PC123 Series
PC123 Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■ Description
■ Agency approvals/Compliance
PC123 Series contains an IRED optically coupled to
a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BSEN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMCO, EN60065, EN60950, file No.
204582 (as model No. PC123)
4. Approved by DEMCO, EN60065, EN60950 (as model No. PC123)
5. Approved by NEMKO, EN60065, EN60950, file No.
P03100205 (as model No. PC123)
6. Approved by FIMKO, EN60065, EN60950, file No.
19383 (as model No. PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE, VDE0884 (as an option) file No.
83601 or No. 134349 or No.40005304 (as model
No. PC123)
9. Package resin : UL flammability grade (94V - 0)
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Soldering)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different potentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A02902EN
Date Oct. 31. 2003
© SHARP Corporation
PC123 Series
■ Internal Connection Diagram
1
1
4
2
3
2
3
4
Anode
Cathode
Emitter
Collector
■ Outline Dimensions
(Unit : mm)
Rank mark
1.2±0.3
PC123
3
4
PC123
4
2
7.62±0.3
3.5±0.5
0.26±0.1
2.7
2.7
Epoxy resin
3.0±0.5
3.5±0.5
3.0±0.5
±0.5
Epoxy resin
0.26±0.1
4.58±0.3
0.5TYP.
4.58±0.3
7.62±0.3
VDE0884
Indenfication mark
0.5±0.1
0.5±0.1
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
3. Wide Through-Hole Lead-Form [ex. PC123F]
3
1
2
4
PC123
±0.3
0.6
±0.2
Date code
4.58
PC123
±0.3
±0.25
4
1.2
1
2.54
±0.2
0.6
3
4
6.5±0.3
±0.3
±0.1
1.0
4.58
VDE0884
Indenfication mark
±0.3
±0.3
±0.3
7.62
4.58
4.58
2.7MIN.
2.7MIN.
3.5
3.5
±0.5
7.62
SHARP mark "S"
6.5±0.3
±0.5
1.0
±0.1
±0.3
±0.3
1.2
Date code
Factory identification mark
Rank mark
Anode mark
±0.25
Factory identification mark
Rank mark
Anode mark
2
4. Wide Through-Hole Lead-Form (VDE0884 option) [ex. PC123FY]
2.54
θ
Epoxy resin
Epoxy resin
±0.1
±0.1
0.26
0.26
±0.5
10.16
0.5TYP.
6.5±0.3
±0.5
6.5±0.3
3
SHARP mark "S"
2.54±0.25
2
Date code
1
4.58±0.3
4
Factory identification mark
2.54±0.25
0.6±0.2
Date code
1
Rank mark
Anode mark
Factory identification mark
0.6±0.2
Anode mark
1.2±0.3
2. Through-Hole (VDE0884 option) [ex. PC123Y]
4.58±0.3
1. Through-Hole [ex. PC123]
±0.5
±0.1
10.16
0.5
±0.1
0.5
Product mass : approx. 0.18g
Sheet No.: D2-A02902EN
2
PC123 Series
(Unit : mm)
3
Factory identification mark
Date code
4
1
PC123
4
2
4.58±0.3
0.6±0.2
1.2±0.3
4.58±0.3
PC123
2.54±0.25
4
1
3
SHARP mark "S"
6.5±0.3
7.62
3.5±0.5
Rank mark
Factory identification mark
1.0
SHARP mark "S"
VDE0884
Indenfication mark
6.5
