TS4982 2 W stereo audio power amplifier with ground-referenced headphone driver Features ■ 125 mW into 16 Ω load ground-referenced stereo headphone driver ■ Four-step gain settings on speaker path ■ 3 levels of 3D effect on speaker path ■ PC-beep input system detection ■ ±8 kV HBM ESD-protected headphone outputs ■ Pop and click reduction circuitry BYP NC 25 HRIN 26 28 3D0 29 VCC 30 17 32 G1 1 2 3D1 16 LHP 15 RHP 14 PVSS 13 CPVSS 12 CP- 3 LRIN LLIN 4 5 BEEP PGND 6 10 CP+ 9 CPVCC 8 7 LOUT+ CPGND LOUT- PVCC Block diagram 1 29 3D0 3D1 30 VCC PVCCL PVCCR ROUT+ 3 2 23 LLIN ROUT- STEREO LOUDSPEAKER AUDIO INPUT LRIN SPKREN 4 31 32 LOUT+ BEEP G0 PGNDR GAIN PC BEEP & DETECTION CONTROL PGNDL G1 HPVCC 27 26 22 HLIN STEREO HEADPHONE AUDIO INPUT HRIN HDEN LHP RHP 28 20 19 6 7 21 5 17 16 15 CHARGE PUMP BIAS CPVSS BYP CP- 24 8 18 3D LOUT- GND The TS4982 features a PC beep input, three levels of 3D stereo enhancement and 4-step gain control using two digital input pins. Minimum external components make the TS4982 wellsuited for notebook and other hand-held sound equipment. It also has an internal thermal shutdown (150° C) and output short circuit protection mechanism. HPVCC 18 11 t e l o s b O PVCC K982 13 r P e 19 31 od The TS4982 features a stereo loudspeaker driver and a ground-referenced stereo headphone driver. An independent standby mode pin allows the TS4982 to simultaneously drive both output drivers. Operating on a single 5 V supply, the TS4982 delivers 2 W (typ.) output power into a 4 Ω load at 1% THD+N. ROUT- 20 CP+ t c u so b O ROUT+ 21 e t e l 27 HLIN G0 Pr PGND 12 Description 23 22 CPGND ) (s Laptop/notebook computers Portable audio devices u d o 10 Thermal shutdown and output short-circuit protection(a) Applications ■ HDEN CPVCC 32-pin 5 x 5 mm QFN package GND ■ SPKREN 24 9 ■ ) s ( ct Pinout (top view) 11 ■ TS4982 - QFN 32 PVSS 2 W output power into 4 Ω load per channel 14 ■ a. Patented US#: 2009/0102561, EP#: 1978636 June 2009 Doc ID 14527 Rev 2 1/31 www.st.com 31 Contents TS4982 Contents 1 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3 2 Typical application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 3.1 Electrical characteristics tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ) s ( ct Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 u d o 4.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.2 Loudspeaker BTL configuration principle . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3 Power dissipation and efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.4 Loudspeaker 3D effect enhancement . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.5 Low frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.6 Gain settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.7 PC beep . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.8 Decoupling and charge pump capacitors . . . . . . . . . . . . . . . . . . . . . . . . . 22 r P e t e l o 4.8.1 ) (s od r P e 5 Charge pump capacitors Cp and Cps . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.9 Wake-up time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.10 Standby time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.11 Pop & click . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.12 Headphone jack detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.13 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 t e l o O t c u Decoupling capacitors Cs and Cb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.8.2 bs s b O Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.1 QFN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2/31 Doc ID 14527 Rev 2 TS4982 1 Absolute maximum ratings and operating conditions Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings Symbol VCC PVCCL PVCCR HPVCC CPVCC Parameter Supply voltage (1) Vin Input voltage Loudspeaker inputs Headphone inputs VHDEN= VIH VHDEN= VIL V Storage temperature u d o Maximum junction temperature Power dissipation (2) s b O HBM: human body model All pins except headphone outputs(4) Headphone output pins (LHP, RHP)(5) -65 to +150 °C 150 °C 80 °C/W Internally limited(3) kV 200 V 1500 V Latch-up immunity 200 mA Lead temperature (soldering, 10 sec) 260 °C ) (s t c u CDM: charged device model(7) od Pr °C 2 8 MM: machine model(6) Latch-up -40 to + 85 r P e t e l o Thermal resistance junction to ambient ESD V ) s ( ct Tstg Pd 6 -3 to 3 -0.3 to VCC + 0.3 Operating free-air temperature range Rthja Unit -0.3 to VCC + 0.3 Toper Tj Value 1. All voltage values are measured with respect to the ground pin. e t e ol 2. Device is protected in case of over-temperature by a thermal shutdown active at 150° C. 3. Exceeding the power derating curves during a long period can cause abnormal operation. s b O 4. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 5. