IAS Executive Board Meeting
October 4 -5, 2009
IAS Annual Meeting
Houston, Texas
Sunday, October 4, 2009
7:30 AM
8:00 – 9:00 AM
9:00 – 10:00 AM
Meeting Description
Breakfast
Financial Planning
Blake Lloyd - IAS Survey Results
Room
Arboretum 1
Arboretum 1
Arboretum 1
IAS Member Survey
2009 Tabulatead Res
10:00 – 11:00 AM
Bruno Lequesne – Annual Meeting
Review/Discussion
Arboretum 1
Pres Elect 2009
Q3.ppt
11:00 – noon
Tom Nondahl - Council Vote Analysis
Arboretum 1
2010 Election
Analysis.pdf
Noon
1:00 – 1:30 PM
1:30 – 3:00 PM
Lunch
Tom Nondahl – ECCE Next Steps
Arboretum 1
Arboretum 1
Arboretum 1
ECCE_2009.ppt
3:00 – 3:30 PM
Janet Flores -WIE report
Arboretum 1
WIE Update
2009.ppt
3:30 – 5:00 PM
5:00 – 6:00 PM
Consent Agenda
Nominating Committee
Monday, October 5, 2009
Noon
Myron Zucker Student Luncheon
Arboretum 1
Arboretum 1
Regency Room Junior Ballroom
2:00 – 6:00
Board Meeting
Tuesday, October 6, 2009
12:00 – 4:00
6:30 – 7:30
7:30 – 10:00
Council Meeting and Luncheon
President’s Special Reception
President’s Award Banquet
Pecan Room
Regency Room
Imperial East Ballroom
Imperial Central West Ballroom
Sunday, October 4, 2009
Item
1.0
1.1
1.2
Description
Welcome & Opening Remarks
Adoption of the Agenda
Attendance using roster
Person
Nondahl
Nondahl
All
2009 Executive
Board Roster.pdf
Members Present: M. Elbuluk, T. Baldwin, M. Halpin, A. Bagley, D.
Mills, D. Dunn, S. Larson, N. Matsui, J.J. Dai, B. Lequesne, P. Magyar,
M. Nelms, G. Parise, R. Simmons, B. Lloyd, D. Durocher, T. Nondahl
Remote Access: J. McConnell
IAS Administrator: L. Bernstein
Guests Present: A. Rotz, O. Mohammed, L. Powell, G. Krolin-Taylor,
C. Speck, D. Zinger, R. Harley
2.0
2.1
2.1.1
Motion and Action Item Review
Nondahl
Motion to approve a conference loan of $12,000 for the 2010 IAS Pulp
and Paper Industry Committee (PPIC) conference to be held June 2123, 2010 in San Antonio, TX USA.
Nelms
Motions balloted electronically since the previous meeting (included
here for the official record
Background: The budget has been reviewed and approved at it meets
the IEEE 20% surplus requirement. Region 5 will be providing a
conference loan of $3,000 for a total loan of $15,000 for the
conference. The attached MOU has been signed myself and a
representative of Region 5.
Motion 071509 PPIC
2010 MOU signed.pdf
2.1.2
2.13
2.2
2.2.1
Motions – Consent Agenda
Motion to approve Consent Agenda
Seconded by Lequesne
Approved unanimously
Motion to accept the minutes of the June 2009 IAS Executive Board
Meeting
Bagley
Dunn
Seconded by: Bagley
2.2.2
Motion to approve a conference loan of $5,000 for the 2010 IEEE
Rural Electric Power Conference to be held May 16-18, 2010 in
Orlando, Florida.
Nelms
Background: The budget has been reviewed and approved at it meets
the IEEE 20% budget surplus requirement.
2.2.3
Motion to approve technical co-sponsorship of the 2010 International
Conference on Industrial Mechatronics and Automation (ICIMA 2010)
to be held May 30-31, 2010, in Wuhan, China.
Nelms
Background: The IAS was a technical co-sponsor of the 2009
conference. The attached MOU for technical co-sponsorship has been
signed by a conference representative and by the IEEE. It contains
the standard IAS limit on the number of papers which may be
submitted for transactions review. The IEEE will not pay an
acquisition fee to include the proceedings in Xplore. In addition, the
IAS has the opportunity to display membership materials at the
conference.
16297_2010 ICIMA
fully executed TCS_IA
2.2.4
Motion to approve technical co-sponsorship of The 2nd International
Conference on Industrial and Information Systems (IIS 2010) 1 to be
held July 10-11, 2010, in Dalian, China.
Nelms
Background: This is the first time that the IAS will be a technical cosponsor of this meeting. The attached MOU has been signed by a
conference representative and by the IEEE. It contains the standard
IAS limit on the number of papers which may be submitted for
transactions review. The IEEE will not pay an acquisition fee to
include the proceedings in Xplore. In addition, the IAS has the
opportunity to display membership materials at the conference
16296_2010 IIS fully
executed TCS_IAS.pd
2.25
Motion to approve technical co-sponsorship of the 2010- XIX
International Conference on Electrical Machines (ICEM 2010) to be
held September 6 – 8, 2010 in Rome, Italy.
Nelms
Background: The IAS has been a technical co-sponsor of this meeting
in the past. The attached MOU has been signed by a conference
representative and representatives from PES, PELS, IES, and IAS. It
contains the standard limit on the number of papers eligible for
transactions reviews. Also, no acquisition fee will be paid for the
conference proceedings.
ICEM 2010 MOU.doc
2.26
Motion to approve a conference loan of $15,000 for the 2010 IEEE
Energy Conversion Congress and Exposition (ECCE 10) to be held
September 10-16, 2010 in Atlanta, GA USA.
Nelms
2.2.7
2.2.8
Background: The budget for this conference has been reviewed and
approved as it satisfies the IEEE 20% surplus requirement. PELS is a
financial co-sponsor of this conference with the IAS and will provide a
$15,000 loan as well.
Motion to approve a conference loan of $6,000 for the 2010 Industrial
and Commercial Power Systems Technical Conference to be held
May 9-13, 2010 in Tallahassee, FL USA.
Background: The budget has been reviewed and approved as it
meets the IEEE 20% surplus requirement. The Tallahassee Area
Section is also providing a loan of $3,000.
Motion to approve technical co-sponsorship of the PCIC Europe
conference for five years beginning with the 2010 conference.
Nelms
Nelms
Background:
The IAS has been a technical co-sponsor of this meeting since 2006.
An MOU was developed for a five-year technical co-sponsorship. This
MOU allows for the conference record to be included in Xplore. No
acquisition fee will be paid for conference proceedings. The attached
MOU has been signed by a representative from PCIC Europe and the
IAS and has been forwarded to the IEEE for approval.
MOU between IEEE
IAS and PCIC Europe
2.3
2.4
2.5
2.6
3.0
3.1
3.2
Motion to accept slate of Distinguished Lecturer’s for 2010-2011 as
shown in Chapter Membership Report. See item 5.2 for the names of
the 2010 Distinguished Lecturers.
Seconded by Durocher
Approved unanimously
M. Halpin abstained
Magyar
Officers’ Reports
Division II Director
-no reportPresident
Nondahl
3-2_President_0910.
doc
3.3
President-Elect
Lequesne
Pres Elect 2009 Q3
report revised 2009-1
3.4
Vice-President
Lloyd
IAS Q3 Report Long
Range Plan Vice Presi
3.5
Treasurer
Larson
IAS-Treas-Rpt Oct
09.pdf
4.0
4.1
Operating Department Reports
Process Industries
Durocher
PID Report_October
2009.pdf
4.2
Manufacturing Systems Development & Application
Elbuluk
MSDAD 3rd Quarter
Report (october, 200
4.3
Industrial & Commercial Power Systems
Baldwin
I&CPS Report 2009
3rd Quarter.pptm
4.4
5.0
5.1
Industrial Power Conversion Systems
No report
Toliyat
Staff Department Reports
Awards
Bagley
Q3 Awards Dpt
Rp.doc
5.2
Chapters & Membership
Magyar
2009 Q3 IAS EB _
Final list to Peter
CMD Report _ PMagy sept 2009.pdf
5.3
Education
CMD DL Committee
Report _ Ro Harley.p
Dunn
IAS Education Dept
Report_Oct 2009.doc
5.4
Meetings
Nelms
Meetings Dept
Report October 2009
5.5
Publications
Peterson
Pubs09Q3.pdf
5.6
2009 IAM Editor
Report.ppt
Standards
Mills
Standards Exec
Board Report Houston
6.0
6.1
Committee Reports
Nominating
6.2
Financial Planning
6.3
Long Range Planning
6.4
6.5
6.6
7.0
8.0
8.1
Halpin
See Treasurer’s Report
See Vice-President’s Report
Constitution & Bylaws
-no reportIntersociety Cooperation
-no reportElectronic Communication
-no report-
Old Business
New Business
S. Larson
Lloyd
Halpin
Lukaszewski
Tallam
Formed two Ad hoc committees : 1) ECCE Cooperation (See
President’s Report for more details)
2) Zucker Design Contest Rejuvenation (Chair M. Halpin)
Members: M. Nelms, D. Durocher, J. Sotile
Expansion of teleconferencing to committees – IAS will arrange and
pay for IEEE teleconference services for Technical Committees upon
request from a Technical Committee Officer
WIE Contribution – No action at this time
Nondahl
9.0
Closing Remarks
Nondahl
10.0
Adjourn <Nelms>
Seconded <Halpin>
Motion to adjourn – October 5, 2009 5:00 PM
8.2
8.3
Nondahl
Total respondents = 1576 or 15.3% of
IAS members
What is your current or most recent member status? (q1)
I belong or belonged to both the IAS and IEEE
I belong or belonged to just the IAS as an affiliate member
I belong or belonged to just the IAS
I do not know
Total
99.3 %
0.2 %
0.1 %
0.4 %
100.0 %
Are you currently a full time student? (q2)
Yes
No
Total
3.5 %
96.5 %
100.0 %
What is your IEEE Region? (q3)
Regions 1 to 6 (United States)
Region 7 (Canada)
Region 8 (Europe, Middle East, Africa)
Region 9 (Latin America)
Region 10 (Asia and Pacific)
Total
60.7 %
8.2 %
14.5 %
6.4 %
10.2 %
100.0 %
(q4) - How familiar are you with the IEEE Industry Application
Society? (1)
Very familiar
Somewhat familiar
Not familiar
No opinion
Total
45.2 %
50.3 %
4.4 %
0.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Appliance Industry (2)
Committee Member
Area of interest
Unknown
Total
2.3 %
30.6 %
67.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Electrostatic Processes (3)
Committee Member
2.9 %
Area of interest
Unknown
Total
13.9 %
83.2 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Automation and Control (4)
Committee Member
Area of interest
Unknown
Total
2.3 %
76.6 %
21.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Lighting and Displays (Formerly
Production and Application of Light) (5)
Committee Member
Area of interest
Unknown
Total
2.0 %
47.7 %
50.3 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Electric Machines (7)
Committee Member
Area of interest
Unknown
Total
4.7 %
84.8 %
10.5 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Drives (8)
Committee Member
Area of interest
Unknown
Total
6.6 %
82.6 %
10.8 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Industrial Power Converter (9)
Committee Member
Area of interest
Unknown
Total
4.9 %
80.0 %
15.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Electronics Devices and
Components (10)
Committee Member
Area of interest
Unknown
Total
2.8 %
77.3 %
19.9 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Cement Industry (12)
Committee Member
Area of interest
Unknown
Total
2.2 %
27.5 %
70.3 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Metal Industry (13)
Committee Member
Area of interest
Unknown
Total
2.5 %
36.2 %
61.3 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Mining Industry (14)
Committee Member
Area of interest
Unknown
Total
3.4 %
35.3 %
61.3 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Petroleum and Chemical Industry (15)
Committee Member
Area of interest
Unknown
Total
10.4 %
54.1 %
35.4 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Pulp and Paper Industry (16)
Committee Member
Area of interest
7.2 %
41.4 %
Unknown
Total
51.4 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Codes and Standards (18)
Committee Member
Area of interest
Unknown
Total
5.2 %
74.7 %
20.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Energy Systems (19)
Committee Member
Area of interest
Unknown
Total
2.1 %
82.8 %
15.1 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Systems Engineering (20)
Committee Member
Area of interest
Unknown
Total
4.7 %
84.9 %
10.4 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Power Systems Protection (21)
Committee Member
Area of interest
Unknown
Total
3.3 %
81.0 %
15.7 %
100.0 %
Are you affiliated with any of the following IAS Technical
Committees or are any of the following committees in an area of
interest for you? (q5) - Rural Electric Power (22)
Committee Member
Area of interest
Unknown
Total
2.4 %
57.1 %
40.5 %
100.0 %
In the past 2 years, in which of these ways (if any) have you been
involved with the Industry Application Society (NOTE THIS
TABLE WILL HAVE LINKS TO THE CURRENT IAS WEBSITE FOR
THE RELEVENT INFORMATION FOR THE CHECK BOX LINE) (q6)
Attended a IAS sponsored technical conference
Read IAS periodicals (Transactions, Magazine)
Accessed on-line IAS periodicals (Transactions, Magazine)
Accessed the IAS Web site and e-newsletters
Used the IEEE IAS Digital Library - Proceedings from relevant conferences
Attended a IAS local chapter meeting or event
Attended a IAS standard working group or activity
Participated in a IAS student event
Participated in a IAS Technical Committee
Volunteered on a IAS board or committee
Are you aware of the IAS Industrial Lecturer and Distinguished Lecturer
Are you aware of awards that are available to members of the IAS
None of the above
Total
35.9 %
86.6 %
48.3 %
42.3 %
29.1 %
23.7 %
7.5 %
1.1 %
13.6 %
6.8 %
18.6 %
21.7 %
5.0 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Enhance my professional relationships / networking (1)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
39.1 %
40.3 %
9.9 %
8.3 %
2.4 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) - Help
me stay current on technical developments (2)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
69.6 %
27.7 %
2.0 %
0.7 %
0.1 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Provide opportunities to publish or present research (3)
Very important
Somewhat important
No opinion
Not too important
Not at all important
22.2 %
26.2 %
18.0 %
20.3 %
13.3 %
Total
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Supports standards developments (4)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
26.3 %
42.4 %
19.6 %
7.7 %
3.9 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Helps me find solutions to technical problems (5)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
40.7 %
43.7 %
9.5 %
4.4 %
1.7 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Gives me access to content relevant to my work (6)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
50.7 %
39.3 %
6.1 %
2.8 %
1.2 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Provides opportunities to volunteer (7)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
8.3 %
24.2 %
36.8 %
19.3 %
11.5 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Offers discounts on professional services (8)
Very important
Somewhat important
No opinion
7.9 %
22.1 %
35.9 %
Not too important
Not at all important
Total
20.1 %
14.0 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Offers awards and scholarships (9)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
6.1 %
18.7 %
36.9 %
19.9 %
18.4 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Other #1 - Specify Enter a benefit to you (10)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
Listed below are some of the major benefits of IAS
Membership (Part A) How important is each to you? (q7a) Other #2 - Specify Enter a benefit to you (11)
Very important
Somewhat important
No opinion
Not too important
Not at all important
Total
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Enhance my professional
relationships / networking (1)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
25.6 %
37.8 %
31.1 %
4.3 %
1.2 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Help me stay current on technical
developments (2)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
43.4 %
46.7 %
7.6 %
1.9 %
0.4 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Provide opportunities to publish
or present research (3)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
20.5 %
23.7 %
51.2 %
3.2 %
1.5 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Supports standards developments
(4)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
23.1 %
34.4 %
38.9 %
2.7 %
0.8 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Helps me find solutions to
technical problems (5)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
27.5 %
49.4 %
18.7 %
3.8 %
0.6 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Gives me access to content
relevant to my work (6)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
32.8 %
46.5 %
15.6 %
3.6 %
1.5 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Provides opportunities to
volunteer (7)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
11.0 %
16.4 %
66.8 %
3.8 %
2.0 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Offers discounts on professional
services (8)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
6.8 %
16.2 %
70.8 %
4.0 %
2.2 %
100.0 %
Listed below are some of the major benefits of IAS
Membership (Part B) How satisfied are you with the job the IAS
is doing in each area? (q9b) - Offers awards and scholarships
(9)
Very satisfied
Somewhat satisfied
No opinion
Somewhat dissatisfied
Very dissatisfied
Total
6.9 %
13.0 %
75.8 %
2.8 %
1.5 %
100.0 %
What is your agreement / disagreement with the following
statements? (q8) - Membership in the IEEE IAS is affordable? (1)
Strongly agree
Agree
No opinion
Disagree
Strongly disagree
Total
20.3 %
65.1 %
8.6 %
5.6 %
0.5 %
100.0 %
What is your agreement / disagreement with the following
statements? (q8) - How valuable would you find a lower cost
membership fee for IAS (not IEEE?) (2)
Strongly agree
Agree
No opinion
Disagree
Strongly disagree
Total
18.1 %
29.6 %
42.9 %
7.3 %
2.1 %
100.0 %
What is your agreement / disagreement with the following
statements? (q8) - When considering attending an IAS
sponsored conference is the registration fee a factor in your
participating? (3)
Strongly agree
Agree
No opinion
Disagree
Strongly disagree
Total
26.0 %
37.6 %
19.5 %
15.2 %
1.6 %
100.0 %
What is your agreement / disagreement with the following
statements? (q8) - When/if you attend and IAS conference the
location is a significant factor in your decision to attend? (4)
Strongly agree
Agree
No opinion
Disagree
Strongly disagree
Total
42.5 %
41.3 %
10.0 %
5.4 %
0.7 %
100.0 %
What is your agreement / disagreement with the following
statements? (q8) - Overall how critical is access to IAS technical
publications and conferences to your professional success? (5)
Strongly agree
Agree
30.7 %
47.3 %
No opinion
Disagree
Strongly disagree
Total
17.3 %
4.0 %
0.7 %
100.0 %
How active are you in your local IAS Chapter? (q9)
Very active
Somewhat active
Occasionally participate
Never participate
Unaware of a local chapter
Total
5.9 %
9.2 %
26.0 %
32.4 %
26.4 %
100.0 %
Aside from classes/seminars at an academic institution, what
types of continuing education courses (if any) do you plan on
taking in the next 12 months. – whether from the IAS or from
some other source? (Select all that apply) (q10)
Technical topic taken in person
Technical topic taken on-line
Business topic taken in person
Business topic taken on-line
None
Total
51.9 %
38.4 %
16.2 %
11.7 %
25.9 %
100.0 %
What are the primary reasons for continuing education? (q11)
For personal or professional enhancement
To achieve a certification
To earn continuing education certificates
To earn university credits toward a degree
Other, please specify
Total
76.1 %
2.9 %
15.1 %
1.9 %
4.0 %
100.0 %
Would you like to see more Technical Tutorials at IAS sponsored
conferences? (q12)
Yes
No
Total
74.1 %
25.9 %
100.0 %
Comments by Blake Lloyd in this column
0.15390625
We need more young people, by definition Students are
normally young
Actual Members
Split by Region We did get a representative mix from each region
57%
8%
16%
7%
12%
100%
We aren't doing to bad at describing ourselves to members
Note that for most committees there are a large percentage
that indicate interest but not membership - lots of room for
growth
90%
80%
70%
60%
Appliance ElectrostaticAutomation Lighting
Machines
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
60%
50%
40%
30%
20%
10%
0%
Drives
Should this not be higher?
Thought this would be higher?
This is us!
Better advertising?
See graph, Stay Current wins by a mile, with Relationships,
Standards, Solutions and Content all high as well
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Relationships
Stay Current
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
0
Publish
My favorite answer is that "Chicks Dig It"
continuing education
Committee Membership
Network with other Engineers
technical papers
PI Insurance requirement
Helps me to expand knowledge in my field and related fields
CED courses
practice English
conforming network to develop projects
update on current issue and trend
Publications
funding support for chapters
CEU for PE renewal
Overall most are somewhat or very satisfied with most areas (green bars in graph below)
0.8
0.7
0.6
Relationships
Stay Current
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
0.6
0.5
0.4
0.3
0.2
0.1
0
Publish
Looks like most are OK with membership dues
Over 50% agree that Registration Fee as a factor
I would not believe location is important - but it is, time to have
conferences in Vegas
That is a big number!
Drives
Converter Electronics
Cement
Metal
Mining
Petro
Paper
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Publish
Standards
Solutions
Access Content
Volunteer
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
CEUs and Maintain PE License
Professional Status Enhanced
Establish a mentor/mentee relationship from experienced professionals
Provide student with travel grant for international conference
tutorials
Companionship
Continuing education for renewal of PE licenses
Expect awards
Keep updated on my competitors
Keeping my former professional environment
ars in graph below)
Publish
Standards
Solutions
Access Content
Volunteer
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Paper
Standards
Energy
Engineering Protection
Rural
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Committee Member
Unknown
Area of interest
Volunteer
Services Discount
Awards and
Scholarships
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
Not at all important
Not too important
No opinion
Somewhat important
Very important
IAS magazine
Keeps me ahead of my colleagues at work
opportunities to publish my works
Informative Conferences
Mentoring others
Chicks dig it
meet old friends
ieee insurance
patent support
Provides access to insurance benefits
business contact
meeting professionals
Discounts on publications
Opportunity to meet potential clients
personal contacts
Insurancemy Technical
Updating
Information
networking
Electrical Safety
Volunteer
Services Discount
Awards and
Scholarships
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Very satisfied
Very dissatisfied
Somewhat disatisfied
No opinion
Somewhat satisfied
Eligible voters
2009 Executive Board
Chapter Chairs
Society Past Presidents
Region Area Chairs
Technical Committee Chairs
Number of votes received
25
116
22
10
25
198
23
20
10
7
15
75
Percentage
92.00%
17.24%
45.45%
70.00%
60.00%
AGENDA ITEM 3.3
IEEE INDUSTRY APPLICATIONS SOCIETY
Bruno Lequesne
President-Elect
Center for Advanced Vehicle Technologies The University of Alabama Tuscaloosa, AL 35487 Date: September 28, 2009
To: IAS Board Members
Subject: President-Elect Report to the IAS Executive Board Meeting to be held on October 5, 2009
What follows are preliminary statistics and comments concerning the 2009 Annual Meeting. Salient points
are in bold. In overall summary, registration numbers are encouraging, especially given the difficult
economic times, in terms of absolute numbers as well as diversity (industry and overseas participation in
particular). Number of new attendees (41%) is particularly welcome. The tutorial program is strong,
although actual attendance is difficult to know until the event. Financial outcome unknown pending
negotiations with the hotel (room block will not be met).
Attendance (numbers as of 9/28/2009):
 221 registrants; We should meet our budgeted registration goal of 226.
 By type: Full conference, 126; Technical sessions only, 89; Tutorials, 5; Single tutorial, 1. It may be
interesting to see how many people actually attend the tutorials.
 By seniority of attendance: 10+ years, 47 (21%); 6-10 years, 32 (14%); 2-5 years. 50 (22%); First
time: 90 (41%); unknown, 2; Large number of new or recent attendees is good, and we need to
pay attention to retention.
 Region of attendance: USA+Canada, 130 (59%); Asia-Pacific, 45 (20%); Europe, 25 (11%); Latin
America, 18 (8%); Africa + Middle East, 3 (1%). Registrants for Chapter workshop is 30. Good
attendance from overseas is encouraging.
 Industry / academia breakdown: Industry/government, 121 (55%); academia, 92 (42%).
 Number of authors: 95 (43%); Ratio of registrants to papers 1.69, at least as high as at previous IAS
annual Meetings. Good attendance from non-authors is healthy.
 Five authors registered more than 2 papers, providing an extra $875 in revenue; All 5 are from Asia or
Latin America; the additional fee for presenting more than 2 papers seems to disproportionally affect
overseas individuals.
 Hotel registrations: 162 attendees booked at the hotel when registering; Of the remaining, 23 are from
Houston and 36 chose to stay elsewhere and pay the extra $300 in fee ($11k in revenue).
 Registration timing: 93% have registered by September 1st (30% by June 1st).
Budget:
On the positive side, meeting the budgeted number of registrants is important from a budgetary point of view.
However, the room block is far from being met (about 600 room nights compared with 1068 room block).
Courtesy is negotiating a lower penalty, or even a waiving of the penalty based on our presence at the same
hotel in 2010, and general economic conditions.
Technical sessions:
 24 sessions, plus a plenary session, for a total of 130 papers. These include 2 sessions from
Electrostatic Processes Committees and a Special Session on Arc Flash from Metals Committee (with
1-hour presentations).
 Plenary session: Its goal was to bring IAS’ diverse committees together and foster better knowledge of
each other, by presenting papers of general interest. Some committees (ILDC and Mining in
particular) responded very well and seemed to take advantage of the opportunity, sometimes
preparing a special presentation for the occasion (no written paper). Other committees participated
less well (I&CPS came on board at the last minute). Preparation presented various minor difficulties,
including scheduling of committee meetings, and making for more overlap of technical sessions with
tutorials than initially anticipated.
 Good management by most committees except Appliance Industries (numerous complaints, only one
session with 3 papers (versus 3 sessions in 2008). I&CPS delayed response until their Spring meeting
was also of some inconvenience.
 Program posted on website as an Excel spreadsheet for authors’ convenience (per 2008 experience).
 Paper template prepared in Word and posted in late May, and shared with ECCE. Could be made
available to other conferences as well.
Paper submission process:
 Hybrid process with I&CPS Dept. and Mining Committee using ScholarOne, the rest using Conference
Express. The Conference Express system worked very well (after all it is the legacy system).
ScholarOne needed attention and worked very well thanks to Louie Powell’s presence and
experience. ScholarOne is a good system for those committees which review papers prior to the
conference, but needs a presence. The Conference Express system is more tolerant in case of an
unresponsive committee than ScholarOne would be.
 Having two systems caused relatively little confusion.
 Maintaining a hybrid system (ScholarOne + Conference Xpress) is recommended for future
years. There is no reason to impose ScholarOne on those committees that don’t want it and don’t
need it, however, it is a good system for others.
Tutorial program:
 Nine tutorials in two parallel tracks.
 Technical material printed in a single book.
 Registration is in a single package, or for a single tutorial. The impact of the latter cannot be
determined yet as this is expected to attract mostly local and last minute attendees.
 Presenters country of origin: USA, 8; Canada, 1.
 Origin of tutorial: Houston section, 6; self-nominated, 3. Help of Houston Section has been
outstanding.
 Number of actual attendees unclear before the conference.
 Posting of program done June 10; earlier posting would help publicity.
 Publicity: Relied almost exclusively on email blasts to members of IAS, PELS, PES, and local Section,
and the IAS website. An attempt was made to link with a company called “pdhengineers.com”,
which advertises all kind of seminars and typically takes a cut on the registration (business model
apparently similar to Expedia for air travel). They posted our program for free as a trial balloon,
effect not know yet.
 Questions for the longer term: 1) expand publicity reach; 2) Need to develop self-sustaining
program; and 3) North America versus internationalization.
Hotel/ Courtesy/Badge Guys/Technical Program Coordinator/IEEE staff/Local committee/Website:
Very smooth operation with our volunteers and partners.
Other:
 Sponsorship: 3 sponsors, all thanks to Sunita Kulkarni of the Houston Section
 Guest tours: Nothing could be done for guests aside from setting up a room for them at the hotel,
because of a lack of a volunteer to organize beyond this. 18 companions have registered.
Respectfully submitted,
Bruno Lequesne
2009-2010 IAS President-Elect
ECCE Overview
2009 IAS Annual Meeting, Houston, TX
T. Nondahl
2009-2010 IAS President
04-October-2009
Energy Conversion Congress &
Exposition – San Jose, CA

