Datasheet - TriQuint

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TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Applications



Point to Point Radio / VSAT
Millimeter-wave Communications
Test Equipment
32-pin 5x5mm package
General Description
NC
28
NC
29
NC
30
Vtune
31
NC
NC
NC
NC
32
27
26
25
NC
1
24
NC
NC
2
23
NC
NC
5
20
NC
NC
6
19
RFout
NC
7
18
NC
NC
8
17
NC
9
10
11
12
13
14
15
16
NC
Vcc
NC
NC
21
NC
22
NC
3
4
RFout / 2
NC
NC
GND





Frequency range: 12.5 – 13.5 GHz
Tune Voltage: 1 – 13 V
Output power: 7 dBm Typical
Phase Noise: -110 dBc/Hz@100 KHz Typical
-133 dBc/Hz@1 MHz Typical
RFout/2 Frequency Range: 6.25 – 6.75 GHz
RFout/2 Output Power: 6 dBm Typical
Bias: Vcc = 5V, Icc = 165 mA Typical
Technology: TriQuint HBT
Dimension: 5 x 5 x 0.85 mm SLP
NC




Functional Block Diagram
NC
Product Features
Pin Configuration
The TriQuint TGV2529-SM is a monolithic voltage
controlled oscillator (VCO) designed to operate at
frequencies that target the Point to Point, VSAT, and
millimeter-wave communication markets.
Pin #
Function Label
11
12
19
GND
RFout/2
RFout
The TGV2529-SM is manufactured on TriQuint’s
GaAs InGaP production process and typically
provides 7 dBm output power at 13GHz with a
-110dBc/Hz phase noise at 100 KHz offset. A divideby-2 output is provided for the PLL function.
21
29
1, 2, 3, 4, 5, 6, 7, 8, 9,
10, 13, 14, 15, 16, 17,
18, 20, 22, 23, 24, 25,
26, 27, 28, 30, 31, 32
Vcc
Vtune
Lead-free and RoHS compliant.
NC
Evaluation Boards are available upon request.
Ordering Information
Part No.
TGV2529-SM
ECCN
EAR99
Description
12.5 – 13.5 GHz VCO
with Divide by 2
Standard T/R size = 500 pieces on a 7.0” reel.
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 1 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Specifications
Absolute Maximum Ratings
Parameter
Supply Voltage, Vcc
Tuning Voltage, Vtune
Power Dissipation, Pdiss
Junction Temperature
Storage Temperature
Recommended Operating Conditions
Rating
Parameter
+5.5V
+14V
1.1W
200°C
-65 to 125C
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Min
Typ
Operating Temp. Range -40
Supply Voltage, Vcc
4.8
Supply Current, Icc
Tuning Voltage, Vtune
1
+25
5.0
165
Max Units
C
V
mA
V
+85
5.2
12
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: 25 ºC, Vcc = 5 V, Icc = 165mA
Parameter
Conditions
Min
Typ
Max
Units
Operational Frequency
12.5
13.5
GHz
RFout/2 Output Frequency
Supply Voltage, Vcc
Supply Current, Icc
Output Power
RFout/2 Output Power
Tuning Sensitivity
6.25
4.8
140
4
2
6.75
5.2
190
12
10
GHz
V
mA
dBm
dBm
MHz/V
Output Return Loss
RFout/2 Output Return Loss
Tuning Voltage
Pushing
Pulling
Harmonics
Freq/2
3*Freq/2
2*Freq
Phase Noise @ 10KHz Offset
Phase Noise @ 100KHz Offset
Phase Noise @ 1MHz Offset
Frequency Drift Rate
Vtune Leakage
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
Vtune = 5V
5
165
7
6
175
7
5
1
13
Vtune = 5V
VSWR 2:1
10
5
Vtune = 5V
Vtune = 5V
Vtune = 5V
21
30
49
-80
-110
-133
1.1
5
Vtune = 12V
- 2 of 14 -
dB
dB
V
MHz/V
MHz (p-p)
dBc
dBc/Hz
dBc/Hz
dBc/Hz
o
MHz/ C
µA
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Specifications
Thermal and Reliability Information
Parameter
Rating
Condition
Thermal Resistance, θJC, measured to back of package
Tbase = 85 °C
θJC = 48 °C/W
Junction Temperature (Tj), and Median Lifetime (Tm)
Tbase = 85 °C
Vd = 5V Id = 165mA
Tch = 125 °C
Tm = 8.4 E+7 Hours
Median Lifetime (Tm) vs. Junction Temperature (Tj)