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 kΩ resistor between two pins of the device. This is done between headphone output pins, between headphone output pins and VCC, GND. The other pins are floating. 6. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. 7. Charged device model: all pins and package are charged together to the specified voltage and then discharged directly to ground through only one pin. Doc ID 14527 Rev 2 3/31 Absolute maximum ratings and operating conditions Table 2. TS4982 Operating conditions Symbol Parameter Value Unit (1) VCC PVCCL PVCCR Common power supply voltage Left channel loudspeaker amplifier power supply Right channel loudspeaker amplifier power supply 4.5 to 5.5 V HPVCC CPVCC Headphone supply voltage(2) Negative charge pump supply voltage 3 to VCC V ≥ 4 ≥ 16 Ω -40 to +85 °C RL Toper Load resistor Speaker output Headphone output Operating free-air temperature range ) s ( ct VIH High-level input voltage 3D0, 3D1, G0, G1, HDEN, SPKREN pin(3) 2.0 ≤ VIH ≤ VCC V VIL Low-level input voltage 3D0, 3D1, G0, G1, HDEN, SPKREN pin(3) GND ≤ VIL ≤ 0.8 V Rthja Thermal resistance junction to ambient(4) 25 °C/W r P e u d o t e l o 1. VCC, PVCCL and PVCCR must be shorted or at the same voltage. 2. HPVCC and CPVCC must be shorted or at the same voltage. 3. Any digital pins (3D0, 3D1, G0, G1, SPKREN, HDEN) must not be left floating. 4. With 4-layer PCB. Table 3. SPKREN HDEN 0 0 0 1 1 1 e t e ol ) (s Operating modes s b O VSPKREN VHDEN Speaker amplifier Headphone amplifier VIL VIL ENABLED DISABLED (standby) ct du VIL VIH ENABLED ENABLED 0 VIH VIL DISABLED (standby) DISABLED (standby) 1 VIH VIH DISABLED (standby) ENABLED o r P s b O 4/31 Doc ID 14527 Rev 2 Typical application Typical application Figure 1. Typical application schematics 3D EFFECT (LSB) CONTROL 2 Vcc Cs 3D EFFECT (MSB) CONTROL TS4982 1uF Vcc Cs Vcc 1uF Cs PVCCL PVCCR ROUT+ LEFT SPEAKER INPUT RIGHT SPEAKER INPUT Cin 1uF 3 Cin 1uF 2 23 SPEAKER STANDBY CONTROL Cinbeep 47nF Rin 47k LLIN ROUT- STEREO LOUDSPEAKER AUDIO INPUT LRIN SPKREN LOUT+ PC BEEP INPUT 31 GAIN SETTING (LSB) CONTROL 32 GAIN SETTING (MSB) CONTROL PGNDR PC BEEP & GAIN DETECTION CONTROL G0 PGNDL let G1 HPVCC du e t e ol o r P O bs GND Cs 1uF 20 LEFT SPEAKER 19 u d o 6 7 21 RIGHT SPEAKER GND 5 17 HPVcc Cs 1uF GND LHP RHP 16 HEADPHONE JACK 15 PVSS GND 14 9 28 ct CPVSS ) (s GND GND Table 4. b O CHARGE PUMP BIAS BYP 1uF so CP- HDEN 13 24 Cb STEREO HEADPHONE AUDIO INPUT HRIN CP+ 22 12 1uF 26 CPGND Cin HEADPHONE STANDBY CONTROL HLIN 10 1uF 27 CPVCC LEFT HEADPHONE INPUT Cin 11 RIGHT HEADPHONE INPUT 18 r P e BEEP ) s ( ct 8 3D LOUT- 4 GND 1 3D1 VCC TS4982 3D0 30 29 GND GND 1uF Cp GND 1uF Cps 1uF GND HPVcc GND External component description Components Value Functional description Cs, Cps 1μF Supply decoupling capacitor that provides power supply filtering. Cb 1μF Bypass decoupling capacitor that provides half-supply filtering. Cin 1μF Input coupling capacitors that block the DC voltage at the amplifier input terminal. The capacitors also form a high-pass filter with Zin. Cinbeep 47nF Input coupling capacitors that block the DC voltage at the PCBEEP input terminal. The capacitors also form a high-pass filter with Rin. Rin 47kΩ Inverting input resistor for PCBEEP input. Together with the internal 47 kΩ feedback resistor the PC beep input gain can be adjusted to change a voltage detection level. Cp 1μF Flying capacitor for the negative charge pump. Doc ID 14527 Rev 2 5/31 Typical application Table 5. TS4982 Pin descriptions Pin number Pin name I/O/P(1) 1 3D1 I 3D effect MSB input pin 2 LRIN I Right channel loudspeaker amplifier input 3 LLIN I Left channel loudspeaker amplifier input 4 BEEP I PC BEEP input 5 PGND P Loudspeaker amplifier power ground 6 LOUT+ O Left channel loudspeaker positive output 7 LOUT- O Left channel loudspeaker negative output 8 PVCC P Loudspeaker amplifier power supply 9 CPVCC P Charge pump power supply 10 CP+ I/O 11 CPGND P 12 CP- I/O 13 CPVSS P Charge pump output, must be shorted to PVSS 14 PVSS P Headphone amplifier negative power supply, must be shorted to CPVSS, no external supply allowed 15 RHP O Right channel headphone output 16 LHP O Left channel headphone output 17 HPVCC P Headphone amplifier positive power supply 18 PVCC P Loudspeaker amplifier power supply 19 ROUT- O 20 ROUT+ O 21 PGND 22 HDEN 24 o s b 25 O Charge pump flying capacitor positive pin r P e Charge pump flying capacitor negative pin t e l o P ) (s s b O t c u Right channel loudspeaker negative output Left channel loudspeaker positive output Loudspeaker amplifier power ground I Headphone standby input pin SPKREN I Loudspeaker standby input pin, BYP I Common mode bias voltage NC Not internally connected 26 HRIN I Right channel headphone amplifier input 27 HLIN I Left channel headphone amplifier input GND P Device ground 29 3D0 I 3D effect LSB input pin 30 VCC P Common power supply 31 G0 I Gain control LSB input pin 32 G1 I Gain control MSB input pin P Thermal pad to be soldered to the ground plane of the PCB 28 (2) EXPAD 1. I - input, O - output, P - passive or power. 