TN-12-25: NOR Land Pad Design
Introduction
Technical Note
Land Pad Design for NOR Flash Memories
Introduction
This document provides high-level information on Micron's NOR Flash memory packages and their suggested PCB land patterns. For additional information and assistance
for any manufacturability issues, contact your Micron representative or log on to
www.micron.com.
Package Outlines and Suggested Land Pattern Designs
The following sections contain detailed mechanical descriptions of Micron's NOR Flash
packages and the related suggested PCB land pattern designs. The suggested land pattern (mm) designs were developed using Mentor's PCB Matrix Calculator software,
which is based on the IPC-7351B standard. For additional information refer to the NOR
Flash section of Micron's website.
Figure 1: Key Land Pattern Sizes Definitions (from IPC-7351B)
L
Manufacturing dimensions of SOICs.
T
Manufacturer's dimensions and
tolerances converted to profile
dimensions, with S at maximum
material condition.
L
If S is not provided by the component
manufacturer, it may be determined by
subtracting T terminal dimensions
from the length.
S
MMC
S = L -2 T
MMC MMC
LMC
G
“N” places
0.05
Fabrication tolerance
equals 0.1mm.
Z
There are many options available to determine the tolerances for each component. The
IPC-7351B formulas for calculating the ZMAX distance are shown below (based on the
RMS method).
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications. All
information discussed herein is provided on an "as is" basis, without warranties of any kind.
TN-12-25: NOR Land Pad Design
Introduction
ZMAX = LMIN + 2JT +
GMIN = SMAX - 2JH XMAX = WMIN + 2JS +
CL2 + F2 + P2
CS2 + F2 + P2
CW2 + F2 + P2
Where:
ZMAX = overall length of land pattern
GMIN = minimum distance between land of the pattern
XMAX = maximum width of the pattern
SMAX = maximum distance among component termination
WMIN = minimum width of the lead
LMIN = minimum distance of the component length
JT = toe joint dimension
CL = tolerance for component length
F = fabrication tolerance
P = positioning tolerance
JH = solder fillet or land protrusion at heel
CS = tolerance on distance between component terminations
CW = tolerance on the lead width
Table 1: Tolerance Definitions (from IPC-7351b)
Tolerance Element
Description
Compound tolerance
The difference of maximum material condition (MMC) and least material condition (LMC) of
each component dimension length, width, and distance between terminations or leads. This
number is the "C" tolerance in the equations.
Printed board tolerance
The difference of MMC and LMC of each land pattern dimension length. This number is the
"F" tolerance in the equations.
Positional accuracy
The diameter of true position (DTP). This is the variation of the part centroid related to the
land pattern theoretical center (includes feature location tolerance from Table 2.
All tolerances for lands are intended to provide a projected land pattern with individual
lands at maximum size, while unilateral tolerance will result in a smaller area for solder
joint formation. Land patterns are within these outer and inner extremities.
The LPW tool uses the distance between pin centers ("C" as shown in the land pattern
figures) instead of the distance between the pin ends (Z). This is the way most of tools
used in the industry manage that dimension.
Some rounding off of values occurs, which is controlled by the calculator settings tab.
These settings should be reviewed and set to meet the user's fabrication and assembly
best practices for their industry and their fabrication/assembly technology. The tolerances shown below have been used in all of the land pattern calculations that follow in
this document.
Table 2: Applied Tolerances
Tolerance Element
Tolerance (mm)
Land-to-land MIN
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
0.20
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TN-12-25: NOR Land Pad Design
Introduction
Table 2: Applied Tolerances (Continued)
Tolerance Element
Tolerance (mm)
Silkscreen to Land MIN
0.25
Solder mask web MIN
0.075
Fabrication
0.05
Placement
0.05
Land place round-off (C)
0.10
Land size round-off
0.05
Definitions of the areas and dimensions provided in this document:
• Land pattern: The combinations of lands used for the mounting of a particular component.
• Courtyard: The smallest rectangular area that provides a minimum electrical and mechanical clearance around the combined component body and land pattern boundaries.
• Silkscreen: The printed area of the position where the component body will be
placed, in relation to the orientation indicator.
• Assembly area: Maximum area allowed for component body mounting on the PCB.
