CSN-11: Product Marks/Product and Packaging Labels
Introduction
Customer Service Note
Product Marks, Product Labels, and Packaging Labels
Introduction
Micron uses various marks and labels on our products and packaging. The first section
of this customer service note describes the product marks and labels we place on our
devices. The second section describes the labels used on and in our packaging.
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11.fm - Rev. AA 3/16 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. All
information discussed herein is provided on an “as is” basis, without warranties of any kind.
CSN-11: Product Marks/Product and Packaging Labels
Table of Contents
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Product Marks and Labels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Component Mark Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Abbreviated Component Mark Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Module Label Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
SSD Label Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Micron Packaging Labels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Master Container Labels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Bar Code Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Individual Packaging Labels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11TOC.fm - Rev. AA 3/16 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
List of Figures
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
Figure 15:
Figure 16:
Figure 17:
Figure 18:
Figure 19:
Figure 20:
Figure 21:
Figure 22:
Figure 23:
Figure 24:
Figure 25:
Figure 26:
TSOP Component Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
SOP2/W-PDFN/BGA/LGA Abbreviated Component Mark. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Legacy BGA Component with Elpida Part Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Module Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
SSD MID Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
2.5-inch Label Structure – P320h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.5-inch Label Structure – P400e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
mSATA Label – P400e. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
2.5-inch Label Structure – P410m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.5-inch Label Structure – P400m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
2.5-inch Label Structure – P420m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
2.5-inch Label Structure – M5XX(DC/IT)/M600 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
M.2 Label Structure – M500 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
M.2 Label Structure – M510/M550 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
mSATA Label Structure – M5XX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
M.2 Label Structure – M600 2260 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
M.2 Label Structure – M600 2280 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
mSATA Label Structure – M6XX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Embedded USB Label Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Standard Master Container Shipping Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Standard Master Container Bar Code Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Standard Bar Code Label. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Micron’s Inner Packing Container Label. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Micron’s Inner Packing Container Label for Modules and SSDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Micron’s Moisture Sensitivity (MST) Label. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Labeling on Moisture-Barrier and Static-Shielding Bags1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11LOF.fm - Rev. AA 3/16 EN
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Product Marks and Labels
Most of Micron’s component products use one of two product mark variations to accommodate smaller components and different package sizes (for example, FBGA and CSP).
Both product marks are right- and left-justified and have a character height of 0.040–
0.050 inches depending on package size. Both marks also include a unique, laserinscribed identification number on the top side of the part for traceability purposes.
Legacy component products with Elpida part marks use the same part marks used prior
to Micron's acquisition of Elpida. Further information may be found in our product
guides and on Micron’s Web site: www.micron.com/numbering.
Component Mark Information
Most component marks contain the following details (see Figure 1 on page 5):
• Date code (year and workweek)
• Special mark characters
• Country of diffusion (see below for country codes)
• Country of encapsulation (see below for country codes)
• Micron® mark or logo
• Product family
• Process technology
• Device number
• Device versions
• Package type
• Speed
• Special test option (if relevant)
• Die revision
• Scribe
For more information on product-specific designators, see the part numbering guides
on Micron’s Web site: www.micron.com/numbering.
Codes for the countries of diffusion and encapsulation:
1 = USA
5 = China
2 = Singapore
7 = Taiwan
3 = Italy
8 = Korea
4 = Japan
9 = Mixed
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
4
B = Israel
C = Ireland
D = Malaysia
F = Philippines
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 1:
TSOP Component Mark
Week code
Year code
Function
Special
mark
mark
characters characters
(optional) (optional)
Country of
diffusion
–
Country of
encapsulation
–
Device number
Micron
mark
or logo
Scribe
Process technology
Product family
Device
versions
Die revision
Speed
Package type
Special test
options or blanks
Abbreviated Component Mark Information
Due to space limitations, FBGA-package component marks contain abbreviated details
for two distinct types of information (see Figure 2 on page 6). The top row of the component mark contains the flooring details that are unrelated to product type:
• Date code (see below)
• Die revision
• Country of diffusion (see below for country codes)
• Country of encapsulation (see below for country codes)
Date codes are alphanumeric characters that indicate the year and workweek the parts
were marked, in even-numbered workweeks. The first character is the last number in the
year, and the second (alpha) character is the workweek.
A=2
E = 10
I = 18
M = 26
Q = 34
U = 42
Y = 50
B=4
F = 12
J = 20
N = 28
R = 36
V = 44
Z = 52
C=6
G = 14
K = 22
0 = 30
S = 38
W = 46
D=8
H = 16
L = 24
P = 32
T = 40
X = 48
Codes for the countries of diffusion and encapsulation:
1 = USA
5 = China
2 = Singapore
7 = Taiwan
3 = Italy
8 = Korea
4 = Japan
9 = Mixed
B = Israel
C = Ireland
D = Malaysia
F = Philippines
The middle and bottom rows of the component mark contain product-specific details
such as:
• Micron logo/ball 1 designator
• Coded part number
• Product family
• Special mark characters
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
More information on product-specific designators is provided in Micron’s various part
numbering guides, which are available on Micron’s Web site at www.micron.com/
numbering. Information on the corresponding part numbers for part mark codes is
available from the FBGA Part Marking Decoder at www.micron.com/decoder.
