pRODUCTS for
Precision optics
e
Ion Beam Figuring Systems
Equipment for Multilayer Deposition
Systems for Large Area Pattering
A member of Meyer Burger Group
Ion Beam Trimming /
Ion Beam Etching
Equipment for high precision contour
shaping and pat tern transfer
Ion Beam Figuring
Ion Beam Figuring (IBF) is increasingly being used for figuring
and finishing of ultra-precision and various optical elements.
Due to the excellent stability of the removal function the
method allows a correction down to or better than λ/50,
especially also for hard and crystalline materials like SiC, Si,
Ge, or WC. By means of an in-situ changeable size of the
removal function down to 0.5 mm, high frequency errors may
be easily corrected, which is especially important for aspheres
or free form optical elements.
IonScan 3D of MicroSystems is designed for high throughput
processing with a double load lock chamber. Sample sizes up
to 200 mm may be processed using the same special sample
holder for metrology and figuring. The IonScan 3D uses a cost
and performance optimum scan stage consisting of 3 axes.
Mean [nm]
RMS [nm]
Pre
823
203
Post
213 Factor 4 improvement
27 8 improvement
IonScan 3D
Ion beam figuring of 200 mm precision optical elements
Ion Beam Etching
MicroSystems offers two general concepts for ion beam
etching in optical applications, including fully reactive gas
compatible reactive ion beam etching (RIBE) and chemically
assisted ion beam etching (CAIBE) in fluorine and chlorine
environment.
As standard systems for ion beam processing, with continuous
sample rotation, tilt and a helium backside cooling contact,
the IonSys 500 / 800 offer a standard solution for ion beam
etching in optics. The systems can be configured with a single
sample load-lock or cassette loading, respectively.
As a large area ion beam etching system the IonScan 1200
combines a linear ion source with a line-scan for covering a
large sample area up to 400 mm x 310 mm. The microwave
based (ECR) linear ion source is fully halogen operation
compatible and gives a homogeneous beam profile across
the full sample dimension.
The lateral scan provides a high performance large area
ion beam process which was originally developed for the
production of computer generated holograms (CGH).
Ion beam figuring of a 45 mm dia. LH lens with a
1.5 mm ion beam tool, x/y-scale [mm]
The IonScan 3D system comes standard, with a suite of
recipes and software tools which completely automate the
process flow starting with the import of the measurement
data, the beam footprint calibration, and multiple processing
steps.
MicroSystems offers customized equipment for Ion Beam
Figuring for sample sizes up to 1.5 m in diameter. A special
feature for these systems is an optimized processing time
using sources with extremely high removal rates of up to 30
mm3/h and 150 mm3/h, respectively.
Facet structure with defined sidewall angle of 45° etched in
a compound semiconductor stack with Cl2 assisted ion beam
etching (CAIBE)
Specification
IonScan 200 IBF
IonScan 1200
IonSys 500 / 800
IonSys 1600
Substrates
3D optical components up
to 200 mm dia.
Flat optical components up
to 400 mm x 310 mm
Flat optical components up
to 150 /200 mm dia.
Optic components up to
500 mm x 300 mm
Applications and
Processes
Ion beam figuring by
focused broad ion beam
Reactive ion beam etching
(RIBE, CAIBE) based on
linear ion source
Full sample size reactive
ion beam etching (RIBE,
CAIBE)
Linear microwave ion beam
source in dual beam
arrangement
Based on pre-calculated
raster scan across sample
surface
Line-scan of sample for
process homogeneity
Tilt and rotation capability of
sample stage for dimensional
structure control
Automatic single sample
load-lock or manual loading
Magnetron /
Ion Beam Sputter Deposition
Equipment for challenging multilayer
deposition
Dual Ion Beam Sputter Deposition
Ion beam sputter deposition provides the most advanced
control and repeatability of film parameters for deposition of
precise multilayer stacks. The IonSys 1000 / 1600 are dual ion
beam deposition (DIBD) tools which consist of both a sputter
and assist ion beam source, a sample chuck and a target drum
for of up to 8 / 6 different materials. As an important benefit
the assist source may be used on the samples for cleaning or
smoothing as well as for controlling the film microstructure like
stress, density or morphology. A load-lock system guarantees
for high throughput, excellent stability and reproducibility of
the deposition conditions.
IonSys 1600
Dual ion beam deposition of refractive and reflective optics
Magnetron Sputter Deposition
The MicroSys 1600 / 2000 are designed for manufacturing
of gradient high-precision reflection optics on samples up to
320 mm and 680 mm, respectively. The deposition strategy is
based on a high precision dynamic physical vapor deposition
(PVD) process. A center-mounted high precision torque motor
rotates the sample carrier over the radially arranged magnetron
sources. Combining a pre-calculated orbital velocity profile
with an additional spin rotation, defined gradient films may
be deposited. Each full orbital rotational cycle hence deposits
one defined period of the multilayer stack.
spin rotation
main rotation
RMS [nm]
Pre
0.52 nm
substrate
Post
0.10 nm
Ion beam smooting of Quartz sample with assist source before
multilayer coating on IonSys 1600
The IonSys systems are capable of depositing virtually all
regular thin film materials and multilayer structures with high
accuracy, thickness uniformity and repeatability. Recipes for
various materials used in optical industry, like Si, Mo, Al, Cr,
Ni, C, B4C, Al2O3, SiO2, TiO2, ZrO2, Nb2O5, Ta2O5, HfO2 are
available.
