Application Requirements and Developments for
CTE-Matched Thermal Core Printed Circuit Boards
David L. Saums, Principal
DS&A LLC, Amesbury MA USA
dsaums@dsa-thermal.com
Robert A. Hay, VP Business Development
MMCC LLCC, Waltham MA USA
Subsidiary of Parker Hannifin Corporation
rhay@mmccinc.com
CIPS Conference 2014
Nürnberg, Germany
25-27 February 2014
© Copyright 2014 DS&A LLC
Purpose
The purpose of this presentation is to present:
•
•
•
•
A brief summary of manufacturing process and product development data prepared to date
for new thermal core materials for high-reliability CTE-matched PCBs.
Present initial thermal conductivity test data for completed thermal core PCBs.
Indicate current and future cost targets.
Describe potential applications for high-reliability CTE-matched thermal core PCBs.
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 2
Introduction
All finished PCBs shown in this presentation were fabricated by TTM Technologies (Stafford Springs
CT USA):
 TTM is the lead PCB fabrication partner for thermal core materials evaluation described in
this presentation.
 Lockheed Martin has been the development lead OEM for the PCB designs shown.
 All PCBs shown were manufactured per IPC 6012 and related industry standard processes.
 NSWC (Navy Surface Weapons Center Crane) has also evaluated PCB fabrication and
processes utilizing these copper-graphite thermal core materials, to assist in
commercialization.
Contact MMCC LLC or DS&A LLC for information regarding the copper-graphite composite core
materials described in this presentation.
 Thermal composite core PCB material concepts discussed in this presentation are currently
manufactured by TTM Technologies (Stafford Springs CT USA) and Cirexx Inc. (Santa Clara
CA USA).
 Manufacturers who may be interested in developing PCB designs utilizing CTE-matched,
high-performance thermal core materials are encouraged to inquire.
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Goals – Thermal Core PCB Development for Thermal Management and Reliability
•
Power semiconductor electronics packaging improvements needed
Module Packaging Improvements
and Needed Development Materials and Components
Packaging and thermal materials capable of higher temperature operation
Low-temperature joining techniques
Transition to improved wirebonding techniques (e.g., wedgebonding)
Transition to monolithic module metals (e.g., copper)
Transition from aluminum wire to aluminum ribbon bonding
Higher thermal conductivity CTE-matched baseplate and PCB materials
Double-sided liquid cooling package developments
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Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Goals – Thermal Core PCB Development for Thermal Management and Reliability
•
Power semiconductor electronics packaging improvements needed
Module Packaging Improvements
and Needed Development Materials and Components
Packaging and thermal materials capable of higher temperature operation
Low-temperature joining techniques
Transition to improved wirebonding techniques (e.g., wedgebonding)
Transition to monolithic module metals (e.g., copper)
Transition from aluminum wire to aluminum ribbon bonding
Baseplate and PCB materials with higher thermal conductivity and CTE-matching
Double-sided liquid cooling package developments
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Goals – Thermal Core PCB Development for Thermal Management and Reliability
Goals for development programs for PCBs – What is needed for thermal control within PCBs?
• Mixed-mode PCBs capable of handling multiple types of semiconductor device types:
 RF power amplifiers (Si, GaAs, GaN, SiC), to handle higher heat fluxes, higher frequency
operation, and sensitivity to peak operating temperatures
 Power components (Si, SiC)
 Logic and mixed digital/analog/RF devices on common substrate
• Reduce weight for advanced mulitilayer PCBs requiring thermal cores by eliminating copper.
• Improve CTE matching capabilities for:
 Semiconductor materials with differing CTE values (Si, SiC, GaAs, GaN) for direct die attach;
 Improved high heat flux packaging materials, such as copper-graphite device baseplates
• Improve thermal performance for RF, power, and IC devices at elevated temperatures:
 Prevent increased gate leakage
 Prevent RF performance degradation.
 Allow use of state-of-the-art device technologies with increased density packaging
 For RF devices, meet signal integrity requirements
• Identify suitable soldering and direct die attach joining materials and processes to maximize the
value of exposed CTE-matched high thermal-conductivity thermal core PCBs.