Established by IAS
and PELS in 2009

2009 Statistics
– 750 Registrants
– 900 Attendees
– 575 Papers
 1200 Abstracts
– 25 Exhibits
September 2009
ECCE 2009 - Overall Schedule
Sunday
Tutorials
Monday am
Plenary (8:00-10:15), Oral Sessions (10:30-noon)
Monday pm
Poster Sessions (1:30-3:15), Oral Sessions (3:30-5:00)
Tuesday am
Oral Sessions
Tuesday pm
Expo
Wed. am
Oral Sessions
Wed. Noon
Expo
Wed. pm
Oral Sessions, Poster Sessions
Wed. Night
Banquet
Thur. am
Oral Sessions
Thur. Noon
Awards Luncheon (Expected 350, served 475)
Thur. pm
Oral Sessions
Plenary Session Topics



TOPIC #1
Science and Planning for
Low Carbon Electricity
System
Daniel M. Kammen
– Daniel M. Kammen holds
appointments in the
Energy and Resources
Group, the Goldman
School of Public Policy,
and the department of
Nuclear Engineering.
Kammen is the founding
Director of the
Renewable and
Appropriate Energy
Laboratory (RAEL) …



TOPIC #2
How Electric Vehicles Must
Change the Way the Auto
Industry Thinks
Martin Eberhard
– Founder of TESLA
Motors
Plenary Session Schedule

















8:00 AM
No lights, then strategic lights and possible screen show; theme
music (logo at crescendo)
8:03 AM
Voice of God (VOG) – Ladies and gentleman please welcome
and give a round of applause to Deepak Divan, President of IEEE Power
Electronics Society and Tom Nondahl, President of IEEE Industry Applications
Society
8:03 AM
Music cued as Deepak and Tom walk onto stage
8:04 AM
Deepak introduction
8:06 AM
Tom introduction
8:08 AM
VOG – Introduce Tomy Sebastian, ECCE General Chair
8:09 AM
Tomy gives overview of conference
8:15 AM
Deepak and Tom declare the conference open
8:16 AM
VOG introduces Phil Krein as the co-chair of the Plenary Session
Committee
8:17 AM
Introduction of Daniel Kammen, plenary speaker by Phil Krein
8:20 AM
Daniel Kammen’s speech and Q&A (?)
9:15 AM
VOG introduces Seth Sanders as the co-chair of the Plenary
Session Committee
9:15 AM
Introduction of Martin Eberhard, plenary speaker by Seth
Sanders
9:18 AM
Martin Eberhard’s speech and Q&A (?)
10:13 AM
VOG welcomes Tomy to the stage to provide closing remarks.
10:14 AM
Tomy’s remarks
10:15 AM
Session concludes
ECCE Student Programs




PELS Grants
IAS Zucker Grants
Free Registration on Tuesday
Student Volunteers
– Microphone runners in sessions
– Guides for participants during
ceremonies
Call for Student Volunteers

Session Assistant – Session Assistants will be required to act as room monitors, audiovisual
assistants, and runners for their respective sessions. Please plan to arrive 30 minutes before
prior to the session and stay 15 minutes after the session.
Room Monitor:

Audiovisual Assistant:

–
–
–
–
–


Double check that all presentations are saved on the session computer.
Provide audiovisual assistance to presenters and Session Chairs when needed (i.e. turn on
microphones, start the PowerPoint presentation, troubleshoot).
If a problem arises with which you cannot immediately assist, contact the roaming AV Tech, or
Conference Managers.
Runner:
–
–
–
–
–

Check that each attendee possesses a badge before they enter the room. There is no need to
check names, but if you see an attendee without a badge, stop them, and ask that they show
you their conference badge, or request that they register prior to attending the sessions.
Provide the Session Chair assistance when needed.
Provide assistance to conference managers where needed, this may include, but is not limited to
the following:
Downloading presenter presentations onto session computers.
Traffic control.
Badge check.
Room counts.
Please note that you may be asked to act as Session Assistant for more than one session if
necessary.
All volunteers will receive complimentary ECCE T-Shirt.
Award Presentations











IEEE William E. Newell Power Electronics Award
IEEE Richard Harold Kaufmann Award (Ron Harley)
IEEE Nikola Tesla Award (Donald Novotny)
Fellows (3 PELS, 6 IAS)
IEEE Power Electronics Distinguished Service Award
Richard M. Bass Outstanding Young Power Electronics
Engineer Award (Ranga Tallam)
Gerald Kliman Innovator Award (John Miller)
Power Electronics Society Best Chapter Award
International Future Energy Challenge Award
Power Electronics Society Transactions Prize Paper
Award
Power Electronics Society Prize Letter Award
Slide show with pictures from meeting and information about the Societies
IAS Fellows
Committee Concerns

Paper Submission System Barely
Worked
– All abstracts submitted to the same
place – some papers not directed to the
proper committee.
– Pete Wung in charge of fixing it for 2010

Too Few Oral Sessions
– 2010 Hotel is much larger

2010 Schedule conflict with EU Electric
Machines meeting.
Background







Sunday evening – Reorg. of IDC & IPCC
Monday am – Special issue of PELS Tran.
Monday eve. – IDC votes
Tuesday pm – IPCC proposal
Tues. eve. – IPCC votes
Wed. noon – IAS proposal
Wed eve. – Joint transactions
– No IAS membership booth
Zucker Design Contest

Ray Sepe said interest in the Design
Contest is waning.
– Submissions have gone from 40 to 3
– Had to solicit former winners to get any
contestants