Figure 2:
SOP2/W-PDFN/BGA/LGA Abbreviated Component Mark
Die
revision
Country
of diffusion
Date
code
Country
of encapsulation
Scribe
(If space
allows)
or
Ball 1
mark
Product
family
Coded part number
Function mark
characters
(optional)
Figure 3:
Special mark
characters
(optional)
Legacy BGA Component with Elpida Part Mark
Product name
(mark name,
may have
multiple lines)
Lot
number
Engineering
sample (ES)
mark
Year
assembled
Week
assembled
In-house
code
Ball 1
mark
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Module Label Information
Labels typically used for module production have standard requirements for each line
printed on the label (see Figure 4):
• Line 1: Code 128 subset B bar code of Micron part number/date code (YWW) with a
space separator between the data.
• Line 2: Marketing part number/date code (YYWW)
• Line 3: JEDEC label as appropriate/optional project number
• Line 4: Module assembly country of origin/lot ID code
• The Micron logo is printed on the left side of the label, and the serial number data
matrix (2D) barcode and the official European Regulatory Requirement logo are
printed on the right side of the label.
Figure 4:
Module Label
MTA36ASF2G72PZ-2G1A2KJ
1510
16GB 2RX4 PC4-2133-RBP-10
Assembled in USA
BZAH193001
Notes:
1. The European Regulatory Requirement logo may or may not be present on a particular
module label.
2. The serial number data matrix (2D) barcode includes the letter “S” followed by Micron's
eight-character serial number.
3. DDR3/DDR4 ECC modules contain two characters at the end of the part number string (KJ in
the example above) that are not part of the ordering part number. These characters are
used by Micron manufacturing.
SSD Label Information
Figures 6 through 19 show the label structures for our SSD products. The figures have
designated “key notes” that outline the details of each particular item on the label.
Micron has added a manufacturing identification (MID) label to all SSD products. This
2D barcode label is for Micron internal use only.
Figure 5:
SSD MID Label
T5A100C2W
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 6:
2.5-inch Label Structure – P320h
1
2
THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE
PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER
COUNTRIES OWNED OR LICENSED BY MICRON
™
Product of: XXXXX
XXXXXXXXXX
HALOGEN FREE
RealSSD P320h HHL
XXXGB PCIe®
Firmware Rev: XXXX
3
4
Rated: VDC
+12
22
21
20
19
5
6
P/N: XXXXXXXXXXXX-XXX
8
S/N: XXXXXXXXXX
7
WWN: XXXXXXXXXXXXX
18
19
9
E320115
D33F63
N12610
10
KCC-REM-MU2-P320hHHHL
11
12 13
14
15
16
Key note definitions:
1. Micron intellectual property statement
2. Micron official logo
3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set
3a. Example: RealSSD P320h HHHL 64GB PLIe®
3b. If for an engineering sample, place “ENGINEERING SAMPLE” (in all caps) under
the description
4. Drive firmware revision number
5. Drive part number bar code for item #6 data (follows the Code 128 standard)
6. Drive part number
7. Drive serial number bar code for item #8 data (follows the Code 128 standard)
8. Drive serial number
8a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
9. Reserved for the official United Underwriters logo
10. Reserved for the official European Regulatory Requirement logo
11. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
12. Reserved for the official Ministry of Information and Communications (MIC) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official C-TICK (Australian) mark
14. Reserved for the official TUV logo
15. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
16. Hot surface logo; not related to any certifications
17. Reserved for the official Restriction of Hazardous Substances logo
18. Worldwide name assigned to Micron (as defined IEEE)
19. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
20. Lot number for tracking the drive’s manufacturing data
20a. This is listed as xxyyyyyzzz
20b. xx = 2 digits to denote manufacturing site
20c. yyyyy = 5 digits to denote the kit number (randomly generated)
20d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
21. Country where the device is assembled, written in English
21a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
22. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
9
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 7:
2.5-inch Label Structure – P400e
1
2
23
THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING
PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON
3
4
24
RealSSD™ P400e 2.5
xxxGB SATA 6Gb/s XXX
Product of XXXXX
XXXXXXXXXX
22
Firmware Rev: XXXX
HALOGEN FREE
Rated VDC AMPS
+5 2.0
21
5
6
P/N: XXXXXXXXXXXX-XXX
7
20
WWN: XXXXXXXXXXXXXXX
S/N: XXXXXXXXXX
8
E320115
9
10
KCC-REM-MU2-C40018
11
12
13
N12610
14
XXXXXX
15
16
17
18
19
Key note definitions:
1. Micron intellectual property statement
2. Micron official logo
3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set
4. Drive firmware revision number
5. Drive part number bar code for item #6 data (follows the Code 128 standard)
6. Drive part number
7. Drive serial number bar code for item #8 data (follows the Code 128 standard)
8. Drive serial number
8a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
9. Reserved for the official European Regulatory Requirement logo
10. Reserved for the official United Underwriters logo
11. Reserved for the official Federal Communications Commission logo
11a. Cispr B is required
12. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official Japan VCCI logo.
