SD2943
HF/VHF/UHF RF power N-channel MOSFETs
Features
■
High power capability
■
POUT = 350 W min. with 22dB gain @ 30 MHz
■
PSAT = 450 W
■
Low RDS(on)
■
Thermally enhanced packaging for lower
junction temperatures
■
Gold metallization
■
Excellent thermal stability
■
Common source configuration
M177 Epoxy sealed
Figure 1.
Pin connection
Description
4
The SD2943 is a gold metallized N-channel MOS
field-effect RF power transistor. It is intended for
use in 50 V dc large signal applications up to 150
MHz. The SD2943 offers a 20% higher power
saturation than the SD2933, and is ideal for ISM
applications where reliability and ruggedness are
critical factors.
1
5
3
2
1. Drain
4. Source
2. Source
5. Source
3. Gate
Table 1.
Device summary
Order code
Marking
Base qty.
Package
Packaging(1)
SD2943W
SD2943(1)
25 pcs
M177
Plastic tray
1. For more details please refer to Chapter 7: Marking, packing and shipping specifications..
August 2011
Doc ID 11584 Rev 3
1/15
www.st.com
15
Contents
SD2943
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7
Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 13
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/15
Doc ID 11584 Rev 3
SD2943
1
Electrical data
Electrical data
(TCASE = 25° C)
Table 2.
Absolute maximum rating
Symbol
Value
Unit
Drain source voltage
130
V
Drain-gate voltage (RGS = 1MW)
130
V
Gate-source voltage
±20
V
Drain current
40
A
Power dissipation
648
W
Max. operating junction temperature
200
°C
EAS
Avalanche energy, single pulse (ID = 53A, 800µH coil)
1100
mJ
TSTG
Storage temperature
-65 to +150
°C
V(BR)DSS(1)
VDGR
VGS
ID
PDISS
Tj
Parameter
1. TJ = 150 °C
Table 3.
Symbol
RthJC
Thermal data
Parameter
Junction to case thermal resistance
Doc ID 11584 Rev 3
Value
Unit
0.27
° C/W
3/15
Electrical characteristics
2
SD2943
Electrical characteristics
(TCASE = 25°C)
Table 4.
Static
Symbol
Test conditions
Min.
Typ.
Max.
Unit
V(BR)DSS(1)
VGS = 0 V
IDS = 200 mA
IDSS
VGS = 0 V
VDS = 50 V
200
µA
IGSS
VGS = 20 V
VDS = 0 V
500
nA
VGS(Q)
VDS = 10 V
ID = 250 mA
4
V
VDS(ON)
VGS = 10 V
ID = 20 A
2
V
GFS(2)
VDS = 10 V
ID = 10 A
CISS
VGS = 0 V
VDS = 50 V
f = 1 MHz
830
pF
COSS
VGS = 0 V
VDS = 50 V
f = 1 MHz
470
pF
CRSS
VGS = 0 V
VDS = 50 V
f = 1 MHz
35
pF
130
V
2
10
mho
1. TJ = 150° C
2. GFS sorts for each unit see Table .
Table 5.
Dynamic
Symbol
Test conditions
POUT
VDD = 50 V
IDQ = 250 mA
GPS
VDD = 50 V
IDQ = 250 mA POUT = 350 W
hD
VDD = 50 V
IDQ = 250 mA POUT = 350 W
Load
Mismatch
Table 6.
4/15
f = 30 MHz
VDD = 50 V IDQ = 250 mA POUT = 350 W
All Phase Angles
f = 30 MHz
f = 30 MHz
f = 30 MHz
GFS sorts
Symbol
Value
A
10 ÷ 10.99
B
11 ÷ 11.99
C
12 ÷ 12.99
D
13 ÷ 13.99
E
14 ÷ 14.99
F
15 ÷ 15.99
G
16 ÷ 16.99
H
17 ÷ 18
Doc ID 11584 Rev 3
Min.
Typ.
350
450
W
22
25
dB
60
65
%
3:1
Max.
Unit
VSWR
SD2943
Impedance
3
Impedance
Figure 2.