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Goals – Thermal Core PCB Development for Thermal Management and Reliability
Goals for development programs for thermal control within PCBs:
1. Evaluate alternative materials which could replace heavy copper core layers for PCBs.
2. Develop manufacturing process to yield “drop-in-place” thermal core formats for PCB
fabrication, per IPC 6012(C) and related standards:
 Dimensional requirements (X-Y)*
 Thickness requirements – interim and final – are critical to successful development
3. Fabricate prototype thermal core PCBs for performance testing and analysis:
 Feature capabilities (through-holes, blinds, compatibility with PCB dielectrics)
 Flatness
 Metallization
 Potential for warpage control (due to moisture absorption) in handling and storage of core
materials and subsequent PCB fabrication processing.
 Potential for actual PCB weight reduction versus current copper core PCBs.
4. Develop PCB thermal performance comparative models and test data to examine:
 Calculated Effective Thermal Conductivity values
 Empirical Effective Thermal Conductivity values
Notes: *Industry requirements determined by existing PCB fabrication process equipment.
IPC 6012(C) ) and associated standards are published by IPC, Bannockburn IL USA. Website: www.ipc.org
CIPS Conference 25-27 February 2014
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Goals – Thermal Core PCB Development for Thermal Management and Reliability
Goals for development programs for thermal control within multilayer PCBs:
5. Test and evaluate electrical and thermal performance:
 Thermal and CTE matching characteristics
 RF performance for attached RF devices
 Solder attach and low-ignition voltage solder alternatives (such as Nanofoil®) as joining
materials and processes for high heat flux device attachment.
6. Evaluate cost:
 Matching existing standardized PCB fabrication processes is a major cost driver.*
 Identify potential cost reduction targets and methods to achieve this.
Notes: *Industry requirements determined by existing standards for PCB fabrication equipment and processes.
Nanofoil is a registered mark of Indium Corporation of America.
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials
Previous industry presentations describe the need for various thermal core materials for PCBs, for
existing types of core materials then available. Example:
• “Printed Circuit Board Technologies for Thermal Management” (3 February 2010)
-- O. Belnoue, Technical Manager, BREE Industries and P.E. Goutorbe, Technical Manager, CIRE
IMAPS France 5th European Thermal and Micropackaging Workshop (La Rochelle, France).
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 9
CTE-Matched Thermal Core PCB Development Materials
How can we improve on what has already been available?
• New materials must offer:
 Reduced weight – critical for aerospace applications
 Higher thermal conductivity – X-Y orientation for thermal conduction to card edges
 Higher thermal conductivity – Z axis, to create near-isotropic material
 Improved CTE matching to selected semiconductor and packaging materials
 Reduced thickness
 Adapt directly to existing printed circuit board manufacturing processes*
 Minimized or eliminated warpage.
Note: *Industry requirements determined by existing standards for PCB fabrication equipment and processes.
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© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials
How can we improve on what has previously been available?
• MMCC is now producing copper-graphite composite thermal core materials in sheet form:
 Available panel thicknesses (thickness to be specified by customer):
Material
Standard Panel Dimensions (X-Y)
Panel Thickness (Z)
0.25mm (0.010”)
Cu-MetGraf™ 7-300 Copper-graphite
composite sheet
30.5cm x 45.7cm (12.0” x 18.0”)*
0.50mm (0.020”)
1.02mm (0.040”)

•
Meets standard PCB processes for electrolytic copper plating and drilling
 Meets industry requirements for multilayer PCB manufacturing, for complex PCBs
 Production thermal core PCB products have been qualified by a major defense electronics
manufacturer.
Manufacturing development process was first described by MMCC LLC at the IMAPS Advanced
Technology Workshop on Thermal Management 2011 (Palo Alto CA USA, Nov. 7-9, 2011).
Note: *Industry requirements determined by existing standards for PCB fabrication equipment and processes.