2. All GNDs are internally-connected together. 6/31 Doc ID 14527 Rev 2 ) s ( ct u d o Charge pump ground d o r P e let 23 Pin description TS4982 Electrical characteristics 3 Electrical characteristics 3.1 Electrical characteristics tables Table 6. General electrical characteristics, VCC = PVCC = HPVcc = CPVcc = 5V, Tamb = 25° C (unless otherwise specified) Symbol Parameter Min. Max. Unit 12 10 mA ICC Current consumption, no load Speaker mode, VSPKREN = VHDEN = GND Headphone mode, VSPKREN = VHDEN = VCC 8 6 ISTBY Standby current consumption, no input signal VHDEN = GND, VSPKREN = VCC, 1 Iin Level input current G0, G1, 3D0, 3D1, SPKREN, HDEN pins Zin Input impedance Table 7. PO e t e ol s b O Parameter Min. Output power THD+N = 1%, RL = 4 Ω, f = 1 kHz )- s ( t c u d o Differential output offset voltage, no load, inputs AC grounded, gain = 13.5 dB, V3D0 = V3D1 = VCC r P e Gain Gain G0 = G1 = VIL G0 = VIH, G1 = VIL G0 = VIL, G1 = VIH G0 = G1 = VIH Gerr Gain error t e l o 30 µA 1 µA 36 kΩ Typ. -35 Unit W 0.08 -62 % dB 35 9 10.5 12 13.5 ratio(1) Max. 2 Total harmonic distortion plus noise, THD + N PO = 1.5 W, RL = 4 Ω, 20 Hz ≤F ≤20 kHz, BW = 22 Hz to 22 kHz Voo u d o Pr 24 ) s ( ct 5 Loudspeaker amplifier, VCC = PVCCL,R = 5 V, VHDEN = VSPKREN = GND, Cb = Cin = Cs = 1 μF, V3D0 = V3D1 = GND, gain = 9 dB, Tamb = 25° C (unless otherwise specified) Symbol s b O Typ. mV dB 0.5 dB PSRR Speaker power supply rejection RL = 4 Ω, Vripple = 200 mVpp, F = 1 kHz -75 dB XT Channel crosstalk Po = 1.5 W, RL = 4 Ω, 20 Hz ≤F ≤20 kHz -85 dB Vn Output noise voltage, A-weighted filter, RL = 4 Ω Gain = 9 dB, V3D0 = V3D1 = GND Gain = 13.5 dB, V3D0 = V3D1 = VCC 17 87 µVrms SNR Signal to noise ratio, A-weighted filter, RL = 4 Ω Po = 2 W, THD+N = 1%, F = 1 kHz 103 dB Doc ID 14527 Rev 2 7/31 Electrical characteristics Table 7. TS4982 Loudspeaker amplifier, VCC = PVCCL,R = 5 V, VHDEN = VSPKREN = GND, Cb = Cin = Cs = 1 μF, V3D0 = V3D1 = GND, gain = 9 dB, Tamb = 25° C (unless otherwise specified) (continued) Symbol Parameter CL Capacitive load RL = 4 Ω to 100 Ω RL > 100 Ω tWU Wake up time tSTBY Standby time Min. Typ. Max. Unit 400 100 pF 10 ms 200 μs 6 1. Dynamic selective measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is an added sinus signal to VCC and PVCCL,R. Table 8. ) s ( ct Headphone amplifier, VCC = PVCCL,R = HPVCC = CPVCC= 5 V , VHDEN = VSPKREN = VCC, Cb = Cin = Cs = Cp = Cps = 1 μF, V3D0 = V3D1 = GND, AV = 3.5 dB, Tamb = 25° C (unless otherwise specified) Symbol PO THD+N Voo Parameter Min. Output power, THD+N = 1%, RL = 16 Ω, F = 1 kHz, HPVCC = CPVCC = 5 V HPVCC = CPVCC = 3 V O ) Output offset voltage, inputs AC grounded, no load Gain GERR Gain error s ( t c -10 Max. 125 65 mW 0.05 -66 % dB 0 10 mV 0.5 dB Power supply rejection ratio RL = 16 Ω, Vripple = 200 mVpp, F = 1 kHz -75 dB XT Channel crosstalk PO = 100 mW, RL = 16 Ω, 20 Hz ≤F ≤20 kHz -75 dB Vn Output noise voltage, A-weighted filter, RL = 16 Ω HPVCC = CPVCC = 5 V HPVCC = CPVCC = 3 V 10 10 µVrms 102 dB u d o (1) SNR Signal-to-noise ratio PO = 125 mW, RL = 16 Ω, A-weighted filter CL Capacitive load RL = 16 Ω to 100 Ω RL > 100 Ω tWU Wake-up time tSTBY Standby time 6 400 100 pF 10 ms 200 μs 1. Dynamic selective measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is an added sinus signal to HPVCC and CPVCC. 8/31 Unit dB r P e s b O 100 35 Typ. 3.5 PSRR t e l o e t e l o s b Total harmonic distortion plus noise PO = 100 mW, RL = 16 Ω, 20 Hz ≤F ≤20 kHz, BW = 22 Hz to 22 kHz Gain Pr u d o Doc ID 14527 Rev 2 TS4982 Electrical characteristics Table 9. Internal charge pump stage Symbol Parameter Internal frequency of charge pump across temperature range fosc Table 10. Typ. Max. Unit 400 550 800 kHz Min. Typ. Max. Unit PC beep input stage, RIN = 47 kΩ, CIN = 47 nF Symbol 3.2 Min. Parameter Vbeep Beep signal minimum amplitude 0.8 Vpp fbeep Beep signal minimum frequency 400 Hz ) s ( ct Electrical characteristic curves Table 11. u d o Index of graphics Description r P e Current consumption vs. power supply voltage let Current consumption vs. standby voltage Power derating curves o s b Speaker output power vs. power supply O ) Headphone output power vs. power supply Speaker output power vs. load resistance t(s Headphone output power vs. load resistance uc THD+N vs. output power od 2 3, 4 5 6, 7 8, 9 10 11 12 - 19 THD+N vs. frequency 20 - 23 Pr 24, 25 PSRR vs. frequency Wake-up and standby time 26 - 29 Crosstalk vs. frequency 30 - 33 e t e l o s b Figure Channel isolation vs frequency 34 Total power dissipation vs. output power 35 - 37 O Doc ID 14527 Rev 2 9/31 Electrical characteristics Figure 2. TS4982 Current consumption vs. power supply voltage Figure 3. 