SKY65135-21 - Digi-Key

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DATA SHEET
SKY65135: WLAN Power Amplifier
Applications
Description
• IEEE802.11 b/g WLAN
Skyworks SKY65135 is a Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SKY65135 ideal for
Wireless Local Area Network (WLAN) applications.
• ISM band
• WCS fixed wireless
• Wireless access nodes
Features
• Linear output power of +31 dBm for IEEE802.11b mask
• Linear output power of +30 dBm for IEEE802.11g mask
• Three percent EVM at POUT >+27 dBm
• High gain of 33 dB
The device is fabricated using Skyworks high reliability Indium
Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT)
technology. The device is internally matched and mounted in a
20-pin, 6 x 6 mm Multi-Chip Module (MCM) Surface-Mounted
Technology (SMT) package, which allows for a highly
manufacturable low cost solution.
The device package and pinout for the 20-pin MCM are shown in
Figure 1. A block diagram of the SKY65135 is shown in Figure 2.
GND
19
18
17
15
VCC_DET
GND
3
14
V_DET
VC_BIAS
4
13
VCC2
VREF1
5
12
VDET_CNTL
VREF2
6
11
VCC3
7
8
9
10
GND
2
GND
RF_OUT
VCC1
1
GND
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
20
16
GND
VREF3
• Small footprint, MCM (20-pin, 6 x 6 mm) Pb-free (MSL3, 250 °C
per JEDEC J-STD-020) SMT package
RF_IN
• Internal RF match and bias circuits
GND
• Superior gain flatness
GND
• Output power detector: 20 dB dynamic range
S414
Figure 1. SKY65135 Pinout – 20-Pin MCM
(Top View)
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DATA SHEET • SKY65135 WLAN PA
VCC1
VC_BIAS
VREF1, VREF2
VREF3
VCC3
Active Bias
RF_IN
Input
Match
Stage 1
PA
Inter-Stage
Match
Stage 2
PA
Inter-Stage
Match
VCC_DET
Detector
V_DET
Output
Match
RF_OUT
Stage 3
PA
VCC2
S413
Figure 2. SKY65135 Block Diagram
Technical Description
The SKY65135 PA contains all of the needed RF matching and DC
biasing circuits. The device also provides an output power
detector voltage.
The SKY65135 is a three-stage, HBT InGaP device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WLANs).
The device has been characterized with the highest specified data
rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these
stringent test conditions, the device exhibits excellent spectral
purity and power efficiency.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65135 is rated to Moisture Sensitivity Level 3 (MSL3) at
250 °C. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65135 are provided in Table 2. Electrical specifications are
provided in Table 3.
Typical performance characteristics are shown in Figures 3
through 11. Figure 12 provides a typical evaluation board
schematic. An assembly drawing for the Evaluation Board is
shown in Figure 13 and the layer detail is provided in Figure 14.
The layer detail physical characteristics are noted in Figure 15.
The phone board layout footprint for the SKY65135 is shown in
Figure 16. Package dimensions for the 20-pin MCM are shown in
Figure 17, and tape and reel dimensions are provided in
Figure 18.
Electrostatic Discharge (ESD) Sensitivity
The SKY65135 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
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DATA SHEET • SKY65135 WLAN PA
Table 1. SKY65135 Signal Descriptions
Pin #
1
Name
GND
Description
Pin #
Ground
11
Name
Description
VCC3
Stage 3 collector voltage
2
GND
Ground
12
VDET_CNTL
Detector voltage control
3
GND
Ground
13
VCC2
Stage 2 collector voltage
4
VC_BIAS
Bias voltage
14
V_DET
Detector output signal
5
VREF1
Bias reference voltage 1
15
VCC_DET
Detector supply voltage
6
VREF2
Bias referance voltage 2
16
VCC1
Stage 1 collector voltage
7
VREF3
Bias referance voltage 3
17
GND
Ground
8
GND
Ground
18
RF_IN
RF input
9
RF_OUT
RF output
19
GND
Ground
10
GND
Ground
20
GND
Ground
Table 2. SKY65135 Absolute Maximum Ratings (Note 1)
Maximum
Units
RF output power
Parameter
POUT
Symbol
Minimum
30
dBm
Supply voltage, measured at pin of package
(Note 2)
VREF1, VREF2, VREF3,
VCC1, VCC2, and
VCC_DET
4
V
3rd stage supply voltage
VCC3, VC_BIAS
6
V
Total supply current (ICC + IBIAS + IREF)
ICC_TOTAL
1200
mA
Power dissipation
Case operating temperature
TC
–40
Storage temperature
TST
–55
Junction temperature
TJ
4.0
W
+85
°C
+125
°C
+150
°C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
Note 2: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 12.