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
14. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
15. Reserved for the official TUV logo
16. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
17. Reserved for the official Restriction of Hazardous Substances logo
17a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
18. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
19. Reserved for the official Serial ATA logo
20. Worldwide name assigned to Micron (as defined by IEEE)
21. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
22. Lot number for tracking the drive’s manufacturing data
22a. This is listed as xxyyyyyzzz
22b. xx = 2 digits to denote manufacturing site
22c. yyyyy = 5 digits to denote the kit number (randomly generated)
22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
24. Country where the device is assembled, written in English
24a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 8:
mSATA Label – P400e
™
RealSSD C400 mSATA
128GB SATA 6.0 Gb/s
1
6
7
2
3
P/N: MTFDDAT128MAM
F/W: XXXX
5
S/N: XXXXXXXXXXXX
XXXXXXXXX
WWN: 500A0751XXX
4
8
9
10
15
11
E320115
N12610
6
20
16
XXXXXX
KCC-REM-MU2-C400mSATA
21
Product of XXXXXXXXXXX
12
17
18
22
13
14
19
Key note definitions:
1. Micron official logo
2. Drive part number bar code for item #3 data (follows the Code 128 standard)
3. Drive part number
4. Drive serial number bar code for item #5 data (follows the Code 128 standard)
5. Drive serial number
5a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
6. Brief description of the product and its form factor
6a. Example: RealSSD™ C400 mSATA
7. The product’s capacity, interface, and maximum interface rate
7a. 64GB mSATA 3 Gb/s
8. Drive firmware revision number
9. Lot number for tracking the drive’s manufacturing data
9a. This is listed as xxyyyyyzzz
9b. xx = 2 digits to denote manufacturing site
9c. yyyyy = 5 digits to denote the kit number (randomly generated)
9d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
10. Worldwide name assigned to Micron (as defined by IEEE)
11. Reserved for the official European Regulatory Requirement logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
12
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
12. Reserved for the official United Underwriters logo
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
14. Reserved for the official Japan VCCI logo.
15. Reserved for the official Serial ATA logo
16. Reserved for the official Restriction of Hazardous Substances logo
16a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
17. Reserved for the official TUV logo
18. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
19. Reserved for the official Federal Communications Commission logo
19a. Cispr B is required
20. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
21. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
22. Country where the device is assembled, written in English
22a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
13
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 9:
2.5-inch Label Structure – P410m
1
2
3
4
24
23
THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING
PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON
RealSSD™ P410m 2.5
xxxGB SAS 6Gb/s XXX
Firmware Rev: XXXX
Product of: XXXXX
XXXXXXXXXX
22
HALOGEN FREE
Rated VDC AMPS
+12 1.25
21
5
6
P/N: XXXXXXXXXXXX-XXX
20
7
8
9
S/N: XXXXXXXXXX
WWN: XXXXXXXXXXXXXXX
E320115
10
11
12
19
N12610
XXXXXX
KCC-REM-MU2-P410M25
13
14
15
S
A
S
16
17
18
Key note definitions:
1. Micron intellectual property statement
2. Micron official logo
3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set
3a. Example: RealSSD P410 2.5 64GB SATA 6 Gb/s
3b. If for an engineering sample, place “ENGINEERING SAMPLE” (in all caps) under
the description
4. Drive firmware revision number
4a. Feature set example: RealSSD C400 2.5 128GB SATA 6 Gb/s SED
5. Drive part number bar code for item #6 data (follows the Code 128 standard)
6. Drive part number
7. Drive serial number bar code for item #8 data (follows the Code 128 standard)
8. Drive serial number
8a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
9. Worldwide name assigned to Micron (as defined by IEEE)
10. Reserved for the official European Regulatory Requirement logo
11. Reserved for the official United Underwriters logo
12. Reserved for the official TUV logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
14. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
15. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
16. Reserved for the official Restriction of Hazardous Substances logo
16a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
17. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
18. Reserved for the official SAS logo
19. VCCI-A certification in the Japanese language. English translation: “This device is a
class A information technology device. Use of this device in home environment may
cause transmission/radio interference. You may be required to take appropriate measures in this case.”
20. FCC disclaimer and notification
21. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
22. Lot number for tracking the drive’s manufacturing data
22a. This is listed as xxyyyyyzzz
22b. xx = 2 digits to denote manufacturing site
22c. yyyyy = 5 digits to denote the kit number (randomly generated)
22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
24. Country where the device is assembled, written in English
24a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 10:
2.5-inch Label Structure – P400m
1
2
3
4
24
23
THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING
PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON
RealSSD™ P400m 2.5
xxxGB SAS 6Gb/s XXX
Firmware Rev: XXXX
Product of: XXXXX
XXXXXXXXXX
22
HALOGEN FREE
Rated VDC AMPS
+5
2
21
5
6
P/N: XXXXXXXXXXXX-XXX
20
7
8
9
S/N: XXXXXXXXXX
WWN: XXXXXXXXXXXXXXX
E320115
10
11
12
19
N12610
XXXXXX
KCC-REM-MU2-P400M25
13
14
15
16
17
18
Key note definitions:
1. Micron intellectual property statement
2. Micron official logo
3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set
3a. Example: RealSSD C400 2.5 64GB SATA 3 Gb/s
3b. If for an engineering sample, “ENGINEERING SAMPLE” (in all caps) is placed
under the description
3c. Feature set example: RealSSD C400 2.5 128GB SATA 6 Gb/s SED
4. Drive firmware revision number
5. Drive part number bar code for item #6 data (follows the Code 128 standard)
6. Drive part number
7. Drive serial number bar code for item #8 data (follows the Code 128 standard)
8. Drive serial number
8a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
9. Worldwide name assigned to Micron (as defined by IEEE)
10. Reserved for the official European Regulatory Requirement logo
11. Reserved for the official United Underwriters logo
12. Reserved for the official TUV logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
16
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
14. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
15. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
16. Reserved for the official Restriction of Hazardous Substances logo
16a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
17. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
18. Reserved for the official Serial ATA logo
19. VCCI-A certification in the Japanese language. English translation: “This device is a
class A information technology device. Use of this device in home environment may
cause transmission/radio interference. You may be required to take appropriate measures in this case.”
