PC817XJ0000F Series
DIP 4pin General Purpose
Photocoupler
PC817XJ0000F
Series
∗
4-channel package type is also available.
(model No. PC847XJ0000F Series)
■ Description
■ Agency approvals/Compliance
PC817XJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC817)
2. Package resin : UL flammability grade
(94V-0)
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different potentials and impedances
■ Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Soldering)
3. High collector-emitter voltage (VCEO:80V)
4. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
5. Several CTR ranks available
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A03102EN
Date Jun. 30. 2005
© SHARP Corporation
PC817XJ0000F Series
■ Internal Connection Diagram
Anode
Cathode
Emitter
Collector
1
1
4
2
3
2
3
4
■ Outline Dimensions
(Unit : mm)
PC817
2
Date code
4
1
PC817
2
2.54±0.25
3
Factory identification mark
6.5±0.5
3
6.5±0.5
7.62±0.3
0.26
±0.1
0.26
0.5TYP.
3.5±0.5
3.0±0.5
2.7±0.5
Epoxy resin
±0.1
4.58±0.5
0.35±0.25
4.58±0.5
7.62±0.3
Epoxy resin
1.0+0.4
−0
3.5±0.5
4.58±0.5
1
0.6±0.2
1.2±0.3
0.6±0.2
Date code
4
Rank mark
Anode mark
Factory identification mark
4.58±0.5
Rank mark
Anode mark
1.2±0.3
2. SMT Gullwing Lead-Form [ex. PC817XIJ000F]
2.54±0.25
1. Through-Hole [ex. PC817XJ0000F]
2.54±0.25
1.0+0.4
−0
10.0+0
−0.5
0.5±0.1
θ
Product mass : approx. 0.23g
Product mass : approx. 0.22g
3. Wide Through-Hole Lead-Form [ex. PC817XFJ000F]
Rank mark
4. Wide SMT Gullwing Lead-Form [ex. PC817XFPJ00F]
Rank mark
Factory identification mark
1
4
0.6±0.2
1.2±0.3
Date code
Date code
1
4
3.5±0.5
2.7
MIN.
2.54
±0.25
6.5±0.5
7.62±0.3
4.58±0.5
3
4.58±0.5
0.26
7.62±0.3
PC817
±0.1
2
0.25±0.25
6.5±0.5
3
1.0±0.1
PC817
2.54±0.25
1.0±0.1
2
4.58
±0.5
0.6±0.2
1.2±0.3
Factory identification mark
Anode mark
Anode mark
3.5±0.5
θ : 0 to 13˚
4.58±0.5
θ
Epoxy resin
±0.25
0.75
Epoxy resin
±0.5
10.16
0.5±0.1
±0.25
0.75
12.0MAX
0.26±0.1
0.5±0.1
±0.5
10.16
Product mass : approx. 0.23g
Product mass : approx. 0.22g
Sheet No.: D2-A03102EN
2
PC817XJ0000F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
Japan
SnCu (Cu : TYP. 2%)
Indonesia
SnBi (Bi : TYP. 2%)
China
SnCu (Cu : TYP. 2%)*
no mark
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A03102EN
3
PC817XJ0000F Series
■ Absolute Maximum Ratings
Output
Input
Parameter
Symbol
Forward current
IF
*1
Peak forward current
IFM
Reverse voltage
VR
Power dissipation
P
Collector-emitter voltage VCEO
Emitter-collector voltage VECO
IC
Collector current
Collector power dissipation
PC
Total power dissipation
Ptot
*2
Isolation voltage
Viso (rms)
Operating temperature
Topr
Storage temperature
Tstg
*3
Soldering temperature
Tsol
Rating
50
1
6
70
80
6
50
150
200
5.0
−30 to +100
−55 to +125
260
(Ta=25˚C)
Unit
mA
A
V
mW
V
V
mA
mW
mW
kV
˚C
˚C
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Transfer characteristics
Output
Input
■ Electro-optical Characteristics
Parameter
Forward voltage
Peak forward voltage
Reverse current
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
Rise time
Response time
Fall time
Symbol
VF
VFM
IR
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
RISO
Cf
fc
tr
tf
Conditions
IF=20mA
IFM=0.5A
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=5V, IC=2mA, RL=100Ω, −3dB
VCE=2V, IC=2mA, RL=100Ω
MIN.
−
−
−
−
−
80
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
−
−
30
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
3.0
10
250
100
−
−
30.0
0.2
−
1.0
−
18
18
(Ta=25˚C)
Unit
V
V
µA
pF
nA
V
V
mA
V
Ω
pF
kHz
µs
µs
Sheet No.: D2-A03102EN
4
PC817XJ0000F Series
■ Model Line-up
Lead Form
Through-Hole
Package
Model No.
Lead Form
Wide Through-Hole
Rank mark
IC [mA]
(IF=5mA, VCE=5V, Ta=25˚C)
PC817XFJ000F
PC817XF1J00F
PC817XF2J00F
PC817XF3J00F
PC817XF4J00F
PC817XF5J00F
PC817XF6J00F
PC817XF7J00F
PC817XF8J00F
PC817XF9J00F
PC817XF0J00F
with or without
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
Wide SMT Gullwing
Taping
2 000pcs/reel
Rank mark
IC [mA]
(IF=5mA, VCE=5V, Ta=25˚C)
Sleeve
100pcs/sleeve
PC817XJ0000F
PC817X1J000F
PC817X2J000F
PC817X3J000F
PC817X4J000F
PC817X5J000F
PC817X6J000F
PC817X7J000F
PC817X8J000F
PC817X9J000F
PC817X0J000F
SMT Gullwing
Package
Sleeve
100pcs/sleeve
Model No.