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
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TN-12-25: NOR Land Pad Design
SO Packages
SO Packages
Figure 2: Calculated SO Parameters
Silkscreen
Land pattern
R1
Y
X
1
8
2
7
3
6
4
5
R2
C
Courtyard
Assembly
V1
ANOM
V2
BNOM
Table 3: SO Packages and Parameter Values
Pins
Width (mm)
Length (mm)
Max
Thickness
(mm)
SOP2-8 150 mils body width (SO8N)
8
4.9
6
1.75
1.27
SOP2-8 208 mils body width (SO8W)
8
5.28
7.9
2.5
1.27
SOP2-16 300 mils body width (SO16W)
16
10.3
10.3
2.65
1.27
Package Type
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4
Pitch (mm)
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
SO Packages
SO8N
Figure 3: SO8N Package Outline
0.25 MIN/
x 45°
0.50 MAX
1.75 MAX/
1.25 MIN
0.17 MIN/
0.23 MAX
0.10 MAX
0.28 MIN/
0.48 MAX
1.27 TYP
0.25 mm
GAUGE PLANE
4.90 ±0.10
0o MIN/
8o MAX
8
6.00 ±0.20
3.90 ±0.10
1
0.10 MIN/
0.25 MAX
0.40 MIN/
1.27 MAX
1.04 TYP
1. All dimensions are in millimeters.
Note:
Table 4: SO8N Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Assembly (mm)
Courtyard (mm)
C
Y
X
R1
R2
ANOM
BNOM
V1
V2
5.2
1.35
0.55
4.9
3.9
3.9
4.9
6.8
5.2
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Silkscreen (mm)
1. See Figure 2 (page 4) for suggested land pattern.
5
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TN-12-25: NOR Land Pad Design
SO Packages
SO8W
Figure 4: SO8W Package Outline
1.51 MIN/
2.00 MAX
0.40 -0.05
+0.11
2.50 MAX
0.10 MIN/
0.35 MAX
0.10 MAX
1.27 TYP
6.05 MAX
7.62 MIN/
8.89 MAX
8
5.02 MIN/
6.22 MAX
1
0.00 MIN/
0.25 MAX
0º MIN/
10° MAX
0.50 MIN/
0.80 MAX
1. All dimensions are in millimeters.
Note:
Table 5: SO8W Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Assembly (mm)
Courtyard (mm)
C
Y
X
R1
R2
ANOM
BNOM
V1
V2
7.5
1.7
0.6
5.15
6
5.62
5.95
9.4
6.3
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Silkscreen (mm)
1. See Figure 2 (page 4) for suggested land pattern.
6
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TN-12-25: NOR Land Pad Design
SO Packages
SO16W
Figure 5: SO16W Package Outline
10.30 ±0.20
16
h x 45°
9
0.23 MIN/
0.32 MAX
10.00 MIN/
10.65 MAX
7.50 ±0.10
1
8
0° MIN/8° MAX
2.5 ±0.15
0.20 ±0.1
0.1 Z
0.33 MIN/
0.51 MAX
1.27 TYP
Note:
0.40 MIN/
1.27 MAX
Z
1. All dimensions are in millimeters.
Table 6: SO16W Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Silkscreen (mm)
Assembly (mm)
Courtyard
(mm)
C
Y
X
R1
R2
ANOM
BNOM
V1
9.2
1.75
0.6
6.8
10.3
7.5
10.3
10.7
1. See Figure 2 (page 4) for suggested land pattern.
7
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TN-12-25: NOR Land Pad Design
DFN Packages
DFN Packages
Figure 6: Calculated DFN Parameters
Silkscreen
Land pattern
Y1
R1
X1
X2
1
8
2
R2
7
9
3
6
4
Y2
5
C
Courtyard
Assembly
V1
ANOM
V2
BNOM
Table 7: DFN Packages and Parameter Values
Pins
Width (mm)
Length (mm)
Max
Thickness
(mm)
U-PDFN-8 2 x 3mm (MLPA8)
8
2
3
0.6
0.5
U-PDFN-8 4 x 3mm (MLPA8)
8
4
3
0.6
0.8
V-PDFN-8 6 x 5mm (MLP8)
8
5
6
1
1.27
V-PDFN-8 6 x 5mm Sawn (MLP8)
8
5
6
0.9
1.27
VPDFN-8 8 x 6mm (MLP8)
8
6
8
1
1.27
Package Type
PDF: 09005aef8503ed82
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8
Pitch (mm)
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
DFN Packages
DFN-8 2mm x 3mm
Figure 7: DFN-8 2mm x 3mm Package Outline
2.00 -0.10
+0.10
0.25 -0.05
+0.05
0.50 TYP
0.15 MAX
0.30 MIN
3.00
-0.10
+0.10
0.20 -0.10
+0.10
0.45 -0.05
+0.05
1.60
0.55 -0.10
+0.05
-0.10
+0.10
0.08 MAX
0.02 -0.02
+0.03
Note:
1. All dimensions are in millimeters.
Table 8: DFN-8 2mm x 3mm Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Silkscreen (mm) Assembly (mm) Courtyard (mm)
C
X1
Y1
X2
Y2
R1
R2
ANOM
BNOM
V1
V2
2.8
0.3
0.75
0.3
1.7
1.3
2
3
2
3.8
2.3
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
1. See Figure 6 (page 8) for suggested land pattern.
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TN-12-25: NOR Land Pad Design
DFN Packages
DFN-8 4mm x 3mm
Figure 8: DFN-8 4mm x 3mm Package Outline
0.80 ±0.10
Datum A
A
4.00 ±0.10
1
2
3
4
B
8 x (0.60 ±0.05)
Datum B
0.20 ±0.10
0.20 DIA TYP
3.00 ±0.10
(See note 1)
2X
0.10
See detail A
C
1
2X
0.10
8 x (0.30 ±0.05)
8
7
2
6
5
0.80 TYP
C
0.10
M C A B
0.05
M C
Bottom View
Top View
Datum A or B
0.55
// 0.10
0.05
C
-0.10
+0.05
C
0.60 ±0.05
C
Seating Plane
0.127 MIN/
0.15 MAX
Note:
0.02 -0.02
+0.03
Terminal Tip
0.40 TYP
0.80 TYP
Side View
Even Terminal/Side
Detail A
1. All dimensions are in millimeters.
Table 9: DFN-8 4mm x 3mm Suggested Land Pattern Dimensions
Land Pattern (mm)2
Reference
Typical dimension
Silkscreen (mm) Assembly (mm) Courtyard (mm)
C
X1
Y1
X2
Y2
R1
R2
ANOM
BNOM
V1
V2
2.6
0.35
0.95
0.3
2.4
3
4
3
4
3.8
4.3
Notes:
1. See Figure 6 (page 8) for suggested land pattern.
2. The software used to generate the land pattern dimensions, does not have the capability to split the thermal tab in two as shown in the drawing above. Please consider doing
one of the following:
1) Screen print such that the part is not lifted excessively by the solder, or
2) Break the thermal tab in two with .05mm clearance around the pad, similar to dimension X2.
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
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TN-12-25: NOR Land Pad Design
DFN Packages
DFN-8 6mm x 5mm
Figure 9: DFN-8 6mm x 5mm Package Outline
6 TYP
Pin 1 ID
laser marking
Pin 1 ID
option
Pin 1 ID
1.27
TYP
3.00 ±0.20
5 TYP
+0.08
0.40 -0.05
3.00 ±0.20
0.6
+0.15
-0.1
0.90 ±0.10
0.1 C
0.08 C
Seating plane
0.20 TYP
+0.03
0.02 -0.02
Note:
Leads coplanarity
C
1. All dimensions are in millimeters.
Table 10: DFN-8 6mm x 5mm Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Silkscreen (mm) Assembly (mm) Courtyard (mm)
C
X1
Y1
X2
Y2
R1
R2
ANOM
BNOM
V1
V2
5.5
0.45
1.05
3.2
3.2
3.7
5
6
5
6.8
5.4
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
1. See Figure 6 (page 8) for suggested land pattern.
11
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TN-12-25: NOR Land Pad Design
DFN Packages
DFN 5mm x 6mm (Not Sawn)
Figure 10: DFN 5mm x 6mm (Not Sawn) Package Outline
0.10 MAX/
0 MIN
5.75 TYP
Pin one
indicator
4.75 TYP
5 TYP
+0.30
4 -0.20
1.27
TYP
0.10 M C A B
B
0.15 C A
6 TYP
A
2x
0.15 C B
0.10 C B
0.10 C A
+0.15
0.60 -0.10
3.40 ±0.20
+0.08
0.40 -0.05
θ
12°
0.05
+0.15
0.85 -0.05
0.20 TYP
0.65 TYP
0 MIN/
0.05 MAX
Note:
C
1. All dimensions are in millimeters.
Table 11: DFN 5mm x 6mm (Not Sawn) Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Silkscreen (mm) Assembly (mm) Courtyard (mm)
C
X1
Y1
X2
Y2
R1
R2
ANOM
BNOM
V1
V2
5.5
0.45
1.05
3.6
4.3
3.8
5
6
5
6.8
5.4
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
1. See Figure 6 (page 8) for suggested land pattern.
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TN-12-25: NOR Land Pad Design
DFN Packages
DFN-8 8mm x 6mm
Figure 11: DFN-8 8mm x 6mm Package Outline
8.00 TYP
aaa C
Pin 1 ID
Ø0.3
Pin 1 ID R 0.20
4.80 TYP
aaa C
6.00 TYP
(NE - 1) × 1.27 TYP
B
8
1
7
2
6
3
5
4
0.50 -0.05
+0.10
1.27
TYP
+0.08
0.40 -0.05
5.16 TYP
0.2
MIN
eee M C A B
fff M C
A
bbb C
ddd C
0.85 TYP/
1 MAX
0.05 MAX
Note:
1. All dimensions are in millimeters.
Table 12: DFN-8 8mm x 6mm Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Silkscreen (mm) Assembly (mm) Courtyard (mm)
C
X1
Y1
X2
Y2
R1
R2
ANOM
BNOM
V1
V2
7.7
0.45
0.9
5.15
4.8
8
6
8
6
8.8
6.4
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
1. See Figure 6 (page 8) for suggested land pattern.
13
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TN-12-25: NOR Land Pad Design
TSOP Packages
TSOP Packages
Figure 12: Calculated TSOP Parameters
Land pattern
Silkscreen
Y
R1
X
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
R2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
C
Courtyard
Assembly
V1
ANOM
V2
BNOM
Table 13: TSOP Packages and Parameter Values
Pins
Width (mm)
Length (mm)
Max
Thickness
(mm)
TSOP48: 12mm x 20mm
48
12
20
1.2
0.5
TSOP56: 14mm x 20mm
56
14
20
1.2
0.5
Package Type
PDF: 09005aef8503ed82
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14
Pitch (mm)
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TN-12-25: NOR Land Pad Design
TSOP Packages
TSOP-I 48 12mm x 20mm
Figure 13: TSOP-I 48 12mm x 20mm Package Outline
48
1
0.50 TYP
12.00 + 0.10
0.22 + 0.05
24
0.80 TYP
25
1.00 + 0.05
18.40 + 0.10
1.20 MAX
20.00 + 0.20
0.10 + 0.05
DIE
0.10 MIN/
0.21 MAX
o
3o + 2o
3
0.60 + 0.10
0.10 MAX
1. All dimensions are in millimeters.
Note:
Table 14: TSOP-I 48 12mm x 20mm Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Assembly (mm)
Courtyard (mm)
C
X
Y
R1
R2
ANOM
BNOM
V1
V2
19.5
0.25
1.1
17.75
12
18.4
12
20.7
12.3
Note:
PDF: 09005aef8503ed82
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Silkscreen (mm)
1. See Figure 12 (page 14) for suggested land pattern.
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TN-12-25: NOR Land Pad Design
TSOP Packages
TSOP-I 56 14mm x 20mm
Figure 14: TSOP-I 56 14mm x 20mm Package Outline
1
56
0.50 TYP
14.00 + 0.10
0.22 + 0.05
28
0.80 TYP
29
1.00 + 0.05
1.20 MAX
18.40 + 0.10
20.00 + 0.20
o
0.10 + 0.05 3 o + 2 o
3
0.60 + 0.10
DIE
0.10 MIN/
0.21 MAX
0.10 MAX
1. All dimensions are in millimeters.
Note:
Table 15: TSOP-I 56 14mm x 20mm Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Assembly (mm)
Courtyard (mm)
X
Y
R1
R2
ANOM
BNOM
V1
V2
19.4
0.25
1.1
17.65
14
18.4
14
20.7
14.3
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Silkscreen (mm)