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials
Development of new manufacturing processes enabling new thermal core materials:
• See reference 3 (A. Pergande et al., Lockheed Martin) for original source material for initial
material selections.
Material
Thermal Conductivity
(W/mK)
CTE
(ppm/°C)
MMCC Cu-MetGraf™ 7-300
X-Y: 285-300
Z: 210
X-Y: 7.0
Z: 16.0
Epoxy
~0.5
~55
Graphite/Epoxy (+0.5 oz. Cu each side)
XY: 175
Z: ~1
XY: 4.0 – 6.5
Z: ~55
OFHC Copper
390
17
Sources: Lockheed Martin (Orlando FL USA); MMCC LLC (Waltham MA USA)
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© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials: Balanced PCB Stack
Development of new manufacturing processes enabling new thermal core materials:
• Described by MMCC LLC (Waltham MA) in IMAPS ATW Thermal 2011
• Example of a balanced thermal core PCB materials stack:
1
Top
1 oz
0.25mm (0.010”)
. 0 10
C o r e ( N el co - 2 9 )
2
1 oz
Pr ep r eg 3 - 10 8 0 ( N el co - 2 9 )
Cu-MetGrafM7-300
et gcopper-graphite
r af M at er i alcomposite layer
Pr ep r eg 3 - 10 8 0 ( N el co - 2 9 )
3
1 oz
0.25mm (0.010”)
. 0 10
4
•
C o r e ( N el co - 2 9 )
Bottom
1 oz
Overall PCB thickness: 2.31mm (0.091”)
Note: *Industry requirements determined by existing PCB fabrication process equipment. Nelco® is a registered mark of Park Electrochemical
Corporation (Melviille NY USA). MetGraf™ and Cu-MetGraf™ are trademarks of MMCC LLC (Waltham MA USA).
Source: Courtesy of TTM Technologies (Stafford Springs CT USA)
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials: Balanced PCB Stack
Development of new manufacturing processes enabling new thermal core materials:
• Development PCB fabrication and analysis by TTM included drilling, plasma etch, other
processes to prove out PCB industry standard production process methods.
Cu-MetGraf 7-300 (0.51mm/0.0200”) copper-graphite
composite layer
Process step and analysis: Drill 0.90mm (0.0354”) and 0.25mm (0.0098”) diameter holes
• Balanced PCB stack
• PCB development core materials must meet process requirements of MIL-P-55110 (IPC-6012).
Source: Courtesy of TTM Technologies (Stafford Springs CT USA)
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© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials – Unbalanced PCB Stack
Development of new manufacturing processes enabling new thermal core materials:
• Example of an unbalanced 10-layer thermal core PCB materials stack:
1
T op
1 oz
. 0 1 0 C or e ( N e l c o - 2 9 )
2
1 oz
P r e pr e g 3 - 1 0 8 0 ( N e l c o - 2 9 )
M ecopper-graphite
t g r a f M a t e r i a l composite layer
Cu-MetGraf 7-300
P r e pr e g 3 - 1 0 8 0 ( N e l c o - 2 9 )
3
1 oz
. 0 1 0 C or e ( N e l c o - 2 9 )
4
1 oz
P r e pr e g 2 - 1 0 8 0 ( N e l c o - 2 9 )
5
1 oz
. 0 1 0 C or e ( N e l c o - 2 9 )
6
1 oz
P r e pr e g 2 - 1 0 8 0 ( N e l c o - 2 9 )
7
1 oz
. 0 1 0 C or e ( N e l c o - 2 9 )
8
1 oz
P r e pr e g 2 - 1 0 8 0 ( N e l c o - 2 9 )
9
1 oz
. 0 1 0 C or e ( N e l c o - 2 9 )
10
•
B ot t om
1 oz
Overall thickness: 3.56mm (0.140”). (Other dimensions shown are in inches.)
Note: *Industry requirements determined by existing PCB fabrication process equipment.
