3.0±0.5
3.0±0.5
2.7±0.5
Epoxy resin
0.26±0.10
VDE idenfication mark
0.5TYP.
6.5±0.3
3.5±0.5
7.62±0.30
4
PC123
2.54±0.25
6.5±0.3
0.6±0.2
3
1.2±0.3
PC123
2
1
2.54±0.25
0.6±0.2
4
0.5TYP.
1
Rank mark
Factory identification mark
Date code
Anode mark
4.58±0.30
Anode mark
1.2±0.3
2. Through-Hole (VDE option)
[ex. PC123XNYSZ0F]
4.58±0.30
1. Through-Hole [ex. PC123XNNSZ0F]
0.5±0.1
θ
θ : 0 to 13˚
Product mass : approx. 0.23g
Product mass : approx. 0.23g
3. Wide Through-Hole Lead-Form
[ex. PC123XNNFZ0F]
4. Wide Through-Hole Lead-Form (VDE option)
[ex. PC123XNYFZ0F]
±0.25
±0.30
PC123
3
4.58
0.6
±0.3
1.2
4
4
±0.1
4.58
±0.30
7.62
VDE idenfication mark
±0.30
4.58
±0.30
2.7
MIN.
2.7MIN.
3.5
3.5
±0.5
4.58
±0.30
SHARP mark "S"
6.5±0.3
±0.5
1.0
1
2
6.5±0.3
7.62
Date code
±0.2
±0.25
3
1.0
PC123
±0.1
2
4
2.54
1
±0.30
±0.2
0.6
±0.3
1.2
Date code
Factory identification mark
Rank mark
Anode mark
2.54
Factory identification mark
Rank mark
Anode mark
Epoxy resin
10.16
±0.50
0.26
Epoxy resin
±0.10
0.5
10.16
±0.1
Product mass : approx. 0.23g
±0.50
0.26
±0.10
0.5
±0.1
Product mass : approx. 0.23g
Sheet No.: D2-A09501FEN
2
PC123XNNSZ0F Series
(Unit : mm)
5. SMT Gullwing Lead-Form (VDE option)
[ex. PC123XNYIP0F]
Factory identification mark
3
7.62±0.30
2.54
4.58±0.30
3.5±0.5
6.5±0.3
Epoxy resin
0.75
1.0+0.4
−0.0
4.58±0.30
0.6±0.2
3.5±0.5
0.35±0.25
0.26
PC123
4.58±0.30
Epoxy resin
1.0+0.4
−0.0
4
0.25±0.25
7.62±0.30
±0.10
1.0
VDE
idenfication mark
6.5
Date code
1
2
SHARP mark "S"
±0.3
Factory identification mark
0.26±0.10 2.54±0.25
3
±0.1
PC123
4
2
4.58±0.30
4
1
1.2±0.3
Date code
Rank mark
Anode mark
2.54±0.25
0.6±0.2
1.2±0.3
Rank mark
Anode mark
6. Wide SMT Gullwing Lead-Form
[ex. PC123XNNUP0F]
±0.25
10.16
±0.50
0.5±0.1
0.75
±0.25
12MAX
±0.25
10.0+0.0
−0.5
Product mass : approx. 0.22g
Product mass : approx. 0.22g
7. Wide SMT Gullwing Lead-Form (VDE option)
[ex. PC123XNYUP0F]
Rank mark
Factory identification mark
Date code
1
PC123
4
3
SHARP mark "S"
VDE
idenfication mark
0.25±0.25
7.62±0.30
Epoxy resin
0.75±0.25
10.16±0.50
4.58±0.30
3.5±0.5
6.5
±0.3
0.26±0.10 2.54±0.25
1.0
±0.1
2
4
4.58±0.30
0.6±0.2
1.2±0.3
Anode mark
0.5±0.1
0.75±0.25
12MAX
Product mass : approx. 0.22g
Sheet No.: D2-A09501FEN
3
PC123XNNSZ0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
Mark
A.D.