C
1. See Figure 12 (page 14) for suggested land pattern.
16
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TN-12-25: NOR Land Pad Design
QFP Packages
QFP Packages
Figure 15: Calculated QFP Parameters
Silkscreen
Land pattern
Y
R1
X
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
Assembly
V1
79 77 75 73 71 69 67 65
80 78 76 74 72 70 68 66
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
R2
Courtyard
C2
ANOM
V2
BNOM
25 27 29 31 33 35 37 39
26 28 30 32 34 36 38 40
C1
QFP 48 12mm x 20mm
QFP assumptions:
•
•
•
•
•
•
•
•
•
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Toe (outside) goal = 0.15
Toe MIN = 0.17
Toe MAX goal = 0.43
Heal (in side) goal = 0.25
Heal MIN = 0.23
Heal MAX = 0.57
Side goal = 0.25
Side MIN = 0.23
Side MAX = 0.57
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TN-12-25: NOR Land Pad Design
QFP Packages
Figure 16: PQFP80 Package Outline
16
1
2.80 + 0.25
80
0.80 TYP
23.20 + 0.25
20.00 + 0.10
18.40 TYP
24
0.30 MIN/
0.45 MAX
3.40 MAX
12.00 TYP
0.10 MAX
14.00 + 0.10
1.60 TYP
17.20 + 0.25
0.13 MIN/
0.23 MAX
0.25 MIN
Note:
o
7o MAX
0 MIN
0.80 + 0.15
1. All dimensions are in millimeters.
Table 16: PQFP80 Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Silkscreen (mm)
Assembly (mm)
Courtyard (mm)
C
X
Y
C2
R1
R2
ANOM
BNOM
V1
V2
16.3
0.55
1.5
14.1
14.1
20.1
14
20
18
27
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
1. See Figure 15 (page 17) for suggested land pattern.
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TN-12-25: NOR Land Pad Design
BGA Packages
BGA Packages
BGA land pattern calculations are mainly based on ball size, but other features are also
considered. Variations that affect BGA land patterns include pitch, ball diameter, the
positional accuracy of the balls vs. the true position of the component on the PCB, and
the manufacturing allowance that can be held for the land on the substrate that mounts
the ball. Basically, the land pattern of the component (where the ball is attached) and
the land pattern of the substrate mounting structure (PCB) should be as close in size as
possible. Reducing the PCB land size by some percentage of the ball diameter is acceptable as well. The IPC-7351 table below show the parameters that may cause variations
of land pattern needed to describe variations in the system. This data is usually described at the MMC for NSMD lands.
Table 17: BGA Tolerances (Reproduced from the IPC-7351B Standard)
Tolerance values are in millimeters
Land Size
Location
Ball
MMC
LMC Allowance Variation
PCB
Fabrication
Allowance
Ball Size
Nominal
MMC
LMC
% Reduction
from Nominal
Variation
Allowance
0.60
0.50
0.10
0.25
0.10
0.75
0.90
0.65
25%
0.29
0.50
0.40
0.10
0.20
0.10
0.60
0.70
0.50
25%
0.24
0.45
0.35
0.10
0.15
0.10
0.55
0.65
0.45
25%
0.20
0.45
0.35
0.10
0.10
0.10
0.50
0.55
0.45
20%
0.17
0.40
0.30
0.10
0.10
0.10
0.45
0.50
0.40
20%
0.17
0.35
0.25
0.10
0.10
0.10
0.40
0.45
0.35
20%
0.17
0.25