10 12 no load SPEAKER V SPKREN = V HDEN = GND Current Consumption (mA) T AMB = 25°C Current Consumption (mA) Current consumption vs. standby voltage 8 6 4 HEADPHONE V SPKREN = V HDEN = V CC 2 V CC= PV CCL,R = 5V 0 3.0 3.5 4.0 4.5 5.0 SPEAKER V CC = PV CCL,R = 5V, V HDEN = GND 10 no load, T AMB = 25°C 8 6 4 2 0 5.5 0 1 2 SPKREN pin Voltage (V) Current consumption vs. standby voltage Figure 5. 8 7 no load, T AMB = 25°C 6 5 ) s ( ct 4 CPV CC = HPV CC = 3V du 1 0 -O CPV CC = HPV CC = 5V 3 2 0 1 2 P e ro 3 4 t e l o bs 3.5 2 1 0 25 Output power vs. power supply Figure 7. 2.0 Output Power (W) 2.0 1.5 1.0 THD+N = 1% 0.0 4.5 10/31 75 100 125 150 Output power vs. power supply 2.5 THD+N = 10% 2.5 0.5 50 Ambient Temperature (° C) 3.0 Output Power (W) O No Heat sink 3 0 5 With 4-layer PCB 4 HDEN pin Voltage (V) Figure 6. r P e bs 5 5 Power derating curves t e l o 6 Package Power Dissipation (W) Current Consumption (mA) 9 HEADPHONE V CC = PV CCL,R = 5V, V SPKREN = V CC 4 u d o Power Supply Voltage (V) Figure 4. ) s ( ct 3 SPEAKER R L = 4 Ω , F = 1kHz THD+N = 10% BW = 22Hz to 22kHz T AMB = 25 ° C 1.5 1.0 THD+N = 1% 0.5 BW = 22Hz to 22kHz T AMB = 25° C 5.0 Power Supply Voltage V CC= PV CCL,R (V) SPEAKER R L = 8 Ω , F = 1kHz 5.5 0.0 4.5 Doc ID 14527 Rev 2 5.0 Power Supply Voltage V CC = PV CCL,R (V) 5.5 TS4982 Electrical characteristics Figure 8. Output power vs. power supply Figure 9. 200 Output power vs. power supply 120 THD+N = 10% THD+N = 10% 100 Output Power (mW) Output Power (mW) 150 100 HEADPHONE V CC = PV CCL,R = 5V 50 R L= 16 Ω , F = 1kHz THD+N = 1% 80 60 THD+N = 1% 3.5 4.0 4.5 5.0 Power Supply Voltage HPV CC= CPV CC (V) 120 F = 1kHz, BW = 22Hz to 22kHz T AMB = 25° C 100 1.5 )- s ( t c 0 du 10 20 30 40 Load Resistance (Ω ) 50 o r P e t e ol s b O e t e ol o r P s b O 80 HEADPHONE V CC = PV CCL,R= 5V, THD+N = 1% F = 1kHz, BW = 22Hz to 22kHz T AMB = 25° C 40 20 0 0 40 80 120 Load Resistance (Ω ) 200 10 SPEAKER R L= 4Ω , V CC= PV CCL,R= 5V Gain = 9dB, T AMB= 25 ° C Gain = 13.5dB, T AMB= 25° C BW = 22Hz to 22kHz BW = 22Hz to 22kHz F = 1kHz THD + N (%) 1 F = 6kHz 0.1 0.01 1E-3 160 Figure 13. THD+N vs. output power SPEAKER R L= 4 Ω , V CC= PV CCL,R = 5V F = 60Hz HPV CC= CPV CC = 5V HPV CC = CPV CC= 3V 60 60 Figure 12. THD+N vs. output power 10 Output Power (mW) Output Power (W) SPEAKER V CC = PV CCL,R = 5V, THD+N = 1% 1.0 5.5 c u d 140 0.5 THD + N (%) ) s ( t 3.5 4.0 4.5 5.0 Power Supply Voltage HPV CC = CPV CC (V) Figure 11. Output power vs. load resistance 2.5 0.0 BW = 22Hz to 22kHz TAMB = 25 ° C 0 3.0 5.5 Figure 10. Output power vs. load resistance 2.0 R L= 32 Ω , F = 1kHz 20 BW = 22Hz to 22kHz TAMB = 25 ° C 0 3.0 HEADPHONE V CC = PV CCL,R = 5V 40 1 F = 60Hz F = 1kHz F = 6kHz 0.1 0.01 0.1 Output Power (W) 1 3 0.01 1E-3 Doc ID 14527 Rev 2 0.01 0.1 Output Power (W) 1 3 11/31 Electrical characteristics TS4982 Figure 14. THD+N vs. output power Figure 15. THD+N vs. output power 10 10 SPEAKER R L= 8 Ω , V CC = PV CCL,R = 5V SPEAKER R L= 8Ω , V CC= PV CCL,R= 5V Gain = 9dB, T AMB= 25 ° C Gain = 13.5dB, T AMB= 25° C BW = 22Hz to 22kHz BW = 22Hz to 22kHz F = 6kHz F = 1kHz F = 60Hz THD + N (%) THD + N (%) 1 0.1 1 F = 6kHz F = 60Hz 0.1 0.01 1E-3 0.01 0.1 Output Power (W) 1 3 Figure 16. THD+N vs. output power 0.01 1E-3 F = 60Hz ) (s 0.01 ct F = 1kHz du 10 Output Power (mW) 100 200 o r P F = 60Hz 0.01 F = 6kHz F = 1kHz 1E-3 1 10 Output Power (mW) 100 200 10 HEADPHONE HPV CC = CPV CC= 5V, R L= 32Ω V CC = PV CCL,R = 5V, T AMB= 25 ° C V CC = PV CCL,R = 5V, T AMB= 25° C 1 BW = 22Hz to 22kHz THD + N (%) THD + N (%) 0.1 HEADPHONE HPV CC = CPV CC= 3V, R L= 32Ω F = 60Hz 0.01 BW = 22Hz to 22kHz 0.1 F = 60Hz 0.01 F = 1kHz 12/31 s b O Figure 19. THD+N vs. output power 0.1 1E-3 BW = 22Hz to 22kHz F = 6kHz Figure 18. THD+N vs. output power s b O THD + N (%) THD + N (%) 0.1 e t e ol t e l o V CC = PV CCL,R = 5V, T AMB= 25° C 1 BW = 22Hz to 22kHz 10 3 HEADPHONE HPV CC = CPV CC= 5V, R L= 16Ω V CC= PV CCL,R= 5V, T AMB= 25° C 1 1 r P e 10 1 ) s ( ct 0.1 Output Power (W) u d o HEADPHONE HPV CC= CPV CC = 3V, R L= 16 Ω 1 0.01 Figure 17. THD+N vs. output power 10 1E-3 F = 1kHz 1 10 Output Power (mW) F = 6kHz F = 6kHz 100 F = 1kHz 200 1E-3 1 Doc ID 14527 Rev 2 10 Output Power (mW) 100 200 TS4982 Electrical characteristics Figure 20. THD+N vs. frequency Figure 21. THD+N vs. frequency 10 10 SPEAKER P O = 1.5W, R L= 4Ω SPEAKER P O = 1W, R L= 8Ω V CC = PV CCL,R = 5V, T AMB = 25° C Gain = 13.5dB Gain = 9dB 0.1 0.01 20 100 BW = 22Hz to 22kHz 1 THD + N (%) THD + N (%) V CC = PV CCL,R = 5V, T AMB = 25° C BW = 22Hz to 22kHz 1 0.01 10000 20k 1000 Frequency (Hz) Figure 22. THD+N vs. frequency 0.1 Gain = 9dB 20 HEADPHONE R L= 32 Ω t e l o V CC = PV CCL,R= 5V, TAMB = 25° C V CC = PV CCL,R= 5V, T AMB = 25° C BW = 22Hz to 22kHz )- P O = 50mW s ( t c du 1000 Frequency (Hz) o r P R L ≥ 4Ω , Cin = Cb = 1 μ F, T AMB= 25° C 1000 Frequency (Hz) 10000 20k R L≥ 16 Ω , Cin = 1 μ F, T AMB= 