Ray also concerned that fewer students
and professors will be interested in
attending the Annual Meeting.
Women in Engineering
2009 IAS Annual Meeting - Women in Engineering
Committee Update
Janet Flores
Industry Applications Society
WIE Liaison
Slide 1 / Flores / 10.04.2009
Women in Engineering
2009 IAS Annual Meeting - Women in Engineering
Committee Update
IEEE Bylaws Section I-305. Functions and Membership of the
Standing Committees
20. Women in Engineering Committee. The IEEE Women in
Engineering Committee (WIEC) shall be appointed by and shall report
to the IEEE Board of Directors.
The WIEC shall be responsible for facilitating the development of
programs and activities that promote the entry into and the retention of
women in engineering programs, enhance the career advancement of
women in the profession, and which promote IEEE membership and
retention of IEEE women
Slide 2 / Flores / 10.04.2009
Women in Engineering
Who makes up the committee?
WIEC consists of ten voting members, appointed by the IEEE Board
of Directors
• Six members serve three-year staggered terms; one member is an
IEEE Student Member
• Regions and Societies appoint coordinators to assist in the
development of related programs and activities.
• IEEE organizational units appoint liaisons.
Slide 3 / Flores / 10.04.2009
Women in Engineering
Current Committee Members
WIE Committee Members
• Karen Panetta, WIEC Chair
Joan Carletta
Jane Lehr
Ramalatha Marimuthu
Susan Murphy
Mary Ellen Randall
Jacqueline Speck
Irena Atov
Evangelia Micheli-Tzanakou
Sule Ozev
Slide 4 / Flores / 10.04.2009
Women in Engineering
WIE Liaisons & Coordinators
Nazanin Bassiri-Gharb, IEEE Ultrasonics, Ferroelectrics, and Frequency
Control Society
Daniece Carpenter, Product Safety Engineering Society
Holly Cyrus, Region 2 Coordinator
Christine Di Lapi, Broadcast Technology Society
Lisa Edge, Reliability Society
Janet Flores, Industry Applications Society
Allan Johnston, Nuclear and Plasma Sciences Society
Carolyn McGregor, Engineering in Medical and Biology Society
Bozenna Pasik-Duncan, Control Systems Society
Susan H. Perkins, Region 7 Coordinator
Darlene Rivera, Region 1 Coordinator
Usha Varshney, Electron Devices Society
Slide 5 / Flores / 10.04.2009
Women in Engineering
Mission and Vision of WIE
The WIE Mission:
Inspire, engage, encourage, and empower IEEE women worldwide.
The WIE Vision:
A vibrant community of IEEE women and men innovating the world of
tomorrow.
Slide 6 / Flores / 10.04.2009
Women in Engineering
WIE Tangibles
WIE has two tangible products
1. IEEE WIE Magazine
1. WIE newsletter
Slide 7 / Flores / 10.04.2009
Women in Engineering
IEEE WIE Magazine
Our first Issue of WIE Magazine
Received 2008 APEX Award for Publication Excellence
The WIEC approved the new schedule of the magazine
as follow:
June 2010- Women reinventing themselves/Entrepreneurship
December 2010- Renewable Energy
Slide 8 / Flores / 10.04.2009
Women in Engineering
IEEE WIE Magazine
All WIE Committee Members, WIE Liaisons, and WIE Coordinators are
requested to submit the following information to the WIE Magazine:
• Biography
• Picture
• Explain why you became an Engineer
• What information or advice you would like to pass on to a young girl
• interested in engineering
Slide 9 / Flores / 10.04.2009
Women in Engineering
WIE Membership by Region
Region Count
US
Canada
Europe, Middle East & Africa
Latin America
Asia & Pacific
Total
Slide 10 / Flores / 10.04.2009
3,485
431
2,276
2,250
2,434
10,876
Women in Engineering
WIE Membership Data March 2009
Grade
Mar-08
Mar-09
Fellow
Life Members
Associates
Member
Senior Member
Student
Total
41
119
113
1513
286
5107
7189
46
117
102
1613
311
5829
8018
Slide 11 / Flores / 10.04.2009
Women in Engineering
WIE Membership Data March 2009
Gender
Mar-08
Mar-09
Female
Male
Not Provided
Total
4721
1927
541
7189
4952
2360
706
8018
Slide 12 / Flores / 10.04.2009
Women in Engineering
PROMOTES member grade advancement for women to
the grades of Senior Member and Fellow
Year Elevated Total Fellow
Nominations
Received
Women
Nominations
Received
Number of
Women
Elevated
% Success
2006
785
44
7
15.9%
2007
765
48
18
37.5%
2008
773
47
27
57.4%
2009
757
46
19
41.3%
Slide 13 / Flores / 10.04.2009
Women in Engineering
WIEC Activities and FUN stuff
Meet Monthly via Conference Call.
Truly Global Group of People – Affinity groups in schools all over the world.
Meet every 1 to 2 Years LIVE: This year was 25 – 26 April 2009 in Orlando,
Florida
STAR Program – Inspire future generations of engineers, partner with teachers of
grades K – 12. Promotional give – a – ways
Interact with world famous engineers and scientists - During Women In
Engineering forums
Slide 14 / Flores / 10.04.2009
Women in Engineering
WIE 2008 Affinity Group Award (Awarded in June
2009) for Technical & Community Contributions
Approved the IEEE WIE Japan Affinity Group as the
recipient to the award. The award provides a certificate and
$250US
IEEE WIE Madras Affinity Group received honorable
mention. This group received a certificate and $100US
Slide 15 / Flores / 10.04.2009
Women in Engineering
What Can We Do to Help?
FROM LAST MONTH’S CONFERENCE CALL
Bassiri-Gharb reported on the IEEE Ultrasonics,
Ferroelectrics, and Frequency Control Society (UFFC).
UFFC has agreed to provide $5000 US annually to support
WIE activities. Bassiri-Gharb will follow up with WIE
Staff to discuss advertising and purchasing magazines.
Slide 16 / Flores / 10.04.2009
Women in Engineering
A GOOD PARTNERSHIP – IEEE
Slide 17 / Flores / 10.04.2009
MEMORANDUM OF UNDERSTANDING
THIS MEMORANDUM OF UNDERSTANDING ("MOU") is made this _15_ day of June, 2009__, by
and between The Institute of Electrical and Electronics Engineers, Incorporated, a New York notfor-profit corporation (“IEEE”), acting through Industry Applications Society (IEEE-IAS),
• Industrial Electronics Society (IEEE-IES),
• Power Electronics Society (IEEE-PELS), and
• Power and Energy Society (IEEE-PES)
• Industry Applications Society ( IEEE – IAS)
and ___Associazione Conferenza ICEM 2010___and sets forth the relationship and obligations
relating to the 2010- XIX International Conference on Electrical Machines ICEM 2010 to be held
[__September 6 – 8 , 2010_Date___], in Rome, Italy.
1. DURATION OF MOU: This MOU addresses the rights and obligations with respect to the Conference.
Although the parties may presently be considering the possibility of future conferences similar in theme or
subject matter, no party shall be under any obligation to renew this MOU.
2. SPONSORSHIP: Technical co-sponsorship indicates direct and substantial involvement by the Technical CoSponsor solely in the organization of the technical program portion of the Conference. The Parties agree that
the financial liability of the Conference is the sole right and responsibility of the Conference.
3. OWNERSHIP OF THE CONFERENCE NAME: The Sponsoring Parties agree and acknowledge that
International Conference on Electrical Machines 2010 is the exclusive owner of all rights, title and interest
throughout the world to the names 2010- XIX International Conference on Electrical Machines ICEM
2010 and ICEM 2010, including, and without being limited to, all rights in the trademarks, service marks,
certification marks, and association marks (“Conference Marks). During the term of this MOU, the Technical
Co-Sponsor shall have a non-exclusive, non-transferable, royalty-free license to use the Conference Marks in
connection with the Conference.
4. OWNERSHIP OF INTELLECTUAL PROPERTY: The Conference Proceedings are the intellectual property of
IEEE The Institute of Electrical and Electronics Engineers
5. INCLUSION IN IEEE CONFERENCE PUBLICATIONS PROGRAM (CPP): The ICEM´10- XIX International
Conference on Electrical Machines ICEM 2010 understands that the IEEE co-sponsoring unit has sole
discretion to designate which papers accepted for presentation at the Conference shall be eligible for inclusion
in the IEEE Conference Publications Program (CPP). ICEM’10 XIX International Conference on Electrical
Machines, shall be responsible for all costs of the publishing and distribution by the CPP of such papers in the
form of Conference Proceedings. The Technical Co-Sponsors will not pay any acquisition fees related to
Conference Proceedings.
Furthermore, Parties shall:
(a) Ensure such papers accepted for inclusion in the CPP are prepared in IEEE-compatible format according to
the procedures available at http://www.ieee.org/portal/pages/pubs/confpubcenter/instructions.html; and
(b) Submit such content to IEEE within one (1) week after the Conference end
6. RESPONSIBILITIES OF THE SPONSORING PARTIES:
•
One copy of the Conference Proceedings will be provided to each Technical Sponsor
and distributed as follows: one copy to the IES VP for Conference Activities, one to the PELS
VP of Meetings, IAS VP of Meetings and one copy to PES’ Executive Director.
•
•
•
Technical input from a representative from each Technical Sponsor.
Link to the conference and advertisement on the websites of the Technical Sponsors.
IEEE Xplore upload of conference papers: (please note this must be done within 30 days after
the last day of the conference: it is a very strict deadline)
Special Notation for IAS Submission to Transactions or Magazine:
The Host shall submit conference papers to the IEEE within one (1) month after the Conference ends. If the
IEEE does not retain copyright to the papers and proceedings, then IEEE shall have the right to sell copies of
the papers and proceedings in the paper, CD, DVD, online or other such media, after the Conference. IEEE
shall retain all proceeds from its own sales.
Papers presented at this Conference may be eligible for review for inclusion in the IEEE Transactions on
Industry Applications or the Industry Applications Magazine provided they meet certain requirements:
a.
The subject of the paper must be within the technical scope of the IEEE Industry
Application Society
b.
The author of the paper must request that it be submitted for review.
c.
A paper submitted to the conference, but not actually presented, will not be eligible for
review. It is the responsibility of the Host to verify the presentation of all papers
submitted for review.
It shall be the responsibility of the Host, with the guidance of the IAS Meetings Dept., to create a committee to
screen papers meeting the requirements given above. This screening committee should, if possible, be made
up of IEEE-IAS members familiar with the requirements of IAS periodicals. Papers selected by the screening
committee shall be judged to have a “reasonable chance” of being accepted for one of the IAS periodicals.
Further, the selected papers within the scope of any one IAS Technical Committee (TC) shall not number more
than 20% of the total number of papers presented at the conference. No paper submitted but not actually
presented shall be included in the papers selected for review. The screening committee shall prepare a list of
selected papers, including the paper’s title and the name and address of the corresponding author. This list
shall be forwarded to the Chair of the IAS Meetings Department promptly after the conference.
Authors shall be advised of this procedure and shall not submit their papers for review prior to the issuing of
the list of selected papers. Papers on the list may then be sent to the Editor-in-Chief of the IEEE Transactions
on Industry Applications. The Host shall instruct authors to submit their own papers.
The Host shall forward two (2) copies of the conference proceedings on CD-ROM to the Chair of the IAS
Meetings Department.
7. IEEE MASTER BRAND: Guidelines for use of the IEEE Master Brand and Logotype “IEEE” can be found on the
IEEE Web site at www.ieee.org/web/publications/rights/idstandards.html
8. INDEMNITY: Each Sponsoring Party shall indemnify and hold harmless the other Sponsoring Party from and
against any and all claims, demands, liabilities, settlements, damages, costs, and expenses, including
reasonable attorneys’ fees and expenses, arising out of, or in any way connected with, any default, breach or
2
negligent non-performance of this MOU or any negligent act or omission on the part of itself, its agents and
employees arising out of this MOU.
9. PROPRIETARY OR CONFIDENTIAL INFORMATION: Neither party shall disclose to a third party Proprietary or
Confidential Information of the other party. Each party further agrees to act as trustee for any Confidential
Information jointly created or acquired through the parties’ participation in this MOU.
10. GENERAL TERMS AND CONDITIONS:
Binding Effect: This MOU shall inure to the benefit of, and be binding upon, the Sponsoring Parties, their
successors in interest, legal representatives, and assigns.
Assignment: None of the Sponsoring Parties may assign or transfer neither its interest in this MOU, nor any
interest herein or claim hereunder without the express written consent of the other Sponsoring Parties.
Complete MOU: This MOU constitutes the entire agreement among the parties and supersedes all other prior
MOUs of the parties for the period to which it applies and may not be modified except in writing signed by the
parties.
Notices: Any notice given under this MOU to any of the Sponsoring Parties may be effected by: (i) email or, (ii)
facsimile, receipt of which is confirmed by facsimile confirmation.
Counterparts: This MOU may be executed simultaneously in two or more counterparts, each of which shall be
deemed an original, but all of which together shall constitute one and the same instrument. If either party
uses a scanned or facsimile transmittal, that copy shall be deemed to be an original.
IN WITNESS WHEREOF, this MOU is executed by the parties hereto by their respective undersigned and
authorized officers as of the date first written above.
The Institute of Electrical and Electronics Engineers, Incorporated acting through Its
Industry Applications Society (IEEE-IAS)
Industrial Electronics Society (IEEE-IES)
Authorized Signature
Authorized Signature
R. Mark Nelms
Print Name
John Y. Hung
Print Name
Title IAS Meetings Department Chair
Title
ECE Department, 200 Broun Hall
Auburn University, AL 36849-5201
USA
Mailing Address
200 Broun Hall
Auburn University, AL 369849-5201
U.S.A.
Mailing Address
Phone 1-334-844-1830
Phone
1-334-844-1813
Email m.nelms@ieee.org
Email
j.y.hung@ieee.org
3
Vice-President for Conference Activities
Power Electronics Society (IEEE-PELS)
Power &Energy Society (IEEE-PES)
Authorized Signature
Authorized Signature
Print Name
Ralph Kennel
Print Name Patrick Ryan
Title
Vice President of Meetings
Title Executive Director – PES
c/o Donna Florek
445 Hoes Lane
Piscataway, NJ 08855
445 Hoes Lane
Piscataway, NJ 08855
Mailing Address
Mailing Address
Phone
Phone (732) 465-6618
Email
Email p.ryan@ieee.org
Associazione Conferenza ICEM 2010
International Conference on Electrical Machines
ICEM Local Organizer
ICEM International Chairman
Francesco Parasiliti
Print Name
Gérard-André Capolino
Print Name
Title Professor, ICEM 2010 General Chairman
Title Professor, ICEM Steering Committee Chair
Dept. of Electrical Engineering – University of L’Aquila
Monteluco di Roio – 67100 L’Aquila, Italy
Mailing Address
LTI - Dept. of EE - Univ. of Picardie “Jules Verne”
7, rue du Moulin Neuf – 80000 Amiens - France
Mailing Address
Phone +39 3209231053
Phone +33-668677122
Email francesco.parasiliti@univaq.it
Email gerard.capolino@ieee.org
4
The Institute of Electrical and
Engineers, Incorporated (IEEE)
IEEE Authorized Signature
Print Name
Title
Mailing Address
Phone
Email
The Institute of Electrical and Electronics
Engineers, Incorporated
_____________________________
IEEE Authorized Signature
_____________________________
Print Name
_____________________________
Title
5
Electronics
Instructions for completing a Technical Co-Sponsor MOU
Opening Paragraph
Fill in the date, name of the Sponsoring Parties and the name and date of the event (If this is a multi-year
MOU, just fill in the Name of the event)
IEEE OU can be a Society, Region, Section, Chapter or Council
Non- IEEE Co-sponsoring parties CAN NOT be a “For profit:” organization
If there are more than two sponsoring parties, please edit the first paragraph to allow for the names of the
other parties
Section 1 – Duration of MOU: If this is a multi-year MOU, please edit this section to reflect the duration of the
MOU.
Section 3 – Ownership of the Conference Name: - Fill in the name of the sponsoring party that is the exclusive
owner of the Conference name
Section 4 – Ownership of Intellectual Property: Fill in the name of the sponsoring party that owns the
Intellectual Property (only one party can own the intellectual property)
Section 5 – Inclusion in IEEE Confernce Publications Program (CPP): Fill in the name of the non IEEE sponsor
Section 6 – Responsibilities of the Sponsoring Parties: To be completed by the sponsoring parties
At a minimum, describe the provisions for dissolving the relationship
For example:
This MOU may not be terminated except by written consent of all parties. Upon termination or nonrenewal of this MOU, no Sponsoring Party may use, license, create derivative works, or exploit in any
way the jointly owned works without the written consent of the other parties.
Or
Multiyear MOUs: This relationship may be dissolved by either party after giving the other notice in
writing no later than nine (9) months prior to the next conference date. Upon termination or nonrenewal of this MOU, no Sponsoring Party may use, license, create derivative works, or exploit in any
way the jointly owned works without the written consent of the other parties.
Signatures:
6
The signing parties should be the appropriate individuals from each sponsoring party that has the authority to
make the commitment for the MOU
7
TECHNICAL CO-SPONSORSHIP
MEMORANDUM OF UNDERSTANDING
Between the
IEEE Industry Applications Society
and
Petroleum and Chemical Industry Committee Europe
THIS MEMORANDUM OF UNDERSTANDING (“MOU”) is made this 15 day of
September, 2009, by and between The Institute of Electrical and Electronics Engineers,
Incorporated, a New York not-for-profit corporation (“IEEE”), on behalf of the Industry
Applications Society (“IEEE Unit”) and Petroleum and Chemical Industry Committee (PCIC)
Europe (“Host” and together with the IEEE Unit collectively referred to as “Sponsoring Parties”)
and sets forth the relationship and obligations relating to the annual PCIC Europe conference 1
(the “Conference”). The PCIC Europe is an Association registered under Swiss Law in
Wichtrach Switzerland, and whose purpose is the organization of an annual Petroleum and
Chemical Industry Conference in Europe.
1. TERMS OF MOU
1.1 Purpose. The purpose of the annual PCIC Europe conference is the exchange of
experience in the practical application of electricity and instrumentation in the petroleum,
chemical and pharmaceutical industries.
1.2 Duration of MOU. This MOU addresses the rights and obligations with respect to
the annual Conference for a period of five years beginning with the 2010 conference.
Although the parties may presently be considering the possibility of future conferences similar
in theme or subject matter, no party shall be under any obligation to renew this MOU.
2. SPONSORSHIP
2.1 The IEEE Industry Applications Society (IAS) shall be a technical co-sponsor of
the Conference. Technical co-sponsorship indicates direct and substantial involvement by the
IAS solely in the organization of the technical program portion of the Conference. This level
of sponsorship allows for use of the IEEE, IAS, and PCIC logos, but not use of the IEEE name
in conjunction with the Conference Name. The Parties agree that the revenues and expenses of
the Conference are the sole right and responsibility of the Host.
2.2 The Sponsoring Parties shall encourage each party's members to submit papers and
attend the Conference. The IEEE-IAS approves inclusion of the proceedings for the
Conference in the IEEE Conference Publications Program (CPP), which includes distribution
1 Technical co-sponsorship conferences cannot use the IEEE name in the title (Policy 10.1.16).
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
1
via IEEE Xplore. The Host shall assure compliance with IEEE Policy regarding format for
inclusion of papers and/or proceedings in IEEE Xplore and shall bear complete financial
responsibility for all expenses associated with the implementation of the papers and/or
proceedings in IEEE Xplore. The Industry Applications Society shall be responsible for all
costs of distribution by the CPP of such papers. The IEEE will not pay any acquisition fees
related to the conference proceedings.
The paper review process for this conference begins with the selection of abstracts. All
PCIC Europe Committee members review the abstracts and submit a written ballot. Criteria
considered in the abstract review process are interest to attendees and past experience with the
author. In addition, preference is given to abstracts written by individuals who are an endusers of technical equipment. A draft technical paper is prepared for each selected abstract,
which is reviewed by at least two persons, mainly members of the PCIC Europe Committee but
other engineers may be utilized in the review process. Papers are reviewed for technical
accuracy as well as overt commercialism. Reviewer comments are returned to the authors.
The final version of the paper is reviewed again to ensure that the authors addressed reviewer
comments.
2.3 The Host shall submit conference papers to the IEEE within one (1) month after the
annual Conference ends. PCIC Europe will retain copyright of the papers presented at the
annual Conference. The IEEE shall have the right to sell copies of the papers and proceedings
in paper, CD, DVD, online or other such media, after the annual Conference. IEEE shall retain
all proceeds from its own sales.
Papers presented at this Conference may be eligible for review for inclusion in the IEEE
Transactions on Industry Applications or the Industry Applications Magazine provided
they meet certain requirements:
a. The subject of the paper must be within the technical scope of the IEEE
Industry Application Society.
b. The author of the paper must request that it be submitted for review.
c. A paper submitted to the conference, but not actually presented, will not be
eligible for review. It is the responsibility of the Host to verify the presentation of
all papers submitted for review.
It shall be the responsibility of the Host, with the guidance of the IAS Meetings Dept., to
create a committee to screen papers meeting the requirements given above. This
screening committee should, if possible, be made up of IEEE-IAS members familiar with
the requirements of IAS periodicals. Papers selected by the screening committee shall be
judged to have a “reasonable chance” of being accepted for one of the IAS periodicals.
Further, the selected papers within the scope of any one IAS Technical Committee (TC)
shall not number more than 20% of the total number of papers presented at the
conference. No paper submitted but not actually presented shall be included in the papers
selected for review. The screening committee shall prepare a list of selected papers,
including the paper’s title and the name and address of the corresponding author. This
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
2
list shall be forwarded to the Chair of the IAS Meetings Department promptly after the
conference.
Authors shall be advised of this procedure and shall not submit their papers for review
prior to the issuing of the list of selected papers. Papers on the list may then be sent to
the Editor-in-Chief of the IEEE Transactions on Industry Applications. The Host shall
instruct authors to submit their own papers.
The Host shall forward two (2) copies of the conference proceedings on CD-ROM to the
Chair of the IAS Meetings Department.
2.4 Each Sponsoring Party will appoint members from its respective society who will
represent the Sponsoring Party on the Technical Program Committee of the Conference.
3. SPONSORING PARTIES SUPPORT OF PROMOTIONAL ACTIVITIES
Each Sponsoring Party shall contribute their services toward the publicity for this
Conference. The Host will forward to the Chair of the IAS Meetings Department a URL for the
conference website as soon as it is available. A link to the Conference will be placed on the IAS
website as soon as the information is received.
The Host grants permission to the IAS to have a booth at the PCIC Europe conference for
the purpose of selling IEEE standards and promoting IAS membership. The Host will provide
space for the IAS to set up their booth if requested by the IAS to do so. If requested, the IAS
PCIC will provide space for a booth at its annual conferences for PCIC Europe to advertise for
its conference. In addition, the Sponsoring Parties will also provide time, if requested, in their
Chairmen's' address to the conference attendees for advertising the conference of the other party.
4. INTELLECTUAL PROPERTY
4.1 The Sponsoring Parties agree and acknowledge that Host is the exclusive owner of
all rights, title and interest throughout the world to the name “PCIC Europe Conference”,
including, without being limited, to all rights in the trademarks, service marks, certification
marks, and association marks (“Conference Marks”). During the term of this MOU, IEEE
shall have a non-exclusive, non-transferable, royalty-free license to use the Conference Marks
in connection with the Conference. IEEE agrees to cooperate with Host in obtaining
registration of the Conference Marks and to execute any documents and take any actions that
may be necessary to enable Host to secure registration of and enforce rights in the Conference