Table 3. SKY65135 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
RF input power
PIN
–6
dBm
Supply voltage, measured at pin of package
(Note 1)
VREF1, VREF2, and
VREF3
2.3
2.5
2.7
V
VCC1 and VCC2
3.0
3.3
3.6
V
VCC_DET
3.3
3.6
3.9
V
VCC3 and VC_BIAS
4.5
5.0
5.5
V
Case operating temperature
TC
–40
+85
°C
Storage temperature
TST
–55
+125
°C
Note 1: Evaluation Board supply voltage levels can be different. Refer to the Evaluation Board schematic diagram in Figure 12.
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DATA SHEET • SKY65135 WLAN PA
Table 4. SKY65135 Electrical Specifications
(VCC1 = VCC2 = 3.3 V, VCC3 = 5 V, TC = +25 °C, Test Frequency = 2.442 GHz unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Using IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps
Total supply current
ICC_TOTAL
1150
mA
Output power (Note 1)
POUT
31
dBm
Power added efficiency (Note 2)
PAE
25
%
Ramp-up/ramp-down (Note 3)
TS
<0.5
µs
1050
mA
Using IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Total supply current
ICC_TOTAL
Output power (Note 4)
POUT
30
dBm
Output power @ EVM = 3%
POUT_EVM
27
dBm
Power added efficiency (Note 2)
PAE
22
%
Using Continuous Wave Input Signals
Small signal gain
G
PIN = –25 dBm
31.5
33
34.5
Gain flatness over band
From 2.4 GHz to 2.5 GHz
±0.5
dB
Gain flatness over channel (16.25 MHz)
Over any 16.25 MHz
within band
±0.1
dB
33
dBm
dBm
Output power @ 1 dB compression
P1dB
PIN = 0 dBm
32
Output IP3
OIP3
PTONE = +27 dBm,
Delta_freq = 5 MHz
42
Quiescent Current
IQ
No RF input
400
450
mA
Noise Figure
NF
5
6
dB
Power added efficiency @ P1dB
PAE
25
34
Note 1: Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met.
Note 2: Measured at the specified average output RF power and modulation type.
Note 3: Ramp-up and ramp-down times are defined from the 10% to 90% power points.
Note 4: Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met.
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dB
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%
DATA SHEET • SKY65135 WLAN PA
35.0
36
35
34.0
Gain (dB)
Gain (dB)
34
33
32
33.0
31
30
32.0
10
14
12
16
18
20
22
24
26
28
30
32
34
2.40
2.41
2.42
2.43
2.44
POUT (dBm)
2.45
2.46
2.47
2.48
2.49
2.50
Frequency (GHz)
Figure 3. Typical Gain vs POUT @ 2.442 GHz
Figure 4. Typical Gain vs Frequency Response
6.0
+10
Relative Power (dB)
5.8
5.6
Noise Figure (dB)
5.4
5.2
5.0
4.8
0
IEEE802.11g
Specification Mask
–10
–20
–30
4.6
POUT = +30 dBm
4.4
–40
4.2
4.0
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
–50
2.411
2.417
2.423
2.430
2.436
Frequency (GHz)
Figure 5. Typical Noise Figure Performance vs Frequency
2.448
2.454
2.461
2.467
2.473
Figure 6. Output Spectrum Response for 802.11g
@ 2.442 GHz and POUT = 30 dBm
1.8
+10
1.6
0
1.4
IEEE802.11b
Specification Mask
–10
Detector Voltage (V)
Relative Power (dB)
2.442
Frequency (GHz)
–20
–30
–40
POUT = +31 dBm
1.2
1.0
0.8
0.6
0.4
–50
0.2
–60
2.411
2.417
2.423
2.430
2.436
2.442
2.448
2.454
2.461
2.467
2.473
Frequency (GHz)
Figure 7. Output Spectrum Response for 802.11b CCK-Coded
@ 2.442 GHz and POUT = 31 dBm
0
10
12
14
16
18
20
22
24
26
28
30
32
34
POUT (dBm)
Figure 8. Detector Output Voltage vs RF Output Power
@ 2.442 GHz
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DATA SHEET • SKY65135 WLAN PA
1000
5.5
900
5.0
800
4.5
700
Current (mA)
6.0
EVM (%)
4.0
3.5
3.0
2.5
×
600
ICC_TOTAL
ICC1
ICC2
ICC3
×
× ×
×
× ×
× ×
× × ×
500
400
300
×
2.0
200
1.5
100
1.0
0
0.5
23
24
25
26
27
28
14
29
16
18
20
22
24
26
Output Power (dBm)
40
35
30
PAE (%)
25
20
15
10
5
0
16
18
20
22
24
26
28
30
32
34
Output Power (dBm)
Figure 11. PAE vs Output Power
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30
Figure 10. Individual Stage Currents and Total Current vs RF
Output Power
Figure 9. EVM vs POUT for 802.11g
14
28
Output Power (dBm)
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DATA SHEET • SKY65135 WLAN PA
Reference
Voltage 3
RF_IN
VDET
16
L1
300 Ω
L2
27 nH
Detector Output
C7
8.2 pF
VC_BIAS
13
C8
8.2 pF
VREF1
VDET_CNTL
GND
RF_OUT
9
VREF2
GND
6
C3
8.2 pF
VCC3
Collector Voltage
(Stage 2)
C16
10 μF
12
11
R4
51 Ω
L3
0Ω
C9
270 pF
10
5
C2
8.2 pF
Collector Voltage
(Stage 1)
Detector Supply
Voltage
C6
3300 pF
15
14
C15
10 μF
SKY65135
VCC2
R2
200 Ω
C13
DNI
GND
GND
7
Reference
Voltage 2
VCC1
3
C1
8.2 pF
R1
750 Ω
C12
DNI
C5
8.2 pF
VCC_DET
8
Reference
Voltage 1
17
GND
VREF3
C11
10 μF
GND
18
2
4
Bias Voltage
GND
1
19
GND
20
R3
270 Ω
C14
DNI
C4
8.2 pF
C10
8.2 pF
C17
10 μF
Collector Voltage
(Stage 3)
Note: Evaluation Board material: four-layer Rogers 4003-12, εr = 3.38.