Source: Courtesy of TTM Technologies (Stafford Springs CT USA)
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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CTE-Matched Thermal Core PCB Development Materials – Unbalanced PCB Stack
Development of new manufacturing processes enabling new thermal core materials:
• Fabrication example of this unbalanced 10-layer thermal core PCB materials stack:
Cu-MetGraf 7-300 (0.51mm/0.0200”) copper-graphite composite layer
•
•
•
Overall PCB thickness: 3.56mm (0.140”)
In this test board developed for process evaluation, excessive warpage from the unbalanced
stack prevented drilling
This is exactly as expected with a heavily unbalanced materials stack, as is also true with a
copper thermal control layer.
Source: Courtesy of TTM Technologies (Stafford Springs CT USA)
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Modeled Data – Effective Thermal Conductivity
Cu-MetGraf™ 7-300 (0.51mm/0.020”)
Stablcor™ ST325-EP387
(2.05mm/0.0800”)
Source: TTM Technologies, October 2012
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© Copyright 2014 DS&A LLC
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Modeled Data – Effective Thermal Conductivity
Data model:
• Model constructed per
conductivity and
thickness values for
material stack through
entire thermal core PCB.
• Modeled results for
overall PCB effective
thermal conductivity:
Cu- MetGraf™ 7-300
(0.51mm/0.0200”)
87.5 W/mK
(Identical PCB materials
stack to test samples)
Stablcor™ ST325-EP387
(2.03mm/0.0800”)
Source: DS&A LLC, October 2012
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Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
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Empirical Data – Effective Thermal Conductivity
Thermal conductivity test fixture and sample construction:
Empirical results - effective thermal conductivity:
• Average thermal conductivity test value for fabricated thermal core PCB samples: 89 W/mK;
• Calculated effective thermal conductivity for Layer 2 (Cu-MetGraf 7-300): ~290 W/mK.
Note: Error Bars: + 1 standard deviation. (Inner and outer insulation for test fixture removed for photograph.)
Data source: Rockwell Collins Inc., Advanced Technology Center October 29, 2012
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© Copyright 2014 DS&A LLC
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effective Thermal Conductivity (W/mK)
Empirical Data – Effective Thermal Conductivity
OFHC Copper
Aluminum
Thermal Core PCB
(Cu-MetGraf™7-300 Core*)
Test Material
Note: Error Bars: + 1 standard deviation.
Note: *Multilayer PCB; single thermal core layer is MMCC Cu-MetGraf-7 Core (0.51mm/0.020”); one additional layer for warpage control of
Stablcor® ST325-EP387 (2.0mm/0.080” thickness).
Data source: Rockwell Collins Inc., October 29, 2012
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Empirical Data vs. Modeled Data – Effective Thermal Conductivity
Average thermal conductivity results, thermal core PCB structure:
• Modeled effective value (PCB): 87.5W/mK
• Calculated value from empirical data (PCB): 89W/mK
• Close agreement of calculated test value to modeled value for average value.
Calculation of effective thermal conductivity for Cu-MetGraf™-7 thermal core:
• Overall thermal conductivity test value for fabricated thermal core PCB samples: 89 W/mK;
• Calculated effective thermal conductivity for Layer 2 (Cu-MetGraf 7-300): ~290 W/mK.
 Calculated as inverse of Layer 2 thickness to overall thickness.
 Good agreement with MMCC test data for Cu-MetGraf 7-300 X-Y thermal conductivity:
Effective Thermal Conductivity
Thermal Conductivity (W/mK)
Data sources:
Calculated Data, OEM Test(1)
~290
Vendor Data, MMCC Test (X-Y)(2)
285-300
Test Data, OEM Test(3)
287
(1) Rockwell Collins Inc., October 29, 2012
(2) MMCC LLC, December 2010
(3) Lockheed Martin, March 6, 2011
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Applications
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Composite Core Materials Availability
•
Cu-MetGraf-7 graphite composite core materials meet European Union legislative
requirements.
•
•
Cu-MetGraf-7 materials are not ITAR-restricted.
Cu-MetGraf-7 production materials can be quoted for pricing and delivery for evaluation
purposes.
