DMN1033UCB4 N-CHANNEL ENHANCEMENT MODE FIELD MOSFET Product Summary Features and Benefits VSSS RSS(ON) IS TA = +25°C Built-in G-S protection diode against ESD 2kV HBM. Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 12V 26mΩ @ VGS = 4.5V 5.5 A Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Description NEW PRODUCT This new generation MOSFET has been designed to minimize the onstate resistance (RSS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. Mechanical Data Case: U-WLB1818-4 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Diagram Weight: 0.005 grams (approximate) Applications Battery Management Load Switch Battery Protection G1 G2 ESD PROTECTED TO 2kV S1 S2 Equivalent Circuit Top View Ordering Information (Note 4) Part Number DMN1033UCB4-7 Notes: Case U-WLB1818-4 Packaging 3000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information GW = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) Date Code Key Year Code Month Code 2009 W Jan 1 2010 X Feb 2 DMN1033UCB4 Document number: DS36264 Rev. 2 - 2 Mar 3 2011 Y Apr 4 May 5 2012 Z Jun 6 1 of 6 www.diodes.com 2013 A Jul 7 Aug 8 2014 B Sep 9 Oct O 2015 C Nov N Dec D September 2013 © Diodes Incorporated DMN1033UCB4 Maximum Ratings Characteristic Symbol Value Drain-Source Voltage VSSS 12 V Gate-Source Voltage VGSS 6 V IS 5.5 4.5 A ISM 20 A Symbol Value Units Continuous Source Current @ VGS = 4.5V TA = +25°C (Note 5) TA = +25°C TA = +70°C Steady State NEW PRODUCT Pulsed Source Current @ TA = +25°C (Notes 5 & 6) Units Thermal Characteristics Characteristic PD 1.45 W RJA 88.21 °C/W TJ, TSTG -55 to +150 °C Power Dissipation, @TA = +25°C (Note 5) Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5) Operating and Storage Temperature Range Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic OFF CHARACTERISTICS (Note 7) Symbol Min Typ Max Unit Test Condition Source to Source Breakdown Voltage TJ = +25°C V(BR)SS 12 — — V Zero Gate Voltage Source Current TJ = +25°C ISSS — — 1.0 µA VSS = 12V, VGS = 0V Gate-Body Leakage IGSS — — 10 µA VGS = 6V, VDS = 0V VGS(th) 0.35 0.5 0.7 V VSS = 10V, IS = 1.0mA 19.5 20 20.5 21 21.5 22 26 26 27 28 29 30 31 33 mΩ 35 50 VGS = 4.5V, IS = 3.0A VGS = 4.0V, IS = 3.0A VGS = 3.7V, IS = 3.0A VGS = 3.5V, IS = 3.0A VGS = 3.1V, IS = 3.0A VGS = 2.5V, IS = 3.0A VGS = 1.8V, IS = 3.0A VGS = 1.5V, IS = 3.0A IS = 1mA, VGS = V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage Static Source -Source On-Resistance — RSS(ON) Forward Transfer Admittance |Yfs| — 11 — S VSS = 10V, IS = 3.0A Body Diode Forward Voltage VF(S-S) — 0.7 1.0 V IF = 3.0 A, VGS = 0 V, Qg — 37 — nC Turn-On Delay Time tD(on) — 10 — ns Turn-On Rise Time tr — 20 — ns Turn-Off Delay Time tD(off) — 83 — ns — 52 — ns DYNAMIC CHARACTERISTICS (Note 8) Total Gate Charge Turn-Off Fall Time Notes: tf 2 VGS = 4.5V, VSS = 10V, IS = 6A VDD = 6V, RL = 6.0Ω, IS = 3.0A 2 5. Device mounted on FR4 material with 1-inch (6.45-cm ), 2-oz. (0.071-mm thick) Cu. 6. Repetitive rating, pulse width limited by junction temperature. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. DMN1033UCB4 Document number: DS36264 Rev. 2 - 2 2 of 6 www.diodes.com September 2013 © Diodes Incorporated DMN1033UCB4 20 12.0 VGS = 6.0V ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 16 VGS = 4.5V VGS = 4.0V 8.0 VGS = 1.5V VGS = 2.0V 6.0 4.0 VGS = 1.0V 12 TA = 150°C 8 TA = 85°C TA = 125°C 4 2.0 TA = 25°C VGS = 0.9V 0 0.5 1 1.5 2 2.5 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 1 Typical Output Characteristics TA = -55°C 0.06 0.05 0.04 VGS = 1.5V VGS = 1.8V 0.03 VGS = 4.5V 0.02 VGS = 6.0V 0.01 0 0 2 4 6 8 10 12 ID, DRAIN-SOURCE CURRENT (A) Figure 3 Typical On-Resistance vs. Drain Current and Gate Voltage VGS = 1.8V ID = 4.0A 1.2 1.0 0.8 0.6 -50 Document number: DS36264 Rev. 2 - 2 0.3 0.6 0.9 1.2 VGS, GATE-SOURCE VOLTAGE (V) Figure 2 Typical Transfer Characteristics 1.5 VGS = 4.5V 0.03 T A = 150°C TA = 125°C 0.025 TA = 85°C TA = 25°C 0.02 TA = -55°C 0.015 0.01 4 6 8 10 12 ID, DRAIN CURRENT (A) Figure 4 Typical On-Resistance vs. Drain Current and Temperature -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) Figure 5 On-Resistance Variation with Temperature DMN1033UCB4 0 0.035 RDS(ON), DRAIN-SOURCE ON-RESISTANCE () 1.6 1.4 0 3 RDS(ON), DRAIN-SOURCE ON-RESISTANCE () RDS(ON), DRAIN-SOURCE ON-RESISTANCE () 0.0 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (NORMALIZED) NEW PRODUCT 10.0 VDS = 5.0V VGS = 1.2V 3 of 6 www.diodes.com 0 2 0.05 0.045 0.04 0.035 0.03 VGS = 1.8V ID = 4.0A 0.025 0.02 0.015 0.01 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) Figure 6 On-Resistance Variation with Temperature September 2013 © Diodes Incorporated DMN1033UCB4 VGS(th), GATE THRESHOLD VOLTAGE (V) 12 0.7 10 IS, SOURCE CURRENT (A) 0.6 ID = 1mA 0.5 ID = 250µA 0.4 0.3 0.2 TA = 25°C 6 4 0 0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) Figure 7 Gate Threshold Variation vs. Ambient Temperature IGSS, LEAKAGE CURRENT (nA) C iss 1000 C oss C rss f = 1MHz 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, SOURCE-DRAIN VOLTAGE (V) Figure 8 Diode Forward Voltage vs. Current 10000 10000 CT, JUNCTION CAPACITANCE (pF) 8 2 0.1 0 2 4 6 8 10 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 9 Typical Junction Capacitance 12 1000 T A = 125°C T A = 150°C 100 10 TA = 85°C TA = 25°C TA = -55°C 1 0.1 1 3 5 6 2 4 VGS, GATE-SOURCE VOLTAGE (V) Figure 10 Gate-Source Leakage Current vs. Voltage 100 R DS(on) Limited ID, DRAIN CURRENT (A) NEW PRODUCT 0.8 PW = 100µs 10 DC 1 PW = 10s PW = 1s PW = 100ms PW = 10ms PW = 1ms 0.1 TJ(max) = 150°C TA = 25°C Single Pulse DUT on 1 * MRP Board VGS = 6V 0.01 0.01 0.1 PW = 100µs 1 10 100 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 11 SOA, Safe Operation Area DMN1033UCB4 Document number: DS36264 Rev. 2 - 2 4 of 6 www.diodes.com September 2013 © Diodes Incorporated DMN1033UCB4 r(t), TRANSIENT THERMAL RESISTANCE NEW PRODUCT 1 D = 0.9 D = 0.7 D = 0.5 D = 0.3 0.1 D = 0.1 D = 0.05 D = 0.02 0.01 D = 0.01 D = 0.005 RJA(t) = r(t) * RJA RJA = 156°C/W Duty Cycle, D = t1/ t2 D = Single Pulse 0.001 0.0001 0.001 0.01 0.1 1 10 t1, PULSE DURATION TIME (sec) Figure 12 Transient Thermal Resistance 100 1,000 Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. e D D I N I P 1 2 B A U-WLB1818-4 Dim Min Max Typ A 0.62 A2 0.36 b 0.25 0.35 0.30 D 1.75 1.80 1.79 E 1.75 1.80 1.79 e 0.65 All Dimensions in mm e E A B b Ø x 6 2 A 1 2 A G N IE T N AA EL SP Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 1 C x 4 D ︵ ︶ 2 A Dimensions C B C D DMN1033UCB4 Document number: DS36264 Rev. 2 - 2 5 of 6 www.diodes.com Value (in mm) 0.65 0.30 September 2013 © Diodes Incorporated DMN1033UCB4 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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