Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
10‐Pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm, 1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package (VDFN)
10M1
GPC
YJT
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Korea
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Acrylic Resin
Acrylate
Polybutadiene Copolymer
Epoxy Resin
Additive
Butadiene Copolymer
Peroxide
7440‐22‐4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous) A
Silica (Amorphous) B
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
7631‐86‐9
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
9.147
0.225
0.009
0.009
9.391
1.869
1.869
0.095
0.010
0.007
0.006
0.003
0.001
0.001
0.000
0.124
0.211
0.211
0.078
0.078
8.311
1.693
1.093
0.853
0.060
12.009
0.439
0.439
24.120
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
76.6
766000
8.3
83000
5.3
53000
5.2
52000
2.4
24000
0.9
9000
0.9
9000
0.4
4000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
69.2
692000
14.1
141000
9.1
91000
7.1
71000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
37.92
379215
0.93
9344
0.04
389
0.04
389
38.93
389338
7.75
77467
7.75
77467
0.39
3936
0.04
426
0.03
272
0.03
267
0.01
123
0.00
46
0.00
46
0.00
21
0.51
5138
0.87
8731
0.87
8731
0.32
3219
0.32
3219
34.45
344545
7.02
70204
4.53
45309
3.54
35351
0.25
2489
49.79
497897
1.82
18210
1.82
18210
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 18, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
10‐Pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm, 1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package (VDFN)
10M1
GPC
YJT
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
Lingsen
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Diluent A
Epoxy Resin A
Hardener
Diluent B
Epoxy Resin B
Organic Peroxide
Dicyandiamide
7440‐22‐4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
9.147
0.225
0.009
0.009
9.391
1.869
1.869
0.095
0.008
0.008
0.006
0.005
0.005
0.001
0.000
0.128
0.211
0.211
0.078
0.078
11.049
0.456
0.456
0.048
12.009
0.439
0.439
24.124
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
74.7
747000
5.9
59000
5.9
59000
4.9
49000
3.9
39000
3.9
39000
0.5
5000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
92.0
920000
3.8
38000
3.8
38000
0.4
4000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
37.92
379158
0.93
9343
0.04
389
0.04
389
38.93
389279
7.75
77455
7.75
77455
0.40
3951
0.03
312
0.03
312
0.03
259
0.02
206
0.02
206
0.00
26
0.00
16
0.53
5289
0.87
8729
0.87
8729
0.32
3219
0.32
3219
45.80
457996
1.89
18917
1.89
18917
0.20
1991
49.78
497822
1.82
18207
1.82
18207
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 18, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.