20. FCC disclaimer and notification
21. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
22. Lot number for tracking the drive’s manufacturing data
22a. This is listed as xxyyyyyzzz
22b. xx = 2 digits to denote manufacturing site
22c. yyyyy = 5 digits to denote the kit number (randomly generated)
22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
24. Country where the device is assembled, written in English
24a. With the exception of “USA” and “UK,” the full English name of the country is
included: for example, Product of Taiwan
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
17
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 11:
2.5-inch Label Structure – P420m
1
2
Model: XXXXXXXXXXXX
3
P/N: XXXXXXXXXXXX-XXX
4
5
S/N: XXXXXXXXXX
6
7
RealSSD™ P420m 2.5
9
L/N: XXXXXXXX
WWN: XXXXXXXXXXXXXXX
Rated VDC AMPS
+5
2
8
10
PCIe® Gen 2
SSD
(DENS)
MLC
24
23
11
THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND
PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR
LICENSED BY MICRON
22
21
12
Product of XXXXXXXXXX
20
13
19
E320115
KCC-REM-MU2-P420M25
14
D22F63 N12610
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
18
15
16
17
Key note definitions:
1. Micron official logo
2. Model number
3. Drive part number bar code for item #4 data (follows the Code 128 standard)
4. Drive part number
5. Drive serial number bar code for item #6 data (follows the Code 128 standard)
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
18
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
6. Drive serial number
6a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
7. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set
7a. Example: RealSSD P420m 2.5 64GB SATA 3 Gb/s
7b. If for an engineering sample, “ENGINEERING SAMPLE” (in all caps) is placed
under the description
8. Lot number for tracking the drive’s manufacturing data
8a. This is listed as xxyyyyyzzz
8b. xx = 2 digits to denote manufacturing site
8c. yyyyy = 5 digits to denote the kit number (randomly generated)
8d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
9. Worldwide name assigned to Micron (as defined by IEEE)
10. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
11. Micron intellectual property statement
12. Country where the device is assembled, written in English
12a. With the exception of “USA” and “UK,” the full English name of the country is
included: for example, Product of Taiwan
13. Reserved for the official European Regulatory Requirement logo
14. Reserved for the official United Underwriters logo
15. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
16. VCCI-A certification in the Japanese language. English translation: “This device is a
class A information technology device. Use of this device in home environment may
cause transmission/radio interference. You may be required to take appropriate measures in this case.”
17. Hot surface logo; not related to any certifications
18. FCC disclaimer and notification
19. Reserved for the official Restriction of Hazardous Substances logo
19a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
20. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
21. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
22. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
23. Reserved for the official TUV logo
24. Description of product type
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
19
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 12: 2.5-inch Label Structure – M5XX(DC/IT)/M600
1
27
2
M600 2.5 SSD
26
Model: XXXXXXXXXX
24
P/N: XXXXXXXXXX
22
S/N: XXXXXXXXXX
F/W:MU04
3
25
4
23
20
xxxGB SATA 6Gb/s XXX 5V 1.7A
WWN: 500A0751XXXXXXXX
18
L/N: XXXXXXXX
HALOGEN FREE
Product of XXXXXXXX
21
19
PSID: XXXXXXXXXXXXXXXXXXXXXXXXXXXXX
5
6
17
E320115
MSIP-REM-MU2-MTFDDAKXXXMBF
16
15
14
XXXXXX
N12610
12
13
11
10
9
8
7
Key note definitions:
1. Market segment, form factor, and product
1a. Example: M500 2.5 SSD
2. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
3. Drive firmware revision number
4. PSID data matrix (2D) barcode
5. PSID alphanumeric code
6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
7. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
8. Reserved for the official Federal Communications Commission logo
8a. Cispr B is required
9. Reserved for the official Japan VCCI logo
10. Reserved for the official Restriction of Hazardous Substances logo
10a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
11. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
12. Reserved for the official TUV logo
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
20
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
14. Reserved for the official United Underwriters logo
15. Reserved for the official Ministry of Information and Communications (MIC) logo.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
16. Reserved for the official European Regulatory Requirement logo
17. Reserved for the official Serial ATA logo
18. Country where the device is assembled, written in English
18a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
19. Lot number for tracking the drive’s manufacturing data
19a. This is listed as xxyyyyyzzz
19b. xx = 2 digits to denote manufacturing site
19c. yyyyy = 5 digits to denote the kit number (randomly generated)
19d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
20. Worldwide name assigned to Micron (as defined by IEEE)
21. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
21a. Example: 512GB SATA 6Gb/s SED
22. Drive serial number
22a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
23. Drive serial number bar code for item #22 data (follows the Code 128 standard)
24. Drive part number
25. Drive part number bar code for item #24 data (follows the Code 128 standard)
26. Micron model number
27. Micron official logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
21
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 13:
M.2 Label Structure – M500
1
26
25
24
23
22
2
3
4
5
6
7
M500 M.2 SSD
Model: XXXXXXXXXX
xxxGB SATA 6Gb/s XXX
3.3V 1.7A
P/N: XXXXXXXXXX
HALOGEN FREE
L/N: XXXXXXXX
F/W:0002
WWN: 500A0751XXXXXXXX
PSID: XXXXXXXXXX
Product of: XXXXXXXX
S/N: XXXXXXXXXX
E320115
21
9
10
KCC-REM-MU2-MTFDDAVxxxMAV
20
8
19
18
17
16
N12610
15
14
13
XXXXXX
12
11
Key note definitions:
1. Micron model number
2. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
2a. Example: 512GB SATA 6Gb/s SED
3. Worldwide name assigned to Micron (as defined by IEEE)
4. Market segment, form factor, and product
4a. Example: M500 M.2 SSD
5. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
7. Reserved for the official Serial ATA logo
8. PSID data matrix (2D) barcode
9. Drive firmware revision number
10. Country where the device is assembled, written in English
10a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
11. Reserved for the official Ministry of Information and Communications (MIC) logo
12. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
14. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
15. Reserved for the official Restriction of Hazardous Substances logo
15a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
16. Reserved for the official Federal Communications Commission logo
16a. Cispr B is required
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
17. The MIC certification number assigned to this Micron product.
18. Reserved for the official European Regulatory Requirement logo
19. Reserved for the official TUV logo
20. Reserved for the official Japan VCCI logo
21. Reserved for the official United Underwriters logo
22. Drive serial number
22a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
23. PSID alphanumeric code
24. Lot number for tracking the drive’s manufacturing data
24a. This is listed as xxyyyyyzzz
24b. xx = 2 digits to denote manufacturing site
24c. yyyyy = 5 digits to denote the kit number (randomly generated)
24d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
25. Drive part number
26. Micron official logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
23
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 14:
M.2 Label Structure – M510/M550
1
2
M500 M.2 SSD
26
xxxGB SATA 6Gb/s XXX
F/W:0002
3.3V 1.7A
Model: XXXXXXXXXX
25
P/N: XXXXXXXXXX
24
23
3
4
5
6
7
9
10
S/N: YYWWXXXXXXXX
E320115
11
Product of: XXXXXXXX
12
WWN: 500A0751XXXXXXXX
L/N: XXXXXXXX
8
N12610
D33F63
HALOGEN FREE
22
13
MSIP-REM-MU2-xxxxxxxxxxx
PSID: XXXXXXXXXX
21
20
19
18
17
16
15
14
Key note definitions:
1. Market segment, form factor, and product
1a. Example: M500 M.2 SSD
2. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
2a. Example: 512GB SATA 6Gb/s SED
3. Worldwide name assigned to Micron (as defined by IEEE)
4. Country where the device is assembled, written in English
4a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
5. Drive serial number and bar code
5a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
6. Reserved for the official TUV logo
7. Reserved for the official United Underwriters logo
8. Reserved for the official Japan VCCI logo
9. Reserved for the official Serial ATA logo
10. Reserved for the official Federal Communications Commission logo
10a. Cispr B is required
11. Reserved for the official Ministry of Information and Communications (MIC) logo
12. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official European Regulatory Requirement logo
14. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
15. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
24
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
16. Reserved for the official Restriction of Hazardous Substances logo
16a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
17. The MIC certification number assigned to this Micron product.
18. PSID data matrix (2D) barcode
19. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
20. Drive firmware revision number
21. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
22. PSID alphanumeric code
23. Lot number for tracking the drive’s manufacturing data
23a. This is listed as xxyyyyyzzz
23b. xx = 2 digits to denote manufacturing site
23c. yyyyy = 5 digits to denote the kit number (randomly generated)
23d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
24. Drive part number
25. Micron model number
26. Micron official logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
25
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 15:
mSATA Label Structure – M5XX
1
28
2
M500 mSATA SSD
27
F/W:0002
Model: XXXXXXXXXX
3
xxxGB SATA 6Gb/s SED
3.3V 1.7A
L/N: XXXXXXXX
4
5
26
25
6
P/N: XXXXXXXXXX
24
7
23
S/N: XXXXXXXXXX
21
WWN: 500A0751XXXXXXXX
PSID: XXXXXXXXXX
KCC-REM-MTFDDATxxxMAV
22
20
HALOGEN FREE
Product of: XXXXXXXX
8
N12610
E320115
19
18
14
16
17
15
13
11
XXXXXX
10
9
12
Key note definitions:
1. Market segment, form factor, and product
1a. Example: M500 mSATA SSD
2. Drive firmware revision number
3. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
3a. Example: 512GB SATA 6Gb/s SED
4. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
5. Lot number for tracking the drive’s manufacturing data
5a. This is listed as xxyyyyyzzz
5b. xx = 2 digits to denote manufacturing site
5c. yyyyy = 5 digits to denote the kit number (randomly generated)
5d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
7. Country where the device is assembled, written in English
7a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
8. PSID data matrix (2D) barcode
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
26
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
9. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
10. Reserved for the official Restriction of Hazardous Substances logo
10a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
11. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
12. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official TUV logo
14. Reserved for the official Federal Communications Commission logo
14a. Cispr B is required
15. Reserved for the official European Regulatory Requirement logo
16. Reserved for the official Japan VCCI logo.
17. Reserved for the official United Underwriters logo
18. Reserved for the official Serial ATA logo
19. Reserved for the official Ministry of Information and Communications (MIC) logo.
20. The MIC certification number assigned to this Micron product.
21. PSID alphanumeric code
22. Worldwide name assigned to Micron (as defined by IEEE)
23. Drive serial number
23a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
24. Drive serial number bar code for item #23 data (follows the Code 128 standard)
25. Drive part number
26. Drive part number bar code for item #25 data (follows the Code 128 standard)
27. Micron model number
28. Micron official logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
27
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
M600 M.2 is available in two different PCB sizes, 22x80 and 22x60.