Marks.
4.2 All advertising materials, advance programs, final programs, and calls for
participation shall feature the names and/or logos of the Sponsoring Parties equally so as not to
suggest any priority or preemption as between the Sponsoring Parties. During the term of this
MOU, each Sponsoring Party grants a non-exclusive, royalty-free, worldwide license to the
other Sponsoring Party to use its name and logo in connection with the advertising and
promotion of the Conference. The graphic design in common use by each of the Sponsoring
Parties shall be used in an equal fashion on printed material in connection with the Conference
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
3
as well. Guidelines for use of the IEEE Master Brand Image and Logotype “IEEE” can be
found on the IEEE Web site at www.ieee.org/web/publications/rights/idstandards.html.
5. INDEMNITY
Each Sponsoring Party shall indemnify and hold harmless the other Sponsoring Party
from and against any and all claims, demands, liabilities, settlements, damages, costs, and
expenses, including reasonable attorneys’ fees and expenses, arising out of, or in any way
connected with, any default, breach or negligent non-performance of this MOU or any willful or
negligent act or omission on the part of itself, its agents and employees arising out of this MOU.
6. PROPRIETARY OR CONFIDENTIAL INFORMATION
“Confidential Information” as used herein means information identified by either party as
“Confidential” and/or “Proprietary,” or information that, under the circumstances, ought
reasonably be treated as confidential and/or proprietary. “Confidential Information” shall
include, but not be limited to, this MOU its Attachments, exhibitor lists, key contacts lists,
technical information, market research, membership data, analyses, studies, developments,
processes, present and/or future product information, pricing information, business plans or other
documents, information and materials that contain or reflect such information. Neither party
shall disclose to a third party Confidential Information of the other party. The receiving party
shall use the same degree of care as it uses to protect the confidentiality of its own confidential
information of like nature, but no less than a reasonable degree of care, to maintain in confidence
the Confidential Information of the disclosing party. Each party further agrees to act as trustee
for any Confidential Information jointly created or acquired through the parties’ participation in
this MOU. The foregoing obligations shall not apply to any Confidential Information that: (a)
can be demonstrated to have been publicly known at the time of the disclosing party’s disclosure
of such Confidential Information to the receiving party; (b) becomes part of the public domain or
publicly known, by publication or otherwise, not due to any unauthorized act or omission by the
receiving party; (c) can be demonstrated to have been independently developed or acquired by
the receiving party without reference to or reliance upon such Confidential Information; (d) is
provided to the receiving party by a third party who is under no obligation to the disclosing party
to keep the information confidential; or (e) is required to be disclosed by law, provided that the
receiving party takes reasonable and lawful actions to avoid and/or minimize such disclosure and
promptly notifies the disclosing party so that the disclosing party may take lawful actions to
avoid and/or minimize such disclosure.
7. TERMINATION
This MOU may not be terminated except by written consent of all parties. Upon
termination or non-renewal of this MOU, no Sponsoring Party may use, license, create derivative
works, or exploit in any way the jointly owned works without the written consent of the other
parties.
8. MISCELLANEOUS
8.1 Binding Effect. This MOU shall inure to the benefit of, and be binding upon the
Sponsoring Parties, their successors in interest, legal representatives, and assigns.
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
4
8.2 Assignment. None of the Sponsoring Parties may assign or transfer its interest in
this MOU, nor any interest herein or claim hereunder without the express written consent of
the other Sponsoring Parties.
8.3 Waiver. Any waiver of a breach of any provision of this MOU shall not operate or
be construed as a waiver of any subsequent breach.
8.4 Governing Law. This MOU shall be interpreted under and governed by the laws of
the State of New York, without reference to its conflicts of laws principles.
8.5 Dispute Resolution. Any controversy or claim arising out of or relating to this
MOU shall be settled by arbitration in accordance with the rules of the American Arbitration
Association. Such arbitration shall occur in New York City and be conducted by one
arbitrator, jointly chosen by the Sponsoring Parties. Any such decision of the arbitrator shall
be binding upon the parties.
8.6 Survival. All rights and obligations provided in this MOU which do not expressly
terminate pursuant to this MOU, shall survive the expiration or termination of this MOU and
shall remain in full force and effect after termination or expiration.
8.7 Headings. Headings used in this MOU are for reference purposes only and shall not
be deemed a part of this MOU.
8.8 Severability. If any provisions or portions of this MOU are invalid under any
applicable statute or rule of law, they are to that extent to be deemed omitted from this MOU
and replaced by provisions or portions thereof which are as close to the original provisions as
possible while being legally permissible. The other provisions or portions(s) of provisions of
this MOU shall remain enforceable and unaffected.
8.9 Complete MOU. This MOU constitutes the entire agreement among the parties and
supersedes all other prior MOUs of the parties for the period to which it applies and may not be
modified except in writing signed by the parties.
8.10 Notices. Any notice given under this MOU to any of the Sponsoring Parties may
be effected by : (i) personal delivery in writing, (ii) facsimile, receipt of which is confirmed by
facsimile confirmation, or (iii) registered or certified mail, postage prepaid, return receipt
requested, and shall be deemed communicated as of actual receipt. Mailed notices and any
other communications among the Sponsoring Parties shall be addressed as set forth below, but
any of the parties may change its address by giving written notice of such to the other parties:
To IEEE Unit:
NAME:
ADDRESS:
CITY, STATE, POSTAL CODE:
ATTENTION:
PHONE:
FACSIMILE:
E-MAIL:
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
R. Mark Nelms
ECE Department, 200 Broun Hall
Auburn University, AL 36849-5201 USA
334-844-1830
334-844-1809
m.nelms@ieee.org
5
With a copy to:
IEEE Conference Contracts
445 Hoes Lane
Piscataway, NJ 08855
Attention:
Facsimile: +1 732 465 6447
Email: conference-contracts@ieee.org
Technical Co-Sponsor MOU – September 2009
IEEE IAS and PCIC Europe
6
AGENDA ITEM 3.3
IEEE INDUSTRY APPLICATIONS SOCIETY
Bruno Lequesne
President-Elect
Center for Advanced
Vehicle Technologies
The University of Alabama
Tuscaloosa, AL 35487
Date: September 28, 2009
Revised Oct. 15, 2009, with final statistics from IAS 09 meeting
To: IAS Board Members
Subject: President-Elect Report to the IAS Executive Board Meeting to be held on October 5, 2009
What follows are preliminary statistics and comments concerning the 2009 Annual Meeting. Salient points
are in bold. In overall summary, registration numbers are encouraging, especially given the difficult
economic times, in terms of absolute numbers as well as diversity (industry and overseas participation in
particular). Number of new attendees (41%) is particularly welcome. The tutorial program is strong,
although actual attendance is difficult to know until the event. Financial outcome unknown pending
negotiations with the hotel (room block will not be met).
Attendance (numbers as of 10/02/2009):
• 258 registrants; We met our budgeted registration goal of 226.
• By type: Full conference, 149; Technical sessions only, 96; Tutorials, 11; Single tutorial, 2. It may
be interesting to see how many people actually attend the tutorials.
• By seniority of attendance: 10+ years, 50 (22%); 6-10 years, 33 (14%); 2-5 years. 55 (23%); First
time: 95 (37%); unknown, 25. There were 120 first-time attendees at the larger 2008 meeting.
Large number of new or recent attendees is good, and we need to pay attention to retention.
• Region of attendance: USA+Canada, 149 (58%); Asia-Pacific, 51 (20%); Europe, 30 (12%); Latin
America, 21 (8%); Africa + Middle East, 7 (3%). Registrants for Chapter workshop is 30. Good
attendance from overseas is encouraging.
• Industry / academia breakdown: Industry/government, 135 (52%); academia, 114 (44%).
• Number of authors: 97 (42%); Ratio of registrants to papers 1.69, at least as high as at previous IAS
annual Meetings. Good attendance from non-authors is healthy.
• Five authors registered more than 2 papers, providing an extra $875 in revenue; All 5 are from Asia or
Latin America; the additional fee for presenting more than 2 papers seems to disproportionally affect
overseas individuals.
• Membership: 152 registrants are members of IAS or of a sister society (59%), 47 (18%) members of
IEEE, 12 (5%) life members. 24 (9%) are registered as students. Only 19 (7%) are non-members.
• Hotel registrations: 176 attendees booked at the hotel when registering; Of the remaining, 27 are from
Houston and 47 chose to stay elsewhere and pay the extra $300 in fee ($11k in revenue).
• Registration timing: 78% have registered by September 1st (15% by June 1st).
Budget:
On the positive side, meeting the budgeted number of registrants is important from a budgetary point of view.
However, the room block is far from being met (about 700 room nights compared with 1068 minimum roonights). Courtesy is negotiating a lower penalty, or even a waiving of the penalty based on our presence at the
same hotel in 2010, and general economic conditions.
Technical sessions:
• 24 sessions, plus a plenary session, for a total of 130 papers. These include 2 sessions from
Electrostatic Processes Committees and a Special Session on Arc Flash from Metals Committee (with
1-hour presentations).
• Plenary session: Its goal was to bring IAS’ diverse committees together and foster better knowledge of
each other, by presenting papers of general interest. Some committees (ILDC and Mining in
particular) responded very well and seemed to take advantage of the opportunity, sometimes
preparing a special presentation for the occasion (no written paper). Other committees participated
less well (I&CPS came on board at the last minute). Preparation presented various minor difficulties,
including scheduling of committee meetings, and making for more overlap of technical sessions with
tutorials than initially anticipated.
• Good management by most committees except Appliance Industries (numerous complaints, only one
session with 3 papers (versus 3 sessions in 2008). I&CPS delayed response until their Spring meeting
was also of some inconvenience.
• Program posted on website as an Excel spreadsheet for authors’ convenience (per 2008 experience).
• Paper template prepared in Word and posted in late May, and shared with ECCE. Could be made
available to other conferences as well.
Paper submission process:
• Hybrid process with I&CPS Dept. and Mining Committee using ScholarOne, the rest using Conference
Express. The Conference Express system worked very well (after all it is the legacy system).
ScholarOne needed attention and worked very well thanks to Louie Powell’s presence and
experience. ScholarOne is a good system for those committees which review papers prior to the
conference, but needs a presence. The Conference Express system is more tolerant in case of an
unresponsive committee than ScholarOne would be.
• Having two systems caused relatively little confusion.
• Maintaining a hybrid system (ScholarOne + Conference Xpress) is recommended for future
years. There is no reason to impose ScholarOne on those committees that don’t want it and don’t
need it, however, it is a good system for others.
Tutorial program:
• Nine tutorials in two parallel tracks.
• Technical material printed in a single book (courtesy of Aramco).
• Registration is in a single package, or for a single tutorial. The impact of the latter cannot be
determined yet as this is expected to attract mostly local and last minute attendees.
• Presenters country of origin: USA, 6; Canada, 2; Europe: 1.
• Origin of tutorial: Houston section, 6; self-nominated, 3. Help of Houston Section has been
outstanding.
• Number of actual attendees unclear before the conference.
• Posting of program done June 10; earlier posting would help publicity.
• Publicity: Relied almost exclusively on email blasts to members of IAS, PELS, PES, and local Section,
and the IAS website. An attempt was made to link with a company called “pdhengineers.com”,
which advertises all kind of seminars and typically takes a cut on the registration (business model
apparently similar to Expedia for air travel). They posted our program for free as a trial balloon,
effect not know yet.
• Questions for the longer term: 1) expand publicity reach; 2) Need to develop self-sustaining
program; and 3) North America versus internationalization.
Hotel/ Courtesy/Badge Guys/Technical Program Coordinator/IEEE staff/Local committee/Website:
Very smooth operation with our volunteers and partners.
Other:
• Sponsorship: 3 sponsors, all thanks to Sunita Kulkarni of the Houston Section
• Guest tours: Nothing could be done for guests aside from setting up a room for them at the hotel,
because of a lack of a volunteer to organize beyond this. 18 companions have registered.
Respectfully submitted,
Bruno Lequesne
2009-2010 IAS President-Elect
THE INSTITUTE OF ELECTRICAL AND
ELECTRONIC ENGINEERS, INC.
INDUSTRY APPLICATIONS SOCIETY
Vice President – Long Range Planning
Blake Lloyd
Iris Power LP
3110 American Drive
Mississauga, On
Canada
blloyd@irispower.com
September 28, 2009
Attention:
Subject:
Location:
IAS Executive Board Members
Report to Executive Board
Remote
•
Web site support and Electronic Communications have been completely handed
off to Ranga – have not done anything on the web site in months.
•
As a corresponding member of the TAB Strategic Planning Committee I will be
attending my first web-conference meeting on Sunday October 18. The goal of
this committee is to develop long-range plans in conjunction with the IEEE
Strategic Planning Committee and to monitor the performance of TAB in
achieving the goals set in the Operational Plan. I will report on the results of the
meeting next quarter.
•
Following input from the Q2 meeting, and working with IEEE staff involved in the
member survey process, a final survey was created and posted on the web. We
advertised the survey thru the web site as well a several email blasts. We had
1536 respondents which is a pretty solid turn out. The survey had one major flaw
in that it indicated in the opening comments that users could input their own
general comments at the end however there was no place to do this. A few
members sent email with comments. Also due to the technology used (and my
general inability to spell without a spell checker), there were several spelling
mistakes in the survey which many took glee in pointing out. The raw results
have been organized and tabulated in a more readable form in the attached
Excel sheet along with some of my personal observations.
•
Respectfully submitted,
Blake Lloyd
IEEE/IAS Vice President
Treasurer's Report to the IAS Executive Board - October, 2009
PART 1 - IAS Statement of Revenue and Expenses, January 1, 2008 to December 31, 2008
From TAB Summary Report Dated June 19, 2009
Revenue
Periodical Sales
Non-Periodical Sales
Meetings/Conferences
Committee/Other
Total Revenue
$
$
$
$
976,000
8,800
3,303,100
200
$
4,288,100
$
5,752,500
$
(1,464,400)
Expenses
Investment Returns
Periodical Related
Non-Periodical Related
Meetings/Conferences
Administration
Committee/Other
Total Expenses
$
$
$
$
$
$
2,320,100
556,200
28,100
2,091,400
387,700
369,000
Net Surplus (Deficit)
PART 2 - IAS Balance Sheet as of December 31, 2008
From TAB Summary Report Dated June 19, 2009
Assets
Accounts Receivable
Loans/Advances Receivable
Prepaid Expenses
Fixed Assets
Pooled Assets
Total Assets
$
$
$
$
$
472,000
192,000
(5,000)
1,000
2,645,000
$
3,305,000
$
180,000
$
3,125,000
Liabilities
Accounts Payable
Deferred Income
Total Liabilities
$
$ 180,000.00
Net Worth
Page 2 of 6
Treasurer's Report to the IAS Executive Board - October, 2009
PART 3 - IAS Statement of Revenue and Expenses, January 1, 2009 to August 31, 2009
From TAB Summary Report Dated September 09, 2009
Revenue
Periodical Sales
Non-Periodical Sales
Meetings/Conferences
Committee/Other
Total Revenue
$
$
$
$
772,500
184,500
$
957,000
$
855,800
$
101,200
Expenses
Investment Returns
Periodical Related
Non-Periodical Related
Meetings/Conferences
Administration
Committee/Other
Total Expenses
$
$
$
$
$
$
421,100
21,600
23,100
309,000
81,000
Net Surplus (Deficit)
PART 4 - IAS Balance Sheet as of June 30, 2009
From TAB Summary Report Dated July 14, 2009
Assets
Accounts Receivable
Loans/Advances Receivable
Prepaid Expenses
Fixed Assets
Pooled Assets
Total Assets
$
$
$
$
$
472,000
202,000
1,000
2,712,000
$
3,387,000
Liabilities
Accounts Payable
Deferred Income
Total Liabilities
$
$
$
Rounding Error
$
Net Worth
1,000
$
Page 3 of 6
-
3,388,000
PART 5 - INDUSTRY APPLICATIONS SOCIETY FINANCIAL DETAIL REPORT: CLOSING DATE: AUGUST 31, 2009
(Based on TAB Report Dated September 09, 2009)
Amounts in Thousands of U. S. Dollars
2004 Actual
Totals
NET
(REVENUE - EXPENSE)
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
Totals
REVENUE
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
Totals
EXPENSES
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
2005 Actual
676.8
198.1
275.5
17.5
(4.6)
590.1
151.3
294.2
(14.6)
(4.1)
(11.3)
(7.1)
802.8
(6.2)
(378.2)
(209.7)
(66.9)
(6.7)
852.3
(15.8)
(417.2)
(182.4)
3,689.1
543.6
365.0
5.4
2,120.7
527.0
331.9
5.5
2.4
2,773.3
(0.2)
(0.4)
2.8
1,253.8
(0.3)
3,012.3
(198.1)
268.1
347.5
10.0
1,530.6
(151.3)
232.8
346.5
9.6
13.7
7.1
1,970.5
6.0
378.2
209.3
69.7
6.7
401.5
15.8
417.2
182.1
997.1
315.6
391.6
25.3
(3.3)
(5.2)
10.2
(18.1)
984.5
0.1
(485.6)
(218.0)
684.3
175.3
457.0
50.4
(4.1)
(0.4)
1.3
(24.7)
850.6
(20.7)
(612.8)
(187.6)
(1,467.6)
(2,320.1)
306.9
115.3
(2.1)
(0.7)
(1.7)
(19.3)
1,215.6
(4.3)
(388.4)
(368.8)
2009 Budget
YTD
(30.4)
220.5
85.9
(5.6)
(3.2)
(32.0)
340.0
(13.6)
(308.8)
(313.6)
3,976.3
614.4
372.9
5.6
3.2
1.7
2,961.9
16.6
-
3,615.6
696.9
388.6
5.6
5.1
0.3
2,534.4
(15.3)
-
4,287.7
587.3
376.7
5.2
6.2
0.2
8.8
3,301.5
1.6
0.2
2,442.8
447.3
305.1
5.6
1,695.2
(10.4)
-
956.9
440.6
330.9
1.0
184.4
-
(1,485.9)
(6.7)
25.8
1.0
(5.6)
(1,510.8)
10.4
-
2,979.2
(315.6)
222.8
347.6
8.9
8.4
(8.5)
18.1
1,977.4
16.5
485.6
218
2,931.3
(175.3)
239.9
338.2
9.7
5.5
(1.0)
24.7
1,683.8
5.4
612.8
187.6
5,755.3
2,320.1
280.4
261.4
7.3
6.9
1.9
28.1
2,085.9
5.9
388.4
369.0
2,473.2
226.8
219.2
5.6
3.2
37.6
1,355.2
3.2
308.8
313.6
857.5
222.7
197.8
(7.3)
5.6
3.2
21.8
15.8
7.3
309.6
81.0
(1,615.7)
(4.1)
(21.4)
(7.3)
(15.8)
(1,339.4)
4.1
0.8
(232.6)
2006 Actual
Page 4 of 6
2007 Actual
2008 Actual
2009 Actual
YTD
99.4
217.9
133.1
7.3
(4.6)
(3.2)
(21.8)
168.6
(7.3)
(309.6)
(81.0)
Variance
129.8
(2.6)
47.2
7.3
1.0
10.2
(171.4)
6.3
(0.8)
232.6
Treasurer's Report to the IAS Executive Board - October, 2009
Part 6 - Year 2009 Executive Board Budget/Expense Summary
As of August 31, 2009
IEEE Account No.
Budget Category
Budgeted
Spent
Remaining
Total of All Listed Accounts
$ 460,800
$ 83,900
$ 376,900
00870 40060
00870 45150
Salary, Transactions Editor
Reimbursed Expenses, Transactions Editor
$ 15,600
$ 7,200
$ 10,200
$ 2,700
$
$
5,400
4,500
00871 40060
00871 45150
Salary, Magazine Editor
Reimbursed Expenses, Magazine Editor
$ 15,600
$ 7,200
$
$
$
$
7,800
4,700
01900 40815
01900 40831
01900 40833
01900 40841
01900 40851
01900 40861
01900 40871
01900 40872
Reimbursed Expenses, IAS President
Chapters
Distinguished Lecturer Program
Operating Departments/Technical Committees
Membership
Executive Board
Awards
Awards HQ Expenses
$ 12,000
$ 48,000
$ 20,400
$ 19,200
$ 28,800
$ 241,200
$ 2,400
$ 43,200
$ 3,800
$ 2,800
$ 4,000
$ 2,200
$ 6,500
$ 20,800
$
$ 20,600
Page 5 of 6
7,800
2,500
$ 8,200
$ 45,200
$ 16,400
$ 17,000
$ 22,300
$ 220,400
$ 2,400
$ 22,600
Treasurer's Report to the IAS Executive Board - October, 2009
Part 1
IAS Statement of Revenue and Expenses, January 1, 2008 to
December 31, 2008
Part 2
IAS Balance Sheet as of December 31, 2008
Part 3
IAS Statement of Revenue and Expenses, January 1, 2009 to
August 31, 2009
Page 2
Page 2
Page 3
Part 4
IAS Balance Sheet as of July 14, 2009
Page 3
Part 5
IAS Financial Detail Report, Closing Date August 31, 2009
Page 4
Part 6
Executive Board Budget/Expense Summary
Page 5
Part 7
Myron Zucker Student Fund & Student Faculty Grant Program
Page 6
Respectfully Submitted
S. A. Larson, Treasurer, Industry Applications Society
Page 1 of 6
Treasurer's Report to the IAS Executive Board - October, 2009
PART 1 - IAS Statement of Revenue and Expenses, January 1, 2008 to December 31, 2008
From TAB Summary Report Dated June 19, 2009
Revenue
Periodical Sales
Non-Periodical Sales
Meetings/Conferences
Committee/Other
Total Revenue
$
$
$
$
976,000
8,800
3,303,100
200
$
4,288,100
$
5,752,500
$
(1,464,400)
Expenses
Investment Returns
Periodical Related
Non-Periodical Related
Meetings/Conferences
Administration
Committee/Other
Total Expenses
$
$
$
$
$
$
2,320,100
556,200
28,100
2,091,400
387,700
369,000
Net Surplus (Deficit)
PART 2 - IAS Balance Sheet as of December 31, 2008
From TAB Summary Report Dated June 19, 2009
Assets
Accounts Receivable
Loans/Advances Receivable
Prepaid Expenses
Fixed Assets
Pooled Assets
Total Assets
$
$
$
$
$
472,000
192,000
(5,000)
1,000
2,645,000
$
3,305,000
$
180,000
$
3,125,000
Liabilities
Accounts Payable
Deferred Income
Total Liabilities
$
$ 180,000.00
Net Worth
Page 2 of 6
Treasurer's Report to the IAS Executive Board - October, 2009
PART 3 - IAS Statement of Revenue and Expenses, January 1, 2009 to August 31, 2009
From TAB Summary Report Dated September 09, 2009
Revenue
Periodical Sales
Non-Periodical Sales
Meetings/Conferences
Committee/Other
Total Revenue
$
$
$
$
772,500
184,500
$
957,000
$
855,800
$
101,200
Expenses
Investment Returns
Periodical Related
Non-Periodical Related
Meetings/Conferences
Administration
Committee/Other
Total Expenses
$
$
$
$
$
$
421,100
21,600
23,100
309,000
81,000
Net Surplus (Deficit)
PART 4 - IAS Balance Sheet as of June 30, 2009
From TAB Summary Report Dated July 14, 2009
Assets
Accounts Receivable
Loans/Advances Receivable
Prepaid Expenses
Fixed Assets
Pooled Assets
Total Assets
$
$
$
$
$
472,000
202,000
1,000
2,712,000
$
3,387,000
Liabilities
Accounts Payable
Deferred Income
Total Liabilities
$
$
$
Rounding Error
$
Net Worth
1,000
$
Page 3 of 6
-
3,388,000
PART 5 - INDUSTRY APPLICATIONS SOCIETY FINANCIAL DETAIL REPORT: CLOSING DATE: AUGUST 31, 2009
(Based on TAB Report Dated September 09, 2009)
Amounts in Thousands of U. S. Dollars
2004 Actual
Totals
NET
(REVENUE - EXPENSE)
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
Totals
REVENUE
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
Totals
EXPENSES
00100 Investment Returns
00870 Trans on Industry Applications
00871 Industry Applications Magazine
00872 CD-ROM
00873 IAS Conf Digital Library
01499 Periodical Related – Other
01500 Newsletters
01600 Non Periodical
01700 Meetings/Conferences
01701 Conference Related
01800 (IEEE) Administration
01900 (IAS) Committee & Other
2005 Actual
676.8
198.1
275.5
17.5
(4.6)
590.1
151.3
294.2
(14.6)
(4.1)
(11.3)
(7.1)
802.8
(6.2)
(378.2)
(209.7)
(66.9)
(6.7)
852.3
(15.8)
(417.2)
(182.4)
3,689.1
543.6
365.0
5.4
2,120.7
527.0
331.9
5.5
2.4
2,773.3
(0.2)
(0.4)
2.8
1,253.8
(0.3)
3,012.3
(198.1)
268.1
347.5
10.0
1,530.6
(151.3)
232.8
346.5
9.6
13.7
7.1
1,970.5
6.0
378.2
209.3
69.7
6.7
401.5
15.8
417.2
182.1
997.1
315.6
391.6
25.3
(3.3)
(5.2)
10.2
(18.1)
984.5
0.1
(485.6)
(218.0)
684.3
175.3
457.0
50.4
(4.1)
(0.4)
1.3
(24.7)
850.6
(20.7)
(612.8)
(187.6)
(1,467.6)
(2,320.1)
306.9
115.3
(2.1)
(0.7)
(1.7)
(19.3)
1,215.6
(4.3)
(388.4)
(368.8)
2009 Budget
YTD
(30.4)
220.5
85.9
(5.6)
(3.2)
(32.0)
340.0
(13.6)
(308.8)
(313.6)
3,976.3
614.4
372.9
5.6
3.2
1.7
2,961.9
16.6
-
3,615.6
696.9
388.6
5.6
5.1
0.3
2,534.4
(15.3)
-
4,287.7
587.3
376.7
5.2
6.2
0.2
8.8
3,301.5
1.6
0.2
2,442.8
447.3
305.1
5.6
1,695.2
(10.4)
-
956.9
440.6
330.9
1.0
184.4
-
(1,485.9)
(6.7)
25.8
1.0
(5.6)
(1,510.8)
10.4
-
2,979.2
(315.6)
222.8
347.6
8.9
8.4
(8.5)
18.1
1,977.4
16.5
485.6
218
2,931.3
(175.3)
239.9
338.2
9.7
5.5
(1.0)
24.7
1,683.8
5.4
612.8
187.6
5,755.3
2,320.1
280.4
261.4
7.3
6.9
1.9
28.1
2,085.9
5.9
388.4
369.0
2,473.2
226.8
219.2
5.6
3.2
37.6
1,355.2
3.2
308.8
313.6
857.5
222.7
197.8
(7.3)
5.6
3.2
21.8
15.8
7.3
309.6
81.0
(1,615.7)
(4.1)
(21.4)
(7.3)
(15.8)
(1,339.4)
4.1
0.8
(232.6)
2006 Actual
Page 4 of 6
2007 Actual
2008 Actual
2009 Actual
YTD
99.4
217.9
133.1
7.3
(4.6)
(3.2)
(21.8)
168.6
(7.3)
(309.6)
(81.0)
Variance
129.8
(2.6)
47.2
7.3
1.0
10.2
(171.4)
6.3
(0.8)
232.6
Treasurer's Report to the IAS Executive Board - October, 2009
Part 6 - Year 2009 Executive Board Budget/Expense Summary
As of August 31, 2009
IEEE Account No.
Budget Category
Budgeted
Spent
Remaining
Total of All Listed Accounts
$ 460,800
$ 83,900
$ 376,900
00870 40060
00870 45150
Salary, Transactions Editor
Reimbursed Expenses, Transactions Editor
$ 15,600
$ 7,200
$ 10,200
$ 2,700
$
$
5,400
4,500
00871 40060
00871 45150
Salary, Magazine Editor
