NANYA ROAD,MUGANG ZHAOQING
CITY GUANGDONG CHINA.
LEDTECH ELECTRONICS CORP.
TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LA(C)3971-11B-M1 EWAK
0.39"(10.0mm)ALPHANUMERIC DISPLAY
Approved by
Checked by
Prepared by
Tung
Andy
CJ
0.39" ALPHANUMERIC
DISPLAY
LA(C)3971-11B-M1
Dimensions
MARK
7.0
6.3
10°
1
0.5
18
1.0
10.0
23.6
10
9
2.54?8=20.32
1.2 DIA.
9.9
F H
G1
E M
0.25
3.5 MIN.
L
A
I
J B
G2
K C
D
DP
7.62
Notes:
1. The slope angle of any PIN may be ±5.0° Max.
2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted
Internal Circuit Diagram
LA3971-11B-M1
PIN. 4,13,17
A B C D E F G1 G2 H I
J
K L M DP
PIN. 18 15 11 8 6 3 5 14 2 1 16 10 9 7 12
LC3971-11B-M1
PIN. 4,13,17
A B C D E F G1 G2 H I
J
K L M DP
PIN. 18 15 11 8 6 3 5 14 2 1 16 10 9 7 12
VER.: 01 Date: 2007/01/24
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0.39" ALPHANUMERIC
DISPLAY
LA(C)3971-11B-M1
Description
LED Chip
Part
No.
Face Color
Material
Emitting Color
Surface
Segments
LA3971-11B-M1 EWAK
AlGaAs/GaAs
Super Red
Grey
White
LC3971-11B-M1 EWAK
AlGaAs/GaAs
Super Red
Grey
White
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Symbol
Rating
Unit
Power Dissipation Per Segment
PD
66
mW
Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.)
Per Chip
IFP
100
mA
Forward Current Per Chip
IF
30
mA
Reverse (Leakage)Current Per Chip
Ir
100
uA
Reverse Voltage Per Chip
VR
4
V
Operating Temperature Range
Topr.
-25 to +85
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature.
Tsol.
Dip Soldering: 260℃ for 5 sec.
Hand Soldering: 350℃ for 3 sec.
VER.: 01 Date: 2007/01/24
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0.39" ALPHANUMERIC
DISPLAY
LA(C)3971-11B-M1
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity Per Segment
IV
If=10mA/seg.
3.7
8.0
Forward Voltage
Vf
If=20mA/seg.
1.8
Peak Wavelength
λp
If=20mA/seg.
660
nm
Dominant Wavelength
λd
If=20mA/seg.
643
nm
Reverse Current Per Chip
(Leakage Current Per Chip)
Ir
Vr=4V
Spectrum Line Halfwidth
∆λ
If=20mA/seg.
30
nm
T
-----------
250
ns
Response Time
Max.
Unit
mcd
2.2
100
V
µA
NOTE: Customer’s special requirements are also welcome
VER.: 01 Date: 2007/01/24
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0.39" ALPHANUMERIC
DISPLAY
LA(C)3971-11B-M1
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Ratio of Maximum
Operating Peak Current to
Temperature
Derated DC Current
0.5
40
40
Forward Current IF(mA)
Forward Current IF(mA)
50
30
20
10
1.6
1.8
2.0
2.2
Forward Voltage VF(V)
10
100
1000
tp - Pulse Duration - μs
10000
Fig.2 MAXIMUM TOLERABLE PEAK
CURRENT VS. PULSE DURATION
50
1.4
Z
Fig.1 RELATIVE INTENSITY VS.
WAVELENGTH
1
0H
10
Wavelength (nm)
Z
0H
30
1
HZ
1K
750
10
Z
700
OPERATION IN THIS
REGION REOUIRES
TEMPERATURE
DERATING OF IDC
MAXIMUM
HZ
3K
650
100
KH
10
600
IF PEAK
IDC MAX
Relative Intensity
1.0
30
20
10
0
2.4
20
40
60
80
100
Ambient Temperature Ta (°C)
Fig.4 FORWARD CURRENT VS.
DERATING CURVE
Fig .3 FORWARD CURRENT VS.
FORWARD VOLTAGE PER CHIP
Relative Luminous Intensity
Relative Luminous Intensity
Normalized at 10mA
10
8
6
4
2
0
10
20
30
40
Forward Current (mA)
2.0
1.0
0.5
0.2
0.1
-30 -20 -10
0
10
20
30
40
50
60
70
Ambient Temperature Ta (°C)
Fig.6 LUMINOUS INTENSITY VS.
AMBIENT TEMPERATURE
Fig.5 RELATIVE LUMINOUS INTENSITY
VS. FORWARD CURRENT
VER.: 01 Date: 2007/01/24
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LA(C)3971-11B-M1
0.39" ALPHANUMERIC
DISPLAY
Precautions in Use:
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO
DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip.
When bending is unavoidable, strictly follow the cautionary instruction below.
(1)Bend the leads before soldering.
(2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part.
(3) The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)When a pin is tested for its endurance, bending degree should be 45∘and repeated no more than two times.
2. Setting a product by using tool such as a holder should be avoided.
When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance,
thermal expansion, thermal contraction of holder, product and circuit board etc.
3. The hole pitch of a circuit board must fit into the lead pitch of products.
4. When soldering, care the followings:
(1)Do not heat a product under any stress (i.e.: twist) to leads.
(2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part.
(3)The temperature of a product should not exceed the specified maximum storage temperature.
(4)Soldering with PC Board should be conducted with following conditions.
(a) For dip soldering
Pre-heating : 90℃ Max. for within 60 Sec.
Soldering Max. : 260±5℃(Solder Temp.) for within 5 Sec.
(b) Soldering iron : 350℃(Soldering iron tip) for within 3 Sec.
5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA,
less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash
around the leads, instead of the entire LED, by the following conditions.
Cleaning
agent : Methyl Alcohol
Cleaning temp : 45℃Max.
Cleaning
time
: 30Sec. Max.
6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion.
7. The following may damage products or LED chips: Attachment or contact of residual flux solvent
onto the product surface or to LED chips, or invasion of the same into the product.
VER.: 01 Date: 2007/01/24
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