Note: Cu-MetGraf™ is a trademark of MMCC LLC, Waltham MA USA
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Applications – High Heat Fluxes
Development of thermal core PCBs of the types described are intended to provide:
• Specific CTE values for mounting RF and power semiconductor devices
 Silicon
 Silicon carbide
 Gallium arsenide
 Gallium nitride
• High in-plane (X-Y) and through-plane (Z) thermal conductivity to mount and dissipate heat
loads from these RF and power semiconductor devices
 High heat fluxes
 Critical reliability requirements for system operation
 Increasingly miniaturized component mounting and thermal conduction footprints
• Reductions in PCB weight and volume, critical for airborne, space, and manpack systems.
• Reductions in semiconductor material packaging stackups by eliminating individual materials.
• Higher frequency operation of RF devices requires capability to handle higher heat fluxes.
• Semiconductor materials such as GaN are sensitive to higher temperatures and operating
peak temperatures are critical.
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Applications – CTE Matching and Weight Reduction: What Has Been Achieved?
Weight reduction can be accomplished by:
• Removing copper layers that are used now as thermal cores in high-reliability PCBs
• Replacing copper layers with CTE-matched, high thermal conductivity Cu-MetGraf-7 composite
cores having higher conductivity values than existing alternative PCB materials.
• Alternating copper-graphite composites such as those described with existing low-weight,
lower-cost materials such as Stablcor™ ST325, to provide a balanced PCB stackup.
• Eliminating traditional transmit/receive module metal packaging to
 Remove metal components (Cu, CuMo, CuW, Kovar™) from these MMIC and other RF
devices, to reduce cost and weight.
 Eliminate thermal interfaces to minimize the conduction path.
• Testing and implementing newer material joining processes for direct die attach and package
attach, such as NanoFoil™ and other low-temperature soldering processes.
Note: Stablcor® is a registered mark of Stablcor Technology Inc.; Nanofoil™ is a trademark of Indium Corporation of America.
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Applications – Practicality
Copper-graphite composites described:
• Commercial manufacturing processes are in place at one commercial PCB manufacturer and
one US Navy PCB development and evaluation facility (NSWC Crane).
• Cu-MetGraf-7 cores are easily machinable with standard CNC machining and tool heads.
• Metallization of exposed surface is straight-forward with standard processes.
• Thermal core PCB manufacturing process proven out at one major military/aero PCB
manufacturing company:
 Production “recipe” is in place and seven PCB design programs are underway
 Further thinning of composite core materials (to 0.010” sheet thickness) is in development
 Cu-graphite composite sheets can be machined, drilled, and processed in any manner that
thick copper sheet can be for PCB applications.
• Prototype thermal core PCBs have been designed, manufactured, and built into prototype
electronic systems for seven military aerospace programs.
• Test flights of prototype missile systems are underway.
• A cost-reduction program for manufacturing of Cu-MetGraf-7 sheet cores is in progress.
