Plastic Packages for Integrated Circuits
Thin Dual Flat No-Lead Plastic Package (TDFN)
L12.4x3A
12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C)
2X
0.15 C A
A
D
MILLIMETERS
2X
0.15 C B
SYMBOL
MIN
A
0.70
A1
-
A3
E
b
6
INDEX
AREA
D2
0.18
E2
3.15
0.10
A
0.08
C
C
-
-
0.05
-
0.23
0.30
5,8
3.30
3.40
7,8
3.00 BSC
1.55
e
//
NOTES
0.80
4.00 BSC
E
TOP VIEW
MAX
0.75
0.20 REF
D
B
NOMINAL
1.70
1.80
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
12
2
Nd
6
3
Rev. 1 10/15
C
NOTES:
A3
SEATING
PLANE
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
SIDE VIEW
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
D2
(DATUM B)
6
INDEX
AREA
7
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
8
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
D2/2
1
2
NX k
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
E2
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
(DATUM A)
E2/2
9. Tiebar shown (if present) is a non-functional feature and maybe
located on any of the 4 sides (or ends).
NX L
N-1
N
8
NX b
e
(Nd-1)Xe
REF
5
0.10 M
C A B
BOTTOM VIEW
CL
(A1)
NX (b)
L
5
e
SECTION "C-C"
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
1