676 Ball Flip-Chip BGA (EF676) Package
PK375 (v1.0) May 26, 2009
X-Ref Target - Figure 1
BOTTOM VIEW
TOP VIEW
0.20 (4X)
D1
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
PIN 1 I.D.
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
E1
24.00 MAX
26
A
D
B
E
24.00 MAX
LID
A2
ccc C
SEATING PLANE
A
aaa C
S
Y
M
B
O
L
A
A1
A2
D /E
D1 / E1
e
Øb
aaa
ccc
ddd
eee
MILLIMETERS
MIN.
NOM.
MAX.
3.00
0.60
1.10
27.00 BASIC
e
b
Øddd M C A B
Øeee M C
Pb/Sn SOLDER BALLS
NOTES:
1. ALL DIMENSIONS AND TOLERANCES CONFORM
TO ANSI Y14.5M-1994
25.00 REF
1.00 BASIC
0.50
0.60
0.70
0.20
0.25
0.25
0.10
26
A1
N
O
T
E
2.35
0.40
0.65
M
C
2. SYMBOL 'M' IS THE BALL MATRIX SIZE
3. CONFORMS TO JEDEC MS-034-AAL-1
2
PK375_01_051409
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PK375 (v1.0) May 26, 2009
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1
676 Ball Flip-Chip BGA (EF676) Package
Revision
History
Notice of
Disclaimer
PK375 (v1.0) May 26, 2009
The following table shows the revision history for this document.
Date
Version
05/26/09
1.0
Description of Revisions
Initial Xilinx release.
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable environmental
laws and regulations. Xilinx subcontracts the production, test and assembly of hardware devices to
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