Impedance Data Schematic
D
ZDL
Typical Drain
Load Impedance
Typical Input
Impedance
G
ZIN
S
Table 7.
Impedance data
f
ZIN (Ω)
ZDL (Ω)
30 MHz
1.3 - j 2.9
3.1 + j 2.3
108 MHz
1.4 - j 2.4
1.9 + j 1.4
175 MHz
1.4 - j 2.2
1.7 +j 1.6
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Typical performance
SD2943
4
Typical performance
Figure 3.
Capacitance vs drain voltage
Figure 4.
Drain current vs gate voltage
40
10000
Vds = 10 V
35
CISS
30
Capacitance (pF)
1000
25
Id (A)
COSS
100
20
15
CRSS
Tc = +20 ºC
10
10
5
Tc = +80 ºC
Freq = 1 MHz
0
1
0
4
8
12
16
20
24 28 32
Vdd (V)
36
40
44
48
52
0
56
1
2
3
4
5
6
Vgs (V)
Gate-source voltage vs case
temperature
Figure 6.
Maximum thermal resistance vs.
case temperature
0.33
1.15
1.1
0.32
Id= 12 A
Id= 10 A
1.05
Id= 7 A
Id= 5 A
Id= 15 A
1
0.95
Id=.1 A
Id= 4 A
0.9
Id= 2 A
0.85
Id=.25 A
0.29
0.28
0.26
0.8
25
0.3
0.27
Id= 1 A
0
0.31
Id= 3 A
Vdd= 10 V
-25
RTH(j-c) (°C/W)
Vgs, GATE-SOURCE VOLTAGE (NORMALIZED)
Figure 5.
50
75
100
25
30
35
40
45
50
55
60
65
70
Tc, CASE TEMPERATURE (°C)
Tc, CASE TEMPERATURE (ºC)
6/15
Tc = -20 ºC
Doc ID 11584 Rev 3
75
80
85
SD2943
Typical performance
Figure 7.
Output power vs input power
Figure 8.
500
500
450
450
Output power vs input power (at
different temperature)
Tc = +25 ºC
400
Tc = +80 ºC
400
Vdd = 50 V
350
350
Pout (W)
300
Pout (W)
Tc = -20 ºC
Vdd = 40 V
250
300
250
200
200
150
150
100
100
Freq = 30 MHz
Idq = 250 mA
50
Freq = 30 MHz
Vdd = 50 V
Idq = 250 mA
50
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
2.0
Pin (W)
Figure 9.
2.5
3.0
3.5
4.0
4.5
Pin (W)
Power gain vs output power
Figure 10. Efficiency vs output power
80
30
28
Tc = +25 ºC
70
Tc = +25 ºC
26
60
50
Tc = -20 ºC
Nd (%)
Gain (dB)
24
Tc = +80 ºC
22
20
40
30
18
20
Freq = 30 MHz
Vdd = 50 V
Idq = 250 mA
16
Freq = 30 MHz
Vdd = 50 V
Idq = 250 mA
10
14
0
0
50
100
150
200
250
300
350
400
450
500
0
50
100
150
200
Pout (W)
250
300
350
400
450
500
Pout (W)
Figure 11. Output power vs supply voltage
Figure 12. Output power vs gate voltage
440
440
Freq = 30 MHz
Idq = 250mA
400
Tc = -20 ºC
Pin = 2.2 W
400
Tc = +25 ºC
360
360
320
280
Pout (W)
Pout (W)
320
280
Pin = 1.1 W
240
240
Tc = +80 ºC
200
160
200
120
Pin = 0.55 W
160
Freq = 30 MHz
Pin = 1.1 W
Vdd = 50 V
Idq = 250 mA
80
120
40
80
0
26
28
30
32
34
36
38
40
42
44
46
48
50
52
-3 -2.5 -2 -1.5
Vdd (V)
-1 -0.5
0
0.5
1
1.5
2
2.5
3
3.5
Vgs (V)
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Test Circuit
5
SD2943
Test Circuit
Figure 13. 30 MHz test circuit schematic
Note:
1
Dimension at component symbol are reference for component placement.