A
2002
B
2003
C
2004
D
2005
E
2006
F
2007
H
2008
J
2009
K
2010
L
2011
M
2012
N
:
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
:
repeats in a 20 year cycle
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
Japan
SnCu (Cu : TYP. 2%)
Indonesia
SnBi (Bi : TYP. 2%)
no mark
or
or
SnCu (Cu : TYP. 2%)*
China
SnCu (Cu : TYP. 2%)
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the production.
Rank mark
Refer to the Model Line-up table.
Sheet No.: D2-A09501FEN
4
PC123XNNSZ0F Series
■ Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Input
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Output
Collector current
Collector power dissipation
Total power dissipation
*2
Isolation voltage
Operating temperature
Storage temperature
*2
Soldering temperature
Symbol
Rating
IF
50
IFM
1
VR
6
P
70
VCEO
70
VECO
6
IC
50
PC
150
Ptot
200
Viso(rms)
5
Topr
−30 to +100
Tstg
−55 to +125
Tsol
260
(Ta=25̊C)
Unit
mA
A
V
mW
V
V
mA
mW
mW
kV
̊C
̊C
̊C
*1 Pulse width≤100ms, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■ Electro-optical Characteristics
Parameter
Forward voltage
Input Reverse current
Terminal capacitance
Collector dark current
Output Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
Collector-emitter saturation voltage
Transfer Isolation resistance
charac− Floating capacitance
teristics Cut-off frequency
Rise time
Response time
Fall time
(Ta=25̊C)
Symbol
VF
IR
Ct
ICEO
BVCEO
BVECO
IC
VCE(sat)
RISO
Cf
fC
tr
tf
Condition
IF=20mA
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10μA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=5V, IC=2mA, RL=100Ω, −3dB
VCE=2V, IC=2mA, RL=100Ω
MIN.
−
−
−
−
70
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
−
30
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
10
250
100
−
−
20
0.2
−
1
−
18
18
Unit
V
μA
pF
nA
V
nA
mA
V
Ω
pF
kHz
μs
μs
Sheet No.: D2-A09501FEN
5
PC123XNNSZ0F Series
■ Model Line-up
Lead Form
Through-Hole
Wide Through-Hole
Sleeve
100pcs/sleeve
Package
Rank mark
DIN
EN60747-5-2
−
Approved
−
Model No.
PC123XNNSZ0F
PC123X1NSZ0F
PC123X2NSZ0F
PC123X5NSZ0F
PC123X8NSZ0F
PC123XNYSZ0F
PC123X1YSZ0F
PC123X2YSZ0F
PC123X5YSZ0F
PC123X8YSZ0F
PC123XNNFZ0F
PC123X1NFZ0F
PC123X2NFZ0F
PC123X5NFZ0F
PC123X8NFZ0F
Lead Form
SMT Gullwing
Model No.
PC123XNYFZ0F With or without
L
PC123X1YFZ0F
M
PC123X2YFZ0F
N
PC123X5YFZ0F
E
PC123X8YFZ0F
Wide SMT Gullwing
Taping
2 000pcs/reel
Package
DIN
EN60747-5-2
Approved
Rank mark
−
Approved
−
−
PC123XNYIP0F
PC123X1YIP0F
PC123X2YIP0F
PC123X5YIP0F
PC123X8YIP0F
PC123XNNUP0F
PC123X1NUP0F
PC123X2NUP0F
PC123X5NUP0F
PC123X8NUP0F
Approved
PC123XNYUP0F With or without
L
PC123X1YUP0F
M
PC123X2YUP0F
N
PC123X5YUP0F
E
PC123X8YUP0F
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A09501FEN
6
PC123XNNSZ0F Series
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
100
Diode power dissipation P (mW)
Forward current IF (mA)
50
40
30
20
10
0
−30
0
25
50 55
75
100
80
70
60
40
20
0
−30
125
0
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
200
150
100
50
0
−30
100
125
0
25
50
75
100
200
150
100
50
0
−30
125
0
Ambient temperature Ta (˚C)
10 000
25
50
75
Ta=75˚C
Forward current IF (mA)
50˚C
1 000
100
10−2
10−1
125
Fig.6 Forward Current vs. Forward Voltage
Pulse width≤100μs
Ta=25˚C
10−3
100
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
10
75
250
Total Power dissipation Ptot (mW)
Collector power dissipation PC (mW)
50 55
Fig.4 Total Power Dissipation vs. Ambient
Temperature
250
Peak forward current IFM (mA)
25
Ambient temperature Ta (˚C)
−25˚C
10
1
1
25˚C
0˚C
100
0
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Duty ratio
Sheet No.: D2-A09501FEN
7
PC123XNNSZ0F Series
Fig.7 Current Transfer Ratio vs.