25 ° C Inputs AC grounded -40 100 HEADPHONE V CC = PV CCL,R = 5V, Vripple = 200mV PP -20 Inputs AC grounded Gain = 13.5dB PSRR (dB) PSRR (dB) O P O= 60mW P O= 40mW 0 SPEAKER V CC = PV CCL,R = 5V, Vripple = 200mV PP -20 20 HPV CC = CPV CC= 5V HPV CC = CPV CC= 3V Figure 25. Power supply rejection ratio vs. frequency 0 bs 0.1 0.01 10000 20k Figure 24. Power supply rejection ratio vs. frequency e t e ol s b O THD + N (%) THD + N (%) P O=100mW HPV CC= CPV CC= 3V 100 BW = 22Hz to 22kHz 1 HPV CC= CPV CC = 5V 20 10000 20k r P e 10 0.1 ) s ( ct 1000 Frequency (Hz) u d o HEADPHONE R L= 16 Ω 0.01 100 Figure 23. THD+N vs. frequency 10 1 Gain = 13.5dB -60 -80 -40 HPV CC = CPV CC= 5V -60 -80 Gain = 9dB -100 -100 HPV CC = CPV CC = 3V -120 20 100 1k 10k 20k -120 20 Frequency (Hz) 100 1k 10k 20k Frequency (Hz) Doc ID 14527 Rev 2 13/31 Electrical characteristics TS4982 Figure 26. Wake-up time, VCC=PVCCL,R=CPVCC=HPVCC=5V, VSPKREN=VIH Figure 27. Standby time, VCC=PVCCL,R=CPVCC=HPVCC=5V, VSPKREN=VIH ) s ( ct Figure 28. Wake-up time, VCC=PVCCL,R=CPVCC=HPVCC=5V, VHDEN=VIL ) (s u d o r P e Figure 29. Standby time, VCC=PVCCL,R=CPVCC=HPVCC=5V, VHDEN=VIL t e l o s b O t c u d o r P e t e l o Figure 30. Crosstalk vs. frequency 0 SPEAKER V CC = PV CCL,R = 5V, P O = 1.5W -20 Crosstalk (dB) O 0 R L= 4 Ω , Gain = 13.5dB, T AMB= 25 ° C R L= 4 Ω , Gain = 9dB, T AMB= 25 ° C -40 -60 Left to Right channel Right to Left channel -80 -100 -120 14/31 SPEAKER V CC = PV CCL,R = 5V, P O = 1.5W -20 Crosstalk (dB) bs Figure 31. Crosstalk vs. frequency -40 -60 Left to Right channel Right to Left channel -80 -100 20 100 1000 Frequency (Hz) 10000 20k -120 20 Doc ID 14527 Rev 2 100 1000 Frequency (Hz) 10000 20k TS4982 Electrical characteristics Figure 32. Crosstalk vs. frequency Figure 33. Crosstalk vs. frequency 0 0 HEADPHONE V CC= PV CCL,R = 5V, HPV CC= CPV CC= 3V -20 P O = 50mW, R L= 16Ω , T AMB= 25° C Crosstalk (dB) Crosstalk (dB) -20 -40 Right to Left channel -60 Left to Right channel -80 -100 P O = 100mW, R L= 16 Ω , T AMB= 25 ° C -40 Left to Right channel -60 Right to Left channel -80 20 100 -100 10000 20k 1000 Frequency (Hz) 20 100 ) s ( ct 1000 Frequency (Hz) 10000 20k u d o Figure 34. Inter-channel isolation vs. frequency Figure 35. Power dissipation vs. output power per one channel r P e 2.0 120 t e l o SPEAKER V CC= PV CCL,R = 5V, F = 1kHz, THD+N < 1% 80 Speaker (Pout = 1.5W) to Headphone Headphone (Pout = 100mW) to Speaker 60 40 )- s ( t c V CC= PV CC = HPV CC= CPV CC = 5V T AMB= 25 ° C 20 Power Dissipation (W) 100 Interchannel Isolation (dB) HEADPHONE V CC= PV CCL,R= CPV CC= HPV CC= 5V 1.6 s b O 1.2 R L= 4Ω R L= 8Ω 0.8 0.4 Headphone: R L= 16 Ω u d o Speaker: R L= 4Ω 0 20 100 0.0 0.0 10000 20k 1000 Frequency (Hz) r P e t e l o 0.5 1.0 1.5 Output Power (W) 2.0 Figure 36. Power dissipation vs. output power Figure 37. Power dissipation vs. output power per one channel per one channel bs 320 100 Power Dissipation (mW) O Power Dissipation (mW) 120 80 R L= 16Ω 60 40 R L= 32Ω 20 HEADPHONE V CC = PV CCL,R = 5V 240 R L= 16Ω 160 80 R L= 32Ω HPV CC= CPV CC = 5V HPV CC= CPV CC = 3V F = 1kHz, THD+N < 1% F = 1kHz, THD+N < 1% 0 0 10 20 30 40 50 60 Output Power (mW) 70 HEADPHONE V CC = PV CCL,R = 5V 80 0 0 Doc ID 14527 Rev 2 40 80 120 Output Power (mW) 160 15/31 Application information TS4982 4 Application information 4.1 General description The TS4982 is a stereo loudspeaker power amplifier and ground-referenced headphone driver with dedicated separated single-ended inputs in a QFN32 package, which is the best solution in space-saving applications. Each of the audio paths, loudspeaker or headphone, can be independently set to standby mode to save battery life. The loudspeaker amplifier with BTL output configuration (see Section 4.2: Loudspeaker BTL configuration principle on page 16) can deliver 2 W output power into a 4 Ω load with both channels enabled at 1% THD+N with a nominal power supply of 5 V. The gain (see Section 4.2) of the loudspeaker amplifier can be set to four discrete levels thanks to two digital inputs. The stereo sound perception which could seem poor in an application (notebook) can be enhanced by a 3D effect internal block in three levels (see Section 4.3: Power dissipation and efficiency on page 17). ) s ( ct u d o In the audio path which is not in standby mode, a PC beep signal is mixed if it is detected (see Section 4.7: PC beep on page 21) on the PC beep input. r P e The outputs are protected against over-current consumption which can appear when the outputs are short-circuited between them or to GND or Vcc. There is also an internal thermal shutdown activated at 150° C (typical) and deactivated at 120° C (typical). t e l o 4.2 s b O Loudspeaker BTL configuration principle ) (s Figure 38. Simplified schematic of the loudspeaker amplifier od t c u INPUT r P e t e l o s b O 16/31 BIAS Av=1 + Vout1 Av=-1 + Doc ID 14527 Rev 2 Vout2 TS4982 Application information Bridge tied load (BTL) means that each end of the load is connected to two single-ended output amplifiers. Therefore, we have: Single-ended output 1 = Vout1 = Vout Single-ended output 2 = Vout2 = -Vout BTL output = Vout1 - Vout2 = 2Vout The output power is: 2 ( 2V outRMS ) P out = -----------------------------------RL For the same power supply voltage, the output power in a BTL configuration is four times higher than the output power in a single-ended configuration. 