2
Gap between group and trasmission files are 0.056[1.42] typ.
3
Transmission lime are not 1:1 scale.
4
Input and output trasmission line are 50Ω
Table 8.
30 MHz test circuit component part list
Symbol
Description
C1,C9
0.01 µF / 500 V surface mount ceramic chip capacitor
C2, C3
750 pF ATC 700B surface mount ceramic chip capacitor
C4
300 pF ATC 700B surface mount ceramic chip capacitor
C5,C10,C11,C14,C16 10000 pF ATC 200B surface mount ceramic chip capacitor
8/15
C6
510 pF ATC 700B surface mount ceramic chip capacitor
C7
300 pF ATC 700B surface mount ceramic chip capacitor
C8
175-680 pF TYPE 46 standard trimmer capacitor
C12
47 µF / 63 V aluminum electrolytic radial lead capacitor
Doc ID 11584 Rev 3
SD2943
Test Circuit
Table 8.
30 MHz test circuit component part list (continued)
Symbol
Description
C13
1200 pF ATC 700B surface mount ceramic chip capacitor
C15
100 µF / 63 V aluminum electrolytic radial lead capacitor
R1,R3
1 KΩ 1 W surface mount chip resistor
R2
560Ω 2 W wire-wound axils lead resistor
T1
HF 2-30 MHz surface mount 9:1 transformer
T2
RG - 142B/U 50Ω coaxial cable OD = 0.165[4.18] L 15”[381.00] covered with 15”[381.00]
tinned copper tubular brand 13/65” [5.1] width
L1
1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire
L2
1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire
RFC1,RFC2
3 turns 14 AWG wire through fair rite toroid
FB1
surface mount emi shield bead
FB2
toroid
PCB
ULTRALAM 2000. 0.030” THK,
ε r = 2.55, 2 Oz ED CU both sides
4 inches
Figure 14. 30 MHz test circuit photomaster
6.4 inches
Doc ID 11584 Rev 3
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Test Circuit
SD2943
Figure 15. 30 MHz test circuit
10/15
Doc ID 11584 Rev 3
SD2943
6
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 9.
M177 (.550 DIA 4/L N/HERM W/FLG)
mm.
inch
DIM.
Min.
Max.
Min.
A
5.72
5.97
0.225
0.235
B
6.73
6.96
0.265
0.275
C
21.84
22.10
0.860
0.870
D
28.70
28.96
1.130
1.140
E
13.84
Typ
14.10
0.545
0.555
F
0.08
-
0.18
0.003
G
2.49
2.74
0.098
0.108
H
3.81
4.32
0.150
0.170
I
7.11
Typ
-
Max.
0.007
0.280
J
27.43
28.45
1.080
1.120
K
15.88
16.13
0.625
0.635
Doc ID 11584 Rev 3
11/15
Package mechanical data
SD2943
Figure 16. M177 package dimensions
12/15
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SD2943
7
Marking, packing and shipping specifications
Marking, packing and shipping specifications
Table 10.
Packing and shipping specifications
Order code
Packaging
Pcs per
tray
Dry pack
humidity
GFS code
Lot code
SD2943W
Plastic tray
25
< 10 %
Not mixed
Not mixed
Figure 17. Marking layout
SD2943
Table 11.
Marking specifications
Symbol
Description
W
Wafer process code
X
GFS sort
CZ
Assy plant
xxx
Last 3 digit of diffusion lot
VY
Diffusion plant
MAR
Country of origin
CZ
Test and finishing plant
y
Assy year
yy
Assy week
Doc ID 11584 Rev 3
13/15
Revision history
8
SD2943
Revision history
Table 12.
14/15
Document revision history
Date
Revision
Description of Changes
18-Oct-2005
1
First Issue.
04-Jan-2006
2
Complete version
24-Aug-2011
3
Inserted Chapter 7: Marking, packing and shipping
specifications.
Minor text changes.
Doc ID 11584 Rev 3
SD2943
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