Reimbursed Expenses, Magazine Editor
$ 15,600
$ 7,200
$
$
$
$
7,800
4,700
01900 40815
01900 40831
01900 40833
01900 40841
01900 40851
01900 40861
01900 40871
01900 40872
Reimbursed Expenses, IAS President
Chapters
Distinguished Lecturer Program
Operating Departments/Technical Committees
Membership
Executive Board
Awards
Awards HQ Expenses
$ 12,000
$ 48,000
$ 20,400
$ 19,200
$ 28,800
$ 241,200
$ 2,400
$ 43,200
$ 3,800
$ 2,800
$ 4,000
$ 2,200
$ 6,500
$ 20,800
$
$ 20,600
Page 5 of 6
7,800
2,500
$ 8,200
$ 45,200
$ 16,400
$ 17,000
$ 22,300
$ 220,400
$ 2,400
$ 22,600
Treasurer's Report to the IAS Executive Board - October 2009
IEEE Foundation
Myron Zucker Student Fund & Student Faculty Grant Program Fund
For the Year ended 31-Dec-08.
Fund 1316
Fund 1317
Beg Fund Balance
$
726,704
$
330,595
Contributions
Dividends and Interest
Net Unreal/Real Gain/(Loss)
$
$
20,969
(232,634)
$
$
9,644
(103,216)
$
(211,666)
$
(93,571)
$
$
-
14,843
3,404
$
-
1,550
$
18,247
$
1,550
$
496,790
$
235,473
Total Income
Awards, Medals / Certificates/ Mtg
Admin and Other
Special Projects and Grants
Total Expenses
Ending Fund Balance
IEEE Foundation
Myron Zucker Student Fund & Student Faculty Grant Program Fund
For the Eight Months ended 31-Aug-09.
Fund 1316
Fund 1317
Beg Fund Balance
$
496,790
$
235,473
Contributions
Dividends and Interest
Net Unreal/Real Gain/(Loss)
$
$
$
6,799
14,040
$
$
$
3,123
6,256
$
20,838
$
9,379
$
$
$
1,766
1,843
-
$
$
$
873
-
$
3,609
$
873
$
514,020
$
243,979
Total Income
Awards, Medals / Certificates/ Mtg
Admin and Other
Special Projects and Grants
Total Expenses
Ending Fund Balance
Charges against 1316 include travel reimbursement for 3 students for $369.07, $369.00
and $600.00 in July 2009 and
$400.00 Cash Award (Feb 2009) for the recipient of the 2008 IEEE IAS Zucker Design
and $1,843 in custodial fees.
Charges against 1317 are $873 in custodial fees.
Page 6 of 6
AGENDA ITEM 3.2
IEEE INDUSTRY APPLICATIONS SOCIETY
Thomas A. Nondahl
President
Date: October 1, 2009
Rockwell Automation
1201 South Second Street
Milwaukee, WI 53204
414-382-0237
t.nondahl@ieee.org
To: IAS Board Members:
Subject: President’s Report to the IAS Executive Board Meeting to be held on October 5, 2009
Appointments and Nominations:
−
−
−
−
−
−
−
−
Nominated Mark Mirolli to the editorial board of the Transaction on Sustainable Energy (Aug. 2009). IAS is a
10% financial co-sponsor of the publication.
Approved a request on June 24, 2009 from Santo (Sandy) Mazzola, the chair of the Long Island Section to Split
the New York/Long Island Joint Sections Power & Energy, Industry Applications Joint Societies Chapter into:
1. New York Section Power & Energy, Industry Applications Joint Societies Chapter. This chapter will retain
the current Account number, Geo Code, and Chapter Chair (Ajoy Das).
2. Long Island Section Power & Energy, Industry Applications Joint Societies Chapter. This chapter will be
created as a new joint chapter. The Chapter Chair will be Steven Rubin
Approved a request to form the Centro Occidente Section Industry Applications Society Chapter (June 2009).
Approved a New Geographic Unit Approval Request for the IEEE Honduras Section Industry Applications
Society Chapter (July 2009).
Approved a request from Hungary Section Chair Kadar Peter to add the Power Electronics Society to the
existing Hungary Section Industry Applications Society Chapter (Aug. 2009).
Approved formation of the IEEE Universidad Tecnologica de Panama Industry Applications Society Student
Branch Chapter (Aug 2009).
Approved a request to add the Industry Applications Society to the existing Bolivia Section Power & Energy
Society Chapter (Sep. 2009).
Nominated Bob Lorenz to replace Tim Haskew on the IEMDC steering committee (Sep. 2009).
Intersociety Cooperation Opportunities:
−
EMC Society Request – looking for areas such as joint sessions or seminars
General Items:
− Volunteer training videos are available at www.ieee.org/go/volunteertraining.
− The bank account for the 2008 IEEE IAS Annual Meeting is closed. The surplus is nearly $100,000.
− Added about 80 key words to the IEEE Technology Navigator system during July 2009.
− The board held its first all-electronic meeting on June 29, 2009.
− The IAS financial analyst and I reviewed the 2009 IAS budget to prepare for IEEE Board approval of
the final IAS donation to the James Rucks fund. The IEEE board will vote on it in November.
− The final council vote for 2010 board members had a response rate of 44%. That is much better than
we have ever had in recent years but still below the 50% level set by IEEE. We will discuss how to
increase participation at the October board meeting.
Trips Planned for the remainder of 2009
− IAS Annual Meeting in Houston, TX on Oct. 4-8.
− ICEMS on Nov. 15-18 in Tokyo, Japan.
− IEEE TAB meeting in New Brunswick, NJ on Nov. 19-21.
Trips:
− I gave two talks at the Region 8 Chapters Workshop on Sept. 6-8 in Sweden. The workshop
presented best practices on Sunday, had wind power talks on Monday, and took a tour to a wind
power expo on Tuesday. There were about 30 attendees on Sunday and 50 on Monday.
th
− I attended ECCE 2009 the week of Sep. 20 . It was a very dynamic and superbly organized event.
Tomy Sebastian, the general chair, anticipates the meeting will generate a surplus. There were almost
750 attendees, 500 papers, and 25 vendor booths. Several IAS members were honored: Donald
Novotny received the Tesla Award, Ron Harley received the Kaufmann Award, John Miller received
the Kliman Award, and six IAS members received Fellows certificates.
Several things happened at ECCE that will require attention from the IAS Board. Two of the
IAS technical committees voted to merge with their counterparts in PELS. This action is not
effective unless approved the IAS Executive Board. Since such actions could have a profound
effect on those technical committees and IAS publications, I intend to ask the board to approve a
special committee that will make recommendations to guide us as we explore further cooperation
with PELS. The IAS committee with work with a sister committee from PELS to determine:
1. The structure of joint technical committees that could be shared between PELS and IAS.
2. The formation of a journal or other mechanism to jointly publish the papers reviewed by the
joint committees.
3. Harmonization of IAS and PELS publication rules for the papers approved by the joint
committees.
4. The society which will serve as the manuscript central host for each joint committee.
5. Rules for selection of technically sponsored conferences that will provide papers to the joint
committees.
6. Any other items that may arise.
In performing these tasks the IAS & PELS committees will provide
1. Updates on progress at each IAS Board Meeting and each PELS Adcom meeting.
2. Statistics on transactions publications by their respective technical committees in the recent
past to serve as a guideline for the equitable distribution of income.
3. Estimates of the financial impact to IAS and PELS of all recommended actions.
4. A list of recommendations that will be presented to the IAS and PELS governing boards for
approval.
The IAS committee would have the following structure:
Chair:
Bruno Lequesne, IAS President-Elect
Vice Chair: Giovanna Oriti, 2010 Industrial Power Conversion Committee Chair
Members: Uday Despande, 2010 Industrial Drives Committee Chair
Lixiang Wei, 2010 Industrial Power Converter Committee Chair
Members receiving correspondence only:
2010 Electric Machines Committee Chair
2010 Power Electronic Devices and Components Committee Chair
Respectfully Submitted,
Thomas A. Nondahl
Process Industries Department
PID 3rd Quarter Report
IAS Board Meeting
Houston, TX
October 4-5, 2009
David B. Durocher, Senior Member IEEE
Process Industries Department Chairman
IEEE Industry Applications Society
26850 SW Kinsman Road
Wilsonville, OR 97070
Phone: 503-582-2714, Fax: 503-582-2814
Cell: 503-780-6062, Email: davidbdurocher@eaton.com
1
Process Industries Department
PID Activities
•
Significant/noteworthy achievements of the Committees, or
members
• Updated IAS web site for all PID committees (need to finalize PCIC)
• Lanny Floyd is our new PID Paper Review Chair
• Very well run Technical Committees/Conferences
–
–
–
–
–
–
–
–
ESW Dallas 2008 (March 18-March 21): Record Attendance 450, 59 booths
CIC Miami 2008 (May 18-May 22): Record Attendance 1210, 100+ booths
PCIC Europe Weimar 2008 (June 10-June 12): 120
PPIC Seattle (June 22-June 27): 178, 22 booths, 10 NPPs
PCIC Cincinnati (Sept 22-Sept 24): 1160 registered
MIC & MC Edmonton 2008 (Oct 5-Oct 9): Active Committees
ESW Saint Louis 2009 (Feb 2-Feb 6): 408 registered, 43 booths
CIC Palm Springs 2009 (May 29-Jun 5): 598 registered, 133 booths @ $1200
+ 133 exhibitors @ $595 = $238,735
– PPIC Birmingham 2009 (June 21-26): 122 registered, 12 of 14 booths
– PCIC Anaheim 2009 (Sept 13-18): 980 registered
– MIC & MC Houston 2009 (Oct 4-8)
$100K+
$151K
$ ?
$ 10K?
$200K+
$ ?
$ ?
$ ?
$
$
2
Process Industries Department
PPIC: Drop off of Industry Producers…
Conference Year
Location
2005
2006
2007
2008
2009
Jacksonville, FL
Appleton, WI
Williamsburg, VA
Seattle, WA
Birmingham, AL
Industry Engineers
47
48
49
45
22
3
Process Industries Department
CIC: Driving for Electrical Relevance…
Question 3: Which subject areas do you feel were the most important to you?
•
Environmental Workshop, General Practices
•
Waste Heat Power, Environmental (Hg), Alternative Fuels
•
Alternative Fuels
•
Environmental Session
•
Environmental and Operational Papers, Ed Sullivan, and Cooler Discussion
•
Improvement ideas for existing operations
•
Environmental, especially on Mercury topic and CO2, Grinding Technology
HPGR, Grinding Technology, Ball Mill Scanner
•
Actual operating experience with currently available OEM equipment
•
Environmental session helped explain things, tutorial was great too
•
Environmental, Plant operating items
•
Emissions and Climate
•
The area on General Practices and Environmental Workshop, Ed Sullivan
presentation
•
Environmental
•
General Practices and Cooler Roundtable
•
Environmental impacts on industry
•
The environmental work group gave the most useful and relevant information,
in light of the new changes
•
Material Handling Technology sessions (numerous)
•
General Practices, Environmental
•
Environmental
•
The environmental and cooler workshops were very applicable
•
Environmental workshop was outstanding. That addition added value to the
conference.
•
Power Distribution and Safety and Drives
•
Technical sessions to includeMACT, Environmental STDS (proposed), Hex
chrome
•
The Automation papers portion of the conference
•
Environmental – General Practices
•
General Practices
•
The NESHAP input was very timely
Question 4: Which subject areas do you feel were the least important to
you?
•
Drives
•
I’m not electrical
•
Electrical stuff
•
Drives, cement strength discussions
•
Automation
•
Power Distribution
•
Electrical and Controls
•
Electrical Power and Cogen
•
Electrical – Not my expertise
•
Power
•
Probably the Drive/Electrical parts because I’m a process guy.
•
Poster Papers
•
Environmental, Alternate Fuels/Materials, PCA Economic Outlook
•
Power Generation, Distribution and Related Products
•
Automation
•
Drives
•
Automation
•
Power Distribution
•
Historical Overviews
•
Power Generation
•
Drives
•
Automation
4
Process Industries Department
S1 Update
PID
•
•
•
•
•
•
ESW - Did not use S1in 2009
CIC - Proceedings via Conference Services, considering S1for awards
PPIC - Proceedings external, 2009: Used MSC for awards
PCIC – S1 used for 2009 conference
Mining – S1for 2009 Annual Meeting
Metal - Conference Services for 2009, S12010
5
Process Industries Department
Growth and Development Initiatives
PID
•
Activities/Plans for growth & development of
– Active membership (separate by academic/industrial, region, etc. as appropriate)
• PID: Expand IAS Membership base via access to technical papers in IEEE Xplore
• Zucker Write-up
• Metal & Mining IC: Expand user involvement, Committee teleconference sessions
– Conferences (attendance, attendee/author ratio, # of papers, etc.)
• CIC Formation of additional Working Group: Environmental, Energy and Sustainability
• PPIC Formation of a new Subcommittee: Forest Products
– Continuing education:
•
How well are ongoing activities working?
• PCIC: Continues to set the bar, emerging standards (need participation outside PCIC)
–
–
–
–
–
–
P1566 Adjustable Speed Drives > 500Hp
P1458 Molded Case Circuit Breakers
P1673 High Pressure Seals for Conduit & Cable
P1716 Guide for managing Natural Disaster Impact
P1584 Guide to Arc Flash Hazard Calculations
P1683 Enhanced Safety Motor Control Centers
6
Process Industries Department
Best Practices
PID
– CIC: Exhibition is a Significant source of Revenue. Co-Sponsorship by
PCA benefits research to develop new technology & involves leadership
– PCIC: Standards, Globalization, Web based post conference survey,
Emeritus Program
– PPIC: New Product Presentations, adding adjacent industry segments,
Student Interns, Senior Members
– Metal IC: Expanding global reach
– Mining IC: Alignment with regulatory bodies - MSHA
7
Process Industries Department
PID UPDATE:
James A. Rooks Memorial Student Intern Fund
PPIC: James A. Rooks, Life Fellow
– Award presented posthumously by Dr. Mark Halpin at 2008
PPIC
– Three student interns attended 2009 PPIC as a part of the
second annual JA Rooks Program
– Many, many, many thanks to the Society for support of
the James A Rooks Memorial Student Intern Fund initiative
2007 Campaign
$38,162 contributions from family & friends
$30,000 IAS matching grant
2008 Campaign
$21,490 contributions from family & friends ($4,035 conference)
$20,000 IAS matching grant (no check yet!)
$59,652 + $50,000 = $109,652
IEEE Foundation Endowment
8
Process Industries Department
The following slides are mostly data that can be
reviewed as presented and need not be discussed
unless there is some specific issue
THE SLIDES WILL BE KEPT FOR
ARCHIVAL PURPOSE AND USED
AS A RESOURCE FOR IEEE
AUDIT
9
Process Industries Department
See http://www.ieee.org/web/geo_activities/home/world_reg.html
For Region Definition
10
Name of Conference: Cement Industry Conference
Process Industries Department
Conferences - PID
Conference Dates
Conference Location
Co-Sponsor(s)
Attendance (tech
sessions)
# Papers Submitted
*Papers Accepted
(presented)
No. Exhibitors
Attendance
(tutorials/seminars)
# tutorials/seminars
IAS financial share
Income
Expense
Net Surplus
Closed
2006
April
Phoenix
AZ
PCA
2007
April 29 –
May 3
Charleston
SC
PCA
2008
May
18-22
Miami
FL
PCA
700
740
36
25
41
25
70
680
82
762
4
50%
4
50%
50%
Yes
No
No
2009
2010
CONFERENCE TUTORIALS
2006
CEU/PDH
2007
CEU
CEU
Networks in a Modern Cement Plant
Mechanical Material Handling for the US Cement Industry
Applications, Design, Retrofits and Maintenance
A Tale of Two Coolers
Relay Coordination for Cement Plants
CEU
CEU
11
Name of Conference: Cement Industry Conference
Process Industries Department
Conferences - PID
IAS PUBLICATION
Transactions on Industry
Applications
Row
NUMBER OF PAPERS:
2006 2007 2008 2009 2010
Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1
Papers submitted and approved for publication
Papers returned by committee for scope reasons, obvious poor
quality, etc.
Papers peer reviewed (row 1 less row 2)
3
Papers from Row 3 eventually rejected
3a
Papers from Row 3 in review process
3b
Papers from Row 3 being revised by authors
3c
Other papers from Row 3 (explain in comments below)
3d
Papers from Row 3 queued for publication
3e
3f
Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where
it is counted in Row 3)
Total: Rows 3a –3f, should equal Row 3
4
PERCENTAGE ACCEPTED via Peer Review
5
To compute this, divide “Row 3f” by “Row 3”
Average number of months from Author Submission to
6
Publication Date. Simply compute an average (from
submission to issue where paper appears)
Region of author affiliation (# of papers)
Regions 1 – 6 (U.S.A.)
Region 7 (Canada)
Region 8 (Europe/Africa)
Region 9 (Central/South America)
Region 10 (Asia/Pacific)
2
Industry Applications Magazine
2006
0
0
3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
3
0
0
0
0
0
3
0
0
0
0
3
100%
2007
2008
2009
2010
13
2
1
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
12
Name of Conference: Petroleum & Chemical Industry Conference
Process Industries Department
Conferences - PID
Conference Dates
Conference Location
Co-Sponsor(s)
Attendance (tech
sessions)
# Papers Submitted
*Papers Accepted
(presented)
No. Exhibitors
Attendance
(tutorials/seminars)
# tutorials/seminars
IAS financial share
Income
Expense
Net Surplus
Closed
2006
Sept
Philadelphia,
PA
None
2007
Sept
16-20
Calgary
AB
2008
Sept
22-24
2009
2010
CONFERENCE TUTORIALS
2006
2007
None
Cincinn
ati OH
None
1190
1274
1160
122
42
147
42
0
322
0
365
5
100%
4
100%
TBD
CEU/PDH
Practical Considerations and Lessons Learned – Applying
Microprocessor Relays for Rotating Machinery Protection
IEEE Std 493 – IEEE Gold Book Tutorial
Changes in the 2008 National Electrical Code
Energy Policy Act of 2006
0
100%
13
Name of Conference: Petroleum & Chemical Industry Conference
Process Industries Department
Conferences - PID
IAS PUBLICATION
Transactions on Industry
Applications
Row
NUMBER OF PAPERS:
2006 2007 2008 2009 2010
Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1
Papers submitted and approved for publication
Papers returned by committee for scope reasons, obvious poor
quality, etc.
Papers peer reviewed (row 1 less row 2)
3
Papers from Row 3 eventually rejected
3a
Papers from Row 3 in review process
3b
Papers from Row 3 being revised by authors
3c
Other papers from Row 3 (explain in comments below)
3d
Papers from Row 3 queued for publication
3e
3f
Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where
it is counted in Row 3)
Total: Rows 3a –3f, should equal Row 3
4
PERCENTAGE ACCEPTED via Peer Review
5
To compute this, divide “Row 3f” by “Row 3”
Average number of months from Author Submission to
6
Publication Date. Simply compute an average (from
submission to issue where paper appears)
Region of author affiliation (# of papers)
Regions 1 – 6 (U.S.A.)
Region 7 (Canada)
Region 8 (Europe/Africa)
Region 9 (Central/South America)
Region 10 (Asia/Pacific)
2
Industry Applications Magazine
2006
12
11
15
0
0
0
12
0
0
0
0
0
12
11
1
0
0
0
0
10
15
0
0
0
0
0
15
12
100%
10
91%
15
100%
29
19
22
7
3
1
6
3
9
4
1
1
1
0
2007
2008
2009
2010
1
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
14
Name of Conference: Pulp & Paper Industry Conference
Process Industries Department
Conferences - PID
Conference Dates
Conference Location
Co-Sponsor(s)
Attendance (tech
sessions)
# Papers Submitted
*Papers Accepted
(presented)
No. Exhibitors
Attendance
(tutorials/seminars)
# tutorials/seminars
IAS financial share
Income
Expense
Net Surplus
Closed
2006
June 1823
Appleton
WI
2008
June
22-27
Seattle
WA
None
2007
June
24-29
William
sburg
VA
None
144
188
178
31
23
49
30
31
21
68
19
103
22
101
5
100%
$167720
$100619
$67101
No
7
100%
6
100%
None
2009
2010
CONFERENCE TUTORIALS
2006
The Selection, Care and Feeding of Rolling Element
Electric Motor Bearings
Understanding Arc Flash
Power Cable Applications for Adjustable Speed Drive
Systems
Protection of Medium Voltage Transformers at Industrial
Facilities
Key Elements of Implementing an Electrical Safety
Program
2007
Energy Alternatives: Marginal Economics of Steam
Production vs Generation
Use of Adjustable Speed Drives for Energy Savings &
Productivity Improvements
Understanding NFPA 70E-2004 Requirements
Personal Protective Equipment for Electrical Safety
Grounding and Ground Fault Protection of Medium
Voltage Industrial Generators
Electrical Safety in the Workplace: NFPA 70E, CSA
Z462 and OSHA Regulations for Electrical Safety
Protective Relay Coordination
CEU/PDH
CEU
CEU
CEU
CEU
CEU
PDH
PDH
PDH
PDH
PDH
PDH
PDH
15
Name of Conference: Pulp & Paper Industry Conference
Process Industries Department
Conferences - PID
IAS PUBLICATION
Transactions on Industry
Applications
Row
NUMBER OF PAPERS:
2006 2007 2008 2009 2010
Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1
Papers submitted and approved for publication
Papers returned by committee for scope reasons, obvious poor
quality, etc.
Papers peer reviewed (row 1 less row 2)
3
Papers from Row 3 eventually rejected
3a
Papers from Row 3 in review process
3b
Papers from Row 3 being revised by authors
3c
Other papers from Row 3 (explain in comments below)
3d
Papers from Row 3 queued for publication
3e
3f
Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where
it is counted in Row 3)
Total: Rows 3a –3f, should equal Row 3
4
PERCENTAGE ACCEPTED via Peer Review
5
To compute this, divide “Row 3f” by “Row 3”
Average number of months from Author Submission to
6
Publication Date. Simply compute an average (from
submission to issue where paper appears)
Region of author affiliation (# of papers)
Regions 1 – 6 (U.S.A.)
Region 7 (Canada)
Region 8 (Europe/Africa)
Region 9 (Central/South America)
Region 10 (Asia/Pacific)
2
Industry Applications Magazine
2006
2007
19
5
10
15
0
0
0
5
0
0
0
0
0
5
10
0
0
0
0
0
10
15
0
0
0
0
0
15
5
100%
10
100%
15
100%
16
13
8
2
2
0
1
0
7
2
0
1
0
11
2
2
0
0
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
2008
2009
2010
16
Name of Conference: IAS Annual Conference - Metals Industry Committee
Process Industries Department
Conferences - PID
Conference Dates
Conference Location
2006
Oct
8-12
Tampa
FL
Co-Sponsor(s)
IAS
Attendance (tech
sessions)
# Papers Submitted
*Papers Accepted
(presented)
No. Exhibitors
Attendance
(tutorials/seminars)
# tutorials/seminars
IAS financial share
Income
23
2007
Sept
23-27
New
Orleans
LA
IAS
7
7
9
N/A
N/A
None
100%
Ref
IAS
100%
Ref
IAS
2008
2009
2010
CONFERENCE TUTORIALS
2006
CEU/PDH
2007
Expense
Net Surplus
Closed
17
Name of Conference: IAS Annual Conference - Metals Industry Committee
Process Industries Department
Conferences - PID
IAS PUBLICATION
Transactions on Industry
Applications
Row
NUMBER OF PAPERS:
2006 2007 2008 2009 2010
Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1
Papers submitted and approved for publication
Papers returned by committee for scope reasons, obvious poor
quality, etc.
Papers peer reviewed (row 1 less row 2)
3
Papers from Row 3 eventually rejected
3a
Papers from Row 3 in review process
3b
Papers from Row 3 being revised by authors
3c
Other papers from Row 3 (explain in comments below)
3d
Papers from Row 3 queued for publication
3e
3f
Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where
it is counted in Row 3)
Total: Rows 3a –3f, should equal Row 3
4
PERCENTAGE ACCEPTED via Peer Review
5
To compute this, divide “Row 3f” by “Row 3”
Average number of months from Author Submission to
6
Publication Date. Simply compute an average (from
submission to issue where paper appears)
Region of author affiliation (# of papers)
Regions 1 – 6 (U.S.A.)
Region 7 (Canada)
Region 8 (Europe/Africa)
Region 9 (Central/South America)
Region 10 (Asia/Pacific)
2
Industry Applications Magazine
2006
2
1
3
0
0
0
2
0
0
0
0
0
2
1
0
0
0
0
0
3
0
0
0
0
0
3
2
100%
1
100%
3
100%
27
15
17
1
1
1
1
2007
2008
2009
2010
2
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
18
Name of Conference: IAS Annual Conference - Mining Industry Committee
Process Industries Department
Conferences - PID
Conference Dates
Conference Location
Co-Sponsor(s)
Attendance (tech
sessions)
# Papers Submitted
*Papers Accepted
(presented)
No. Exhibitors
Attendance
(tutorials/seminars)
# tutorials/seminars
IAS financial share
Income
2006
Oct
8-12
Tampa
FL
IAS
2007
Sept
23-27
New
Orleans
LA
IAS
2008
2009
2010
CONFERENCE TUTORIALS
2006
CEU/PDH
2007
23
7
7
19
N/A
N/A
None
100%
Ref
IAS
100%
Ref
IAS
Expense
Net Surplus
Closed
19
Name of Conference: IAS Annual Conference - Mining Industry Committee
Process Industries Department
Conferences - PID
IAS PUBLICATION
Transactions on Industry
Applications
Row
NUMBER OF PAPERS:
2006 2007 2008 2009 2010
Note: Rows 3a-3f account for each paper’s fate based on its year of submission
1
Papers submitted and approved for publication
Papers returned by committee for scope reasons, obvious poor
quality, etc.
Papers peer reviewed (row 1 less row 2)
3
Papers from Row 3 eventually rejected
3a
Papers from Row 3 in review process
3b
Papers from Row 3 being revised by authors
3c
Other papers from Row 3 (explain in comments below)
3d
Papers from Row 3 queued for publication
3e
3f
Papers from Row 3 eventually published (if a paper is
published in a subsequent year, list in year of submittal where
it is counted in Row 3)
Total: Rows 3a –3f, should equal Row 3
4
PERCENTAGE ACCEPTED via Peer Review
5
To compute this, divide “Row 3f” by “Row 3”
Average number of months from Author Submission to
6
Publication Date. Simply compute an average (from
submission to issue where paper appears)
Region of author affiliation (# of papers)
Regions 1 – 6 (U.S.A.)
Region 7 (Canada)
Region 8 (Europe/Africa)
Region 9 (Central/South America)
Region 10 (Asia/Pacific)
2
Industry Applications Magazine
2006
4
5
0
0
0
0
4
0
0
0
0
0
4
5
0
0
0
0
0
5
0
0
0
0
0
0
0
4
100%
5
100%
0
0%
18
13
1
2
2
1
2
1
IEEE region map: http://www.ieee.org/web/geo_activities/home/world_reg.html
2007
2008
2009
2010
20
MANUFACTURING SYSTEMS
DEVELOPMENT AND APPLICATIONS
DEPARTMENT (MSDAD)
MSDAD 2nd QUARTER REPORT
IAS EXECUTIVE BOARD MEETING
Houston, Texas
October 3-5, 2009
Malik Elbuluk
MSDAD Chair
4/28/2014
1
Update Information
• Four Committee Report
- Appliance Industry Committee (AIC)
- Electrostatic Process Committee (EPC)
- Industrial Automation and Control Committee (IACC)
- Industrial Lighting and Display Committee (ILDC)
• IAS 2009.
• Status of IAS Transaction & Magazine Papers.
• 2009-2010 Budget.
4/28/2014
2
IACC
1. Budget requested for 2009: $1,200