Median Lifetime, Tm (Hours)
1.0E+15
1.0E+14
1.0E+13
1.0E+12
1.0E+11
1.0E+10
1.0E+09
1.0E+08
1.0E+07
1.0E+06
1.0E+05
HBT1
1.0E+04
25
50
75
100
125
150
175
200
Junction Temperature, Tj (°C)
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 3 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Typical Performance
Frequency vs Tuning Voltage
Vcc = 5V
-60
+85°C
SSB Phase Noise (dBc/Hz)
Output Frequency (GHz)
14.5
Phase Noise vs Tuning Voltage
@ 10 KHz offset
+25°C
14
-40°C
13.5
13
12.5
12
11.5
+85°C
-65
+25°C
-70
-40°C
-75
-80
-85
-90
-95
-100
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
0
1
Output Power vs Tuning Voltage
Vcc = 5V
4
5
6 7 8
Vtune (V)
9
10 11 12 13
-90
SSB Phase Noise (dBc/Hz)
+85°C
11
Output Power (dBm)
3
Phase Noise vs Tuning Voltage
@ 100KHz offset
12
+25°C
10
-40°C
9
8
7
6
5
4
-95
+85°C
+25°C
-100
-40°C
-105
-110
-115
-120
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
0
Sensitivity vs Tuning Voltage
Vcc = 5V
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
Phase Noise vs Tuning Voltage
@ 1 MHz offset
-110
SSB Phase Noise (dBc/Hz)
700
+85°C
600
Sensitivity (MHz/V)
2
+25°C
500
-40°C
400
300
200
100
-115
+85°C
-120
+25°C
-40°C
-125
-130
-135
-140
-145
-150
0
1
2
3
4
5
6 7 8
Vtune (V)
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
9
10 11 12 13
- 4 of 14 -
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Typical Performance
7.5
7.3
7.1
6.9
6.7
6.5
6.3
6.1
5.9
5.7
5.5
RFout/2 Phase Noise vs Tuning Voltage
@ 10 KHz offset
-60
+85°C
SSB Phase Noise (dBc/Hz)
Output Frequency (GHz)
RFout/2 Frequency vs Tuning Voltage
Vcc = 5V
+25°C
-40°C
-65
+85°C
-70
+25°C
-80
-85
-90
-95
-100
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
0
RFout/2 Output Power vs Tuning Voltage
Vcc = 5V
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
-100
SSB Phase Noise (dBc/Hz)
+85°C
11
Output Power (dBm)
1
RFout/2 Phase Noise vs Tuning Voltage
@ 100 KHz offset
12
+25°C
10
-40°C
9
8
7
6
5
4
+85°C
-105
+25°C
-40°C
-110
-115
-120
-125
-130
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
0
RFout/2 Sensitivity vs Tuning Voltage
Vcc = 5V
350
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
RFout/2 Phase Noise vs Tuning Voltage
@ 1 MHz offset
SSB Phase Noise (dBc/Hz)
-120
300
Sensitivity (MHz/V)
-40°C
-75
+85°C
250
+25°C
-40°C
200
150
100
50
+85°C
-125
+25°C
-40°C
-130
-135
-140
-145
-150
0
1
2
3
4
5
6 7 8
Vtune (V)
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
9
10 11 12 13
- 5 of 14 -
0
1
2
3
4
5
6 7 8
Vtune (V)
9
10 11 12 13
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Typical Performance
Phase Noise (dBc/Hz)
Phase Noise vs Tuning Voltage
Vcc = 5V
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
+85°C
+25°C
-40°C
1
10
100
Frequency (KHz)
1000
10000
Pushing vs Tuning Voltage
20
Pushing (MHz/V)
15
+85°C
10
+25°C
-40°C
5
0
-5
-10
0
1
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
2
3
4
5
6 7 8
Vtune (V)
- 6 of 14 -
9
10 11 12 13
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Vtune
NC
NC
NC
NC
30
29
28
27
26
25
NC
3
22
NC
NC
4
21
Vcc
NC
5
20
NC
NC
6
19
RFout
NC
7
18
NC
NC
8
17
NC
10
11
12
13
14
15
16
NC
NC
NC
23
NC
2
NC
NC
RFout / 2
NC
GND
24
NC
1
NC
Pin
31
NC
9
1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 13, 14,
15, 16, 17, 18, 20,
22, 23, 24, 25, 26,
27, 28, 30, 31, 32
NC
32
NC
NC
Pin Description
Symbol
Description
NC
No internal connection.