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Market Requirements -- Constraining Core Thermal Materials for PCBs
Parameter or Property
Goal or Requirement
CTE
Selectable, Lower value range appropriate for SiC, GaN
Packaged or bare die
Thermal Conductivity
Relatively high versus existing CTE-matched materials
Requirement: > 250 W/mK
Isotropic or near-isotropic if possible
Density
Young’s Modulus
Fabrication
Manufactured Panel Size
Manufactured Panel Thickness
Manufactured Cost
Availability
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Reduced versus existing CTE-matched materials
Requirement: 30+% reduction
Relatively stiff, with reduced or no warpage in fabricated PCB
Demonstrated compatibility with standard PCB fabrication processes (per IPC)
“Drop-in-place” replacement of heavy copper layer
Suitable for microdrilling, microvia processes
Requirement: 30.5cm x 45.7cm (minimum)
Initial requirement: 0.50mm (maximum)
Stretch requirement: 0.25mm
Reducible with future manufacturing process cost improvement program
Suitable for IPC-standard PCB fabrication facilities globally
Not subject to legislative restrictions
Development for Copper-Graphite Composite Thermal Cores for PCBs
for High-Reliability RF Systems
© Copyright 2014 DS&A LLC
Page 27
Solution: Constraining Core Thermal Materials for PCBs
Parameter or
Property
Goal or Requirement
Cu-MetGraf-7
Value
Lower value range, appropriate for SiC, GaN
Packaged or bare die
7.0 ppm/°C
Yes
Relatively high versus existing CTE-matched materials
Requirement: > 250 W/mK
Isotropic or near-isotropic if possible
X-Y: 287 W/mK
Z: 225 W/mK
Near-isotropic
Reduced versus existing CTE-matched materials
Requirement: 30+% reduction
6.0 g/cc
Relatively stiff, with reduced or no warpage in fabricated PCB
75.8 GPa
Demonstrated compatibility, standard PCB fabrication processes
“Drop-in-place” replacement of heavy copper layer
Suitable for microdrilling, microvia processes
Yes
Yes
Yes
Manufactured Panel
Size
Requirement: 30.5cm x 45.7cm (minimum)
Yes, demonstrated
Manufactured Panel
Thickness
Initial requirement: 0.50mm (maximum)
Stretch requirement: 0.25mm
Yes, completed
Yes, completed
Manufactured Cost
Reducible with future manufacturing process cost improvement program
Yes, now underway
Suitable for IPC-standard PCB fabrication facilities globally
Not subject to legislative restrictions
Yes
Yes
CTE
Thermal
Conductivity
Density
Young’s Modulus
Fabrication
Availability
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Solution: Constraining Core Thermal Materials for PCBs
Result: A single new material to replace heavy copper layer(s) for high-reliability PCBs.
Molybdenum1
Cu-Mo-Cu1
25Cu/50Mo/
25Cu2
20Cu/60 Invar/
20Cu2
Cu-Graphite
(Cu-MetGraf 7-300)
Cu1
5.0
6
7.9
X-Y: 6.0
Z: 7.7
7.0
17
X: 140
Y: 142
170-182
X-Y: 268
Z: N/A
X-Y: 164
Z: 22
X-Y: 287
Z: 225
385
Density
(g/cc)
10.2
9.9 - 10.0
9.6
8.5
6.1
8.9
Young’s Modulus
(GPa)
330
280
220
135
75.84
120-130
Parameter or Property
CTE
(ppm/°C)
Thermal Conductivity
(W/mK)
Notes: Constraining core materials for high-reliability PCBs.
Sources:
1. Rockwell Collins Inc., USA;
2. Pecht, M., Agarwal, R., McCluskey, F.P., Dishongh, T.J., Javadpour, S., Mahajan, R., Electronic Packaging Materials and Their Properties, CRC Press, 1998.
ISBN 0-8493-9625-5.
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for High-Reliability RF Systems
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Applications
•
•
•
•
Phased array radars
•
•
RF modules for direction finding for guided ordnance
Beamforming technologies
Seekers
Electronic countermeasures (ECM) and electronic counter-countermeasures (ECCM) and
similar jamming systems
High bandwidth video streaming mixed RF and logic modules for airborne battlefield
communications
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Acknowledgments
Assistance for the manufacturing and process development activities described in this presentation
is gratefully acknowledged:
•
Rob Hay, VP Business Development; Mark Ryals, President; Kevin Fennessy, VP Engineering,
MMCC LLC (Waltham MA USA)
•
•
•
•
•
Al Pergande, Staff Engineer, Lockheed Martin (Orlando FL USA)
Janice Rock, Research Engineer, US Army AMRDEC (Redstone Arsenal, Huntsville AL USA)
John Vesce, Vice President Engineering, TTM Technologies (Stafford Springs CT USA)
Rockwell Collins Inc. (Cedar Rapids iA USA)
Naval Surface Weapons Center (NSWC), Crane IN USA
Other contributors:
•
Nick Chandler, Executive Scientist (Retired), Advanced Technology Centre, BAE Systems
(Chelmsford, UK)
•
Ben Velsher, Manager, Advanced Packaging Development (Retired), TriQuint Semiconductor
(Dallas TX USA).
