Package Code
Package Description
Lead Finish
RoHS Compliant
MSL Rating
Assembly Location
Atmel Corporation - Package Material Declaration Datasheet
8M1-A
GPC
YBR
8-Pad, 6 x 5 x 1.00 mm Body, Thermally Enhanced Plastic Very Thin Dual Flat No Lead Package (VDFN)
Matte Tin (Sn)
J-STD-609 Category
e3
Yes
Green Compliant
Yes
1
Max Reflow Temperature
260 Celsius
External Manufacturing
Package Material Declaration
Material
Leadframe
Sub-Total
Integrated Circuit
Sub-Total
Die Attach
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440-50-8
7439-89-6
7723-14-0
7440-66-6
Silicon (Si)
7440-21-3
Silver (Ag)
2-(Chloromethyl)oxirane, Formaldehyde, Phenol
2,6-Diglycidyl Phenyl Allyl Ether Oligomer
Epoxy Resin
gamma-Butyrolactone
Copper(II) Oxide
Organosilane
Poly(oxypropylene)diamine
7440-22-4
9003-36-5
Proprietary
68475-94-5
96-48-0
1317-38-0
Proprietary
9046-10-0
Silver (Ag)
7440-22-4
Gold (Au)
7440-57-5
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
Proprietary
Proprietary
1333-86-4
Tin (Sn)
7440-31-5
Sub-Total
Die Pad Plating
Sub-Total
Bond Wire
Sub-Total
Encapsulation
Sub-Total
Terminal Plating
Sub-Total
Total
Weight (mg)
26.968
0.665
0.028
0.028
27.688
4.197
4.197
0.241
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.311
0.621
0.621
0.062
0.062
35.339
3.231
2.209
0.123
40.901
1.295
1.295
75.075
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
77.6
776000
3.2
32000
3.2
32000
3.2
32000
3.2
32000
3.2
32000
3.2
32000
3.2
32000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
86.4
864000
7.9
79000
5.4
54000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
35.92
359213
0.89
8851
0.04
369
0.04
369
36.88
368802
5.59
55899
5.59
55899
0.32
3216
0.01
133
0.01
133
0.01
133
0.01
133
0.01
133
0.01
133
0.01
133
0.41
4144
0.83
8270
0.83
8270
0.08
827
0.08
827
47.07
470714
4.30
43040
2.94
29420
0.16
1634
54.48
544808
1.72
17249
1.72
17249
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation
products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances
(RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or
destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited
information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's
standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 14, 2013
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent
Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in
any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.