11
GND
12
RFout/2
19
RFout
21
Vcc
29
Vtune
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
Backside Paddle. Multiple vias should be employed to minimize
inductance and thermal resistance
Frequency/2 Output match to 50 ohms, AC coupled
Output, matched to 50 ohms, AC coupled
Supply voltage. Bias network is required; see Application Circuit on
page 8 as an example.
VCO tuning voltage.
- 7 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Application Circuit
Vtune
J3
R2
32
31
30
28
29
27
26
25
R1
1
24
2
23
3
22
4
21
5
20
6
19
C2
C1
C3
Vcc
7
18
8
17
9
10
11
13
12
14
15
RFout
J2
16
J1
RFout/2
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 8 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Application Circuit
PC Board Layout
Top RF layer is 0.008” thick Roger RO4003, єr = 3.38. Microstrip 50Ω line detail: width =0.0175”. For further
technical information, refer to the TGV2529-SM Product Information page.
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount
processes vary from company to company, careful process development is recommended.
Top layer
1 oz Cu
Roger 4003
GND layer
0.008"
1/2 oz Cu
0.062"
FR4
1 oz Cu
Bottom layer
Bill of Material
Ref Des
Value Description
Manufacturer
C1
100 pF Ceramic Cap, 0402
various
C2
1 µF
Ceramic Cap, 0603
various
C3
10 µF
Tantalum Cap, 0805/1206
various
R1, R2
0 ohm Chip Res, 0402
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
Part Number
various
- 9 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Mechanical Information
Package Marking and Dimensions
All dimensions are in millimeters.
2529
YYWW
XXXX
This package is lead-free/RoHS-compliant. The package base is copper alloy and the plating material on the leads
is 100% matte Sn annealed. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead
(maximum 245 °C reflow temperature) soldering processes.
The TGV2529-SM will be marked with the “2529” designator and a lot code marked below the part designator. The
“YY” represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the
“XXXX” is last 4 digits of lot number.
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 10 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Mechanical Information
PCB Mounting Pattern
All dimensions are in millimeters [inches].
Notes:
1. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount
processes vary from company to company, careful process development is recommended.
2. Ground / thermal vias are critical for the proper performance of this device. Vias have a final plated thru diameter
of .25 mm (.010”).
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 11 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Tape and Reel Information
Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes”
section.
Standard T/R size = 500 pieces on a 7.0” reel.
CARRIER AND COVER TAPE DIMENSIONS
Symbol
Size (in)
Size (mm)
Length
A0
0.207
5.25
Width
B0
0.207
5.25
Depth
K0
0.043
1.1
P1
0.315
8.00
P2
0.079
2.00
F
0.217
5.50
Cover Tape
Pitch
Cavity to Perforation
Length Direction
Cavity to Perforation
Width Direction
Width
C
0.374
9.50
Carrier Tape
Width
W
0.472
12.00
Part
Cavity
Distance Between
Centerline
Feature
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 12 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Product Compliance Information
ESD Information
Solderability
Compatible with both lead-free (260 °C max.
reflow temp.) and tin/lead (245 °C max. reflow
temp.) soldering processes.
ESD Rating:
Value:
Test:
Standard:
Class 0
Passes > 200V min
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Package lead plating: matte Sn annealed
RoHS Compliance
MSL Rating
Moisture Sensitivity Level (MSL) 3 at 260°C convection
reflow per JEDEC standard IPC/JEDEC J-STD-020.
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and
Electronic Equipment).
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
Recommended Soldering Temperature Profile
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 13 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: info-sales@tqs.com
Tel:
Fax:
+1.972.994.8465
+1.972.994.8504
For technical questions and application information:
Email: info-networks@tqs.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the
information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information
contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the
entire risk associated with such information is entirely with the user. All information contained herein is subject to
change without notice. Customers should obtain and verify the latest relevant information before placing orders for
TriQuint products. The information contained herein or any use of such information does not grant, explicitly or
implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to
such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe
personal injury or death.
Data Sheet: Rev B 11/10/15
© 2012 TriQuint Semiconductor, Inc.
- 14 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
®
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