2.54±0.25
3.5±0.5
4.58±0.3
7.62±0.3
0.5±0.1
±0.25
0.75
12.0MAX
3.5±0.5
0.26±0.1
0.25
±0.25
Epoxy resin
10.16
3
±0.3
4.58±0.3
7.62±0.3
±0.5
PC123
4
0.25±0.25
6.5±0.3
0.6
2
4
0.26±0.1
3
Date code
1
±0.1
PC123
4.58±0.3
4
±0.2
1.2±0.3
Date code
1
Factory identification mark
Anode mark
2.54±0.25
0.6±0.2
1.0±0.1
2.54±0.25
1.0+0.4
−0
8. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123ZY]
Rank mark
Anode mark
1.2±0.3
Epoxy resin
10.0+0
−0.5
7. Wide SMT Gullwing Lead-Form [ex. PC123FP]
0.75
0.35±0.25
0.26
±0.1
3.5±0.5
1.0+0.4
−0
10.0+0
−0.5
±0.25
4.58±0.3
2.54±0.25
1.0+0.4
−0
Epoxy resin
2
VDE0884
Indenfication mark
7.62±0.3
0.35±0.25
0.26±0.1
1.0+0.4
−0
6.5±0.3
4.58±0.3
±0.3
4.58±0.3
2
Rank mark
Anode mark
Factory identification mark
Date code
0.6±0.2
1.2±0.3
Rank mark
Anode mark
6. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123PY]
2.54±0.25
5. SMT Gullwing Lead-Form [ex. PC123P]
Epoxy resin
±0.25
0.75
±0.5
10.16
0.5±0.1
±0.25
0.75
12.0MAX
Product mass : approx. 0.18g
Sheet No.: D2-A02902EN
3
PC123 Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02902EN
4
PC123 Series
■ Absolute Maximum Ratings
Output
Input
Parameter
Symbol
Forward current
IF
*1
Peak forward current
IFM
Reverse voltage
VR
Power dissipation
P
Collector-emitter voltage VCEO
Emitter-collector voltage VECO
IC
Collector current
Collector power dissipation
PC
Ptot
Total power dissipation
*2
Isolation voltage
Viso (rms)
Topr
Operating temperature
Tstg
Storage temperature
*3
Soldering temperature
Tsol
Rating
50
1
6
70
70
6
50
150
200
5.0
−30 to +100
−55 to +125
260
(Ta=25˚C)
Unit
mA
A
V
mW
V
V
mA
mW
mW
kV
˚C
˚C
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■ Electro-optical Characteristics
Input
Output
Transfer
characteristics
Parameter
Symbol
Forward voltage
VF
IR
Reverse current
Terminal capacitance
Ct
Collector dark current
ICEO
Collector-emitter breakdown voltage BVCEO
Emitter-collector breakdown voltage BVECO
Collector current
IC
Collector-emitter saturation voltage VCE (sat)
Isolation resistance
RISO
Cf
Floating capacitance
fc
Cut-off frequency
tr
Rise time
Response time
tf
Fall time
Conditions
IF=20mA
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=5V, IC=2mA, RL=100Ω, −3dB
VCE=2V, IC=2mA, RL=100Ω
MIN.
−
−
−
−
70
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
−
30
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
10
250
100
−
−
20
0.2
−
1.0
−
18
18
(Ta=25˚C)
Unit
V
µA
pF
nA
V
nA
mA
V
Ω
pF
kHz
µs
µs
Sheet No.: D2-A02902EN
5
PC123 Series
■ Model Line-up
Lead Form
Through-Hole
Package
VDE0884
Model No.