Figure 16:
M.2 Label Structure – M600 2260
1
26
25
24
23
22
3
4
5
6
7
M600 M.2 SSD
Model: XXXXXXXXXX
xxxGB SATA 6Gb/s XXX
3.3V 1.7A
P/N: XXXXXXXXXX
HALOGEN FREE
L/N: XXXXXXXX
F/W: MU04
WWN: 500A0751XXXXXXXX
PSID: XXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
Product of xxxxxxx
S/N: XXXXXXXXXX
E320115
21
Figure 17:
2
19
18
17
16
9
10
N12610 XXXXXX
MSIP-REM-MU2-MTFDDAYXXXMBF
20
8
15
14
13
12
11
M.2 Label Structure – M600 2280
19
15
4
26
Model: XXXXXXXXXX
25
P/N: XXXXXXXXXX
10
22
27
8
21
6
20
7
S/N: XXXXXXXXXX
E320115
Product of XXXXXXX
11
WWN: 500A0751XXXXXX
12
N12610 XXXXXX
L/N: XXXXXXXX
24
23
5
M600 M.2 SSD
xxxGB SATA 6Gb/s XXX
F/W: MU04 3.3V 1.7A
9
1
2
16
HALOGEN FREE
PSID: XXXXXXXXXXXXXXXXXXXXXXXXXXX
MSIP-REM-MU2-MTFDDAVXXXMBF
3
17
14
13
18
Key note definitions:
1. Micron model number
2. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
2a. Example: 512GB SATA 6Gb/s SED
3. Worldwide name assigned to Micron (as defined by IEEE)
4. Market segment, form factor, and product
4a. Example: M600 M.2 SSD
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
28
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
5. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
7. Reserved for the official Serial ATA logo
8. PSID data matrix (2D) barcode
9. Drive firmware revision number
10. Country where the device is assembled, written in English
10a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
11. Reserved for the official Ministry of Information and Communications (MIC) logo
12. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
14. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
15. Reserved for the official Restriction of Hazardous Substances logo
15a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
16. Reserved for the official Federal Communications Commission logo
16a. Cispr B is required
17. The MIC certification number assigned to this Micron product.
18. Reserved for the official European Regulatory Requirement logo
19. Reserved for the official TUV logo
20. Reserved for the official Japan VCCI logo
21. Reserved for the official United Underwriters logo
22. Drive serial number
22a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
23. PSID alphanumeric code
24. Lot number for tracking the drive’s manufacturing data
24a. This is listed as xxyyyyyzzz
24b. xx = 2 digits to denote manufacturing site
24c. yyyyy = 5 digits to denote the kit number (randomly generated)
24d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
25. Drive part number
26. Micron official logo
27. Serial part number bar code for item #22 data (follows the Code 128 standard)
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
29
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 18:
mSATA Label Structure – M6XX
1
28
2
3
M600 mSATA SSD
27
F/W:MU04
Model: XXXXXXXXXX
xxxGB SATA 6Gb/s SED
3.3V 1.7A
L/N: XXXXXXXX
4
5
26
25
P/N: XXXXXXXXXXXXXXXXXXXXXXX
6
23
S/N: XXXXXXXXXX
HALOGEN FREE
PSID: XXXXXXXXXXXXXXXXXXXXXXXXXXXXXX
7
24
22
21
20
MSIP-REM-MU2-MTFDDATXXXMBF
Product of XXXXXXXX
WWN: 500A0751XXXXXXXX
N12610
E320115
19
18
14
16
17
15
13
11
8
XXXXXX
10
9
12
Key note definitions:
1. Market segment, form factor, and product
1a. Example: M600 mSATA SSD
2. Drive firmware revision number
3. Drive’s capacity, product type, maximum interface rate, and security feature set (if
applicable)
3a. Example: 512GB SATA 6Gb/s SED
4. The device’s voltage level with its related amperes at normal operation (defined by
Micron QRA)
5. Lot number for tracking the drive’s manufacturing data
5a. This is listed as xxyyyyyzzz
5b. xx = 2 digits to denote manufacturing site
5c. yyyyy = 5 digits to denote the kit number (randomly generated)
5d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information)
6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements
7. PSID data matrix (2D) barcode
8. Worldwide name assigned to Micron (as defined by IEEE)
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
30
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
9. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
10. Reserved for the official Restriction of Hazardous Substances logo
10a. This device must meet the standards of RoHS to enable the 20 year indication of
