Package Code
Package Description
Lead Finish
RoHS Compliant
MSL Rating
Assembly Location
Atmel Corporation - Package Material Declaration Datasheet
40M1
GPC
ZBC
40-Pad, 6.0 x 6.0 x 0.9 mm Body, 0.50 mm Pitch, 4.62 mm Square Thermal ePAD, Very-Thin Quad Flat No Lead Package, Sawn (VQFN)
Matte Tin (Sn)
J-STD-609 Category
e3
Yes
Green Compliant
Yes
3
Max Reflow Temperature
260 Celsius
External Manufacturing
Package Material Declaration
Material
Leadframe
Sub-Total
Integrated Circuit
Sub-Total
Die Attach
Sub-Total
Die Pad Plating
Sub-Total
Bond Wire
Sub-Total
Encapsulation
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Silicon (Si)
7440-21-3
Silver (Ag)
Acrylic Resin
Acrylate
Polybutadiene Copolymer
Epoxy Resin
Additive
Butadiene Copolymer
Peroxide
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Silver (Ag)
7440-22-4
Gold (Au)
7440-57-5
Silica
Phenol Resin
Epoxy Resin - 1
Epoxy Resin - 2
Others
Carbon Black
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Tin (Sn)
7440-31-5
Sub-Total
Terminal Plating
Sub-Total
Total
Weight (mg)
43.009
1.341
0.268
0.089
44.708
7.975
7.975
0.405
0.044
0.028
0.028
0.013
0.005
0.005
0.002
0.529
1.014
1.014
0.317
0.317
36.645
2.010
1.633
1.089
0.377
0.126
41.880
2.115
2.115
98.537
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
76.6
766000
8.3
83000
5.3
53000
5.2
52000
2.4
24000
0.9
9000
0.9
9000
0.4
4000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
87.5
875000
4.8
48000
3.9
39000
2.6
26000
0.9
9000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
43.65
436472
1.36
13611
0.27
2722
0.09
907
45.37
453713
8.09
80932
8.09
80932
0.41
4112
0.04
446
0.03
285
0.03
279
0.01
129
0.00
48
0.00
48
0.00
21
0.54
5368
1.03
10290
1.03
10290
0.32
3220
0.32
3220
37.19
371889
2.04
20401
1.66
16576
1.11
11050
0.38
3825
0.13
1275
42.50
425016
2.15
21461
2.15
21461
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers
and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this
declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract
or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 7, 2013
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) and maximum concentration value of 0.01% (100 ppm)
for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.