$1000 for prizes, paper awards

$200: Materials and supplies.
2. Committee planning for IAS 2009 in Houston
 An increase of submitted papers for IAS 2009 from 2008.
 57 digests, 6 sessions with a 75% acceptance rate.

Control of Machines and Drives

Intelligent Control of Systems

Automation and Control in Renewable Energy Systems

Control of Power Converters

Advanced Sensing and Real Time Control

Industrial Applications Control
• 2 papers accepted for the plenary session
• No tutorials have been submitted
• New Award: Best Conference Paper Award
4/28/2014
3
IACC
IAS Transactions & Magazine
No Change since last quarter
4/28/2014
4
EPC
2010 New Board Member
Chair:
Prof. Norbert GRASS
Vice-Chair: Prof. Akira MIZUNO
Secretary: Dr. Rajesh SHARMA
Adjunct Secretary: Angela Antoniu or Calle Carlos not yet
fixed
Technical Program: Prof. L. DASCALESCU
Paper Review:
Prof. Kaz ADAMIAK
Technical Awards:
Dr. Kelly ROBINSON
Fellow Nomination: Prof. L. DASCALESCU
4/28/2014
5
EPC
•
EPC Plan in 2009-2010
•
EPC will attend main conference of Electrostatic Society of America in
Boston with 3 other Societies in June, 2009.
IAS 2009 have two sessions including (9 papers)
Session 1: Applied Electrostatics
Session 2: Non-thermal Plasma Processes
•
•
•
•
•
•
EPC will join IAS Meeting in 2010 (total 94 presentations)
28 papers from EPC published in IAS Transactions
No paper in IAS Magazine.
Out of 44 papers presented at IEEE/IAS 2008 meeting, 20 papers are
accepted and 13 are rejected for Transaction publication.
•
•
Manuscript Central:
All authors of accepted papers in IAS 2008 received information on how
submit papers to the Transaction using Manuscript Central. (performance is
not yet checked)
4/28/2014
6
EPC
Budget request for 2009-2010
*
*
*
*
4/28/2014
Paper Awards:
$600
Service Award(s): $200
Postage and Misc: $200
Invited Speakers: $1, 500
Total: $2,500
7
EPC
Transaction Papers: Since the last report:
• 22 new papers have been submitted to the Transactions
after our Joint Meeting on Electrostatics in Boston
• 7 papers have been scheduled for publication
• 6 papers have been rejected
• 2 papers have been accepted for publication in the IAS
Magazine
• 9 papers have been accepted for publication in the IEEE
Transactions
• 1 new Associate Editor (Masaaki Okubo) has been
appointed from our Committee.
4/28/2014
8
ILDC
1.
•
Budget.
Prize Papers $800 = $350 1st + $250 2nd + $200 3rd
2. IAS 2009 (4 Sessions)

HID Lamps and Ballasts
Fluorescent Lamps and Ballasts and Novel Applications
LEDs and Drivers
Displays