Forward Current
Fig.8 Collector Current vs.
Collector-emitter Voltage
300
VCE=5V
Ta=25˚C
250
54
Collector current IC (mA)
Current transfer ratio CTR (%)
Ta=25˚C
60
200
150
100
PC (MAX.)
48
42
36
30
A
0m
3
I F=
24
18
20
I F=
mA
IF=10mA
12
50
IF=5mA
6
0
0
0.1
1
10
0
100
Forward current IF (mA)
Collector-emitter saturation voltage VCE (sat) (V)
Relative current transfer ratio (%)
50
25
50
75
5
6
7
8
10
0.12
0.1
0.08
0.06
0.04
0.02
0
−30
100
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs.
Ambient Temperature
Fig.12 Response Time vs.
Load Resistance
1 000
VCE=50V
VCE=2V
IC=2mA
Ta=25˚C
10−6
100
Response time (μs)
Collector dark current ICEO (A)
9
IF=20mA
IC=1mA
0.14
Ambient temperature Ta (˚C)
10−5
4
0.16
IF=5mA
VCE=5V
0
3
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
100
0
−30
2
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
150
1
−7
10
10−8
−9
10
tr
tf
10
td
1
ts
10−10
10−11
−30
0
20
40
60
80
0.1
0.01
100
0.1
1
10
100
Load resistance (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A09501FEN
8
PC123XNNSZ0F Series
Fig.13 Test Circuit for Response Time
Fig.14 Frequency Response
5
VCC
0
Output
RD
Output
10%
Voltage gain Av (dB)
Input
RL
VCE=5V
IC=2mA
Ta=25˚C
Input
90%
VCE
td
ts
tr
tf
Please refer to the conditions in Fig.12.
−5
−10
RL=10kΩ
1kΩ
100Ω
−15
−20
0.1
1
10
100
1 000
Frequency (kHz)
Collector-emitter saturation voltage VCE (sat) (V)
Fig.15 Collector-emitter Saturation Voltage vs.
Forward Current
Ta=25˚C
5
IC=0.5mA
1mA
3mA
5mA
7mA
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
2
4
6
8
10
12
14
16
18
20
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A09501FEN
9
PC123XNNSZ0F Series
■ Design Considerations
● Design guide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended foot print (reference)
SMT Gullwing lead-form
Wide SMT Gullwing lead-form
10.2
1.7
1.7
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A09501FEN
10
PC123XNNSZ0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A09501FEN
11
PC123XNNSZ0F Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A09501FEN
12
PC123XNNSZ0F Series
■ Package specification
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12
±2
5.8
10.8
520
(Unit : mm)
6.7
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A09501FEN
13
PC123XNNSZ0F Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
I
H
MA
X.
H
A
B
C
E
Dimensions List
A
B
±0.3
16.0
7.5±0.1
H
I
±0.1
10.4
0.40±0.05
5˚
K
C
1.75±0.10
J
4.2±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
F
4.0±0.1
(Unit : mm)
G
φ1.5+0.1
−0.0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
φ330
17.5±1.5
e
f
±1
φ23
2.0±0.5
f
a
b
(Unit : mm)
c
d
φ100±1 φ13.0±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A09501FEN
14
PC123XNNSZ0F Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
X
MA
.
H
H
A
B
C
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
±0.1
12.4
0.40±0.05
5˚
K
C
1.75±0.10
J
4.1±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
(Unit : mm)
F
G
4.0±0.1
φ1.5+0.1
−0.0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
φ330
25.5±1.5
e
f
±1
φ23
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1
φ100
φ13.0±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A09501FEN
15
PC123XNNSZ0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
Sheet No.: D2-A09501FEN
[E253]
16