−
PC123
PC123A
PC123B
PC123C
PC123S
Wide Through-Hole
Sleeve
100pcs/sleeve
Approved
−
Approved
PC123Y PC123F PC123FY
PC123Y1 PC123F1 PC123FY1
PC123Y2 PC123F2 PC123FY2
PC123Y5 PC123F5 PC123FY5
PC123YS PC123FS PC123FY8
SMT Gullwing
−
PC123P
PC123P1
PC123P2
PC123P5
PC123PS
Wide SMT Gullwing
Taping
IC [mA]
Rank mark
(IF=5mA, VCE=5V, Ta=25˚C)
2 000pcs/reel
Approved
−
Approved
PC123PY PC123FP PC123ZY with or without 2.5 to 30.0
A
2.5 to 7.5
PC123PY1 PC123FP1 PC123ZY1
B
5.0 to 12.5
PC123PY2 PC123FP2 PC123ZY2
No mark
10.0 to 20.0
PC123PY5 PC123FP5 PC123ZY5
S
5.0 to 10.0
PC123PY8 PC123FP8 PC123ZY8
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A02902EN
6
PC123 Series
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Fig.1 Forward Current vs. Ambient
Temperature
100
Diode power dissipation P (mW)
Forward current IF (mA)
50
40
30
20
10
0
−30
0
25
50 55
75
100
80
70
60
40
20
0
−30
125
0
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Total Power dissipation Ptot (mW)
Collector power dissipation PC (mW)
75
100
125
250
200
150
100
50
0
−30
0
25
50
75
100
200
150
100
50
0
−30
125
0
Fig.5 Peak Forward Current vs. Duty Ratio
10 000
50
75
100
125
Fig.6 Forward Current vs. Forward Voltage
500
Pulse width≤100µs
Ta=25˚C
5 000
25
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Ta=75˚C
200
2 000
Forward current IF (mA)
Peak forward current IFM (mA)
50 55
Fig.4 Total Power Dissipation vs. Ambient
Temperature
250
1 000
500
200
100
50
20
50˚C
100
25˚C
0˚C
50
−25˚C
20
10
5
2
10
5
25
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
1
5 10−3 2
5 10−2 2
5 10−1 2
5
1
0
Duty ratio
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward voltage VF (V)
Sheet No.: D2-A02902EN
7
PC123 Series
Fig.7 Current Transfer Ratio vs. Forward
Current
300
Fig.8 Collector Current vs. Collector-emitter
Voltage
VCE=5V
Ta=25˚C
250
54
Collector current IC (mA)
Current transfer ratio CTR (%)
Ta=25˚C
60
200
150
100
PC (MAX.)
48
42
36
30
mA
30
I F=
24
18
mA
20
I F=
IF=10mA
12
50
IF=5mA
6
0
0
0.1
1
10
100
0
Forward current IF (mA)
Collector-emitter saturation voltage VCE (sat) (V)
Relative current transfer ratio (%)
50
25
50
75
5
6
7
8
10
0.12
0.10
0.08
0.06
0.04
0.02
0.00
−30
100
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Response Time vs. Load Resistance
1 000
VCE=50V
VCE=2V
IC=2mA
Ta=25˚C
−6
10
5
100
−7
Response time (µs)
Collector dark current ICEO (A)
9
IF=20mA
IC=1mA
0.14
Ambient temperature Ta (˚C)
10−5
5
4
0.16
IF=5mA
VCE=5V
0
3
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
100
0
−30
2
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
150
1
10
5
10−8
5
10−9
5
tr
tf
10
td
1
ts
10−10
5
10−11
−30
0
20
40
60
80
0.1
0.01
100
0.1
1
10
100
Load resistance (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A02902EN
8
PC123 Series
Fig.13 Test Circuit for Response Time
Fig.14 Frequency Response
5
VCC
0
Output
RL
RD
Output
10%
Voltage gain Av (dB)
Input
VCE=5V
IC=2mA
Ta=25˚C
Input
90%
VCE
td
ts
tr
tf
Please refer to the conditions in Fig.12.
−5
−10
RL=10kΩ
−15
−20
0.1
1
1kΩ
10
100
100Ω
1 000
Frequency (kHz)
Collector-emitter saturation voltage VCE (sat) (V)
Fig.15 Collector-emitter Saturation Voltage
vs. Forward Current
5.0
Ta=25˚C
IC=0.5mA
1mA
3mA
5mA
7mA
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
8
10
12
14
16
18
20
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A02902EN
9
PC123 Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
SMT Gullwing lead-form
Wide SMT Gullwing lead-form
10.2
1.7
1.7
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A02902EN
10
PC123 Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A02902EN
11
PC123 Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A02902EN
12
PC123 Series
■ Package specification
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A02902EN
13
PC123 Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
D
F
J
G
I
H
X.
MA
H
A
B
C
E
Dimensions List
A
B
16.0±0.3
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
5˚
K
C
1.75±0.1
J
4.2±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
(Unit : mm)
c
d
100±1.0
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02902EN
14
PC123 Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
5˚
M
.
AX
H
H
A
B
C
K
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
12.4±0.1
0.4±0.05
C
1.75±0.1
J
4.1±0.1
D
8.0±0.1
K
5.1±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
25.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02902EN
15
PC123 Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A02902EN
16