4.3 ) s ( ct Power dissipation and efficiency Hypotheses: r P e The voltage and current in the load are sinusoidal (Vout and Iout). The supply voltage is a pure DC source (Vcc). t e l o Regarding the load we have: V out = V PEAK sin ωt and )- s ( t c and du o r P u d o s b O V out I out = ------------RL V PEAK 2 P out = -----------------------2R L (V) (A) (W) Therefore, the average current delivered by the supply voltage is: e t e l O o s b I CC AVG V PEAK = 2 -----------------πRL (A) Figure 39. Current delivered by power supply voltage Icc (t) Vpeak/RL IccAVG 0 T/2 T Doc ID 14527 Rev 2 3T/2 2T Time 17/31 Application information TS4982 The power delivered by the supply voltage is: P supply = V CC ⋅ I CC AVG (W) Then, the power dissipated by each amplifier is: (W) P diss = P supply – P out 2 2V CC P diss = ------------------------ ⋅ π RL (W) P out – P out and the maximum value is obtained when: ) s ( ct ∂ P diss --------------------- = 0 ∂ P out u d o and its value is: 2 2V cc P dissmax = -----------π2 R L r P e (W) t e l o This maximum value only depends on the power supply voltage and load values. The efficiency, η, is the ratio between the output power and the power supply: bs P πV out PEAK η = -------------------- = ------------------------ P supply O ) 4V CC The maximum theoretical value is reached when: – VPEAK = VCC for the loudspeaker part, so that: s ( t c u d o r P e π η= --- = 78.5% 4 t e l o s b O 18/31 – VPEAK = VCC /2 for the headphone part, so that: π η= --- = 39.3% 8 Doc ID 14527 Rev 2 TS4982 4.4 Application information Loudspeaker 3D effect enhancement The TS4982 features a 3D audio effect which can be programmed at three discrete levels (LOW, MEDIUM, HIGH) through input pins 3D1 and 3D0 which provide a digital interface. The correspondence between the logic levels of this interface and 3D effect levels are shown in the Table 12 on page 19. The 3D audio effect applied to the stereo audio signals evokes perception of spatial hearing and improves this effect in cases where the stereo speakers are too close to each other, such as in small handheld devices or mobile equipment. The perceived amount of 3D effect also depends on many factors such as speaker position, distance between speakers and listener, frequency spectrum of the audio signal, or the difference of signal between the left and right channels. In some cases, the volume can increase when the 3D effect is switched on. This factor depends on the composition of the stereo audio signal and its frequency spectrum. Table 12. ) s ( ct 3D1 3D0 V3D1 V3D0 0 0 VIL VIL 0 1 VIL 1 0 VIH 1 1 VIH ) Low frequency response s ( t c u d o r P e t e ol 4.5 u d o 3D effect settings r P e t e l o s b O 3D effect level OFF VIH LOW VIL MEDIUM VIH HIGH Figure 40. Simplified schematic of input stage External s b O Internal (TS4982) Rfeed Cin Rin INPUT BIAS In the low-frequency region, the input coupling capacitor Cin starts to have an effect. Cin forms, with the Rin, a first order high-pass filter with a -3 dB cut-off frequency: 1 F CL = ---------------------------------------2π ⋅ Rin ⋅ Cin Doc ID 14527 Rev 2 19/31 Application information TS4982 In this case we can consider that Rin equals Zin. So, for a desired cut-off frequency FCL, Cin is calculated as follows: 1 Cin = --------------------------------------2π ⋅ Zin ⋅ F CL The input impedance Zin is for the whole power supply voltage range, typically 30 kΩ . There is also a tolerance around the typical value (see Table 6 on page 7) and it must be taken into account. In the typical application, Cin =1 μ F, then FCL = 5.3 Hz. If FCL is required higher to limit low frequencies, it must be taken account that the speaker’s PSRR performance for the low frequency region is decreased. The headphone PSRR remains the same. ) s ( ct Figure 41. PSRR vs. frequency 0 -20 R L ≥ 4 Ω , Cb = 1 μ F, T AMB= 25 ° C, Gain = 9dB r P e Inputs AC grounded -40 PSRR (dB) u d o SPEAKER V CC = PV CCL,R = 5V, Vripple = 200mV PP Cb = 100nF t e l o Cb = 220nF -60 -80 -100 s b O Cb = 1μ F )- -120 100 20 s ( t c Cb = 470nF 1k 10k 20k Frequency (Hz) u d o 4.6 Gain settings r P e In the flat region of the frequency-response curve (no input coupling capacitor or internal feedback loop + load effect) the gain of the loudspeaker amplifier can be set in four discrete levels thanks to the two digital inputs