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 31
References
Hay, R., “Copper MetGraf Composites for Printed Circuit Board Thermal Control,” IMAPS
Advanced Technology Workshop on Thermal Management 2011, Palo Alto CA USA,
November 7-9, 2011.
IPC 6012(C) “Qualification and Performance Specification for Rigid Printed Circuit Boards,”
ISBN 1-580986-36-6, April 2010. Published by IPC, Bannockburn IL USA, www.ipc.org.
Pergande, ., Rock, J., “Advances in Passive PCB Thermal Control,” Proceedings of the 2011 IEEE
Aerospace Conference, Big Sky MT USA, March 2011, Manuscript 978-1-4244-7351-9/11.
Saums, D., “Developments in CTE-Matched Thermal Core Printed Circuit Boards,” Electronics
Cooling Magazine, June 2011, pp. 10-11.
Saums, D., “Improvements in Thermal Control for High Reliability Printed Circuit Board
Development,” Advancing Microelectronics Magazine, International Microelectronics and
Packaging Society, Washington DC USA, September-October 2012, pp. 16-20.
Saums, D., Hay, R., Edward, B., Ruzicka, P., “Application of Conduction-Cooled PCBs and Composite
Housing Materials in an Aerospace Electronic System”, IMAPS France ATW Thermal and
Micropackaging 2014, La Rochelle, France, 4-6 February 2014
Vasoya, K., Burch, C., Roy, D., “Solving Thermal and CTE Mismatch Issues in Printed Circuit
Boards and Substrates,” Proceedings, IMAPS Symposium 2005, Philadelphia PA USA,
September 25-29, 2005.
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 32
Notes
MetGraf™ and Cu-MetGraf™ are trademarks of MMCC LLC, Waltham MA USA
Website: www.mmccinc.com
Stablcor® is a registered mark of Stablcor Technology Inc., Huntington Beach CA USA
Website: www.stablcor.com
Nelco® is a registered mark of Park Electrochemical Corporation, Melville NY USA
Website: www.parkelectro.com
NanoFoil® is a registered mark of Indium Corporation of America, Clinton NY USA
Website: www.indium.com
IPC 6012(C) and associated standards are published by IPC, Bannockburn IL USA.
Website: www.ipc.org
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 33
Notes
DS&A LLC: Consulting firm founded in 2003. Practical market assessment, business strategy development,
and product strategy development for electronics thermal management materials and components.
David L. Saums, Principal
Thirty-four years of electronics thermal management business development, strategic planning, market
assessment, product development management, and technical marketing. IMAPS Fellow (2010)
MMCC LLC: Manufacturing company founded in 1993. Developer and manufacturer of pressure-infiltration
cast metal matrix composite materials offering CTE matching, light weight, excellent thermal conductivity
for electronics packaging. Subsidiary of Parker Hannifin Company.
Robert A. Hay, Vice President, Business Development
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 34
Contact Information
DS&A LLC
Chestnut Innovation Center
11 Chestnut Street
Amesbury MA 01913 USA
David L. Saums, Principal
Email:
dsaums@dsa-thermal.com
Tel:
+ 1 978 499 4990
Web:
www.dsa-thermal.com
Practical and experienced market assessment, business strategy development, and new product strategy development for
electronics thermal management materials and components.
MMCC LLC
Subsidiary of Parker Hannifin Corporation
101 Clematis Ave
Waltham MA 02453-7012 USA
Robert A. Hay, VP Business Development
Email:
rhay@mmccinc.com
Tel:
+1 781 893 4449
Web:
www.mmccinc.com
Practical CTE-matched high thermal conductivity net-shape cast aluminum-graphite, copper-graphite, and copper-diamond
components for commercial electronics, mil/aerospace, and medical and industrial electronics systems.
CIPS Conference 25-27 February 2014
Nürnberg, Germany
Development for Copper-Graphite Composite Thermal Cores for PCBs for HighReliability RF Systems
© Copyright 2014 DS&A LLC
Page 35