the RoHS logo
11. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo
12. Reserved for the official C-TICK (Australian) mark.
In addition, the certification number assigned to this Micron product shall be listed
below the logo in a legible font
13. Reserved for the official TUV logo
14. Reserved for the official Federal Communications Commission logo
14a. Cispr B is required
15. Reserved for the official European Regulatory Requirement logo
16. Reserved for the official Japan VCCI logo.
17. Reserved for the official United Underwriters logo
18. Reserved for the official Serial ATA logo
19. Reserved for the official Ministry of Information and Communications (MIC) logo.
20. Country where the device is assembled, written in English
20a. With the exception of “USA” and “UK,” the full English name of the country
should be included: for example, Product of Taiwan
21. The MIC certification number assigned to this Micron product.
22. PSID alphanumeric code
23. Drive serial number
23a. Format: 12 characters: YYWWXXXXXXXX
YY is the current year
WW is the current Micron workweek
XXXXXXXX is an eight digit hex (base 16 0–9. A–F) serial number
24. Drive serial number bar code for item #23 data (follows the Code 128 standard)
25. Drive part number
26. Drive part number bar code for item #25 data (follows the Code 128 standard)
27. Micron model number
28. Micron official logo
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
31
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Product Marks and Labels
Figure 19:
Embedded USB Label Structure
2
1
XXXXXXXXXXXX-XXX
XXXXXXXXXX YYYYWW
FW: XX___6
LEAD FREE, HF
RealSSD™ eXXX DEN__X
COUNTRY OF ORIGIN XXXX___XX
®
10
9
3
4
5
E320115
8
7
6
Labels for engineering samples
replace these logos with text: ENGINEERING SAMPLE.
Key note definitions:
1. Micron logo
2. USB part number
3. Lot ID for tracking the USB’s manufacturing data including a six-digit date code
4. Firmware revision
5. Lead free statement
6. Reserved for the official Federal Communications Commission logo
6a. Cispr B is required
7. Reserved for the official United Underwriters logo
8. Reserved for the official European Regulatory Requirement logo
9. Country where the device is assembled, written in English
10. Model number and density
10a. Example: RealSSD™ e230 6GB
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
32
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Micron Packaging Labels
Micron Packaging Labels
Micron uses various packaging labels to enable quick identification of packaged
contents, provide a simple order verification method, and indicate inner-package moisture levels. All labels are manufactured from matte-coated facestock or synthetic paper
and contain acrylic- or water-based adhesive. See CSN-16 for complete information on
all Micron packaging materials, including recyclable materials.
Master Container Labels
For all shipments, Micron uses standard bar code labels that conform to EIA Standard
556. The bar code labels enable customers to scan Micron containers for quick order
verification. Figure 21 on page 34 shows an example of the standard bar code label used
on master containers. Each box also carries its own bar code label (see the Individual
Packaging Labels section).
Bar Code Information
The following information appears on the master container labels only:
• (3S/4S) - PKG ID: Invoice or packing slip number
• (1P) - SPLR PROD ID: Reserved for individual customer requirements
• (Q) - QUANTITY: Number of parts in master container
• (K) - TRANS ID: Customer purchase order number
• (P) - CUST PART NO: If a customer part number is not designated, the Micron part
number will be printed
• (4L) - Country of Origin: The country in which the product was made
Figure 20:
Standard Master Container Shipping Label
Micron Technology, Inc.
For Company Name
8000 S. Federal Way
BOISE ID 83707–0006
USA
US01
COMPANY NAME
ADDRESS
CITY STATE/PROVINCE ZIP CODE
COUNTRY
WB # 638030055867 / 0087659818
Child W/B: 00821466
*************
Piece 1 of 1
*************
PKG ID:
87659819A1
PO #s XXXXXXXX XXXXXXXX
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
33
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Individual Packaging Labels
Figure 21:
Standard Master Container Bar Code Label
(3S) PKG ID:
87189127A1
Ship_To_Name
Address
City, ST ZIP Code
Country
(1P) SPLR PROD ID: MT29F2G08AACWP
Micron Technology, Inc.
1160 Exchange, Doc 1D
Boise ID 83715
USA
(Q) QUANTITY:
PACKAGE COUNT:
1 OF 1
1793 EA
16.0 x 12.0 x 8.0 in
40.6 x 30.5 x 20.8 cm
(K) TRANS ID:
PACKAGE WEIGHT:
2596PW3329100
10.9 lb/4.9 kg
SHIP DATE:
08/16/2007
(P) CUST PART NO:
MT29F2G08AACWP
(4L) COUNTRY OF ORIGIN
US
Additional Label Information
The following information appears in the far-right portion of the master container
labels:
• Ship-to name: Customer’s name and ship-to address
• Ship-from name: Micron’s name and address
• PACKAGE COUNT: Master container package count
• PACKAGE WEIGHT: Package size
• SHIP DATE: Date the product leaves the factory
Individual Packaging Labels
For quick order verification, Micron attaches a standard bar code label and inner
packing container label on the inner packing container. Additionally, the moisturebarrier or static-shielding bag has a moisture sensitivity (MST) label and a standard bar
code label attached to the front. If ordering in tape and reel, the tape-and-reel carrier
will have a standard bar code label attached. Figure 22 on page 35 shows an example of
the standard bar code label, Figure 23 on page 35 shows an example of Micron’s inner
packing container label, and Figure 25 on page 36 shows an example of Micron’s MST
label. Refer to Figure 26 on page 36 for approximate placement of these labels on
Micron’s moisture-barrier and static-shielding bags.