0.20
0.05
0.10
0.05
0.30
0.35
0.25
20%
0.15
0.20
0.17
0.05
0.06
0.03
0.25
0.28
0.22
20%
0.08
0.20
0.14
0.05
0.04
0.03
0.20
0.22
0.18
15%
0.07
0.20
0.14
0.05
0.04
0.02
0.17
0.17
0.13
15%
0.07
0.18
0.12
0.05
0.04
0.02
0.15
0.15
0.10
15%
0.07
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
19
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TN-12-25: NOR Land Pad Design
BGA Packages
BGA Calculated Land Pattern Parameters
Figure 17: BGA Calculated Land Pattern Parameters
24-Ball TBGA land pattern
X
A1
A2
A3
A4
A5
B1
B2
B3
B4
B5
C1
C2
C3
C4
C5
D1
D2
D3
D4
E1
E2
E3
E4
X
A2
A3
A4
A5
A6
B8
B1
B2
B3
B4
B5
B6
C8
C1
C2
C3
C4
C5
C6
D1
D2
D3
D4
D5
D6
E1
E2
E3
E4
E5
E6
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
C1
C2
C3
C4
C5
C6
C7
D5
D1
D2
D3
D4
D5
D6
D7
D8
E5
E1
E2
E3
E4
E5
E6
E7
E8
C2
C2
F1
F2
F3
F4
F5
F6
F7
F8
F1
F2
F3
F4
F5
F6
G1
G2
G3
G4
G5
G6
G7
G8
G1
G2
G3
G4
G5
G6
H1
H2
H3
H4
H5
H6
H7
H8
H1
H2
H3
H4
H5
H6
VFBGA56 land pattern
X
X
A1
A1
C1
X
TFBGA48 land pattern
Easy BGA64 land pattern
C1
C1
TFBGA88 land pattern
lBGA80 land pattern
X
C2
A1
A2
A3
A4
A5
A6
A7
A8
A1
A2
A3
A4
A5
A6
A7
A8
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
B8
B1
B2
B3
B4
B5
B6
B7
B8
B1
B2
B3
B4
B5
B6
B7
B8
C1
C2
C3
C4
C5
C6
C7
C8
C1
C2
C3
C4
C5
C6
C7
C8
C1
C2
C3
C4
C5
C6
C7
C8
D1
D2
D3
D4
D5
D6
D7
D8
D1
D2
D3
D4
D5
D6
D7
D8
D1
D2
D3
D4
D5
D6
D7
D8
E1
E2
E3
E4
E5
E6
E7
E8
E1
E2
E3
E4
E5
E6
E7
E8
E1
E2
E3
E4
E5
E6
E7
E8
F1
F2
F3
F4
F5
F6
F7
F8
F1
F2
F3
F4
F5
F6
F7
F8
F1
F2
F3
F4
F5
F6
F7
F8
G1
G2
G3
G4
G5
G6
G7
G8
G1
G2
G3
G4
G5
G6
G7
G8
G1
G2
G3
G4
G5
G6
G7
G8
J1
J2
J3
J4
J5
J6
J7
J8
J1
J2
J3
J4
J5
J6
J7
J8
K1
K2
K3
K4
K5
K6
K7
K8
K1
K2
K3
K4
K5
K6
K7
K8
L1
L2
L3
L4
L5
L6
L7
L8
C1
C2
C2
C2
C1
M1 M2 M3 M4 M5 M6 M7 M8
C1
Table 18: BGA Packages and Parameter Values
Balls
Width (mm)
Length (mm)
Max
Thickness
(mm)
Easy BGA64 10 x 13 x 1.2mm
64
10
13
1.2
TBGA24 6 x 8 x 1mm
24
6
8
1
1
LBGA80 10 x 12 x 1.4mm
80
10
12
1.4
0.6
TFBGA88 8 x 10 x 1.2mm
88
8
10
1.2
0.8
TFBGA48 6 x 9 x 1.2mm
48
6
9
1.2
0.8
VFBGA56 7.7 x 9 x 1mm
56
7.7
9
1
0.75
Package Type
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
20
Pitch (mm)
1
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TN-12-25: NOR Land Pad Design
BGA Packages
24-Ball TBGA
Figure 18: 24-Ball TBGA Package Outline
0.79 TYP
Seating
plane
A
0.1 A
24X Ø0.40 ±0.05
Ball A1 ID
5
4
3
2
Ball A1 ID
1
A
B
C
4.00
8 ±0.10
D
1.00 TYP
E
1.00 TYP
1.20 MAX
4.00
0.20 MIN
6 ±0.10
Note:
1. All dimensions are in millimeters.
Table 19: 24-Ball TBGA Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
C1
C2
X
4
4
0.35
1. See Figure 17 (page 20) for suggested land pattern.
21
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
BGA Packages
Easy BGA64
Figure 19: Easy BGA64 Package Outline
0.78 TYP
Seating
plane
0.1
1.00 TYP
64X Ø0.43 ±0.1
1.5 ±0.1
8
7
6
5
4
3
2
Ball A1 ID
Ball A1 ID
1
0.5 ±0.1
A
B
C
D
8 ±0.1
E
F
1.00 TYP
G
H
10 ±0.1
1.20 MAX
Note:
1. All dimensions are in millimeters.
Table 20: Easy BGA64 Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
C1
C2
X
7
7
0.4
1. See Figure 17 (page 20) for suggested land pattern.
22
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
BGA Packages
TFBGA48
Figure 20: TFBGA48 Package Outline
6.00 + 0.10
1.00 TYP
1.70 TYP
4.00 TYP
0.40 TYP
0.40 TYP
9.00 + 0.10
Ball A1
5.60 TYP
0.10 MAX
0.80 TYP
0.80 TYP
0.40 + 0.05
1.00 MAX
1.20 MAX
Note:
0.20 MIN
1. All dimensions are in millimeters.
Table 21: TFBGA48 Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
C1
C2
X
4
5.6
0.35
1. See Figure 17 (page 20) for suggested land pattern.
23
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
BGA Packages
VFBGA56
Figure 21: VFBGA56 Package Outline
Seating plane
A
0.08 A
Ball A1 ID
56X Ø0.35 ±0.05
8
7
6
5
4
3
2
Ball A1 ID
1
A
B
C
9 ±0.1
D
4.5 CTR
E
F
G
0.75 TYP
0.75TYP
1 MAX
5.25 CTR
7.7 ±0.1
Note:
0.2 MIN
1. All dimensions are in millimeters.
Table 22: VFBGA56 Suggested Land Pattern Dimensions
Land Pattern (mm)
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Reference
C1
C2
X
Typical dimension
5.3
4.5
0.35
1. See Figure 17 (page 20) for suggested land pattern.
24
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
BGA Packages
TFBGA88
Figure 22: TFBGA88 Package Outline
Seating plane
A
0.1 A
88X Ø0.35 ±0.05
Ball A1 ID
8
7
6
5
4
3
2
Ball A1 ID
1
A
B
C
D
E
F
10 ±0.1
G
8.8 CTR
H
0.8 TYP
J
K
L
M
0.8 TYP
5.6 CTR
1.2 MAX
0.2 MIN
8 ±0.1
Note:
1. All dimensions are in millimeters.
Table 23: TFBGA88 Suggested Land Pattern Dimensions
Land Pattern (mm)
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
Reference
C1
C2
X
Typical dimension
5.6
8.8
0.35
1. See Figure 17 (page 20) for suggested land pattern.
25
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
BGA Packages
LBGA80
Figure 23: LBGA80 Package Outline
10.00 TYP
7.00 TYP
1.50 TYP
1.50 TYP
0.50 TYP
0.50 TYP
12.00 TYP
9.00 TYP
BALL A1
0.15 MAX
1.00 TYP
1.00 TYP
0.60 TYP
1.60 MAX
1.05 MAX
0.40 MIN
Note:
1. All dimensions are in millimeters.
Table 24: LBGA80 Suggested Land Pattern Dimensions
Land Pattern (mm)
Reference
Typical dimension
Note:
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
C1
C2
X
7
9
0.5
1. See Figure 17 (page 20) for suggested land pattern.
26
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TN-12-25: NOR Land Pad Design
Land Pattern Compatibility
Land Pattern Compatibility
Some small outline (SO) and dual flat no-lead (DFn) packages can use the same land
pattern on a PCB. SO8W and DFN8L 6 x 8mm packages have a very similar overall footprint; both packages fit the same area on the PCB. The shaded areas in the picture below indicate the areas that match between the DFN8L 6 x 8mm and the SO8W packages.
All of the dimensions for the DFN 6 x 8mm, particularly pads, are smaller than the corresponding maximum dimensions for the SO8W packages.
Figure 24: SO8W and DFN 6 x 8mm Land Pattern Compatibility
SO8W
DFN 6 x 8
Another difference between the packages is the DFN's central conductive pad, which
does not require a solder connection. Micron recommends that no PCB traces run below the DFN package, because they could short-circuit to the central pad. A recommended trace routing in the PCB specifically for DFN packages is shown in the figure below.
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
27
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
Land Pattern Compatibility
Figure 25: Recommended Trace Routing for DFN and SO Packages
Traces
No
Yes
Land pads
The same recommendations apply for SO8N and DFN 8L 5 x 6mm package compatibility. A complete analysis and verification of the design and requirements regarding the
variations between the packages should be made before attempting to match the PCB
land pad.
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
28
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© 2012 Micron Technology, Inc. All rights reserved.
TN-12-25: NOR Land Pad Design
Revision History
Revision History
Rev. A – 10/13
• Initial release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
PDF: 09005aef8503ed82
tn1225_land_pad_design.pdf - Rev. A 10/13 EN
29
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.