TECHNICAL GUIDE
KAMAYA OHM
SMD Product handling manual (RECOMMENDED LAND PATTERN)
Note: This land pattern is not supported by the mounting evaluation.
This is reference information only.
•Application
•Recommended land pattern (Reference)
All KAMAYA Surface Mount Devices
1.Square chip type (No. of terminals: 2)
X
Size
Y
A
B
Y
Flow soldering
Metric
Inch
0402
0603
1005
1608
2012
3216
3225
5025
6332
01005
0201
0402
0603
0805
1206
1210
2010
2512
A
B
X
Reflow soldering
Y
A
B
X
Y
0.8
0.9
1.05
1.05
1.2
1.2
0.18
0.3
0.5
1.0
1.3
2.2
2.2
3.9
5.2
0.58
0.9
1.3
2.0
2.7
3.9
3.9
5.9
7.2
0.2
0.3
0.5
0.8
1.25
1.6
2.5
2.5
3.2
0.2
0.3
0.4
0.5
0.7
0.85
0.85
1.0
1.0
Not applied
1.0
1.3
2.2
2.2
3.9
5.2
2.6
3.1
4.3
4.3
6.3
7.6
0.8
1.25
1.6
2.5
2.5
3.2
※For RLP, MLP please refer to the page 20 and 21.
2.Chip network type (No. of terminal: Multiple)
Land pattern 1
Land pattern 2
P
A
B
Y
Y
B
A
Y
Y
P
X C X
X C X
Land pattern 4
Land pattern 3
P
Y
Y
A
B
A
Y
B
Y
P
X C X
X
C
X
Flow soldering
Land pattern
Style
RAC10 2D
RAC10 1A
RAC10 4D
RAC16 4D
RAC16 8U
RAC16 8D
1
2
2
3
4
Terminals style
C
C
C
C
P
A
B
0.65
0.5
0.8
0.64
0.5
C
Reflow soldering
X
Y
Not applied
1.0
2.6
0.35
Not applied
0.45
0.8
A
B
C
X
Y
0.5
1.3
0.34
0.33
0.4
0.5
1.0
1.0
1.0
1.3
2.0
2.0
2.0
0.15
0.35
0.32
0.2
0.35
0.45
0.32
0.3
0.4
0.5
0.5
0.5
•Others
(1) Please contact Kamaya Sales Dept. for other products and further details.
(2) Please carry out an enough mounting evaluation when use these patterns.
54
Product specifications contained in this catalogue are subject to change at any time without notice. Please confirm specifications with your order. 【RoHS】