IonSys 1600 is based on a linear source concept and utilizes
as the coating strategy a sample rotation together with a lateral
movement of the sample, combined with a variable shaper
system.
targets
Sample movement strategy in MicroSys 2000 for large area
gradient multilayer deposition
The MicroSys 2500 is designed for coating of large mirrors
especially for astronomical telescopes. The samples with up
to 2,000 mm in diameter and 2,000 kg in weight are rotated
beneath a magnetron revolver containing 4 independent
sputter magnetrons. Hence the films required for the reflector
coating can be deposited in one continuous process run.
The AK 1000 inline is the standard PVD equipment of
MicroSystems. Up to 4 independent DC, pulsed-DC or RF
magnetrons may be applied in linear configuration. Coating
is performed dynamically moving the sample carrier on a
roller track system across the sources.
Specification
IonSys 1000 / 1600
MicroSys 1600 / 2000
MicroSys 2500
AK 1000 inline
Substrates
Flat optical components up
to 200 mm dia. / 300 mm x
500 mm
Curved optical samples
up to 320 mm dia. (18 kg) /
680 mm dia. (75 kg)
Weakly curved samples up
to 2,000 mm dia. (2,000 kg)
Weakly curved large
samples or batches up to
480 mm x 480 mm
Applications and
Processes
Dual ion beam deposition
with 8 / 6 sputter targets
Magnetron sputter deposition
with 8 / 6 magnetrons
Magnetron sputter deposition
with 4 magnetrons
Magnetron sputter deposition
with 4 magnetrons
Multilayer coating of
refractive and reflective
optics
Gradient multilayer coating
of refractive and reflective
optics
Coating of reflective mirrors
for visible spectral
Coating of metal and / or
oxide films incl. reactive
sputtering
Specialised Optics
Manufacturing Equipment
Equipment for etching and deposition
Systems for Reactive Ion Etching (RIE)
With the AK 800 / 1000 systems MicroSystems offers two
large area systems for reactive ion etching. The systems
are fully compatible with chlorine and other halogen gases.
Applications of the system are etching of metal film, structuring
of glasses, as well as resist stripping. Processes may be
performed on large single samples or batches processed on
one carrier.
A key element of the AK platform is our patented high density linear
microwave plasma source. The sample stage with an independent
RF sample bias is equipped with an efficient sample cooling.
With the MicroSys 200 a powerful tool for reactive ion etching of up
to 200 mm wafers or similar optical samples is available. Besides
of the standard parallel plate discharge arrangement, inductively
coupled plasma sources (ICP) are available for optimum equipment
adaptation to the customer’s processing needs.
AK 1000
Large area Cl2 based RIE of Chromium masks
Systems for Plasma Enhanced Chemical Vapor
Deposition (PECVD)
Both, the AK platform as well as the MicroSys may also be
configured for PECVD deposition of dielectric films. Using a
similar source layout, the gas shower and the sample stage
with a heating capability of up to 650 °C are available.
As a special solution MicroSystems offers with the MicroSys
500 DLC a compact system for DLC antireflective and wearresistant coating of infrared optics.
Specification
AK 800 / 1000
MicroSys 200
MicroSys DLC
Substrates
Optical components up to 450 mm x
400 mm / 550 mm x 550 mm
Optical components up to 200 mm
dia.
Curved optical components or
batches up to 320 mm dia.
Applications and
Processes
RIE with sample cooling for oxygen,
fluorine or chlorine based chemistry
RIE with sample cooling for oxygen,
fluorine or chlorine based chemistry
PECVD of Diamond Like Carbon
(DLC) films for infrared applications
PECVD with sample heating up to
650 °C and optional RF bias for a-Si,
SiO2, Si3N4 and SiC deposition
PECVD with sample heating up to
900 °C and optional RF bias for
a-Si, SiO2, Si3N4 and SiC deposition
MicroSystems
Company Profile
The Roth & Rau AG with its business unit MicroSystems is
located in Hohenstein-Ernstthal, near Chemnitz in Germany.
As part of the Meyer Burger group the company provides
advanced solutions in plasma and ion beam technology for
applications in the semiconductor industry, in the production
of high precision optics and sensors as well as for research
and development.
Around 100 employees provide complex services ranging from
consultancy, design, construction and assembly to software
development as well as installation and after sale service.
Roth & Rau is certified with the ISO 9001 standard.
Roth & Rau AG - Business Unit MicroSystems
An der Baumschule 6-8
09337 Hohenstein-Ernstthal
Germany
Phone +49 3723 671 234
Fax + 49 3723 671 1000
info@microsystems.de
www.microsystems.de
The company has set up an excellent infrastructure for the
manufacture of its process systems. The production area of
more than 5,000 m² includes one outstanding cleanroom of
class 10,000 (ISO 7) with 700 m² and one heavy goods crane
(up to 15.000 kg), where the systems for microtechnology and
the optical industry are configured and put into operation.
Especially for the optics industry MicroSystems has got
advanced capabilities for sampling and demonstrations
which include in-house equipment of most products as well
as metrology systems including interferometers for sample
measurement.