SN74AUP1T34 www.ti.com SCES841C – JUNE 2012 – REVISED MAY 2013 1-Bit Unidirectional Voltage-Level Translator Check for Samples: SN74AUP1T34 FEATURES 1 • • • • • • • • • • Wide Operating VCC Range of 0.9 V to 3.6 V Balanced Propagation Delays: tPLH = tPHL (1.8 V to 3.3 V Translation Typical) Low Static-Power Consumption, 5 µA Max ICC ±6 mA Output Drive at 3 V Ioff Supports Partial Power-Down-Mode Operation VCC Isolation Feature – If VCCA Input Is at GND, B Port Is in the High-Impedance state Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input ESD Protection Exceeds JESD 22 5000-V Human-Body Model (A114-A) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II DCK PACKAGE (TOP VIEW) VCCA 1 A 2 GND 3 5 VCCB 4 B DRY PACKAGE (TOP THROUGH VIEW) VCCA 1 6 VCCB A 2 5 NC GND 3 4 B DSF PACKAGE (TOP THROUGH VIEW) VCCA 1 6 VCCB A 2 5 NC GND 3 4 B DESCRIPTION The SN74AUP1T34 is a 1-bit non-inverting translator that uses two separate configurable power-supply rails. It is a uni-directional translator from A to B. The A port is designed to track VCCA. VCCA accepts supply voltages from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts supply voltages from 0.9 V to 3.6 V. This allows for low-voltage translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes. The SN74AUP1T34 is also fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature ensures that if VCCA input is at GND, the B port is in the high-impedance state. If VCCB input is at GND, any input to the A side does not cause the leakage current even floating. ORDERING INFORMATION For package and ordering information, see the Package Option Addendum at the end of this document. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated SN74AUP1T34 SCES841C – JUNE 2012 – REVISED MAY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PIN FUNCTIONS PIN FUNCTION VCCA Input Port DC Power Supply VCCB Output Port DC Power Supply GND Ground A Input Port B Output Port Table 1. FUNCTION TABLE INPUT OUTPUT A PORT B PORT L L H H ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VCCA, VCCB Supply voltage range VI Input voltage range Voltage range applied to any output in the high-impedance or power-off state VO Voltage range applied to any output in the high or low state MIN MAX –0.3 4.0 –0.5 4.6 –0.5 4.6 –0.5 4.6 –0.5 4.6 –0.5 4.6 –0.5 4.6 –0.5 4.6 UNIT V V V V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA 150 °C Continuous current through VCCA or GND Tstg 2 Storage temperature range –65 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SN74AUP1T34 SN74AUP1T34 www.ti.com SCES841C – JUNE 2012 – REVISED MAY 2013 RECOMMENDED OPERATING CONDITIONS VCCA VCCA, VCCB VIH VIL VCCB Supply voltage High-level input voltage Low-level input voltage Δt/Δv Input transition rise or fall rate TA Operating free-air temperature MIN MAX 0.9 3.6 0.9 to 1.95V 0.9 to 1.95V 0.65 x VCCA 2.3 to 2.7V 0.9 to 3.6V 1.6 3.0 to 3.6V 0.9 to 3.6V 2 0.9 V 0.9 to 1.95V 0.3 x VCCA V V 1 to 1.95V 0.9 to 1.95V 0.35 x VCCA 2.3 to 2.7V 0.9 to 3.6V 0.7 3.0 to 3.6V 0.9 to 3.6V 0.9 3.0 to 3.6V 0.9 to 3.6V –40 UNIT V 200 ns/V 85 °C MAX UNIT RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA VCCB IOH = –100 µA 0.9 V to 3.6 V 0.9 V to 3.6 V VCCB – 0.2 IOH = –0.25 mA 0.9 V 1V 0.9 V 1V 0.75 x VCCB 1.2 V 1.2 V 1.0 1.65 V 1.65 V 1.32 IOH = –3 mA 2.3 V 2.3 V 1.9 IOH = –6 mA 3V 3V 2.72 IOL = 100 µA 0.9 V to 3.6 V 0.9 V to 3.6 V IOL = 0.25 mA 0.9 V 1V 0.9 V 1V IOL = 1.5 mA 1.2 V 1.2 V 0.3 x VCCB 1.65 V 1.65 V 0.31 IOL = 3 mA 2.3 V 2.3 V 0.31 IOL = 6 mA 3V 3V 0.31 0.9 V to 3.6 V 0.9 V to 3.6 V ±1 IOH = –1.5 mA VOH IOH = –2 mA VOL IOL = 2 mA II Control inputs Ioff A or B port ICCA VI = VIH VI = VIL VI = VCCA or GND VI or VO = 0 to 3.6 V VI = VCCI or GND, IO = 0 ICCB VI = VCCI or GND, IO = 0 ICCA + ICCB VI = VCCI or GND, IO = 0 MIN V 0.1 0.1 0V 0 V to 3.6 V ±5 0 V to 3.6 V 0V ±5 0.9 V to 3.6 V 0.9 V to 3.6 V 5 0.9 V to 3.6 V VCCA 2 0V 0 V to 3.6 V 1 0 V to 3.6 V 0V 1 0.9 V to 3.6 V 0.9 V to 3.6 V 5 0.9 V to 3.6 V VCCA 2 0V 0 V to 3.6 V 1 0 V to 3.6 V 0V 1 V µA µA µA µA 0.9 V to 3.6 V 0.9 V to 3.6 V 5.2 µA Ci Control inputs VI = 3.3 V or GND 3.3 V 3.3 V 