PC817XIJ000F
PC817XI1J00F
PC817XI2J00F
PC817XI3J00F
PC817XI4J00F
PC817XI5J00F
PC817XI6J00F
PC817XI7J00F
PC817XI8J00F
PC817XI9J00F
PC817XI0J00F
PC817XPJ000F PC817XFPJ00F with or without
A
PC817XP1J00F
−
B
PC817XP2J00F
−
C
PC817XP3J00F
−
D
−
PC817XP4J00F
A or B
−
PC817XP5J00F
B or C
−
PC817XP6J00F
C or D
−
PC817XP7J00F
−
A, B or C
PC817XP8J00F
−
B, C or D
PC817XP9J00F
−
A, B, C or D
PC817XP0J00F
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A03102EN
5
PC817XJ0000F Series
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Fig.1 Forward Current vs. Ambient
Temperature
100
Diode power dissipation P (mW)
Forward current IF (mA)
50
40
30
20
10
0
−30
0
25
50 55
75
100
80
70
60
40
20
0
−30
125
0
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Total Power dissipation Ptot (mW)
Collector power dissipation PC (mW)
75
100
125
250
200
150
100
50
0
−30
0
25
50
75
100
200
150
100
50
0
−30
125
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Current Transfer Ratio vs. Forward
Current
10 000
500
Pulse width≤100µs
Ta=25˚C
VCE=5V
Ta=25˚C
Current transfer ratio CTR (%)
Peak forward current IFM (mA)
50 55
Fig.4 Total Power Dissipation vs. Ambient
Temperature
250
1 000
100
10
25
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
10−3
10−2
10−1
400
300
200
100
0
0.1
1
Duty ratio
1
10
Forward current IF (mA)
100
Sheet No.: D2-A03102EN
6
PC817XJ0000F Series
Fig.7 Forward Current vs. Forward Voltage
Fig.8 Collector Current vs. Collector-emitter
Voltage
30
Ta=75˚C
IF=30mA
25˚C
0˚C
50
−25˚C
25
Collector current IC (mA)
Forward current IF (mA)
50˚C
100
20
10
5
Ta=25˚C
20mA
PC (MAX.)
20
15
10mA
10
5mA
5
2
1
0
0
0.5
1
1.5
2
2.5
3
0
3.5
1
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Collector-emitter saturation voltage VCE (sat) (V)
Relative current transfer ratio (%)
5
6
0.14
IF=1mA,VCE=5V
IF=5mA,VCE=5V
100
50
−20
0
20
40
7
8
9
60
80
IF=20mA
IC=1mA
0.12
0.1
0.08
0.06
0.04
0.02
0
−40
100
Ambient temperature Ta (˚C)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
10−5
6
Collector-emitter saturation voltage VCE (sat) (V)
VCE=50V
10−6
Collector dark current ICEO (A)
4
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
150
10−7
10−8
10−9
10−10
10−11
−30
3
Collector-emitter voltage VCE (V)
Forward voltage VF (V)
0
−40
2
Ta=25˚C
5
IC=0.5mA
1mA
4
3mA
5mA
3
7mA
2
1
0
0
20
40
60
80
Ambient temperature Ta (˚C)
0
100
5
10
15
Forward current IF (mA)
Sheet No.: D2-A03102EN
7
PC817XJ0000F Series
Fig.13 Response Time vs. Load Resistance
100
Fig.14 Test Circuit for Response Time
VCE=2V
IC=2mA
Ta=25˚C
Output
Response time (µs)
tr
Input
tf
RD
RL
10%
Output
90%
VCE
10
ts
td
tr
tf
td
ts
1
0.1
0.01
Please refer to the conditions in Fig.13.
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
VCC
VCE=5V
IC=2mA
Ta=25˚C
0
Voltage gain Av (dB)
Input
VCC
RD
RL
Output
VCE
100Ω
1kΩ
−10
Please refer to the conditions in Fig.15.
RL=10kΩ
−20
1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A03102EN
8
PC817XJ0000F Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
1.7
1.7
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A03102EN
9
PC817XJ0000F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A03102EN
10
PC817XJ0000F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D2-A03102EN
11
PC817XJ0000F Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing Lead-Form
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
2. Wide Through-Hole Lead-Form or Wide SMT Gullwing Lead-Form
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A03102EN
12
PC817XJ0000F Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
D
F
J
G
I
H
X.
MA
H
A
B
C
E
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
5˚
K
C
1.75±0.1
J
4.2±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
e
23±1.0
f
a
b
17.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A03102EN
13
PC817XJ0000F Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
5˚
MA
X.
H
H
A
B
C
K
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
±0.1
12.4
0.4±0.05
C
1.75±0.1
J
4.1±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
a
330
e
23±1.0
f
b
25.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A03102EN
14
PC817XJ0000F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E178]
Sheet No.: D2-A03102EN
15