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
34
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Individual Packaging Labels
Figure 22:
Standard Bar Code Label
PART NUMBER: (1P) MT46V16M16P – 6T
QUANTITY: 1000
DATE: 200704
(1T)12 34567 . 89
235C MST: 3
260C MST: 3
Figure 23, Micron’s Inner Packing Container Label, indicates the RoHS status of compliance with either RoHS or RoHS and HF (for those products that are also free of halogens). This space will be blank on labels for containers that hold parts with lead. Also, an
asterisk (*) at the end of the date code indicates that the container holds a mix of product
from more than one date; the date shown is that of the oldest product in the container.
Figure 23:
Micron’s Inner Packing Container Label
ti
C au on
T69M
M
For U.S.: Country of Origin Korea
For EU: Circuits Diffused in Taiwan
oi
RoHS/HF
QTY: 1000
TNN
(9D) 201214
tiv
e
A
BXW9WZM.11
stur ensi
e- S
111142
MT46H128M32L2KQ — 5 IT:A
Figure 24:
Micron’s Inner Packing Container Label for Modules and SSDs
HU
BG112JM.3S
12 Redwood Crescent
E.K. G74 5PA U.K.
Country of Origin U.S.
BOX
QTY: 100
(9D) 201205
FNN
FAB 6
RoHS
113904
MT36HTG51272FZ — 667H1D66A
Notes:
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
1. The European Regulatory Requirement logo may or may not be present on a particular
inner packing label.
35
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Individual Packaging Labels
Figure 25:
Micron’s Moisture Sensitivity (MST) Label
235C Peak Package Body Temp
Floor Life: One Year
Moisture Level: 2
Condition < = 30 deg. C/60% RH
260C Peak Package Body Temp
Floor Life: One Year
Moisture Level: 2
Condition < = 30 deg. C/60% RH
Package Seal Date: Apr 08 2004
Operator: JDOE
Figure 26:
Labeling on Moisture-Barrier and Static-Shielding Bags1
Heat-sealed
moisture-barrier bag
ESD and moisture precautions
Internal label2
MST label with moisture level,
floor life, and package seal date3
Standard bar code label4
Notes:
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
1. This figure indicates the approximate locations only of the various labels.
2. Internal labels are applicable to tube and tray shipments only and may or may not be present on every bag.
3. See Figure 25.
4. See Figure 22.
36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Individual Packaging Labels
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/support Customer Comment Line: 800-932-4992 Micron
and the Micron logo are trademarks of Micron Technology, Inc. All other
trademarks are the property of their respective owners.
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
37
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Revision History
Revision History
Rev. AA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/16
• Corrected typo in Note 3 of Figure 4
• Updated Figures 12, 16 and added new Figure 17. 1/16
Rev. Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/15
• Updated module label explanation and notes.
• Added M6xx SSD labels.
• Deleted links to specific SSD label figures under SSD Label Information.
• Added Table of Contents and List of Figures.
• Updated Figure 2 title.
Rev. Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/15
• Added SSD MID label.
Rev. X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/15
• Updated Figure 4.
• Updated Figure 23.
Rev. W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/15
• Added Note 2 to Figure 4.
Rev. V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/14
• Updated information on page one.
• Added information for legacy components with Elpida part marks.
• Added DC and IT mark to M5xx SSD label title.
• Added 2.5in P420m label information.
Rev. U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/14
• Added M.2 M510/M550 label.
Rev. T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1/14
• Added “.../date code (YWW)” to Line 1 of the Module Label Information section.
Rev. S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12/13
• Added European Regulatory Requirement logo and note to Figures 3 and 20.
• Corrected numbering on pages 4 and 5.
Rev. R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/13
• Corrected label titles for Figure 12, Figure 14, and Figure 15.
Rev. R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/13
• Added new SSD labels.
Rev. Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/13
• Added new SSD labels.
Rev. P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/13
• Updated Inner Packing Container and Standard Master Container Shipping labels.
• Corrected note references for Figure 15.
Rev. O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/12
• Added Microdisplay panel label.
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
38
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
CSN-11: Product Marks/Product and Packaging Labels
Revision History
Rev. N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/12
• Added the Embedded USB label.
Rev. M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/12
• Added the SSD mSATA label.
Rev. L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/12
• Corrected references in Figure 12.
Rev. K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/11
• Updated security feature set to Figure 6 and it’s notes.
Rev. J. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/11
• Added aliases to the links for the part numbering guides and FBGA date codes, and
the FBGA Part Marking Decoder.
• Added specific date code information.
• Updated country codes.
• Added SSD C400 label information.
Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/10
• Added date code information to the text for Figure 9
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1/10
• Corrected typo
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12/09
• Added SSD product labels
• Added packaging label information from CSN-16
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/09
• Updated template
• Updated Figure 3, “Module Label”
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/08
• Added Korea to note 1 country codes
• Updated and renamed Figure 2
• Deleted Figure 3, “DDR2/GDDR3 FBGA Abbreviated Component Mark”
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/07
• Added Taiwan to note 1 country codes
Rev. 12/9/05
• Added logo information to Figure 1 on page 5 and Figure 2 on page 6
Rev. 2/14/05
• Added China to note 1 country codes
PDF: 09005aef80d6313a/Source: 09005aef80d5e2c2
CSN11_2.fm - Rev. AA 3/16 EN
39
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.