G1 and G0. t e l o s b O 20/31 The headphone amplifier gain does not depend on the loudspeaker gain setting and is kept equal to 3.5 dB. Table 13. Gain settings G1 G0 VG1 VG0 Loudspeaker amplifier gain (dB) Headphone amplifier gain (dB) 0 0 VIL VIL 9 3.5 0 1 VIL VIH 10.5 3.5 1 0 VIH VIL 12 3.5 1 1 VIH VIH 13.5 3.5 Doc ID 14527 Rev 2 TS4982 4.7 Application information PC beep The PC beep input allows to send a system beep (for instance power-on self-test error code) through the amplifiers to the loudspeaker or (and) headphone output. In the typical application (see Figure 1) the input is passed through when eight sequential rising edges in the signal appear on the detector input with the minimum amplitude VinMIN = 0.8 VP-P and minimum frequency FMIN = 400 Hz. The PC beep signal is mixed with gain = -1 V/V into a loudspeaker (SPKREN = 0) or headphone (HDEN = 1) path. The signal from the loudspeaker or headphone inputs are not muted. The beep signal pass-through is switched off when there is no signal with sufficient amplitude VinMIN present during a 1/FMIN (1/400 s) time period. The overall gain in the typical application (Rin = Rfeed = 47 kΩ) is equal to the loudspeaker or headphone gain setting. ) s ( ct Figure 42. PC beep input stage External u d o Internal (TS4982) Rfeed e t e ol 47k Cinbeep Rin PC BEEP INPUT PC BEEP Avbeep 47k 47nF Vin GND ) (s t c u Pr LOUDSPEAKER AUDIO INPUT VOLT. & FREQ. DETECTOR s b O GND HEADPHONE AUDIO INPUT The input capacitor Cinbeep with input resistor Rin forms a high-pass filter with a -3 dB low frequency cut-off FCL which must be lower than FMIN. d o r P e 1 Cinbeep ≥ -------------------------------------------2π ⋅ Rin ⋅ F MIN t e l o For a typical application (Rin = 47 kΩ, FMIN = 400 Hz) a good choice is Cinbeep = 47 nF. s b O If it is necessary to change the minimum amplitude VinMIN = 0.8 VP-P the gain of the PC BEEP input amplifier has to be changed. For a typical application (Rin = Rfeed = 47 kΩ) the gain is -1 V/V. Rfeed 47000 Av = – ----------------- = – ---------------- = – 1 Rin 47000 If VinMIN2 is a new requested minimum amplitude then a new input resistor Rin is: Rfeed ⋅ Vin MIN2 Rin [ Ω] = ---------------------------------------------- = 5875 ⋅ Vin MIN2 [ V PP ] Vin MIN Doc ID 14527 Rev 2 21/31 Application information 4.8 TS4982 Decoupling and charge pump capacitors Only a power supply decoupling capacitor Cs and a bias voltage decoupling capacitor Cb are needed to correctly decouple the TS4982. 4.8.1 Decoupling capacitors Cs and Cb Cs has a particular influence on the THD+N in the high frequency region (above 7 kHz) and an indirect influence on the power supply disturbances. With a value for Cs of 1 µF, you can expect similar THD+N performances to those outlined in this document (see Figure 12 to Figure 23). For example: ● In the high frequency region, if Cs is lower than 1 µF, it increases THD+N and disturbances on the power supply rail are less filtered. ● On the other hand, if Cs is higher than 1 µF, those disturbances on the power supply rail are more filtered. ) s ( ct u d o Cb has a critical influence on the final result of the PSRR with input grounded and in the lower frequency region in the following manner: r P e ● If Cb is lower than 1 µF the PSRR performance worsens at lower frequencies. ● If Cb is higher than 1 µF, the benefit to PSRR is decreased significantly. t e l o Figure 43. PSRR vs. frequency 0 s b O SPEAKER V CC = PV CCL,R = 5V, Vripple = 200mV PP -20 ) (s R L ≥ 4 Ω , Cin = 1 μ F, T AMB= 25 ° C, Gain = 9dB t c u od e t e l o s b Pr PSRR (dB) Inputs AC grounded -40 -60 Cb = 470nF -80 -100 Cb = 1μ F -120 20 Cb = 2.2μ F 100 1k Frequency (Hz) O 22/31 Doc ID 14527 Rev 2 10k 20k TS4982 4.8.2 Application information Charge pump capacitors Cp and Cps A proper selection of the charge pump capacitors Cp and Cps is necessary to generate an efficient negative voltage by the internal charge pump without a negative impact on the audio performance. The following are some recommendations for the decoupling and charge pump capacitors. 4.9 ● Low ESR capacitors are needed to minimize the output resistance of the charge pump. ● An X7R dielectric type for large temperature ranges should be used. ● Placement of the component as close to the package pins as possible. Small packages (for instance SMD 0603, 0402) make it easier. ● Use of a 10 V DC rating voltage for 5 V operation or 6.3 V DC rating operation for 3 V operation with regard to the ΔC/ΔV variation of this type of dielectric. ● For a typical application a 1 μF ceramic capacitor is recommended (see Figure 1 on page 5). ) s ( ct u d o r P e Wake-up time When the standby is released to turn the device ON, the bypass capacitor Cb is charged immediately. As Cb is directly linked to the bias of the loudspeaker amplifier, the bias will not work properly until the Cb voltage is correct. The