•
•
•
3.
•
•
•
•
•
ILDC strongly interested in drives and devices, which are now part of ECCE.
Not planning to meet at IAS 2010
Will meet at ECCE 2010.
IAS Transactions and Magazine.
No Magazine paper activity this Quarter.
A special issue on Displays is published in IAS Magazine for August 2008; 5
papers editorial from ILDC members.
IAS Transactions: 5 papers submitted, 2 are still in review process, 3 accepted.
One reviewed Transaction paper awaiting author updates.
Manuscript Central will be used by authors and all involved with the review process
starting with the 2008 Conference papers??? No response
4/28/2014
9
AIC
•
•
•
•
•
No update received.
One Session organized for 2009 IAS Conference.
No Exhibitors or Tutorials
No plans to organize sessions for IAS 2009.
Future of AIC????
4/28/2014
10
2008 MSDAD Papers
IAS Transactions
Issue
Jan/Feb
Mar/Apr
May/Jun
Jul/Aug
Sep/Oct
Nov/Dec
Total
Approved
AIC
1
1
0
0
0
0
2
1
EPC
9
6
2
7
7
1
32
23
IACC
1
2
0
2
5
3
13
8
ILDC
2
0
0
0
0
1
3
2
Total
13
9
2
9
12
5
50
34
4/28/2014
11
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Industrial & Commercial Power Systems
Department (I&CPS-D) Report
IAS Board Meeting
Houston, TX
October 4-5, 2008
Tom Baldwin
I&CPS Department Chair
1
Name of Conference: IAS Annual Meeting
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences–2007 I&CPS Technical
Date:
May 6-11, 2007
Location:
Edmonton, AB, Canada
Co-Sponsors: IAS and North Canada
Section
Conference closed: No
Chair:
Don Koval
Tutorials/Seminars:
• Dynamic Parameter Tuning Based on System Transient
Response
• Comprehensive Design Of Electrical Installations
Integrating System Configuration And Operational
Safety Aspects
• Electrical Arc Hazard Committee - Electrical Safety and
Arc Flash in the Industrial & Commercial environment
• Application Guidelines on Current Transformer (CT) and
Potential
Attendance (tech sessions)
135
# Papers Submitted
30
Papers Accepted (presented)
28
No. Exhibitors
8
Attendance (tutorials/seminars)
?
# tutorials/seminars
4
IAS financial share
0
Income
?
Expense
?
Net Surplus
?
2
Name of Conference: IAS Annual Meeting
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences–2008 I&CPS Technical
Date:
May 4-8, 2008
Location:
Clearwater Beach, FL
Co-Sponsors: IAS and Florida West
Coast Section
Conference closed: Yes
Chair:
Jim Beall
Attendance (tech sessions)
77
# Papers Submitted
31
Papers Accepted (presented)
27
No. Exhibitors
1
Attendance (tutorials/seminars)
16
# tutorials/seminars
1
IAS financial share
0
Tutorials/Seminars (CEUs:Y): Yes
Income
$ 36 k
• NEC 2008 Update (2 Part)
Expense
$ 22 k
Net Surplus
$ 14 k
3
Name of Conference: IAS Annual Meeting
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences–2009 I&CPS Technical
Dates:
May 3-7, 2009
Location:
Calgary, Alberta
Co-Sponsors: IAS and Southern
Alberta Section
Conference closed: No
Chair:
Rasheek Rifaat
Tutorials/Seminars (CEUs:Y): Yes
• Lates Revisions and Requirements of
NFPA 70E
• Understanding the Origin and Purpose
of CSA Z462
• Protection for Rotating Equipment and
the Applications of the Buff Book
• The New Format of the Color Books
and Insights into the Base Book
Attendance (tech sessions)
131
# Papers Submitted
27
Papers Accepted (presented)
27
No. Exhibitors
4
Attendance (tutorials/seminars)
35
# tutorials/seminars
4
IAS financial share
tbd
Income
tbd
Expense
tbd
Net Surplus
$3.5 k
4
Name of Conference: IAS Annual Meeting
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences–2010 I&CPS Technical
Dates:
May 9-13, 2010
Location:
Tallahassee, Florida
Co-Sponsors: IAS and Tallahassee
Area Section
Conference closed: No
Chair:
Chris Edrington /
Tom Baldwin
Attendance (tech sessions)
goal: 125
# Papers Submitted
goal: 30
Tutorials/Seminars (CEUs?): Yes
Income
• Transformer Protection-Chuck Mozina
• Switching Transients-(proposed)
• Others TBD
Expense
Papers Accepted (presented)
No. Exhibitors
goal: 5
Attendance (tutorials/seminars)
goal: 60
# tutorials/seminars
goal: 4
IAS financial share
Net Surplus
5
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
2007
2008
2009
1) Submitted
28
27
27
2) Returned by AE for scope reasons, obvious poor quality, etc.
0
0
0
3) Peer reviewed (row 1 less row 2)
28
27
27
3a) Papers from Row 3 eventually rejected
15
8
tbd
3b) Papers from Row 3 in review process
0
0
4
3c) Papers from Row 3 with authors in revision
0
0
0
3d) Other papers from Row 3 (explain in comments below)
0
0
0
3e) Papers from Row 3 queued for publication
0
19
tbd
3f) Papers from Row 3 eventually published (if a paper is published in a
subsequent year, list in year of submittal where it is counted in Row 3)
13
0
0
4) Total: Rows 3a-3f, should equal Row 3
28
27
0
PERCENTAGE ACCEPTED
46%
70%
0%
Average number of months from Author Submission to Publication Date
(submission to issue where paper appears)
?
?
?
NUMBER OF PAPERS: I&CPS
6
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – I&CPS Technical
Geographical distribution of Authors
2007
2008
2009
Regions 1 – 6
26
33
19
Region 7
6
4
8
Region 8
7
1
5
Region 9
0
0
4
Region 10
25
8
18
7
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
2007
2008
2009
1) Submitted
37
36
28
2) Returned by AE for scope reasons, obvious poor quality, etc.
0
0
0
3) Peer reviewed (row 1 less row 2)
37
36
28
3a) Papers from Row 3 eventually rejected
17
0
0
3b) Papers from Row 3 in review process
0
36
28
3c) Papers from Row 3 with authors in revision
0
0
0
3d) Other papers from Row 3 (explain in comments below)
0
0
0
3e) Papers from Row 3 queued for publication
0
0
0
3f) Papers from Row 3 eventually published (if a paper is published in a
subsequent year, , list in year of submittal where it is counted in Row 3)
20
tbd
tbd
4) Total: Rows 3a-3f, should equal Row 3
37
36
28
PERCENTAGE ACCEPTED
54%
0%
0%
Average number of months from Author Submission to Publication Date
(submission to issue where paper appears)
?
tbd
tbd
NUMBER OF PAPERS: IAS
8
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – IAS Annual Mtg
Geographical distribution of Authors
2007
2008
2009
Regions 1 – 6
37
21
29
Region 7
3
9
0
Region 8
31
27
5
Region 9
0
3
8
Region 10
27
24
42
9
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – 2007 REPC
Dates: May 6-8, 2007
Location: Rapid City, SD
Co-Sponsor(s): IAS
Conference closed: Yes
(Except for Audit)
Chair: David Lankutis
Tutorials/Seminars (CEUs?): YES
Attendance (tech sessions)
249
# Papers Submitted
38
Papers Accepted (presented)
16
No. Exhibitors
47
Attendance (tutorials/seminars)
?
# tutorials/seminars
2
IAS financial share
0
Income (Prelim)
$ 123.7 k
Expense (Prelim)
$ 97.8 k
Net Surplus
$ 25.9 k
10
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – 2008 REPC
Dates: April 27-30, 2008
Location: Charleston, SC
Co-Sponsor(s): IAS
Conference closed: No
Chair: Russ Dantzler
Tutorials/Seminars (CEUs?): YES
• Power Capacitors on the Distribution
System
• Designing Underground Distribution
Systems
• Improving Feeder Reliability Using SEL
Product Applications and Technologies
Attendance (tech sessions)
345
# Papers Submitted
39
Papers Accepted (presented)
15
No. Exhibitors
53
Attendance (tutorials/seminars)
75
# tutorials/seminars
3
IAS financial share
$0
Income (Prelim)
$ 148 k
Expense (Prelim)
$ 132 k
Net Surplus
$ 16 k
11
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – 2009 REPC
Dates: April 26-28, 2009
Location: Fort Collins, CO
Co-Sponsor(s): IAS
Conference closed: No
Chair: Jerry Hager
Tutorials/Seminars (CEUs?): YES
• Critical Elements in the Operation,
Installation and Maintenance of Power
Transformers
• Cooperative Sees Big Results from System
Improvements
• Design Tools and Fundamentals of Rural
Electric Power Distribution Systems: Design
and Application Guidelines
Attendance (tech sessions)
273
# Papers Submitted
38
Papers Accepted (presented)
15
No. Exhibitors
41
Attendance (tutorials/seminars)
tbd
# tutorials/seminars
3
IAS financial share
$0
Income (Prelim)
tbd
Expense (Prelim)
tbd
Net Surplus
tbd
12
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – 2010 REPC
Dates: May 16-19, 2010
Location: Orlando, FL
Co-Sponsor(s): IAS
Conference closed: No
Chair: Mike Williams
Tutorials/Seminars (CEUs?): YES
• TBD
Attendance (tech sessions)
# Papers Submitted
Papers Accepted (presented)
No. Exhibitors
Attendance (tutorials/seminars)
# tutorials/seminars
IAS financial share
Income (Prelim)
Expense (Prelim)
Net Surplus
13
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
2007
2008
2009
1) Submitted
39
39
15
2) Returned by AE for scope reasons, obvious poor quality, etc.
0
0
0
3) Peer reviewed (row 1 less row 2)
39
39
15
3a) Papers from Row 3 eventually rejected
23
24
0
3b) Papers from Row 3 in review process
0
0
15
3c) Papers from Row 3 with authors in revision
0
0
0
3d) Other papers from Row 3 (explain in comments below)
0
0
0
3e) Papers from Row 3 queued for publication
0
0
0
3f) Papers from Row 3 eventually published (if a paper is published in a
subsequent year, list in year of submittal where it is counted in Row 3)
16
15
0
4) Total: Rows 3a-3f, should equal Row 3
39
39
15
PERCENTAGE ACCEPTED
41%
38%
0%
Average number of months from Author Submission to Publication Date
(submission to issue where paper appears)
3
4.5
TBD
NUMBER OF PAPERS: REPC
14
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Conferences – REPC
Geographical distribution of Authors
2007
2008
2009
Regions 1 – 6
16
14
20
Region 7
0
1
0
Region 8
0
0
0
Region 9
0
0
0
Region 10
0
0
0
15
IEEE INDUSTRY APPLICATIONS SOCIETY
Industrial & Commercial Power Systems Department
IAS
®
IEEE IND USTRY
A PPLIC ATION S
SOC IETY
Department Progress
• TBCC
– Progress made in converting Color Books to
the 300x.x.x standards
• two PARS in ballot now
• several going to balloting by end of year
• most are a year away
– Base book making progress for fundamental
materials
• needs about a year’s worth of work
16
Industry Applications Society
2009 Q3 EB Meeting, Houston, TX
Oct 4-5, 2009
2009 Q3 ACTIVITY REPORT TO THE EXECUTIVE BOARD
Period of reporting: May – Sep 2009
IAS Chapters and Membership Development Department
Peter Magyar, Chairman
peter.magyar@ieee.org
1.
CMD Staff 2009 and Report Status Q3
1.1 CMD Officers
CMD Chair
1 Awards Committee Chair
2 Chapters Electronic Publ. Committee Chair
3 Chapters Committee Chair
Distinguished Lecturer and Regional Speaker
4 Program Committee Chair
5 Leadership Training Committee Chair
6 Membership Committee Chair
7 Regional Workshop Committee Chair
R1-7 Co-Chair
R8 Co-Chair
R9 Co-Chair
R10 Co-Chair
Technical and Professional Outreach Program
8 Committee Chair
1.2 Chapters Area Chairs
Region-1
Region-2
Region-3
Region-4
Region-5
Region-6
Region-7
Region-8
Region-9
Region-10
Report received
Peter Magyar
Balvinder Blah
Joël McConnell
Vietson M. Nguyen
Ronald G Harley
Mark T Harris
Sunita Kulkarni
Caio A Ferreira
Kaushik Rajashekara
Tamás Ruzsányi
Jorge Him
Satish Chaparala
Y
Y
Y
Gilbert K.K. Li
Y
Hazem A. Huss
Andrew M. Novotny
Osama A. Mohammed
Vietson M. Nguyen
Sunita Kulkarni
David Eng
Dewei (David) Xu
Tamás Ruzsányi
Jorge Him
Satish Chaparala
Y
Y
Y
Y
CMD Q3 2009 EB Meeting Report
2
CMD Activities
2.1 Chair
Chapter Support Activities
1. Visiting Hungary Section IAS Chapter Meeting
Budapest, Hungary, June 26-27, 2009
2. Visiting Germany Section IAS/PELS/IES Chapter Meeting
Munich, Germany, Aug 06-08, 2009
3. Co-organizing, visiting and giving IAS CMD and R8 related presentations
IEEE R8 Nordic Chapter Chair Conference
R8 Power Chapters’ Leadership Workshop & IAS Seminar on Wind Power Technologies
Stockholm, Sep 11-16, 2009
Hosted by Sweden Section IAS Chapter and Norway Section IAS Chapter
in co-operation with
the Sweden and the Norway Section, and the R8 Chapter Coordination Subcommittee
4. Visiting and giving IAS CMD related presentation
R-5 Student Branch Meeting
Organized by Houston Section IAS Chapter
Hosted by COOPER Technology Centre, Houston, TX, Oct 2,2009
5. IAS CMD Chapters Workshop
Houston, TX
Oct 6, 2009.
6. Visiting Portugal Section IES/IAS/PELS Chapter Meeting
First contact, and activating. Giving
- IEEE leadership related presentation
- Technical lecture “Motor Identity Control”
Chapter News column in the IAS Magazine
Article is published bi-monthly.
2.2. Awards Committee
The IAS Outstanding Chapter Awards will be presented at the IAS 2009 Annual Meeting Presidents´
Reception
No report
Awardees
Continued Outstanding Performance Category: Panama IAS Chapter
Large Joint Chapters Category:
Delhi PES/IAS Chapter
Large Chapters Category:
San Francisco IAS Chapter
Small Joint Chapters Category:
Hong Kong IAS/PES/PELS/IES J. Chapter
Small Chapters Category:
no awardee
Outstanding New Chapter Category:
Nanjing PES/IAS Joint Chapter
Statistics
9 nominees, 5 awardees (1 from R6, 1 from R9, 3 from R10)
2.3. Chapters Electronic Publication Committee
CMD Blogspot started.
No report
http://iaschapters.blogspot.com/
IAS CMD website content has not been set-up for a year.
Very urgent action for updating is necessary,
- Committee programs are missing
- DL list is missing
- Chapters’ roster has not been updated for 3 years.
2.4. Chapters Committee
No report
Page 2 of 5
CMD Q3 2009 EB Meeting Report
New Chapter formations
R1 New York / Long Island Joint Section PES/IAS Chapter has been split to
New York Section PES/IAS Chapter (Ajoy Das, Chapter Chair) and Long Island Section
Joint Chapter
(Steven Rubin, Chapter Chair)
R5 Kansas City Section PES Chapter joined IAS and exists as Kansas City Section PES/IAS Joint
Chapter
(John Fessler, Chapter Chair)
R7 Toronto Section IAS Chapter joined the Power Electronics Society and the Consumer Electronics
Society
and exists as Toronto Section IAS/PELS/CES Joint Chapter (Ehsan Behboundi, Chapter
Chair)
R8 Russia Central Section IES/PES/PELS Joint Chapter joined IAS and exists as
Russia Central Section IES/PES/PELS Joint Chapter (Yuri Rozanov, Chapter Chair)
R8 Sweden Section IAS Chapter, newly created (Yung-Kang Robert Chin, Chapter Chair)
R8 Hungary Section Budapest University of Technology and Economics Student Branch
IAS/PES Joint Chapter, newly created (Richard Cselkó, Chapter Chair)
R9 Columbia Section Militar Neuva Granada Student Branch IAS Chapter, newly created (Pauline
Gama,
Student Branch Chair)
R9 Centro Occidente Section IAS Chapter, newly created (Elisa Espinosa-Juarez, Chapter Chair)
R9 Honduras Section IAS Chapter, newly created (Alba Gabriela Garay, Chapter Chair)
R9 Panama Section Universidad Technologica de Panama Student Branch IAS Chapter, newly created
(Julio Alexander Garcia Maison, Chapter Chair)
R10 Taipei Section IAS Chapter, newly created (Yen-Shin Lai, Chapter Chair)
R10 Hyderabad Section PES/IAS Joint Chapter joined PELS and exists as Hyderabad
Section PES/IAS/PELS Joint Chapter (Venketesa Akilan, Chapter Chair)
Chapter statistics
Regular Chapters
125
Student Branch Chapters :
3 (1 in R8, 2 in R9)
Rate of (number of chapters / societies+councils),
- IEEE worldwide average = 39.6
- IAS has 128 chapters which is 3.23-times higher than the average
Distribution: 48% in R 1-7
52% in R 8-10
Dec´08 Aug´09
Distribution of IAS Chapters by Regions
30
25
20
Number of IAS Chapters
2008
2009
R1-7
59
61
R8-10
59
67
Total
118
128
15
10
5
0
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
Page 3 of 5
CMD Q3 2009 EB Meeting Report
Chapter Subsidies
New Chapter Grants (4)
R8 Hungary SB IAS/PES Chapter
R9 Colombia Militar Neuva Granada SB IAS Chapter
R9 Panama UTP SB IAS Chapter
R10 Taipei IAS Chapter
Subsidy for special projects and technical activities (7)
R6 San Francisco IAS Chapter
R8 Hungary IAS Chapter
R8 Norway IAS Chapter
R8 Sweden IAS Chapter
R10 Beijing IAS Chapters
R10 Hong Kong IAS/IES/PES/PELS Chapter
R10 Nanjing PES/IAS Chapter
Annual Meeting Conference fee reimbursing
For 21 of 30 Chapters Workshop attendees
Inactive Chapters (8)
R2 Cleveland IAS Chapter
R3 Central Tennessee PES/IAS
R7 Montreal PES/IAS
R8 Egypt IAS
R9 Guadalajara ES/IAS/PELS
Venezuela IAS
R10 Beijing IAS
Lahore PES/IAS
no reply
status changed from “to be dissolved” to “renewal by
new board election”
no reply
will be reactivated by board election
will be reactivated by board election
status “to be dissolved”
missing reports submitted, status changed to “active”
no reply
Statistics of inactive chapters
Chapters worldwide
Number
Total
1784 (100%)
IAS
128 (100%)
Inactive
212 (11.9%)
7 (5.5%)
To be dissolved
23 (1.9%)
1 (0.8%)
Area Chairs
- Should be have key positions in chapter organization
- active Area Chairs are: R1, R2, R5, R6, R8, R9, R10
2.5. DL and Regional Speaker Program Committee
Statistics
RS activities for 2008
RS activities for 2009
DL activities for 2008
13
1
11
Report
submitted
DL activities for 2009
10
Listing of 2008-2009 Distinguished Lecturers
R10
Hiroaki Ikeda
R9
Louis Morán
R8
Ion Boldea
R7
William Greason
R1-6 John Holmquist
Tomy Sebastian
Farrokh Shokooh
2010-2011 Distinguished Lecturers
Recommened for
Nominated (11)
approval (7)
R10
1
1
R9
R8
3
2
R7
1
1
R1-6
6
3
Listing will be published at the EB-Meeting
C:\Users\User\
C:\Users\User\
Desktop\2009-Q3 IASDesktop\2009-Q3
EB Meeting\2010 IAS
DL Nominations
EB Meeting\2010
2010-2011.doc
DL Recommen
Page 4 of 5
CMD Q3 2009 EB Meeting Report
Report
submitted
No report
2.6. Leadership Training Committee
2.7. Regional Workshop Committee
The following regional chapter workshops are planned by CMD Chair in 2010
R 1, 2, 4, 7
Pittsburgh
R 3, 5, 6, 9
Panama
R8
Bahrain
R 10 N/S
Xian / Bangkok
Structure
- combined wit a technical conference or new chapter establishment
- combined leadership and technical workshop
- common support by Regional Committees and dominant joint Societies
- shared financing
Region 30%, Societies 30%, Chapters 30%, Industrial supporter 10%
This model has been tested with success in R8.
Report
submitted
2.8. Membership Committee
Status of IEEE membership
- high grade of arrears (20…..40%)
- student membership is declining very intensively (average ~50%, >70% in R9)
- increasing number of affiliates
Status of IAS membership
IAS higher grade
IAS student grade
IAS affiliates
IAS total
Status of Division II membership
Higher grade
Student
Affiliates
Total
July 2008
July 2009
Change %
9,202
172
24
9,374
9,252
117
38
9,369
+0.5%
-32%
25,651
688
112
26,451
26,047
632
174
26,853
2.9. Technical and Professional Outreach Program Committee
58%
+0.05%
+1.5%
-8.1%
55.4%
+1.3%
Report
submitted
Respectfully submitted,
/Magyar, Peter/
Page 5 of 5
Distinguished Lecturer
Regional Speakers
Program
Ron Harley
IEEE Industry Applications Society
Chapters and Membership Development Department
CHAPTERS WORKSHOP
Houston, TX, USA, Oct 6, 2009
IEEE IAS Chapters & Membership Department Workshop 2009
1
Distinguished Lecturer Program
Ron Harley, Chair: rharley@ee.gatech.edu
B.K. Bose, Vice-Chair
Established in 1990
Six to eight Distinguished Lecturers elected to two-year terms.
Must be IEEE Fellows
$20,000 typical annual budget for DL and RS
How Program Works
Chapter makes arrangements with DL as well as DL Chair
Plan well in advance since overseas travel takes many months
to schedule.
multiple chapters within a region could coordinate and arrange
a “Lecture Tour”
Society reimburses DL for economy class air fare or mileage per
lecture ($750 max)
Chapter/Section cover local accommodation and transportation
expenses
IEEE IAS Chapters & Membership Department Workshop 2009
2
Regional Speaker Program
Provides access to quality presentations by knowledgeable
regional speakers
Regional Speaker can be a past DL or an “expert”.
Expert does not have to be from any specific lists
Chapter can propose an Expert
Experts have to be approved by DL and Chapters Chair
How Program Works
Society reimburses RS for travel per lecture ($450)
Chapter makes arrangements with RS
(multiple chapters within a region could coordinate and arrange
a “Lecture Tour” )
Chapter/Section covers local expenses as for DL
IEEE IAS Chapters & Membership Department Workshop 2009
3
2006-2007 Distinguished Lecturers
(became Regional Speakers from Jan
2008 onwards)
Atsuo Kawamuro
Japan kawamura@ynu.ac.jp
Power Electronics and UPS systems
Edison da Silva
Brazil edison@dee.ufcg.edu.br
Power Electronics and Drives
Rik de Donker
Germany dd@isea.rwth-aachen.de
Power Electronics and Drives
Clayton Reid
Canada chreid@ieee.org
Medium voltage motors and drives
Prasad Enjeti
USA
Power electronics, drives, matrix inverters, power quality
Kaushuk Rajashekara USA ksrajashekara@ieee.org
Automotive electronics, fuel cells,distributed generation
IEEE IAS Chapters & Membership Department Workshop 2009
4
2008-2009 Distinguished Lecturers
Hiroaki Ikeda
Japan h.ikeda@eagle.ocn.ne.jp
High frequency RF MOSFETS
Luis Morán
Brazil
luis.moran@udek.d
Power quality and drives in mining
Ion Boldea
Romania ionboldea@yahoo.com
Linear and rotary electric machines, drives, and power electronics
William Greason
Canada wgreason@uwo.ca
Electrostatic Discharge and Industrial Applications of Electrostatics
John Holmquist
USA john.holmquist@comcast.net
Power electronics, drives, matrix inverters, power quality
Tomy Sebastian
USA tomy.sebastian@delphi.com
Trends in automotive drives and steering systems
Farrokh Shokooh
USA farrokh@etap.com
Power system dynamics and analysis
IEEE IAS Chapters & Membership Department Workshop 2009
5
DL Activities for 2008
April 2, 2008
Febr 2, 2008
June 19, 2008
June 25, 2008
July 7, 2008
July 8, 2008
Brasil
Ian Boldea
June 6, 2008
Tomy Sebastian
Detroit, USA
Dec 13, 2008
Hungary
Dec 15, 2008
India
Dec 17, 2008
India
Dec 20, 2008
India
IEEE IAS Chapters & Membership Department Workshop 2009
Italy
Hong Kong
China
China
Taiwan
6
RS Activities for 2008
March 5, 2008
March 10, 2008
March 11, 2008
Ajit Chattapadhyay
Peru
March 17, 2008
Chile
March 19, 2008
Chile
Dec 2008
Brazil
Brazil
India
March 25, 2008
March 27, 2008
Gerardo Hiriart Le Bert
Chile
March 28, 2008
Chile
March 29, 2008
Chile
Chile
Oct 21, 2008
Kaushuk Rajashekara
India
July 2008
Russia
July 17, 2008
Mo El-Hawary
Pittsburgh
IEEE IAS Chapters & Membership Department Workshop 2009
7
DL Activities for 2009
Ian Boldea
March 2009
March 16, 2009
March 17, 2009
March 17, 2009
Oct 2009
April 2009
Italy
May 2009
Tomy Sebastian
Brazil
March 19, 2009
Brazil
March 20, 2009
Brazil
Hiroaki Ikeda
Singapore
Oct2009
Spain
Brazil
Brazil
Malaysia
William Greason
Canada
IEEE IAS Chapters & Membership Department Workshop 2009
8
RS Activities for 2009
June 2009
Freddy Villalta
Panama
IEEE IAS Chapters & Membership Department Workshop 2009
9
Inter-Society DL Program
Chapters can access Distinguished Lecturers from
IES, PELS & PES (Sister Societies with similar
technical interests)
How Program Works
DL expenses are covered by sponsoring Society
according to rules of that Society
Chapter makes arrangements with sponsoring
Society DL Program Chair directly
CMD can assist
IEEE IAS Chapters & Membership Department Workshop 2009
10
Intersociety Contacts
IEEE Power Electronics Society
info.distlec.pel@ieee.org
http://www.pels.org/Comm/Chapters/lecture.html
IEEE Power Engineering Society
info.distlec.pe@ieee.org
http://www.ewh.ieee.org/soc/pes/membership/ch
apters/
IEEE Industrial Electronics Society
info.distlec.ie@ieee.org
IEEE IAS Chapters & Membership Department Workshop 2009
11
IEEE INDUSTRY APPLICATIONS SOCIETY
EDUCATION DEPARTMENT
Donald G. Dunn, IEEE Senior Member
Education Department
Chairman
Aramco Services Company
Technical Services
Engineering Unit
MS-1089
909 West Loop South
Houston, TX 77096
Phone: 713-432-8588
Email: donald.dunn@ieee.org
April 17, 2009
To:
Mr. Tom Nondahl
IAS President
Subj.: Education Department
3rd Quarter 2009 Report to the IAS Executive Board
October 2009 Houston, Texas
Action Item: 5.3
1. Expert Now
Status of the Expert Now modules. Continue to work with Tara Gallus (IEEE
EAB Staff)
• Power Quality – Mark Halpin (Joint IAS/PES)
o Completed available 2009
• Distributed Generation – SME Identified (Joint IAS/PES)
o Tara working with Prof. Hatziargyriou and Prof. Papathanassiou. All
information has been submitted and is in development.
• Recent Trends in Substation Automation and Enterprise Data Management
(Joint IAS/PES)
o John McDonald has submitted materials for IAS comments. IAS has
provided input. Should be available late 2009.
• Integrating an Effective Electrical Safety Program into Occupational Safety &
Health Management (Joint IAS/PES)
o Lanny Floyd materials are in the process of submission. Module
currently in development.
• Cable Insulation Basics (Joint IAS/PES)
o Prof. Jayaram materials are in the process of submission. Module
currently in development.
2. IAS Tutorials
• Revised Guidelines for the 2009 conference and those thereafter to be strictly
a $500 honorarium.
• 2009 Tutorials are as follows:
Grounding Considerations for Industrial Power Systems – Wednesday 10-7-09 AM
Matt McBurnett - V I Engineering
Stu Gibbon - Post Glover Resistor
APPLICATION OF ELECTROMAGNETIC TRANSIENT STUDIES IN INDUSTRIAL
APPLICATIONS - Wednesday 10-7-09 AM
Randy Wachal, P. Eng - Manitoba HVDC Research Centre
Dharshana Muthumuni, Ph.D., P Eng. - Manitoba HVDC Research Centre
NFPA 70E and Safety by Design – Wednesday 10-7-09 PM
Jim Bowen – Powell Electric
Page 2 / 3
IAS Education Department
2nd Quarter 2008 Report to the IAS Executive Board
Modern Protective Device Coordination for Industrial Power Systems - Wednesday
10-7-09 PM
Rasheek Rifaat, P. Eng, IEEE Sr. Member - Jacobs Engineering
Field Assembly, Testing & Commissioning of HV Power Transformers – Thursday
10-8-09 AM
Randy Slaybaugh – Substation Engineering Services
Application Considerations for Industrial UPS & Dc Power Systems – Thursday 108-08 AM
Matthias Dreier – Gutor Electronic Ltd
Understanding IGBT Modules used in Industrial Motor Drives – Thursday 10-8-08
AM
John F. Donlon – Powerex, Inc.
Eric R. Motto - Powerex, Inc.
IEC 61850 Basics and Substation Automation – Thursday 10-8-09 PM
Mark Adamiak – GE Multilin
Substation Equipment Application Considerations – Thursday 10-8-09 PM
Dr. Kurt Ederhoff - VI Engineering
Dominik Pieniazek - Dashiell Corp
3. 2009 Zucker Program.
The 2009 winners of the student design contest are listed below. The travel
program had excellent response and applicants with eleven selected for this
year. We have revised the key contacts on this program to coordinate with IAS
staff and the conference coordinators to facilitate logistics at the conference.
First Place:
"Partial Discharge and Oil Quality Monitoring Using an RF Antenna"
Esam Al Murawwi
AbdelRahim Huwair
Kamal Al Mazam
Second Place:
"Quantitative Measure of Bone Healing Process Using Pulsed Ultrasound
Technique”
Anwar Mohammad
Marzouq Al Zaabi
Mohammad Khalil
Third Place:
“High Precision Intelligent Speed Control of Brushless DC Motor”
Thanh Dang
Nicholas Feilner
2009 Zucker Travel Program:
2009 Zucker Travel
Program Candidate lis
Page 3 / 3
IAS Education Department
2nd Quarter 2008 Report to the IAS Executive Board
4. Industrial Lecture Program (ILP)
New Program within the Education Department. (Dunn)
•
Working with committee to select and confirm individuals that are on a list of
all senior members and above within the IAS. IAS staff provided the list
earlier this year. The list of subject matter experts (SME’s) for this program
will be in place by year’s end.
Respectfully submitted
Donald G. Dunn
IEEE INDUSTRY APPLICATIONS SOCIETY
R. Mark Nelms
Chair
Meetings Department
ECE Department
200 Broun Hall
Auburn University, AL 36849-5201 USA
Phone: 334-844-1830
FAX: 334-844-1809
Email: m.nelms@ieee.org
October 5, 2009
Subj.:
Agenda item 5.4 - Meetings Department Report
3rd Quarter Report 2009 to the IAS Executive Board
Conference status report
I received a conference status report from the IEEE in July 2009. Using this report and email
correspondence, I have updated the status of IAS conferences.
Conference
2005 IEEE-IAS/PCA CIC
2007 APEC
2007 I&CPS
2007 IEEE-IAS/PCA CIC
2007 REPC
2007 APC
2007 PCIC
2008 IEEE-IAS/PCA CIC
2008 REPC
2008 I&CPS
2008 PPIC
2008 PCIC
2008 IAS Annual Meeting
2008 ESMTP
2009 ESW
Missing
Surplus, final report, 1099 forms, proof
of bank closure
(surplus estimate from committee email)
Audit in progress; should close by the
end of the year
Final, Surplus, Loan Outstanding,
Certificate of Accuracy, 1099 Schedule,
Proof of Bank Closure
Audit complete, surplus distributed,
should close by the end of the year
Surplus, Audit, Proof of Bank Closure
FINAL RCV DATE – 7/2008
Sponsorship MOU, Technical
MOU, Signature Card, Final,
Surplus, Certificate of Accuracy
1099 Schedule, Proof of Bank
Closure
Surplus
FINAL RCV DATE – 12/2008
CLOSE DATE – 12/2008
Final, Surplus, Certificate of
Accuracy, Audit, CB Destroy
Check Form
Final, Surplus, Certificate of Accuracy,
Proof of Bank Closure
Final, Surplus, Loan Outstanding,
Certificate of Accuracy, Audit, CB
Destroy Check Form, Proof of Bank
Closure, Registration/Tax Documents
Final, Surplus, Loan Outstanding,
Certificate of Accuracy, Audit, CB
Destroy Check Form, Proof of Bank
Closure, Registration/Tax Documents
Audit in progress
Final, Surplus, Certificate of Accuracy,
1099 Schedule Update, Audit, Proof of
Bank Closure, Registration/Tax
Documents
Final, Surplus, Certificate of Accuracy,
1099 Schedule, 1042 Schedule, Audit,
Surplus
$91,523.48
$222,274.60
(bank account
balance)
$42,373.24
$25,918
$201,074
$151,245
$103,028.12
2009 APEC
CB Destroy Check Form
Final, Surplus, Certificate of Accuracy,
Audit, CB Destroy Check Form, Proof of
Bank Closure
$244,573.63
2007 IEEE-IAS/PCA Cement Industry Conference
The IEEE has completed the audit for this conference. The surplus of $42,373.24, divided
equally between the IAS and PCA, will be distributed soon. Lynda Bernstein has provided
valuable assistance in closing this conference.
Meeting with Portland Cement Association representatives
A meeting was held on August 12, 2009 at IEEE Headquarters in Piscataway, NJ. Mary Ward
Callan, Vita Feuerstein, and Lynda Bernstein attended from the IEEE. Five representatives from
the PCA attended. Discussions focused on the status and future of the memorandum of
understanding between the IAS and PCA and the annual cement conference. The PCA was to
notify the IAS of its interest to continue the relationship between the two entities. If the decision is
made to continue, a new memorandum of understanding will be developed. It is likely that a
steering committee will be formed for the annual cement conference.
Penalty fees
The IAS was charged the following conference penalty fees in August 2009:
2005 IEEE-IAS/PCA CIC
2007 APEC
2008 REPC
2008 I&CPS
2008 PPIC
$750
$375
$350
$350
$350
The IAS was charged penalty fees for the 2007 I&CPS and the 2007 APC.
Site visit for the 2011 IEEE IAS Annual Meeting
The New York Marriott at the Brooklyn Bridge was visited on August 13 as a potential site for the
2011 IAS Annual Meeting. The hotel facilities are a good match for the meeting requirements.
However, the room rate quoted by the hotel is in excess of $200 per night without taxes. As
such, other cities and venues will be investigated for this meeting.
2009 Panel of Conference Organizers Meeting
Attendance at this meeting allows me to stay informed about changes in IEEE conference
policies. MOUs for technical co-sponsorship must now include information about the paper
review process for a conference. This change was made to ensure the quality of papers entered
into Xplore.
Respectfully submitted,
Editor’s Report
Louie J. Powell, PE
Editor – in-Chief
October 2009
LJ Powell - October 2009 Magazine Committee
Looking back on 2009:
• Critical statistics:
o Papers published – 46
o Editorial pages published – 506
o Timeliness – All issues on schedule
one under plan
19 under adjusted plan, 7 over minimum threshold
• Report on Initiatives:
o Special Feature (July/August issue) – Automotive Motors/Sensors
• Pete Wung, Guest Editor
• History article – Linos Jacovides
• Five articles on aspects of automotive electrification
LJ Powell - October 2009 Magazine Committee
2009 Page count
Physical Design
Jan/Feb Mar/Apr May/June July/Aug Sept/Oct Nov/Dec
11
10
10
12
11
12
92
84
84
100
92
100
7.5
7.5
5.41
5
7.16
7.42
84.5
76.5
78.59
95
84.84
92.58
Feature Articles
8
6
8
8
8
8
Feature pages
61
54
56
68
63
65
Signatures
Pages
Advertising
Editorial Pages
Budget
496
Totals
39.99
512.01
46
367
Average pages/article
7.6
9.0
7.0
8.5
7.9
8.1
8.0
History
Columns and recurring items
Conference Columns/Promotions
Calls for Papers
Zucker Award Paper
Awards Column
Annual Index
Other Editorial*
3
17.5
2
2.1
13.2
3.5
14.6
3
4
14.8
5
1
4
13
2.5
18.5
19.1
91.6
6
0.58
0
4.3
6
24.01
2
4.3
1
• Original editorial page budget:
• Revised editorial page budget:
• Actual editorial pages charged:
LJ Powell - October 2009 Magazine Committee
2
0.9
1.49
2.2
2.84
496 pages
525 pages (498.75 minimum)
512 pages
Advertising:
60
10
Insertions
Pages
Covers
Wrappers
Advertising Pages
9
50
8
7
40
6
5
30
4
20
3
2
10
1
Comments:
 All trends positive
 More advertisers; more advertising pages
 Shift toward higher-value advertising covers and wrappers
 Some softness mid-year – economic recession
 Personal opinion: eclectic nature of IAS audience makes advertising a hard sell
LJ Powell - October 2009 Magazine Committee
Sep
May
Jan
Sep
May
Jan
Sep
2009
May
2008
Jan
2007
Sep
2006
May
2005
Jan
0
0
2009 Production Issues:
• Paper length
o An ongoing battle
• Timeliness
o One paper rejected: author failed to provide permissions to reprint copyrighted figures
 No time to substitute a reserve paper
o Timeliness of column submissions
• Zucker Award Paper
• Authors declined invitation to publish their paper
A Relatively Drama-Free Year!
LJ Powell - October 2009 Magazine Committee
Impact Factor:
0.6
What is it?
•
•
•
•
•
Average rate of citations of articles in a journal
From Journal Citation Report published by Thomson ISI
Measures impact of the journal on current research
Proxy for relevance
Universities pushing for publication in high-IF journals
0.5
0.4
0.3
0.2
0.1
0
Concerns
•
•
•
•
•
2002
2003
Invalid comparison between fundamentally dissimilar journals
Considers only publications listed in JCR
Biased toward current publications (2 year lookback)
Can be distorted by changes in publication volume
Attempts to manipulate IF raise ethical issues
IEEE view
•
•
•
Valid comparison of journals within similar fields of activity