Some component labels may be different than the corresponding component symbol shown here.
Component values, however, are accurate as of the date of this Data Sheet.
S702
Figure 12. SKY65135 Evaluation Board Schematic
C5
C15
C6
C11 C1
L1
C7
C12 C2
L2
J3
R1
C13
C3
J4
C8
C16
L3
R4
R2
C10
R3
C14
C17
C9
C4
J2
S588
Figure 13. Evaluation Board Assembly Drawing
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DATA SHEET • SKY65135 WLAN PA
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
S590
Figure 14. Evaluation Board Layer Detail
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DATA SHEET • SKY65135 WLAN PA
Cross Section
Name Thickness (mils) Material
εr
L1
1.4
Cu, 1 oz.
–
Lam1
12
Rogers 4003-12
3.38
L2_GND
1.4
Cu, 1 oz
–
4
FR4-4
4.35
L3_GND
1.4
Cu, 1 oz.
–
Lam3
12
FR4-12
4.35
L4
1.4
Cu, 1 oz.
–
Lam2
S573
Figure 15. Layer Detail Physical Characteristics
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DATA SHEET • SKY65135 WLAN PA
Pin 20
20X 0.75
Pin 1
20X 0.5
2X 1.7
6.3
1.0 Typical
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening.
Component outline
2X 1.7
6.3
Thermal Via Array ∅0.3 mm
on 0.6 mm pitch.
Additional vias will improve
thermal performance.
Stencil Aperture
Top View
20X 0.75
Pin 20
0.25 Typical
Pin 1
Pin 20
20X 0.85
Pin 1
20X 0.5
20X 0.6
0.6 Typical
6.3
2X 1.7
6.4
1.0 Typical
1.0 Typical
Component outline
0.6 Typical
Component outline
2X 1.7
6.3
6.4
Metallization
Top View
Solder Mask Opening
Top View
All measurements are in millimeters
Note: Thermal vias should be tented and filled with
solder mask: 30 to 35 µm Cu plating recommended.
Figure 16. SKY65135 Phone Board Layout Footprint
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S965
6
Pin 1
B
Pin 20
(2.075)
4X 0.5
4X 1.5
12X 2.9
2X 1.9
DATA SHEET • SKY65135 WLAN PA
(∅0.3) Solder Mask Opening
∅0.15 Metal Pad
Pin 1 Indicator
C
(2.75)
4X 2.5
Pin 1
4X 1.5
4X 0.5
6
A
2X 1.9
8X 2.9
20X SMT Pad
A
1.45 ± 0.1
0.15 A B C
Top View
4X R0.2
0.1
Solder Mask Opening
0.15 A B C
0.2 A B C
Bottom View
Side View
0.5 ± 0.1
0.1
0.5 ± 0.05
Metal Pad
Edge
All dimensions are in millimeters
Dimensioning and tolerancing according
to ASME Y14.5M-1994
Detail A
S416
Figure 17. SKY65135 20-Pin MCM Package Dimensions
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DATA SHEET • SKY65135 WLAN PA
2.00 ± 0.05
4.00
8.00
∅1.55 ± 0.05
0.30 ± 0.05
B
5.50 ± 0.05
A
1.75 ± 0.10
6.30
A
12.00 ± 0.30
Pin #1
Indicator
5o Max.
B
∅1.50 Min.
1.70
6.30
B
5o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
A
C1222
Figure 18. SKY65135 20-Pin MCM Tape and Reel Dimensions
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DATA SHEET • SKY65135 WLAN PA
Ordering Information
Model Name
SKY65135 WLAN Power Amplifier
Manufacturing Part Number
SKY65135-21 (Pb-free package)
Evaluation Kit Part Number
TW13-D122
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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