time to reach this voltage plus a time delay of 1 ms (pop precaution) is called the wake-up time or tWU. It is specified in the electrical characteristics with Cb = 1 µF in Table 7 on page 7. t e l o s b O If Cb has a value other than 1 µF, you can calculate the typical tWU by using the following formula, or read it directly from the graph (Figure 44). ) (s t WU [ s ] = 5199 ⋅ Cb + 0.001[F] t c u Figure 44. Typical wake-up time vs. bypass capacitor P e s b O t e l o Wake-up Time (ms) d o r 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 T AMB =25°C 0 1 2 3 4 5 Cb (μ F) If the headphone (speaker) is already out of the standby mode and the speaker (headphone) is enabled there is no need to charge Cb. Therefore, the wake-up time is only the pop precaution delay of 1 ms (typical). Doc ID 14527 Rev 2 23/31 Application information 4.10 TS4982 Standby time The time to disable the dedicated part into the standby mode since the level of the dedicated standby pins are changed (HDEN from "1" to "0", SPKREN from "0" to "1") is called the standby time. It is specified in the electrical characteristics in Table 7 on page 7. 4.11 Pop & click Older generations of headphone drivers with single-ended outputs have a load connected in series with a bulky capacitor (for instance 220 μF) to ground. With this type of configuration, when the amplifier is turned on by a standby control pin, a time transient phenomena on the load is present. This has been the main contribution to the unpleasant audible sound currently called "pop effect". ) s ( ct Thanks to the negative charge pump the headphone outputs are referred to ground without the need for bulky in-series capacitors. Therefore, the pop created by these bulky capacitors is internally eliminated. In addition, the TS4982 include a pop & click circuitry which suppresses any residual pop on the headphone and speaker outputs, thus enabling the outputs to be virtually pop & click-free. u d o 4.12 r P e t e l o Headphone jack detection s b O The device incorporates a simple circuitry that can be used to enable the headphone amplifier and disable the speaker amplifier by a headphone jack insertion. ) (s Figure 45. Headphone jack detection schematics od t c u e t e ol bs Pr Vcc 100K HDEN SPKREN HEADPHONE JACK LHP RHP O 10K GND GND 24/31 Doc ID 14527 Rev 2 TS4982 4.13 Application information PCB layout recommendations The TS4982 can delivery 2 W into a 4 Ω load at 1% THD+N. To reach this output power value, you should follow these few recommendations during the design phase of the PCB. ● Use large and short traces for power supply (PVCCL,R) and outputs - load tracks to minimize losses due to track parasitic resistance. ● Connect all VCC tracks (PVCCL,R, HPVCC, CPVCC, VCC) to one point on the board. ● Connect all grounding planes or tracks (GND, PGNDL, PGNDR, CPGND) to one point on the board. ● Keep the grounding of the charge pump CPGND away from other GNDs. ● Connect the exposed pad to the grounding plane or a large bottom copper area using vias for good heatsink. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 14527 Rev 2 25/31 Package information 5 TS4982 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 26/31 Doc ID 14527 Rev 2 TS4982 5.1 Package information QFN32 package information Figure 46. QFN32 package mechanical drawing ) s ( ct u d o r P e t e l o Table 14. ) (s QFN32 package mechanical data t c u Ref. od Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. 0.80 0.90 1.00 0.031 0.035 0.039 0.02 0.05 0.0008 0.002 A2 0.65 1.00 0.026 0.039 A3 0.20 A e t e ol A1 s b O s b O Pr 0.008 b 0.18 0.25 0.30 0.007 0.010 0.012 D 4.85 5.00 5.15 0.191 0.20 0.203 D1 4.75 0.19 D2 3.15 3.30 3.45 0.124 0.130 0.136 E 4.85 5.00 5.15 0.191 0.20 0.203 3.45 0.124 0.130 E1 E2 4.75 3.15 e L 3.30 0.19 0.50 0.30 0.40 0.136 0.020 0.50 0.012 0.016 0.020 P 0.60 0.024 K 14 0.55 ddd 0.08 0.003 Doc ID 14527 Rev 2 27/31 Package information TS4982 Figure 47. Footprint recommendation 0.45 mm 5.4 mm 3.2 mm 0.5 mm 0.3 mm 0.65 mm ) s ( ct 3.2 mm u d o 0.45 mm 5.4 mm t e l o ) (s s b O t c u d o r P e t e l o s b O 28/31 r P e Doc ID 14527 Rev 2 TS4982 6 Ordering information Ordering information Table 15. Order code Order code Temperature range Package Packaging Marking -40°C to +85°C QFN32 Tape & reel K982 TS4982IQT ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O Doc ID 14527 Rev 2 29/31 Revision history 7 TS4982 Revision history Table 16. Document revision history Date Revision Changes 18-Mar-2008 1 Initial release. 16-Jun-2009 2 Document status promoted from target specification to full datasheet. ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 30/31 Doc ID 14527 Rev 2 TS4982 Revision history ) s ( ct Please Read Carefully: Information in this document is provided solely in connection with ST products. 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