IEEE periodicals should be in upper 50% in their competitive field
Be very careful with attempts to manage IF
Its only one data point – not an ultimate metric
LJ Powell - October 2009 Magazine Committee
2004
2005
2008
Industry Applications Magazine Competition:
2005 JCR
2008 JCR
Machine Vision and Applications
Springer-Verlag
0.667
1.485
Industry Applications Magazine
IEEE
0.469
0.529
Power Engineering Journal
IET (was IEE)
0.064
0.435
European Transactions on Electrical
Power Engineering
VDE
0.056
0.36
Transmission & Distribution World
Intertec
Not in JCR
Not in JCR
Plant Engineering
Cahners
Not in JCR
Not in JCR
Electric Construction and Maintenance
Primedia Intertec
Not in JCR
Not in JCR
Power
McGraw-Hill
Not in JCR
Not in JCR
Consulting-Specifying Engineer
Cahners
Not in JCR
Not in JCR
Electrical World
McGraw-Hill
Not in JCR
Not in JCR
Power Electronics
Primedia Intertec
Not in JCR
Not in JCR
EPE Journal
European Power
Electronics Assn
Not in JCR
Not in JCR
Power Pulse CD
Darnell Group
Not in JCR
Not in JCR
LJ Powell - October 2009 Magazine Committee
Concern for IAS Magazine:
•
Significance of changes relative to competitive journals?

•
Does the list of competitive publications truly reflect the nature of
IAS Magazine?



•
Our Impact Factor has been essentially constant – others are increasing
Dominated by power & infrastructure journals – not in JCR
Competitive journals in JCR have distinct research orientation
Does not represent all IAS technologies equally
Serious questions about the validity of the comparison
List of Competitive Publications Should Be
Reviewed Before Next TAB Audit
LJ Powell - October 2009 Magazine Committee
2009 Call for Papers: 60 recommendations
Source of 2010 Papers
PEDCC
EMC
Disposition of 2010 Papers
CIC
Rejected
EPC
No Response
IPCC
Transferred to
Transactions
IDC
REPC
PCIC
PSPC
PSEC
Scheduled
MetIC
MIC
PPIC
Conclusions:
 PID continues to be the dominant source of papers

Support from other departments up significantly this year
LJ Powell - October 2009 Magazine Committee
Impact of ScholarOne Manuscripts:
1.
Three submission processes in 2009
•
•
•
2.
S1M Final Files
Legacy process – conventional manual submissions
Reviews in S1M – manual submissions
 Copyright transfer completed on-line
Legacy review
 Final file submission was manual
Reviews in S1M – “Final Files” submissions (totally electronic process)
 Decision letter requests that author submit ‘final files’ to S1M within 30 days
 Files exported from S1M to IEEE Production by EiC as part of planning process
Process change – immediate submission for all papers
•
•
•
•
All authors asked to submit materials for publication by 9/1/09
Eliminates uncertainty about individual issue content
Allows flexibility to change content of individual issues
Eliminates need for “reserve” articles
LJ Powell - October 2009 Magazine Committee
S1M
2010 Plans:
Technical content
o
Initial page budget: 496 pages


o
Agreed to set budget at 476 pages at 10/08 Magazine Meeting
IEEE agreed to adjust their numbers
Papers: 43 scheduled (7-8 articles per issue)


May need to adjust budget mid-year
Note average manuscript length – down from 8.0 in 2009
Feature articles
Average article length
Projected feature article pages
Zucker Award Paper
Awards feature
Annual Index
History article
Recurring editorial & fillter *
Calls for papers
Conference promotion
Total planned editorial pages
Advertising pages
Total planned pages
Total physical pages
Signatures
Jan/Feb
7
8.43
59
Mar/Apr
7
7.43
52
2010 Plan by Month
May/June July/Aug
8
7
4.38
7.43
35
52
3
Nov/Dec
7
7.43
52
4
4
15
78
4
15
2
2
79
7
85
92
11
7
86
92
11
4
15
2
59
4
15
1
2
74
7
66
76
9
7
81
84
10
Editorial pages charged: 478
LJ Powell - October 2009 Magazine Committee
Sept/Oct
7
7.29
51
Annual
Totals
43
7.00
301
3
7
4
16
7
73
2
81
8
444
7
80
84
10
7
88
92
11
42
486
520
4
15
3
2010 Initiatives & Challenges:
o Special Issue – Applied Electrostatics (July/August)
• EPC selected six papers from 2008 Annual Meeting
 Still waiting for one author
• Guest Editorial by Kaz Adamiak
• Related history article by Peter Castle
o Maintain 10 page length on feature articles
o Expand coverage of Chapters activities
o Expand use of S1M Final Files export
• Requires that all committees adopt S1M
o Initiate routine plagiarism screening on papers submitted via S1M
o Replenish “Lighter Side” archive
o Future Special Issue:
“How Low Can You Go” – Perspectives on high resistance grounding
Joe Sottile, Guest Editor (July/August 2011)
LJ Powell - October 2009 Magazine Committee
Transition plan for new Editor
• ExBoard appoints new EiC
• No later than February 2010
• Authorizes attendance at 2010 Panel of Editors Meeting, April 23-24, 2010, New Jersey
• Transition Meeting at 2010 Panel of Editors Meeting
• Incoming EiC, Outgoing EiC, Managing Editor
• Announce New EiC – November/December 2010 issue
• New EiC assumes responsibility effective with January/February 2011 issue
•
•
•
•
•
Issues 2011 Call for Papers (April 2010)
Develops 2011 publication plan (July/August 2010)
Works with Geri Krolin-Taylor on January 2011 issue
Supported by outgoing EiC
Utilize “Guidelines & Traditions” document
• Outgoing EiC responsibilities end with November/December 2010 issue
LJ Powell - October 2009 Magazine Committee
Future Needs:
• Revisit list of ‘competing’ publications
 Before 2012 TAB review
• “Rapid posting”





Papers posted to Xplore 3-4 weeks after manuscripts released for publication
Can significantly reduce “sub-pub” metric on individual papers
Transactions is adopting the practice
Enabled by S1M “final files” function
Issues for the Magazine
• No process exists for Magazines
• Magazine cycle will take longer – potentially 6-8 weeks
• Changes not possible after posting
• Review design/layout of the Magazine
 Maximize marketing value of the Magazine for the Society
 Should be done on 10-12 year cycle; last done in 1999
 Requires Staff support
LJ Powell - October 2009 Magazine Committee
Action Required:
Formal approval of 2010 plan
LJ Powell - October 2009 Magazine Committee
IEEE INDUSTRY APPLICATIONS SOCIETY
Kevin L. Peterson
Publications Department Chair
P2S Engineering, Inc.
th
5000 East Spring Street, 8 Floor
Long Beach, CA 90815 USA
Tel +1 562 497 2999
Fax +1 562 497 2990
Email k.l.peterson@ieee.org
October 1, 2009
Subject:
Publications Department Report to the IAS Executive Board, October 4th in
Houston, TX
IAS Transactions

The November/December 2009 issue of the IAS Transactions has been filled with 35 papers, which
were forwarded to IEEE on August 26th. They arrived about two weeks ahead of the September 14th
manuscript due date. Although we have received many more approved papers, given that the
September/October issue’s actual page count is not known as of this date, this was our best estimate
of the number of papers required to meet our approved page budget for the year. Attached is a table
showing the source by technical committee of the papers that will have been published or scheduled
for publication in 2009 as of September 14th. This table shows the number of papers approved by each
technical committee, either not yet processed or not yet received, for publication. Of these 152 papers,
we have already received 77 papers. 17 of these 77 papers have arrived via the new electronic
submission function of ScholarOne, Final Files, rather than our legacy mailed hardcopy procedure.
 Our TAB-approved 2010 page budget allows for 40 papers for each issue of the year. This amounts
to 240 papers, an increase of 9 papers over the number that will have been published in 2009. If we
do not begin to see a further reduction in the backlog of received papers, we will revisit this in April
when Carl has the chance to further increase the number of papers published in the last three issues of
the year.
IAS Magazine


Critical statistics for 2009:
o Papers published: 46 (one under plan)
o Editorial pages published: 506 (19 under adjusted plan, 7 over minimum threshold)
o Timeliness: All issues on schedule
Call for Papers Statistics:
IEEE IAS Publications Department Report – 2009 Q3
Page 2 of 3

2009 Page Count Statistics:
Physical Design
Jan/Feb Mar/Apr May/June July/Aug Sept/Oct Nov/Dec
11
10
10
12
11
12
92
84
84
100
92
100
7.5
7.5
5.41
5
7.16
7.42
84.5
76.5
78.59
95
84.84
92.58
Feature Articles
8
6
8
8
8
8
Feature pages
61
54
56
68
63
65
Signatures
Pages
Advertising
Editorial Pages
Budget
496
Totals
39.99
512.01
46
367
Average pages/article
7.6
9.0
7.0
8.5
7.9
8.1
8.0
History
Columns and recurring items
Conference Columns/Promotions
Calls for Papers
Zucker Award Paper
Awards Column
Annual Index
Other Editorial*
3
17.5
2
2.1
13.2
3.5
14.6
3
4
14.8
5
1
4
13
2.5
18.5
19.1
91.6
6
0.58
0
4.3
6
24.01
2
2
4.3
1
0.9
1.49
2.2
2.84

2010 Initiatives and Challenges:
o Applied Electrostatics will be focus of July/August special issue
o Maintain 10 page length on feature articles
o Expand coverage of chapter activities
o Expand use of S1M Final Files export
o Initiate routine plagiarism screening on papers submitted via S1M
o Replenish “Lighter Side” archive
IAS Prize Paper Selections


The TIA prize paper selection process for 2008 papers was completed on June 24th.
The IAS Magazine prize paper selection process for 2008 papers was completed on August 10th.
Respectfully submitted,
IEEE IAS Publications Department Report – 2009 Q3
Page 3 of 3
IEEE INDUSTRY APPLICATIONS SOCIETY
T. David Mills, PE
Standards Department Chair
Savannah River Nuclear Solutions, LLC
Bldg. 707-38B, Room 8
Savannah River Site
Aiken, SC 29808
Tel +1 803 952 8295
Fax +1 803 952 8453
Cell +1 706 399 2554
Email d.mills@ieee.org
April 28, 2014
Subject:
Standards Department Report to the IAS Executive Board, October 4, 2009 at the
Hyatt Regency Hotel, Houston, TX
The activities of the Standards Department Chair since the Meeting in Ft. Collins, CO consist of the
following:
•
•
Chair submitted three IAS Magazine Standards articles for publication.
Participated in PCIC Standards groups activities in Anaheim, CA
I will be attending the Executive Board Meeting in Houston, TX on October 4-6 to report on the
Standards Department.
Respectfully submitted,
Industry Applications Society
2012 Q3 EB Meeting, Las Vegas NV
Oct 7-8, 2012
2012 Q3 ACTIVITY REPORT TO THE IAS EXECUTIVE BOARD
IAS Chapters and Membership Development Department
Peter Magyar, Chairman
peter.magyar@ieee.org
1. Chapter Overview
2012
January
2012
May
2012
September
2012
September
Chapters
Number and distribution of existing chapters
Regular
Student
Total
132 (88%)
18 (12%)
150 (100%)
133 (86%)
22 (14%)
155 (100%)
135 (79%)
35 (21%)
170 (100%)
Petitions
submitted
2
2
Petitions on
progress
1
~10
~11
New chapters Jan-Oct 2012
Region
R-2
R-5
Chapter
PES/IAS/PELS
IES/PES/PELS, Joined IAS
R-8
Section
Dayton OH, USA
Central Texas TX,
USA
Algeria Sub-Section
R-4
Nebraska (NE, USA
R-8
Algeria Sub-Section
Bosnia and
Herzegovina
Croatia
Greece
Hungary
Palestine Sub-Section
Portugal
South-Africa
South-Africa
Honduras
Univ. of Nebraska-Lincoln SB PES/PELS
(joined IAS)
Mentouri University Constantine SB IAS
University of Sarajevo SB IAS
(submitted to the Section)
University of Zagreb SB IAS
Democritos University of Thrace SB IAS
Òbuda University SB IAS
Al-Najah National University SB IAS
Instituto Técnico Superior SB IAS
University of Cape-Town SB IAS
University of Pretoria SB IAS
Universidad Nacional Autonoma de
Honduras SB IAS
Universidad Nacional de Callao SB IAS
Dhirubhani Ambani Inst. of Inf. & Comm.
Technology SB IAS
Marwadi Education Foundations Group of
Institutions SB IAS
Saint Gits College of Engineering SB IAS
R-9
Peru
Gujarat
(India)
R-10
Kerala
(India)
Nanjing
(China)
IES/IAS
Southeast University SB IAS
Comment
Technical Society
(regular)
Chapters
Student Branch
Chapters
CMD Report for 2012 Q3 EB Meeting
2. Membership Overview
IAS membership by Region
IAS higher grade membership
global distribution trend
Change: R1-7:
-76 / year
R8-10:
+117 / year
Difference: -193 / year
Membership Statistics
July 31,
2012
Count
Y-o-Y
change
Society Membership
Student
total
IAS
Div II
IEEE min
IEEE
max
9714
1.3%
0.3%
-11.9 %
5.7%
GSM
Student grade members
IAS
661
n.a.
334
n.a.
Div II
IEEE
740
1.2%
16.077
-1.1%
327
28.2%
Highest
value in
Div II
and 2nd
highest
at IEEE
Student Membership by Regions
a) Undergraduate
b) Graduate
c) Total
Page 2 of 6
CMD Report for 2012 Q3 EB Meeting
Development history of IAS chapters
Development history of IAS Student Branch chapters
Asymetrical distribution of members and chapters by global regions
Page 3 of 6
CMD Report for 2012 Q3 EB Meeting
3. Committee Activity
3.1.
Chapter Development and SB Chapter Development Committee
IAS Outstanding Chapter Chair 2012
Megha Tak
Region-10, Dhirumbani Ambani Institute of Information and
Communication Technology Student Branch IAS Chapter Chair
IAS Outstanding Chapters Area Chair 2012
D. David Eng
Region-6 Chapters Area Chair
IAS Outstanding Student Branch Chapters Area Chair 2012
Srikanth Vasudevan Pillai
Region-10 Student Branch Chapters Area Chair
3.2.
Chapter Award Committee
IAS Outstanding Chapters 2012
Outstanding Large Joint Chapter:
Argentina Section Joint IES/CSS/RAS/IAS/PELS/VTS Chapter
Germany Section Joint IAS/IES/PELS Chapter
Outstanding Large Chapter:
Panama Section IAS Chapter
Outstanding Small Chapter:
Morelos Section IAS Chapter
Outstanding Small Joint Chapter:
Nanjing Section Joint PES/IAS Chapter
Outstanding Student Branch Chapter:
Colombia Section Universidad Militar Nueva Granada Student Branch IAS
Chapter
Outstanding New Chapter:
Colombia Section Universidad de San Buenaventura Student Branch IAS Chapter
Continued Outstanding Performance Large Chapter:
New York Section Joint PES/IAS Chapter
Continued Outstanding Performance Small Chapter:
Calcutta Section IAS Chapter
Continued Outstanding Performance Student Branch Chapter:
Hungary Section Budapest University of Technology and Economics Student
Branch Joint PES/IAS Chapter
IAS Outstanding Chapter 2012 Statistics
R1:
1
Regular chapters:
R8:
2
Student chapters:
R9:
5
R10: 2
7
3
Page 4 of 6
CMD Report for 2012 Q3 EB Meeting
3.3.
Chapter Web Contest Sub-Committee
IAS Chapter Web Contest Winners
1st Prize: Hungary Section Budapest University of Technology and Economics Student
Branch Joint PES/IAS Chapter (http://eszk.org/en )
nd
2 Prize: Panama Section IAS Chapter (www.ieee.org/go/iaspanama )
3rd Prize: Kerala Section Rajiv Gandhi Institute of Technology Govt. Eng. College
Kottayam Student Branch IAS Chapter
(http://www.rit.ac.in/IEEEIAS/index.html )
IAS Web Contest 2012 Statistics
R8:
1
Regular chapters:
R9:
1
Student chapters:
R10: 1
3.4.
1
2
Student Master Thesis Contest Sub-Committee
SMTC 2012 Winners
1st Prize recipient
Andrés Mauricio Lopez Cañon, M.Sc.
Pontificia Universidad Javeriana, Bogotá, Colombia
2nd Prize recipients
Johanna Stella Castellanos Arias, M.Sc
Pontificia Universidad Javeriana, Bogotá, Colombia.
Andrés Alberto Ladino López, M.Sc.
Pontificia Universidad Javeriana, Bogotá, Colombia.
rd
3 Prize Recipients:
Aathira K V, M.Tech.: .
Rajiv Gandhi Institute of Technology, Kottayam, Kerala, India
Gábor Göcsei, M.Sc.
Budapest University of Technology and Economics, Hungary
SMTC 2012 Statistics
3.5.
R8:
R9:
1
3
R10:
1
Female: 2
Male:
3
Conference Publication and Travel Support Sub-Committee
Supported travellers on basis of accepted paper, á $500
R-8 Hungary:
R-9 Colombia:
R-10 Australia:
India:
1
3
1
5
Supported travelers to regional Student Branch Conferences
R-5:
R-8:
R-9:
R-10:
SBC chair:
SBC chairs (8) and SBC Area Chair (1):
SBC chair
SBC chair:
1
9
1
1
Page 5 of 6
CMD Report for 2012 Q3 EB Meeting
3.6.
Membership Development
Conference Support Program / IAS Information Desk Service 2012
-
3.7.
Safety Workshop, Daytona Beach, FL
APEC, Orlando, FL
IEVC, Greenville, SC
OPTIM, Romania
ITEC, Dearborn, MI
ICEM, Marseille, France
ECCE, Raleigh, NC
PCIC, New Orleans, LA
Annual Meeting, Las Vegas, NV
PEDES, Bengaluru, India
Workshops / Meetings, June-Sep 2012
IAS CMD Presentation Meeting, July 13, 2012
University Pécs, Pollack Mihaly College of Engineering, Pécs, Hungary
Attendee: Peter Magyar, CMD chair
R8 SB and GOLD Conference, Madrid, July 25-29, 2012
Attendees:
Peter Magyar, CMD Chair
Luigi Parise, IAS SB Chapters Area Chair R-8
IAS SB Chapter Chairs:
R-5 TAMU PES/IAS/PELS SBC Chair
R-10 India Saint-Gits IAS SBC Chair
R-8 Bosnia and Herzegovina IAS SBC Chair
Croatia IAS SBC Chair
Greece IAS SBC Chair, VC (2)
Palestine IAS SBC Chair
Portugal IAS SBC Chair
South-Africa Pretoria SBC Chair
South-Africa Cape Town SBC Chair
2012 IAS Peruvian Workshop, Lima, Aug 3-5, 2012
Attendee: Peter Magyar, CMD chair
R9 Student Branch Conference, Argentina, Aug 18-20, 2012
Attendee: Lizeth Vega Medina, Colombia UMNG SBC Chair
IEEE ECCE, Raleigh NC, USA, Sept 16-20, 2012
EMC and IPCC meetings, CMD presentation, membership dríve
Attendee: Peter Magyar, CMD chair
*.*
Respectfully submitted
Page 6 of 6