4 pF Cio A or B port VO = 3.3 V or GND 0V 3.3 V 7 pF Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SN74AUP1T34 3 SN74AUP1T34 SCES841C – JUNE 2012 – REVISED MAY 2013 www.ti.com AC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER tPLH/tPHL tPLH/tPHL tPLH/tPHL tPLH/tPHL 4 VCCB = 0.9 V VCCB = 1.2 V VCCB = 1.65 V VCCB = 2.3 V VCCB = 3 V CL VCCA 5 pF 0.9V 5 pF 1.2V 42.5 24.9 23.2 22.6 22.5 5 pF 1.65V 40 10.7 8.84 8.08 7.88 5 pF 2.3V 41.3 8.02 5.73 4.92 4.2 5 pF 3V 42.5 7.61 4.5 3.65 3.39 10 pF 0.9V TYP MAX 25 TYP MAX 18 28.9 TYP MAX 16.2 19.8 TYP MAX 16.3 17.9 TYP MAX 16.8 18.0 1.2V 43.22 12.33 9.57 8.81 8.61 10 pF 1.65V 40.44 9.21 6.57 5.5 4.73 10 pF 2.3V 41.56 8.3 5.54 4.42 4.01 3V 15 pF 0.9V 42.81 30.6 7.87 21.6 4.55 19.6 3.8 19.7 3.36 1.2V 43.87 12.98 10.3 9.54 9.34 15 pF 1.65V 40.78 9.59 6.95 5.87 5.07 15 pF 2.3V 41.79 8.55 5.8 4.68 4.27 15 pF 3V 43.09 8.16 4.84 4.09 30 pF 0.9V 21.3 18.7 18 ns 3.65 18.3 30 pF 1.2V 45.65 14.76 12.37 11.61 11.41 30 pF 1.65V 41.72 10.65 8.01 6.94 5.99 30 pF 2.3V 42.44 9.26 6.51 5.39 4.97 30 pF 3V 43.69 8.8 5.48 4.72 4.28 Submit Documentation Feedback ns 20.3 15 pF 32.1 ns 18.5 10 pF 10 pF UNIT ns Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SN74AUP1T34 SN74AUP1T34 www.ti.com SCES841C – JUNE 2012 – REVISED MAY 2013 VCC Pulse Generator DUT CL RL Figure 1. AC (Progagation Delay) Test Circuit SPACER TEST tPLH, tPHL CL = 5 pF, 10 pF, 15 pF, 30 pF or equivalent (includes probe and jig capacitance) RL = 1 MΩ or equivalent ZOUT of pulse generator = 50 Ω VIH Input (An) Vm Vm 0V tPLH tPLH Vm Output(Bn) VOH Vm VOL VMI =VIH/2; VMO= VCCB/2 NOTE: tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 2. Waveform 1 - Propagation Delays Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SN74AUP1T34 5 SN74AUP1T34 SCES841C – JUNE 2012 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision A (June 2012) to Revision B • Page Removed Feature: Output Enable Feature Allows User to Disable Outputs to Reduce Power Consumption. ................... 1 Changes from Revision B (July 2012) to Revision C Page • Added Feature: VCC Isolation Feature – If VCCA Input Is at GND, B Port Is in the High-Impedance state. ........................ 1 • Updated PIN FUNCTIONS table. ......................................................................................................................................... 2 • Added FUNCTION TABLE. .................................................................................................................................................. 2 • Deleted IOZ PARAMETER from RECOMMENDED OPERATION CONDITIONS. ................................................................ 3 • Added VMI and VMO equations to Wavefrom 1 graphic. ........................................................................................................ 5 6 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SN74AUP1T34 PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74AUP1T34DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 U2E SN74AUP1T34DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 U2 SN74AUP1T34DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 U2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 9-Apr-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.5 1.2 4.0 8.0 Q3 SN74AUP1T34DCKR SC70 DCK 5 3000 178.0 9.0 2.4 SN74AUP1T34DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1 SN74AUP1T34DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Apr-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1T34DCKR SC70 DCK 5 3000 180.0 180.0 18.0 SN74AUP1T34DRYR SON DRY 6 5000 184.0 184.0 19.0 SN74AUP1T34DSFR SON DSF 6 5000 184.0 184.0 19.0 Pack Materials-Page 2 MECHANICAL DATA PLASTIC SMALL OUTLINE NO-LEAD DSF (S-PX2SON-N6) 1.05 0.95 A B PIN 1 INDEX AREA 1.05 0.95 0.4 MAX C SEATING PLANE 0.05 C (0.11) TYP SYMM 0.05 0.00 3 2X 0.7 4 SYMM 4X 0.35 6 1 (0.1) PIN 1 ID 6X 6X 0.45 0.35 0.22 0.12 0.07 0.05 C A C B 4208186/F 10/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MO-287, variation X2AAF. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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